CN113201289A - Electronic packaging heat-conducting double-sided adhesive tape and preparation method thereof - Google Patents
Electronic packaging heat-conducting double-sided adhesive tape and preparation method thereof Download PDFInfo
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- CN113201289A CN113201289A CN202110428212.XA CN202110428212A CN113201289A CN 113201289 A CN113201289 A CN 113201289A CN 202110428212 A CN202110428212 A CN 202110428212A CN 113201289 A CN113201289 A CN 113201289A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses the technical field of adhesive tapes, and particularly relates to an electronic packaging heat-conducting double-sided adhesive tape which comprises a substrate layer, wherein heat-conducting pressure-sensitive adhesive layers are coated on two sides of the substrate layer, release film layers are coated on the side walls of the heat-conducting pressure-sensitive adhesive layers, a heat-conducting silica gel sheet and a power battery are attached in a double-sided adhesive tape mode, the double-sided adhesive tape and the heat-conducting silica gel sheet jointly form a heat dissipation surface of the power battery, the defect that the viscosity of the heat-conducting silica gel sheet is insufficient is overcome while rapid heat conduction is ensured, and the double-sided adhesive tape and the power battery are attached in a seamless mode, so that the effective heat dissipation surface is fully ensured; the double-sided adhesive tape has the characteristics of high heat conduction and insulation, flexibility, compressibility, conformability, strong viscosity and large adaptive temperature range, can fill up uneven surfaces, can tightly and firmly adhere to a heat source device and a radiating fin, can quickly conduct heat out, and is simple in preparation method.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to an electronic packaging heat-conducting double-sided adhesive tape and a preparation method thereof.
Background
Along with the national advocation of environmental protection, new energy automobiles gradually become a great direction of automobile development, and the new energy automobiles mainly comprise a battery driving system, a motor system, an electric control system, an assembly and the like. The motor, the electric control and the assembly are basically the same as those of the traditional automobile, and the battery driving system drives the whole automobile by taking electric power as main energy, so that pollutants discharged by the battery driving system are reduced to a great extent compared with the traditional gasoline driving system. The power battery is a power source for providing power source for the tool, and is a storage battery for providing power for electric automobiles, electric trains, electric bicycles and golf carts.
The automobile power battery generally comprises a battery pack consisting of square power batteries (battery cells) one by one, heat dissipation is carried out between the power batteries through a heat-conducting silica gel sheet, disassembly is convenient, but the heat-conducting silica gel sheet is low in viscosity and easy to generate a gap with the power batteries, and the heat dissipation effect is influenced.
Disclosure of Invention
The invention aims to provide an electronic packaging heat-conducting double-sided tape and a preparation method thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides an electron encapsulation heat conduction double sided tape, includes the substrate layer, the both sides coating of substrate layer has heat conduction pressure sensitive adhesive layer, the coating has from type rete on heat conduction pressure sensitive adhesive layer's the lateral wall.
Preferably, the heat-conductive pressure-sensitive adhesive layer includes acrylic pressure-sensitive adhesive and heat-conductive powder.
Preferably, the heat-conducting pressure-sensitive adhesive layer comprises the following components:
the acrylic acid sub-sensitive glue water is prepared by polymerizing 33 parts of butyl acetate, 26 parts of butyl acrylate, 10 parts of methyl methacrylate, 32 parts of acrylic acid, 6 parts of styrene and 2 parts of hydroxybutyl acrylate in 31 parts of ethyl acetate solvent through 0.6 part of initiator azobisisobutyronitrile;
the dispersant is Changzhoujiashun JS-8105 solvent type non-silicon system dispersant;
the heat conducting powder is one or more of aluminum oxide, aluminum nitride, boron nitride and graphite powder;
the solvent is ethyl acetate.
Preferably, the release film layer is a PET release film.
Preferably, the thermal conductive pressure sensitive adhesive layer has a thickness of 80-110 μm, a peel strength of 1000gf/25mm or more, a shore hardness of 50-70, a resistance of 1015 Ω or more, and good insulation.
Preferably, the substrate layer is glass fiber cloth with the thickness of 80-90 μm.
