CN210406047U

CN210406047U - Ultrathin insulating composite heat conduction structure for electronic component

Info

Publication number: CN210406047U
Application number: CN201921398950.9U
Authority: CN
Inventors: 韩冰
Original assignee: Suzhou Taijinuo New Material Technology Co ltd
Current assignee: Suzhou Taijinuo New Material Technology Co ltd
Priority date: 2019-08-27
Filing date: 2019-08-27
Publication date: 2020-04-24
Anticipated expiration: 2029-08-27

Abstract

The utility model discloses an ultrathin insulating composite heat conduction structure for electronic components, the thickness range of which is not higher than 0.8mm, the ultrathin insulating composite heat conduction structure is formed by a heating and rolling process, and comprises a polyimide film as a middle layer, a graphite flake complex body positioned on the upper layer and a phase change heat conduction layer positioned on the lower layer; the utility model discloses realizing that thickness is less than under 0.8 mm's the prerequisite, having higher coefficient of heat conductivity, possessing good insulating properties and the moist effect of surface laminating simultaneously, can effectively satisfy each trade to electronic components's integrated lightweight application development demand.

Description

Ultrathin insulating composite heat conduction structure for electronic component

Technical Field

The utility model belongs to an electronic components's heat conduction structure, concretely relates to compound heat conduction structure of ultra-thin insulation for electronic components.

Background

With the rapid development of modern electronic technology, the integration degree and the assembly density of electronic components are continuously improved, and the working power consumption and the heat productivity of the electronic components are increased sharply while providing strong use functions. High temperatures can adversely affect the stability, reliability and service life of electronic components.

In order to solve the heat dissipation problem of electronic components, thermal interface management materials are generally adopted in the industry, and the purpose of effectively dissipating heat is achieved by effectively filling air gaps and fine irregular gaps between electronic components and heat dissipation fins, so that interface thermal resistance is greatly reduced. The heat conduction materials applied to the installation requirement with low assembly thickness (the thickness is usually less than 0.8mm) in the current market mainly comprise an ultrathin heat conduction gasket, a heat conduction silicon adhesive tape, heat conduction grease and a heat conduction phase change material, but the materials have the following defects in application:

first, the ultra-thin thermal conductive gasket has a low thermal conductivity (less than 6W/m.K), and the material has poor mechanical strength and toughness, and low insulation strength.

Secondly, the heat-conducting silica gel cloth has higher hardness, and has higher heat resistance and lower heat conductivity (less than 6W/m.K) because of the higher surface adhesion and wetting capability with the heating element of the electronic component.

Thirdly, the reliability of the thermal grease is poor, the extrusion phenomenon is easy to occur during the use, and meanwhile, the thermal grease with relatively high thermal conductivity (>4W/m.k) usually contains metal or other conductive materials, so the insulation property is poor.

Fourth, the phase change material with higher thermal conductivity includes phase change sheet and phase change paste, and usually contains metal or other conductive filler, so the insulation property is poor.

Therefore, the applicant sought a new technical solution to solve the above technical problem.

Disclosure of Invention

In view of this, the utility model aims at providing an ultra-thin insulating compound heat conduction structure for electronic components realizes that thickness is less than 0.8 mm's prerequisite under, has higher coefficient of heat conductivity, possess good insulating properties and the moist effect of surface laminating simultaneously, can effectively satisfy each trade to electronic components's integrated lightweight application development demand.

The utility model adopts the technical scheme as follows:

the ultrathin insulating composite heat conduction structure for the electronic component is compounded and molded by a heating and calendering process and comprises a polyimide film serving as a middle layer, a graphite flake composite body positioned on an upper layer and a phase change heat conduction layer positioned on a lower layer.

Preferably, the thickness of the polyimide film ranges from 0.05 mm to 0.3mm, the thickness of the graphite sheet composite ranges from 15 μm to 250 μm, and the thickness of the phase-change heat conduction layer ranges from 0.02 mm to 0.2 mm.

Preferably, the graphite sheet composite body comprises a first adhesive layer and a graphite sheet layer which are compounded into a whole, and the graphite sheet composite layer is adhered to one outer surface of the polyimide film through a second adhesive layer.

Preferably, the thickness of the first glue layer and/or the second glue layer ranges from 1 to 10 μm, and the thickness of the graphite sheet layer ranges from 15 to 200 μm.

Preferably, the first adhesive layer and the second adhesive layer are made of acrylic acid heat-conducting glue or organic silicon heat-conducting glue.

It should be noted that the phase-change heat conduction layer related to the present application is made of a heat conduction phase-change material in the prior art, and can be purchased directly from the market.

The utility model provides an adopt and pass through the graphite flake complex body, polyimide film and phase transition heat-conducting layer and through heating the compound ultra-thin insulating compound heat conduction structure that forms of calendering technology, not only simple and convenient easy to carry out of technology, and under the prerequisite of guaranteeing that installation thickness is no longer than 0.8mm, the graphite flake complex body that lies in the upper strata has very excellent plane radiating effect, middle polyimide film has softly, high strength and high insulating nature's characteristics, and the phase transition heat-conducting layer of bottom has heat conduction, the characteristics of energy storage, simultaneously have very good surface laminating moist effect with electronic components's heating element, ensure the utility model discloses can effectively satisfy the application development demand of each trade to electronic components's integrated lightweight.

