CN215203816U

CN215203816U - High-heat-conductivity composite buffering radiating fin with good tensile resistance

Info

Publication number: CN215203816U
Application number: CN202121568786.9U
Authority: CN
Inventors: 刘欣; 张羽霜
Original assignee: Suzhou Xinche Electronic Co ltd
Current assignee: Suzhou Xinche Electronic Co ltd
Priority date: 2021-07-12
Filing date: 2021-07-12
Publication date: 2021-12-17
Anticipated expiration: 2031-07-12

Abstract

The utility model discloses a high heat conduction composite buffering fin that fin technical field's stretch-proofing performance is good, including the heat conduction silica gel layer, heat conduction silica gel layer upper surface is equipped with the second fin, heat conduction silica gel layer lower surface is equipped with first fin, first fin lower surface is equipped with the viscose layer, viscose layer lower surface is equipped with first buffer layer, first buffer layer lower surface is equipped with from the type rete, second fin upper surface is equipped with the bubble cotton, the cotton upper surface of bubble is equipped with the second buffer layer, second buffer layer upper surface is equipped with the graphite paster, the utility model discloses can be effectual the stretch-proofing performance of reinforcing fin under the inside elastic rubber piece effect of buffer layer, guaranteed high heat conduction composite buffering fin overall structure's stability.

Description

High-heat-conductivity composite buffering radiating fin with good tensile resistance

Firstly, the method comprises the following steps: Technical Field

The utility model relates to a fin technical field specifically is high heat conduction composite buffer fin that stretch-proofing performance is good.

II, secondly: background

Along with the development of electronic technology, more and more highly integrated electronic products are provided, more and more electronic components in the electronic products are provided, the size of the electronic components is smaller and smaller, along with the increase of the heat productivity of the electronic components, and the normal work of the electronic products can be ensured only by taking away the heat in the electronic products in time.

The existing high-thermal-conductivity composite buffer radiating fin generally has the defects of frangibility, low strength and poor tensile resistance, is easy to damage during production and application, and also seriously reduces the service life of a radiating fin product.

Thirdly, the method comprises the following steps: SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high heat conduction composite buffering fin that stretch-proofing performance is good to solve the current high heat conduction composite buffering fin ubiquitous defect breakable, that intensity is low, anti tensile properties is poor that proposes in the above-mentioned background art, damage easily when production and application, also seriously reduced the life's of fin product problem.

In order to achieve the above object, the utility model provides a following technical scheme: high heat conduction composite buffering fin that stretch-proofing performance is good, including heat conduction silica gel layer, heat conduction silica gel layer upper surface is equipped with the second fin, heat conduction silica gel layer lower surface is equipped with first fin, first fin lower surface is equipped with the viscose layer, viscose layer lower surface is equipped with first buffer layer, first buffer layer lower surface is equipped with from the type rete, second fin upper surface is equipped with the bubble cotton, the cotton upper surface of bubble is equipped with the second buffer layer, second buffer layer upper surface is equipped with the graphite paster.

Preferably, the first buffer layer and the second buffer layer are filled with elastic rubber balls, and the upper surface and the lower surface of the first buffer layer and the lower surface of the second buffer layer are both bonded with double-sided adhesive tapes.

Preferably, the first and second heat dissipation fins are both aluminum foil heat dissipation sheets.

Preferably, the inner wall of the foam is uniformly filled with silica gel blocks.

Preferably, the graphite patch comprises a synthetic patch and a natural graphite patch, and the graphite patch is a natural graphite patch with the thickness of 60 microns.

Compared with the prior art, the beneficial effects of the utility model are that: 1. this practicality can effectual reinforcing fin's stretch-proofing performance under the inside elastic rubber piece effect of buffer layer, guaranteed high heat conduction composite buffering fin overall structure's stability.

2. This practicality can be faster and the more even high thermal conductivity of the acceleration fin through heat conduction silica gel layer, simultaneously can be better dispel the heat to electronic component under the effect of first fin, second fin and graphite paster.

Fourthly, the method comprises the following steps: drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: 1. a release film layer; 2. a first buffer layer; 3. an adhesive layer; 4. a first heat sink; 5. a heat conductive silica gel layer; 6. a second heat sink; 7. soaking cotton; 8. a second buffer layer; 9. and (6) sticking a graphite sheet.