A preparation method of an electronic packaging heat-conducting double-sided tape comprises the following steps:
1) adding heat conducting powder into a solvent, and soaking for 1-3h to fully wet the heat conducting powder;
2) diluting the dispersing agent with a solvent, adding the diluted dispersing agent into acrylic pressure-sensitive adhesive water, stirring for 5-10min, and fully and uniformly mixing to obtain the acrylic pressure-sensitive adhesive water with the dispersing agent;
3) adding the fully wetted heat conducting powder into acrylic pressure-sensitive adhesive water with a dispersing agent, and increasing the rotating speed of a stirrer to uniformly mix materials;
4) dissolving an isocyanate curing agent in a solvent, adding the isocyanate curing agent into the material obtained in the step 3), continuously stirring and uniformly mixing, and filtering the uniformly mixed material through a 200-mesh filter screen to obtain the heat conduction pressure sensitive adhesive glue;
5) standing the heat-conducting pressure-sensitive adhesive to remove bubbles or removing bubbles in vacuum, coating the heat-conducting pressure-sensitive adhesive on a release film layer, and drying redundant solvent through an oven to obtain the heat-conducting pressure-sensitive adhesive bare adhesive;
6) laminating the heat conduction pressure-sensitive adhesive on the release film layer through a laminating machine, and transferring the heat conduction pressure-sensitive adhesive to the glass fiber cloth to obtain a heat conduction double-sided adhesive tape;
7) placing the heat-conducting double-sided adhesive tape in a curing chamber for curing.
The total thickness of the obtained electronic packaging heat-conducting double-sided tape is 240-320 mu m, the viscosity is more than 1000gf/25mm, the tape can resist the temperature of minus 40-120 ℃, the heat resistance is low at 1.02 ℃ in2/W, the heat conductivity coefficient is 0.1-1.5W/m.k, the breakdown voltage is more than 5KV, the specific gravity is 1.2-1.8g/cm3, the Shore hardness is 50-70, and the tape has the characteristics of high heat conduction and insulation, and has the characteristics of flexibility, compressibility, conformability and strong viscosity.
The invention has the beneficial effects that:
(1) the heat-conducting silica gel sheet and the power battery are attached in a double-sided adhesive tape mode, the double-sided adhesive tape and the heat-conducting silica gel sheet jointly form a heat-radiating surface of the power battery, the defect that the heat-conducting silica gel sheet is not enough in viscosity is overcome while rapid heat conduction is guaranteed, and the double-sided adhesive tape and the power battery are attached in a seamless mode, so that a heat-radiating effective surface is fully guaranteed;
(2) the double-sided adhesive tape has the characteristics of high heat conduction and insulation, flexibility, compressibility, conformability, strong viscosity and large adaptive temperature range, can fill up uneven surfaces, can tightly and firmly adhere to a heat source device and a radiating fin, and can quickly conduct heat out;
(4) the special acrylic pressure-sensitive adhesive is adopted, so that the adhesive force performance is stable, the texture is light, and the cost is low;
(5) the preparation method provided by the invention is simple, easy to implement and high in production efficiency, can quickly produce the heat-conducting double-sided adhesive tape with good comprehensive performance, and is beneficial to wide popularization and application.
Drawings
FIG. 1 is a schematic view of a main structure of an electronic packaging heat-conducting double-sided tape of the present invention;
FIG. 2 is a schematic view of the electronic packaging heat-conducting double-sided tape of the present invention in a use state.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
1) adding 40 parts of boron nitride powder into 20 parts of ethyl acetate solvent, and soaking for 2 hours to fully wet the boron nitride powder;
2) diluting 0.5 part of dispersing agent by ethyl acetate, adding into 100 parts of acrylic pressure-sensitive adhesive, stirring for 5min, and fully and uniformly mixing to obtain the acrylic pressure-sensitive adhesive with the dispersing agent;
3) adding the fully wetted boron nitride powder into acrylic pressure-sensitive adhesive water with a dispersing agent, and increasing the rotating speed of a stirrer to uniformly mix the materials;
4) dissolving 0.5 part of isocyanate curing agent in ethyl acetate, adding the obtained solution into the material obtained in the step 3), continuously stirring and uniformly mixing the obtained solution, and filtering the uniformly mixed material through a 200-mesh filter screen to obtain the heat-conducting pressure-sensitive adhesive;
5) standing the heat-conducting pressure-sensitive adhesive to remove bubbles or removing bubbles in vacuum, coating the heat-conducting pressure-sensitive adhesive on a release film layer, wherein the coating thickness is 80 mu m, and drying redundant solvent through an oven to obtain the heat-conducting pressure-sensitive adhesive bare adhesive;
6) laminating the heat conduction pressure-sensitive adhesive on the release film layer through a laminating machine, and transferring the heat conduction pressure-sensitive adhesive to glass fiber cloth with the thickness of 80 microns to obtain a heat conduction double-sided adhesive tape;
7) placing the heat-conducting double-sided adhesive tape in a curing chamber for curing, and curing for 72h at 40 ℃.