Drawings

Fig. 1 is a schematic view of an ultra-thin insulating composite heat conducting structure according to an embodiment of the present invention.

Detailed Description

The embodiment of the utility model discloses compound heat conduction structure of ultra-thin insulation for electronic components, its thickness scope is not higher than 0.8mm, and compound shaping of ultra-thin compound heat conduction structure of insulation is through heating calendering technology, include the polyimide film as the intermediate level, be located the graphite flake complex body on upper strata and be located the phase transition heat-conducting layer of lower floor.

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

Referring to fig. 1, an ultra-thin insulating composite heat conducting structure for electronic components is formed by a known heating and rolling process, and includes a polyimide film 10 as an intermediate layer, a graphite sheet composite 20 located on an upper layer, and a phase-change heat conducting layer 30 located on a lower layer; the polyimide film 10, the graphite sheet complex 20 and the phase-change heat conduction layer 30 according to the present embodiment can be obtained by direct purchase from the market;

preferably, in the present embodiment, the graphite sheet composite 20 includes a first acrylic thermal conductive adhesive layer 21 and a graphite sheet layer 22 which are integrally combined, and the graphite sheet composite layer 22 is bonded to an outer surface of the polyimide film 10 through a second acrylic thermal conductive adhesive layer 23; of course, in other embodiments of the present application, silicone thermal conductive paste may be used instead of acrylic thermal conductive paste; the phase change heat conductive layer 30 is made of a conventional phase change heat conductive material in the prior art, typically a heat-enhancing polymer;

preferably, in the present embodiment, the thickness of the polyimide film 10 is in the range of 0.05 to 0.3mm, the thickness of the graphite sheet composite 20 is in the range of 15 to 250 μm, and the thickness of the phase-change heat conductive layer 30 is in the range of 0.02 to 0.2 mm; the thickness range of the first acrylic acid heat-conducting adhesive layer 21 and the second acrylic acid heat-conducting adhesive layer 23 is 1-10 mu m, and the thickness range of the graphite sheet layer 22 is 15-200 mu m; particularly preferably, in the present embodiment, the thickness of the polyimide film 10 is about 0.1mm, and the thickness of the phase-change heat conduction layer 30 is about 0.1 mm; the first acrylic thermal adhesive layer 21 and the second acrylic thermal adhesive layer 23 are equal in thickness and about 6 μm, and the graphite sheet layer 22 is about 130 μm; in other embodiments, the thickness may be specifically selected according to the practical application, which is not a main limitation for the present embodiment.

This embodiment adopts through graphite flake complex body 20, polyimide film 10 and phase transition heat-conducting layer 30 and through heating the compound ultra-thin insulating compound heat conduction structure who forms of calendering technology, not only the simple and convenient easy to carry out of technology, and under the prerequisite of guaranteeing that installation thickness is no longer than 0.8mm, the graphite flake complex body 20 that lies in the upper strata has very excellent plane radiating effect, middle polyimide film 10 has the softness, high strength and high insulating nature's characteristics, and the phase transition heat-conducting layer 30 of bottom has heat conduction, the characteristics of energy storage, it has very good surface laminating moist effect with electronic components's heating element simultaneously, ensure that this embodiment can effectively satisfy the application development demand of each trade to electronic components's integrated lightweight.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The ultrathin insulating composite heat conduction structure for the electronic component is characterized by being formed by compounding through a heating and rolling process and comprising a polyimide film serving as a middle layer, a graphite flake composite body located on an upper layer and a phase change heat conduction layer located on a lower layer.

2. The ultra-thin insulating composite heat conducting structure for electronic components as claimed in claim 1, wherein the thickness of the polyimide film is in the range of 0.05-0.3mm, the thickness of the graphite sheet composite body is in the range of 15-250 μm, and the thickness of the phase change heat conducting layer is in the range of 0.02-0.2 mm.

3. The ultra-thin insulating composite heat conducting structure for electronic components according to claim 1, wherein the graphite sheet composite body comprises a first adhesive layer and a graphite sheet layer which are compounded into a whole, and the graphite sheet composite layer is bonded to an outer surface of the polyimide film through a second adhesive layer.

4. The ultra-thin insulating composite heat conducting structure for electronic components according to claim 3, wherein the thickness of the first adhesive layer and/or the second adhesive layer ranges from 1 μm to 10 μm, and the thickness of the graphite sheet layer ranges from 15 μm to 200 μm.

5. The ultrathin insulating composite heat-conducting structure for electronic components as claimed in claim 3, wherein the materials of the first adhesive layer and the second adhesive layer are acrylic heat-conducting glue or organic silicon heat-conducting glue.