CN210868319U - Heat conduction film for aluminum substrate and aluminum substrate - Google Patents
Heat conduction film for aluminum substrate and aluminum substrate Download PDFInfo
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- CN210868319U CN210868319U CN201921213590.0U CN201921213590U CN210868319U CN 210868319 U CN210868319 U CN 210868319U CN 201921213590 U CN201921213590 U CN 201921213590U CN 210868319 U CN210868319 U CN 210868319U
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Abstract
The utility model relates to a heat conduction film and aluminium base board for aluminium base board, this adhesive force enhancement layer that this heat conduction film is provided with on at least one side of heat conduction basic unit for aluminium base board. The heat-conducting base layer contains glass fiber reinforced material, has good mechanical strength, can be directly laminated with an aluminum plate and a copper foil and then is subjected to hot pressing, and the process is simple. The bonding force enhancement layer does not contain glass fiber reinforced materials, has higher bonding strength with metal materials so as to enhance the bonding firmness with the aluminum plate and/or the copper foil and avoid the problem that components or pads fall off in the downstream process.
Description
Technical Field
The utility model relates to an aluminium base board field especially relates to an aluminium base is heat conduction film and aluminium base board for board.
Background
The LED lamp is used as an environment-friendly light source and is widely applied to various fields, and the used aluminum-based laminated board contains an insulating heat-conducting film, so that heat generated by the operation of the lamp beads can be conducted to an aluminum plate, and the accumulation of the heat is reduced.
At present, the following two types of high thermal conductivity films are mainly used in the field of aluminum substrates. One type of film does not contain reinforcing materials, has the advantages of high heat conductivity coefficient, good bonding force with metal and low cost, but has soft quality, the film needs to be pasted on an aluminum plate in a false mode when used in downstream, the working procedure is complicated, and the reject ratio is high. In addition, the film without the reinforcing material has short storage period and is easy to cause waste. The other is a film containing glass fiber reinforced material, the material has certain strength, can be directly laminated with an aluminum plate and a copper foil and then is subjected to hot pressing, the process is simple, but the problem of low bonding force with metal exists, and the problem that components or pads fall off easily occurs in the downstream process such as the above-mentioned process.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a heat conductive film for an aluminum substrate and an aluminum substrate, which can solve the problem of low adhesion between the heat conductive film for an aluminum substrate containing a glass fiber reinforced material and a metal.
A heat conduction film for an aluminum substrate comprises a heat conduction base layer and a bonding force enhancement layer, wherein the heat conduction base layer is composed of a resin base body, a glass fiber reinforced material and first heat conduction particles, the bonding force enhancement layer is at least arranged on one side of the heat conduction base layer, and the glass fiber reinforced material and the first heat conduction particles are coated in the resin base body.
In one embodiment, the adhesion enhancing layer is disposed on both sides of the heat conductive base layer.
In one embodiment, the adhesion promotion layer has a thickness of 3 μm to 5 μm.
In one embodiment, the adhesion promotion layer contains second thermally conductive particles.
In one embodiment, the second thermally conductive particles have a particle size of 0.1 μm to 3 μm.
In one embodiment, the second thermally conductive particles have a distribution density of 1.0 × 104Per mm2～1.0×109Per mm2。
In one embodiment, the thickness of the heat-conducting base layer is 25-200 μm.
In one embodiment, the glass fiber reinforcement is a glass fiber mat or a glass fiber cloth.
In one embodiment, the fiberglass cloth is 101, 1015, 1017, 1027, 1037, or 106 gauge.
An aluminum substrate is characterized by comprising an aluminum plate, copper foils and the heat-conducting film for the aluminum substrate in any embodiment, wherein the copper foils of the aluminum plate are respectively arranged on two sides of the heat-conducting film for the aluminum substrate.
Compared with the prior art, the heat-conducting film for the aluminum substrate and the aluminum substrate have the following beneficial effects:
the heat-conducting film for the aluminum substrate and the aluminum substrate are provided with the adhesive force enhancement layer on at least one side of the heat-conducting base layer. The heat-conducting base layer contains glass fiber reinforced material, has good mechanical strength, can be directly laminated with an aluminum plate and a copper foil and then is subjected to hot pressing, and the process is simple. The bonding force enhancement layer does not contain glass fiber reinforced materials, has higher bonding strength with metal materials so as to enhance the bonding firmness with the aluminum plate and/or the copper foil and avoid the problem that components or pads fall off in the downstream process.
Drawings
FIG. 1 is a schematic structural view of a heat conductive film for an aluminum substrate according to an embodiment;
FIG. 2 is a schematic structural diagram of an aluminum substrate including the thermal conductive film for the aluminum substrate shown in FIG. 1.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a heat conductive film 100 for an aluminum substrate according to an embodiment of the present invention includes a heat conductive base layer 110 and a bonding strength enhancement layer 120.