Wherein: the acrylic acid sub-sensitive glue water is prepared by polymerizing 33 parts of butyl acetate, 26 parts of butyl acrylate, 10 parts of methyl methacrylate, 32 parts of acrylic acid, 6 parts of styrene and 2 parts of hydroxybutyl acrylate in 31 parts of ethyl acetate solvent through 0.6 part of initiator azobisisobutyronitrile;
the dispersant is Changzhoujiashu JS-8105 solvent-based non-silicon type system dispersant.
Example 2:
1) adding 80 parts of boron nitride powder into 40 parts of ethyl acetate solvent, and soaking for 2 hours to fully wet the boron nitride powder;
2) diluting 1 part of dispersing agent by ethyl acetate, adding the diluted dispersing agent into 100 parts of acrylic pressure-sensitive adhesive, stirring for 10min, and fully and uniformly mixing to obtain the acrylic pressure-sensitive adhesive with the dispersing agent;
3) adding the fully wetted boron nitride powder into acrylic pressure-sensitive adhesive water with a dispersing agent, and increasing the rotating speed of a stirrer to uniformly mix the materials;
4) dissolving 3 parts of isocyanate curing agent in ethyl acetate, adding the mixture into the material obtained in the step 3), continuously stirring and uniformly mixing, and filtering the uniformly mixed material through a 200-mesh filter screen to obtain the heat conduction pressure-sensitive adhesive glue;
5) standing the heat-conducting pressure-sensitive adhesive to remove bubbles or removing bubbles in vacuum, coating the heat-conducting pressure-sensitive adhesive on a release film layer, wherein the coating thickness is 100 mu m, and drying redundant solvent through an oven to obtain the heat-conducting pressure-sensitive adhesive bare adhesive;
6) laminating the heat conduction pressure-sensitive adhesive on the release film layer through a laminating machine, and transferring the heat conduction pressure-sensitive adhesive to glass fiber cloth with the thickness of 90 microns to obtain a heat conduction double-sided adhesive tape;
7) placing the heat-conducting double-sided adhesive tape in a curing chamber for curing, and curing for 72h at 40 ℃.
Wherein: the acrylic acid sub-sensitive glue water is prepared by polymerizing 33 parts of butyl acetate, 26 parts of butyl acrylate, 10 parts of methyl methacrylate, 32 parts of acrylic acid, 6 parts of styrene and 2 parts of hydroxybutyl acrylate in 31 parts of ethyl acetate solvent through 0.6 part of initiator azobisisobutyronitrile;
the dispersant is Changzhoujiashu JS-8105 solvent-based non-silicon type system dispersant.
Example 3:
1) adding 90 parts of boron nitride powder into 60 parts of ethyl acetate solvent, and soaking for 1.5h to fully wet the boron nitride powder;
2) diluting 2 parts of dispersing agent by ethyl acetate, adding the diluted dispersing agent into 100 parts of acrylic pressure-sensitive adhesive, stirring for 5min, and fully and uniformly mixing to obtain the acrylic pressure-sensitive adhesive with the dispersing agent;
3) adding the fully wetted boron nitride powder into acrylic pressure-sensitive adhesive water with a dispersing agent, and increasing the rotating speed of a stirrer to uniformly mix the materials;
4) dissolving 4 parts of isocyanate curing agent in ethyl acetate, adding the mixture into the material obtained in the step 3), continuously stirring and uniformly mixing, and filtering the uniformly mixed material through a 200-mesh filter screen to obtain the heat conduction pressure-sensitive adhesive glue;
5) standing the heat-conducting pressure-sensitive adhesive to remove bubbles or removing bubbles in vacuum, coating the heat-conducting pressure-sensitive adhesive on a release film layer, wherein the coating thickness is 110 mu m, and drying redundant solvent through an oven to obtain the heat-conducting pressure-sensitive adhesive bare adhesive;
6) laminating the heat conduction pressure-sensitive adhesive on the release film layer through a laminating machine, and transferring the heat conduction pressure-sensitive adhesive to glass fiber cloth with the thickness of 80 microns to obtain a heat conduction double-sided adhesive tape;
7) placing the heat-conducting double-sided adhesive tape in a curing chamber for curing, and curing for 72h at 40 ℃.
