CN210868319U - Heat conduction film for aluminum substrate and aluminum substrate - Google Patents

Abstract

The utility model relates to a heat conduction film and aluminium base board for aluminium base board, this adhesive force enhancement layer that this heat conduction film is provided with on at least one side of heat conduction basic unit for aluminium base board. The heat-conducting base layer contains glass fiber reinforced material, has good mechanical strength, can be directly laminated with an aluminum plate and a copper foil and then is subjected to hot pressing, and the process is simple. The bonding force enhancement layer does not contain glass fiber reinforced materials, has higher bonding strength with metal materials so as to enhance the bonding firmness with the aluminum plate and/or the copper foil and avoid the problem that components or pads fall off in the downstream process.

Description

Thermal conductive film for aluminum substrate and aluminum substrate

technical field

The utility model relates to the field of aluminum substrates, in particular to a thermal conductive film for aluminum substrates and an aluminum substrate.

Background technique

As an environmentally friendly light source, LED lamps have been widely used in various fields. The aluminum-based laminate used in it contains a layer of insulating thermal conductive film, which can conduct the heat generated by the lamp beads to the aluminum plate and reduce the accumulation of heat. .

At present, the following two types of high thermal conductivity films are mainly used in the field of aluminum substrates. One is the film without reinforcing material, which has the advantages of high thermal conductivity, good adhesion to metal and low cost, but it is soft in quality. When downstream use, the film needs to be falsely attached to the aluminum plate, the process is complicated, and the defective rate is high. high. In addition, the shelf life of film without reinforcement material is short, which can easily lead to waste. The other is a film containing glass fiber reinforced material. The material has a certain strength and can be directly laminated with aluminum plates and copper foils and then hot-pressed. The process is simple, but there is a problem of low adhesion to metals. In the downstream process, such as the above piece It is easy to cause the problem of components or pads falling off.

Utility model content

Based on this, it is necessary to provide a thermally conductive film for an aluminum substrate and an aluminum substrate to solve the problem of low adhesion between the thermally conductive film for an aluminum substrate containing glass fiber reinforced materials and a metal.

A thermally conductive film for an aluminum substrate, comprising a thermally conductive base layer composed of a resin matrix, a glass fiber reinforced material and first thermally conductive particles, and an adhesion enhancement layer arranged at least on one side of the thermally conductive base layer, the glass fiber reinforced material and the The first thermally conductive particles are encapsulated in the resin matrix.

In one embodiment, both sides of the thermally conductive base layer are provided with the adhesion-enhancing layer.

In one embodiment, the thickness of the adhesion enhancing layer is 3 μm˜5 μm.

In one embodiment, the adhesion-enhancing layer contains second thermally conductive particles.

In one embodiment, the particle size of the second thermally conductive particles is 0.1 μm˜3 μm.

In one embodiment, the distribution density of the second thermally conductive particles is 1.0×10 ⁴ /mm ² to 1.0×10 ⁹ /mm ² .

In one embodiment, the thickness of the thermally conductive base layer is 25 μm˜200 μm.

In one embodiment, the glass fiber reinforcement material is glass fiber mat or glass fiber cloth.

In one embodiment, the fiberglass cloth is 101, 1015, 1017, 1027, 1037 or 106 gauge.

An aluminum substrate is characterized in that it includes an aluminum plate, a copper foil, and a thermally conductive film for an aluminum substrate according to any one of the above embodiments, and each of the copper foils of the aluminum plate is respectively disposed on both sides of the thermally conductive film for an aluminum substrate.

Compared with the existing solution, the above-mentioned thermal conductive film for aluminum substrate and aluminum substrate have the following beneficial effects:

In the above-mentioned thermal conductive film for aluminum substrate and aluminum substrate, an adhesive force enhancement layer is provided on at least one side of the thermal conductive base layer. Among them, the heat-conducting base layer contains glass fiber reinforced material, which has good mechanical strength, can be directly laminated with aluminum plate and copper foil and then hot-pressed, and the process is simple. The adhesion enhancement layer does not contain glass fiber reinforced material, and has a high bonding strength with metal materials to enhance the bonding firmness with aluminum plates and/or copper foils, and avoid the occurrence of components in downstream processes such as the above or the problem of the pads falling off.