Wherein the heat-conducting base layer 110 serves as a base layer of the heat-conducting film. The heat conductive base layer 110 includes a resin matrix 112, and a glass fiber reinforcement material 114 and first heat conductive particles encapsulated in the resin matrix 112.
An adhesion enhancing layer 120 is provided on at least one side of the heat conductive base layer 110. The bonding strength of the bonding strength enhancement layer 120 to the metal material is better than the bonding strength of the heat conduction base layer 110 to the metal material, and the bonding strength enhancement layer 120 is arranged on the surface of the heat conduction base layer 110, so that the defect that the bonding strength of the heat conduction base layer 110 to the metal material is poor can be overcome. It is understood that the adhesion enhancing layer 120 may be used for adhesion with a copper foil or for connection with an aluminum plate.
The heat conducting base layer 110 contains glass fiber materials, has good mechanical strength, can be directly laminated with an aluminum plate and a copper foil and then is subjected to hot pressing, and the process is simple. The adhesion enhancement layer 120 does not contain the glass fiber reinforced material 114, and has higher adhesion strength with a metal material so as to enhance the adhesion firmness with an aluminum plate and/or a copper foil and avoid the problem of component or pad falling off in the downstream processes such as the above process.
In the specific example shown in fig. 1, both sides of the heat conductive base layer 110 are provided with the adhesion enhancing layers 120. More specifically, two adhesion enhancing layers 120 are disposed on opposite sides of the thermally conductive base layer 110. Two adhesion enhancing layers 120 are used to connect the aluminum plate and the copper foil, respectively.
In one example, the thickness of the heat conductive base layer 110 is 25 μm to 200 μm. Further, in one example, the thickness of the thermal conductive base layer 110 is 50 μm to 150 μm. In some specific examples, the thickness of the thermal base layer 110 is 30 μm, 60 μm, 80 μm, 100 μm, 170 μm.
In one example, the resin matrix 112 in the thermal conductive base layer 110 is composed of raw material components including epoxy resin, curing agent, and the like.
In one example, the glass fiber reinforcement 114 included in the thermally conductive base layer 110 is a glass fiber mat or a glass fiber cloth. Optionally, the glass fiber cloth is in 101, 1015, 1017, 1027, 1037 or 106 specifications.
In the heat conductive base layer 110, the first heat conductive particles are dispersed in the resin matrix 112. Alternatively, the first heat conductive particles may be selected from, but not limited to, aluminum oxide, aluminum nitride, boron nitride, and the like.
In one example, the first thermally conductive particles have a particle size of 0.1 μm to 20 μm. Further, in one example, the first thermally conductive particles have a particle size of 0.5 μm to 12 μm. In some specific examples, the first thermally conductive particles have a particle size of 0.8 μm, 1 μm, 2.5 μm, 3 μm, 8 μm.
In one example, the firstThe distribution density of the thermally conductive particles in the resin matrix 112 was 5.0 × 102Per mm2～1.0×108Per mm2Further, in one example, the first thermally conductive particles have a distribution density of 1.0 × 10 in the resin matrix 1123Per mm2～1.0×107Per mm2In some specific examples, the first thermally conductive particles have a distribution density of 7.0 × 10 in the resin matrix 1122Per mm2、1.0×103Per mm2、1.0×104Per mm2、1.0×105Per mm2。
By adding a proper amount of the first heat conducting particles, the heat conducting base layer 110 has better mechanical strength, and the heat conducting base layer 110 has better heat conductivity. In one example, the thermal conductivity of the thermal conductive base layer 110 is 1.4W/(m · K), such as 1.5W/(m · K).
In one example, the adhesion promotion layer 120 has a thickness of 3 μm to 5 μm. Further, in one example, the adhesion promotion layer 120 has a thickness of 3.5 μm to 4.5 μm. In some specific examples, the adhesion promotion layer 120 has a thickness of 3.2 μm, 4 μm, 4.2 μm, 4.8 μm.
The thickness of the heat-conducting base layer 110 is much greater than that of the adhesive force enhancement layer 120, so that the mechanical strength of the heat-conducting film can be prevented from being reduced due to the arrangement of the adhesive force enhancement layer 120 on the basis of improving the adhesive strength of the surface of the heat-conducting film.
The adhesion enhancing layer 120 is an organic polymer layer, and preferably, the organic polymer in the adhesion enhancing layer 120 is the same as or similar to the resin matrix 112 in the heat conductive base layer 110, so as to ensure a firm bond between the adhesion enhancing layer 120 and the heat conductive base layer 110. In one example, the adhesion enhancing layer 120 is composed of raw materials including glycidyl amine type epoxy resin, a curing agent, and the like.
In one example, the adhesion enhancement layer 120 contains the second heat conduction particles, so that the adhesion enhancement layer 120 has high adhesion and forms a heat conduction network structure, and has high heat conduction capability, thereby effectively reducing heat accumulation during the operation of the LED lamp and prolonging the service life of the LED lamp.
Alternatively, the second thermally conductive particles may be selected from, but not limited to, aluminum oxide, aluminum nitride, boron nitride, and the like.