Wherein: the acrylic acid sub-sensitive glue water is prepared by polymerizing 33 parts of butyl acetate, 26 parts of butyl acrylate, 10 parts of methyl methacrylate, 32 parts of acrylic acid, 6 parts of styrene and 2 parts of hydroxybutyl acrylate in 31 parts of ethyl acetate solvent through 0.6 part of initiator azobisisobutyronitrile;
the dispersant is Changzhoujiashu JS-8105 solvent-based non-silicon type system dispersant.
Example 4:
1) adding 120 parts of boron nitride powder into 70 parts of ethyl acetate solvent, and soaking for 3 hours to fully wet the boron nitride powder;
2) diluting 3 parts of dispersing agent by ethyl acetate, adding the diluted dispersing agent into 100 parts of acrylic pressure-sensitive adhesive, stirring for 10min, and fully and uniformly mixing to obtain the acrylic pressure-sensitive adhesive with the dispersing agent;
3) adding the fully wetted boron nitride powder into acrylic pressure-sensitive adhesive water with a dispersing agent, and increasing the rotating speed of a stirrer to uniformly mix the materials;
4) dissolving 5 parts of isocyanate curing agent in ethyl acetate, adding the mixture into the material obtained in the step 3), continuously stirring and uniformly mixing, and filtering the uniformly mixed material through a 200-mesh filter screen to obtain the heat conduction pressure-sensitive adhesive glue;
5) standing the heat-conducting pressure-sensitive adhesive to remove bubbles or removing bubbles in vacuum, coating the heat-conducting pressure-sensitive adhesive on a release film layer, wherein the coating thickness is 90 mu m, and drying redundant solvent through an oven to obtain the heat-conducting pressure-sensitive adhesive bare adhesive;
6) laminating the heat conduction pressure-sensitive adhesive on the release film layer through a laminating machine, and transferring the heat conduction pressure-sensitive adhesive to glass fiber cloth with the thickness of 90 microns to obtain a heat conduction double-sided adhesive tape;
7) placing the heat-conducting double-sided adhesive tape in a curing chamber for curing, and curing for 72h at 40 ℃.
Wherein, the acrylic acid sub-sensitive glue water is polymerized by 33 parts of butyl acetate, 26 parts of butyl acrylate, 10 parts of methyl methacrylate, 32 parts of acrylic acid, 6 parts of styrene and 2 parts of hydroxybutyl acrylate through 0.6 part of initiator azobisisobutyronitrile in 31 parts of solvent ethyl acetate;
the dispersant is Changzhoujiashu JS-8105 solvent-based non-silicon type system dispersant.
The electronic packaging heat-conducting double-sided tapes prepared in examples 1 to 4 were tested:
although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An electronic packaging heat-conducting double-sided tape is characterized in that: the heat-conducting pressure-sensitive adhesive film comprises a substrate layer, wherein the two sides of the substrate layer are coated with heat-conducting pressure-sensitive adhesive layers, and release film layers are coated on the side walls of the heat-conducting pressure-sensitive adhesive layers.
2. The heat-conducting double-sided tape for electronic packaging according to claim 1, wherein: the heat-conducting pressure-sensitive adhesive layer comprises acrylic acid pressure-sensitive adhesive and heat-conducting powder.