Description of drawings

1 is a schematic structural diagram of a thermally conductive film for an aluminum substrate according to an embodiment;

FIG. 2 is a schematic structural diagram of an aluminum substrate including the thermally conductive film for the aluminum substrate shown in FIG. 1 .

Detailed ways

In order to facilitate the understanding of the present utility model, the present utility model will be more fully described below with reference to the related drawings. The preferred embodiments of the present utility model are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in FIG. 1 , a thermally conductive film 100 for an aluminum substrate according to an embodiment of the present invention includes a thermally conductive base layer 110 and an adhesion-enhancing layer 120 .

The thermally conductive base layer 110 serves as the base layer of the thermally conductive film. The thermally conductive base layer 110 includes a resin matrix 112 , and a glass fiber reinforced material 114 and first thermally conductive particles wrapped in the resin matrix 112 .

The adhesion enhancement layer 120 is disposed on at least one side of the thermally conductive base layer 110 . The bonding strength of the adhesion enhancement layer 120 to the metal material is better than that of the thermally conductive base layer 110 to the metal material. The adhesion enhancement layer 120 is arranged on the surface of the thermally conductive base layer 110, which can make up for the adhesion of the thermally conductive base layer 110 to the metal material. Insufficient strength. It can be understood that, the adhesion enhancement layer 120 can be used for bonding with copper foil, and also can be used for connecting with aluminum plate.

The heat-conducting base layer 110 contains glass fiber material, which has good mechanical strength, and can be directly laminated with aluminum plate and copper foil and then hot-pressed, and the process is simple. The adhesion enhancement layer 120 does not contain the glass fiber reinforcement material 114, and has a high adhesion strength with the metal material, so as to enhance the adhesion with the aluminum plate and/or the copper foil, so as to avoid occurrence in the downstream process such as the above part. The problem of components or pads falling off.

In the specific example shown in FIG. 1 , both sides of the thermally conductive base layer 110 are provided with adhesion enhancing layers 120 . More specifically, two adhesion enhancing layers 120 are disposed on opposite sides of the thermally conductive base layer 110 . The two adhesion-enhancing layers 120 are used to connect the aluminum plate and the copper foil, respectively.

In one example, the thickness of the thermally conductive base layer 110 is 25 μm˜200 μm. Further, in one example, the thickness of the thermally conductive base layer 110 is 50 μm˜150 μm. In some specific examples, the thickness of the thermally conductive base layer 110 is 30 μm, 60 μm, 80 μm, 100 μm, 170 μm.

In one example, the resin matrix 112 in the thermally conductive base layer 110 is composed of raw materials including epoxy resin, curing agent and the like.

In one example, the glass fiber reinforcing material 114 contained in the thermally conductive base layer 110 is glass fiber mat or glass fiber cloth. Optionally, 101, 1015, 1017, 1027, 1037 or 106 specifications are used for the glass fiber cloth.

In the thermally conductive base layer 110 , the first thermally conductive particles are dispersed in the resin matrix 112 . Optionally, the first thermally conductive particles can be selected from, but not limited to, aluminum oxide, aluminum nitride, boron nitride, and the like.

In one example, the particle size of the first thermally conductive particles is 0.1 μm˜20 μm. Further, in one example, the particle size of the first thermally conductive particles is 0.5 μm˜12 μm. In some specific examples, the particle sizes of the first thermally conductive particles are 0.8 μm, 1 μm, 2.5 μm, 3 μm, and 8 μm.

In one example, the distribution density of the first thermally conductive particles in the resin matrix 112 is 5.0×10 ² pieces/mm ² to 1.0×10 ⁸ pieces/mm ² . Further, in one example, the distribution density of the first thermally conductive particles in the resin matrix 112 is 1.0×10 ³ pieces/mm ² to 1.0×10 ⁷ pieces/mm ² . In some specific examples, the distribution density of the first thermally conductive particles in the resin matrix 112 is 7.0×10 ² /mm ² , 1.0×10 ³ /mm ² , 1.0×10 ⁴ /mm ² , 1.0×10 ⁵ /mm ² .