Fifthly: Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1, the present invention provides a technical solution: high heat conduction composite buffering fin that stretch-proofing performance is good, including heat conduction

silica gel layer

5, 5 upper surfaces of heat conduction silica gel layer are equipped with

second fin

6, 5 lower surfaces of heat conduction silica gel layer are equipped with

first fin

4, 4 lower surfaces of first fin are equipped with

viscose layer

3, 3 lower surfaces of viscose layer are equipped with

first buffer layer

2, 2 lower surfaces of first buffer layer are equipped with from

type rete

1, 6 upper surfaces of second fin are equipped with bubble cotton 7, bubble cotton 7 upper surfaces are equipped with

second buffer layer

8, 8 upper surfaces of second buffer layer are equipped with graphite paster 9.

In this embodiment, referring to fig. 1, the first heat sink 4 and the second heat sink 6 are both aluminum foil heat dissipation sheets, which have better heat dissipation performance.

In this embodiment, referring to fig. 1, the inner wall of the foam 7 is uniformly filled with the silica gel blocks, and the silica gel blocks filled in the foam 7 can effectively remove air in the foam 7, thereby enhancing heat dissipation and thermal conductivity.

In this embodiment, referring to fig. 1, the graphite patches 9 include a synthetic patch and a natural graphite patch, and the graphite patches 9 are natural graphite patches with a thickness of 60 microns, and the natural graphite patches have good quality.

The working principle is as follows: can be faster and the more even high thermal conductivity of accelerating the fin at heat conduction silica gel layer 5, can get rid of the air in the cotton 7 of bubble under the effect of the silica gel piece in the cotton 7 of bubble, the reinforcing is dispelled the heat, can be better dispel the heat to electronic component under the effect of first fin 4, second fin 6 and graphite paster 9 simultaneously, and the effect is better.

Example 2

Referring to fig. 1, this embodiment is different from the first embodiment in that: all fill in first buffer layer 2 and the second buffer layer 8 and be equipped with the elastic rubber ball, and the upper and lower surface of first buffer layer 2 and second buffer layer 8 all bonds and has had the double faced adhesive tape.

The working principle is as follows: the upper and lower surface of first buffer layer 2 is connected with release film layer 1 and adhesive layer 3 surface through double faced adhesive tape, and second buffer layer 8 is connected with bubble cotton 7 and graphite paster 9 surface through double faced adhesive tape, can effectual reinforcing fin's tensile resistance under first buffer layer 2 and second buffer layer 8's effect.

Claims

1. High heat conduction composite buffering fin that stretch-proofing performance is good, including heat conduction silica gel layer (5), its characterized in that: the utility model discloses a heat-conducting silica gel layer, including heat-conducting silica gel layer (5), heat-conducting silica gel layer (5) upper surface is equipped with second fin (6), heat-conducting silica gel layer (5) lower surface is equipped with first fin (4), first fin (4) lower surface is equipped with viscose layer (3), viscose layer (3) lower surface is equipped with first buffer layer (2), first buffer layer (2) lower surface is equipped with from type rete (1), second fin (6) upper surface is equipped with bubble cotton (7), bubble cotton (7) upper surface is equipped with second buffer layer (8), second buffer layer (8) upper surface is equipped with graphite paster (9).

2. The high thermal conductivity composite buffer heat sink with good tensile resistance of claim 1, wherein: all fill in first buffer layer (2) and second buffer layer (8) and be equipped with the elasticity rubber ball, and surface all bonds about first buffer layer (2) and second buffer layer (8) has the double faced adhesive tape.

3. The high thermal conductivity composite buffer heat sink with good tensile resistance of claim 1, wherein: the first radiating fin (4) and the second radiating fin (6) are both aluminum foil radiating sheets.

4. The high thermal conductivity composite buffer heat sink with good tensile resistance of claim 1, wherein: and the inner wall of the foam (7) is uniformly filled with silica gel blocks.

5. The high thermal conductivity composite buffer heat sink with good tensile resistance of claim 1, wherein: the graphite patch (9) comprises a synthetic patch and a natural graphite patch, and the graphite patch (9) is a natural graphite patch with the thickness of 60 micrometers.