In one example, the second thermally conductive particles have a particle size of 0.1 μm to 3 μm. Further, in one example, the second thermally conductive particles have a particle size of 0.3 μm to 2.5 μm. In some specific examples, the second thermally conductive particles have a particle size of 0.5 μm, 0.8 μm, 1.5 μm, 2.0 μm, 2.2 μm.
In one example, the second thermally conductive particles have a distribution density of 1.0 × 10 in the resin matrix 1124Per mm2～1.0×109Per mm2Further, in one example, the distribution density of the second thermally conductive particles in the resin matrix 112 is 2.0 × 104Per mm2～1.0×108Per mm2In some specific examples, the second thermally conductive particles have a distribution density of 2.5 × 10 in the resin matrix 1124Per mm2、5.0×104Per mm2、1.0×105Per mm2、5.0×105Per mm2、1.0×106Per mm2。
By adding a proper amount of the second heat conducting particles into the adhesion enhancing layer 120, the adhesion enhancing layer 120 is kept to have better adhesion strength, and meanwhile, the adhesion enhancing layer 120 has better heat conductivity. In one example, the thermal conductivity of the thermal conductive base layer 110 is 1.4W/(m · K), such as 1.5W/(m · K).
Further, as shown in fig. 2, the present invention further provides an aluminum substrate 200, which includes an aluminum plate 210, a copper foil 220 and the heat conductive film 100 for aluminum substrate of any of the above examples, wherein the aluminum plate 210 and the copper foil 220 are respectively disposed on two sides of the heat conductive film 100 for aluminum substrate.
Wherein, copper foil 220 is used for being connected with LED lamp pearl, and aluminium base board 200 can make the produced heat conduction of lamp pearl work to aluminum plate 210 with heat conduction film 100 on, reduce thermal gathering.
The heat conductive film 100 for an aluminum substrate and the aluminum substrate 200 have an adhesive strength reinforcing layer 120 provided on at least one side of the heat conductive base layer 110. The heat conducting base layer 110 contains glass fiber reinforced material, has good mechanical strength, can be directly laminated with an aluminum plate and a copper foil and then is subjected to hot pressing, and the process is simple. The adhesion enhancement layer 120 does not contain glass fiber reinforced materials, and has higher adhesion strength with metal materials, so as to enhance the adhesion firmness with an aluminum plate and/or a copper foil and avoid the problem of component or pad falling off in the downstream processes such as the above process.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The heat-conducting film for the aluminum substrate is characterized by comprising a heat-conducting base layer and a bonding force enhancement layer, wherein the heat-conducting base layer is composed of a resin base body, a glass fiber reinforced material and first heat-conducting particles, the bonding force enhancement layer is at least arranged on one side of the heat-conducting base layer, and the glass fiber reinforced material and the first heat-conducting particles are coated in the resin base body.
2. The heat conductive film for the aluminum substrate according to claim 1, wherein the adhesion enhancing layer is disposed on both sides of the heat conductive base layer.
3. The heat conductive sheet according to claim 1, wherein the adhesion enhancing layer has a thickness of 3 μm to 5 μm.
4. The heat conductive film for aluminum substrate of claim 1, wherein the adhesion enhancing layer comprises second heat conductive particles.
5. The heat conductive film for the aluminum substrate according to claim 4, wherein the second heat conductive particles have a particle size of 0.1 μm to 3 μm.
6. The heat conductive film for the aluminum substrate according to claim 4 or 5, wherein the second heat conductive particles have a distribution density of 1 × 104Per mm2～1×109Per mm2。
7. The heat conductive film for the aluminum substrate according to any one of claims 1 to 5, wherein the thickness of the heat conductive base layer is 25 μm to 200 μm.
8. The heat conductive film for the aluminum substrate according to any one of claims 1 to 5, wherein the glass fiber reinforcement material is a glass fiber mat or a glass fiber cloth.
9. The heat conductive film for the aluminum substrate according to claim 8, wherein the glass fiber cloth is 101, 1015, 1017, 1027, 1037 or 106 in specification.
10. An aluminum substrate comprising an aluminum plate, a copper foil and the heat conductive film for an aluminum substrate according to any one of claims 1 to 9, wherein the aluminum plate and the copper foil are respectively disposed on both sides of the heat conductive film for an aluminum substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921213590.0U CN210868319U (en) | 2019-07-30 | 2019-07-30 | Heat conduction film for aluminum substrate and aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921213590.0U CN210868319U (en) | 2019-07-30 | 2019-07-30 | Heat conduction film for aluminum substrate and aluminum substrate |
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| Publication Number | Publication Date |
|---|---|
| CN210868319U true CN210868319U (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921213590.0U Active CN210868319U (en) | 2019-07-30 | 2019-07-30 | Heat conduction film for aluminum substrate and aluminum substrate |
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| CN (1) | CN210868319U (en) |
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- 2019-07-30 CN CN201921213590.0U patent/CN210868319U/en active Active
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