3. The heat-conducting double-sided tape for electronic packaging according to claim 2, wherein: the heat-conducting pressure-sensitive adhesive layer comprises the following components:
the acrylic acid sub-sensitive glue water is prepared by polymerizing 33 parts of butyl acetate, 26 parts of butyl acrylate, 10 parts of methyl methacrylate, 32 parts of acrylic acid, 6 parts of styrene and 2 parts of hydroxybutyl acrylate in 31 parts of ethyl acetate solvent through 0.6 part of initiator azobisisobutyronitrile;
the dispersant is Changzhoujiashun JS-8105 solvent type non-silicon system dispersant;
the heat conducting powder is one or more of aluminum oxide, aluminum nitride, boron nitride and graphite powder;
the solvent is ethyl acetate.
4. The heat-conducting double-sided tape for electronic packaging according to any one of claims 1 to 3, wherein: the release film layer is a PET release film.
5. The heat-conducting double-sided tape for electronic packaging according to claim 3, wherein: the thickness of the heat conducting pressure sensitive adhesive layer is 80-110 mu m.
6. The heat-conducting double-sided tape for electronic packaging according to claim 4, wherein: the substrate layer is glass fiber cloth with the thickness of 80-90 mu m.
7. A preparation method of an electronic packaging heat-conducting double-sided tape is characterized by comprising the following steps: the method comprises the following steps:
1) adding heat conducting powder into a solvent, and soaking for 1-3h to fully wet the heat conducting powder;
2) diluting the dispersing agent with a solvent, adding the diluted dispersing agent into acrylic pressure-sensitive adhesive water, stirring for 5-10min, and fully and uniformly mixing to obtain the acrylic pressure-sensitive adhesive water with the dispersing agent;
3) adding the fully wetted heat conducting powder into acrylic pressure-sensitive adhesive water with a dispersing agent, and increasing the rotating speed of a stirrer to uniformly mix materials;
4) dissolving an isocyanate curing agent in a solvent, adding the isocyanate curing agent into the material obtained in the step 3), continuously stirring and uniformly mixing, and filtering the uniformly mixed material through a 200-mesh filter screen to obtain the heat conduction pressure sensitive adhesive glue;
5) standing the heat-conducting pressure-sensitive adhesive to remove bubbles or removing bubbles in vacuum, coating the heat-conducting pressure-sensitive adhesive on a release film layer, and drying redundant solvent through an oven to obtain the heat-conducting pressure-sensitive adhesive bare adhesive;
6) laminating the heat conduction pressure-sensitive adhesive on the release film layer through a laminating machine, and transferring the heat conduction pressure-sensitive adhesive to the glass fiber cloth to obtain a heat conduction double-sided adhesive tape;
7) placing the heat-conducting double-sided adhesive tape in a curing chamber for curing.
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| CN202110428212.XA CN113201289A (en) | 2021-04-21 | 2021-04-21 | Electronic packaging heat-conducting double-sided adhesive tape and preparation method thereof |
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| CN202110428212.XA CN113201289A (en) | 2021-04-21 | 2021-04-21 | Electronic packaging heat-conducting double-sided adhesive tape and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114836146A (en) * | 2022-06-14 | 2022-08-02 | 昆山兆科电子材料有限公司 | Reaction type heat-conducting insulating double-sided adhesive tape and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104087186A (en) * | 2014-02-27 | 2014-10-08 | 天诺光电材料股份有限公司 | Heat conducting adhesive tape and preparation method thereof |
| CN212934716U (en) * | 2020-08-28 | 2021-04-09 | 芜湖天量电池系统有限公司 | Power battery module structure |
-
2021
- 2021-04-21 CN CN202110428212.XA patent/CN113201289A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104087186A (en) * | 2014-02-27 | 2014-10-08 | 天诺光电材料股份有限公司 | Heat conducting adhesive tape and preparation method thereof |
| CN212934716U (en) * | 2020-08-28 | 2021-04-09 | 芜湖天量电池系统有限公司 | Power battery module structure |
Non-Patent Citations (1)
| Title |
|---|
| 金真 等: "《应用化学综合实验》", 30 September 2017, 中山大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114836146A (en) * | 2022-06-14 | 2022-08-02 | 昆山兆科电子材料有限公司 | Reaction type heat-conducting insulating double-sided adhesive tape and preparation method thereof |
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Application publication date: 20210803 |