By adding an appropriate amount of the first thermally conductive particles, the thermally conductive base layer 110 is maintained to have good mechanical strength, and at the same time, the thermally conductive base layer 110 has good thermal conductivity. In one example, the thermal conductivity of the thermally conductive base layer 110 is greater than or equal to 1.4 W/(m·K), such as 1.5 W/(m·K).

In one example, the thickness of the adhesion enhancing layer 120 is 3 μm˜5 μm. Further, in one of the examples, the thickness of the adhesion enhancing layer 120 is 3.5 μm˜4.5 μm. In some specific examples, the thickness of the adhesion enhancing layer 120 is 3.2 μm, 4 μm, 4.2 μm, 4.8 μm.

The thickness of the thermally conductive base layer 110 is much larger than the thickness of the adhesive force enhancement layer 120 . On the basis of improving the adhesive strength of the surface of the thermally conductive film, the mechanical strength of the thermally conductive film can be prevented from being reduced due to the arrangement of the adhesive force enhancement layer 120 .

The adhesion-enhancing layer 120 is an organic polymer layer. Preferably, the organic polymer in the adhesion-enhancing layer 120 is the same as or similar to the resin matrix 112 in the thermally conductive base layer 110 to ensure that the adhesion-enhancing layer 120 and the thermally conductive The base layers 110 are firmly bonded. In one example, the adhesion enhancing layer 120 is composed of raw materials including glycidylamine epoxy resin, curing agent and the like.

In one example, the adhesion-enhancing layer 120 contains second thermally conductive particles, so that the adhesion-enhancing layer 120 has high adhesion and forms a thermally conductive network structure with high thermal conductivity, thereby effectively reducing the work of the LED lamp When the heat builds up, the life of the LED lamp is increased.

Optionally, the second thermally conductive particles can be selected from, but not limited to, aluminum oxide, aluminum nitride, boron nitride, and the like.

In one example, the particle size of the second thermally conductive particles is 0.1 μm˜3 μm. Further, in one of the examples, the particle size of the second thermally conductive particles is 0.3 μm˜2.5 μm. In some specific examples, the particle sizes of the second thermally conductive particles are 0.5 μm, 0.8 μm, 1.5 μm, 2.0 μm, and 2.2 μm.

In one example, the distribution density of the second thermally conductive particles in the resin matrix 112 is 1.0×10 ⁴ pieces/mm ² to 1.0×10 ⁹ pieces/mm ² . Further, in one of the examples, the distribution density of the second thermally conductive particles in the resin matrix 112 is 2.0×10 ⁴ pieces/mm ² to 1.0×10 ⁸ pieces/mm ² . In some specific examples, the distribution density of the second thermally conductive particles in the resin matrix 112 is 2.5×10 ⁴ /mm ² , 5.0×10 ⁴ /mm ² , 1.0×10 ⁵ /mm ² , 5.0×10 ⁵ pieces/mm ² , 1.0×10 ⁶ pieces/mm ² .

By adding an appropriate amount of the second thermally conductive particles into the adhesive force enhancing layer 120 , the adhesive force enhancing layer 120 can be maintained to have good adhesive strength, and at the same time, the adhesive force enhancing layer 120 can be made to have good thermal conductivity. In one example, the thermal conductivity of the thermally conductive base layer 110 is greater than or equal to 1.4 W/(m·K), such as 1.5 W/(m·K).

Further, as shown in FIG. 2 , the present invention further provides an aluminum substrate 200 . The aluminum substrate includes an aluminum plate 210 , a copper foil 220 and the thermally conductive film 100 for an aluminum substrate in any of the above examples. The aluminum plate 210 and the copper foil 220 are respectively It is arranged on both sides of the thermal conductive film 100 for an aluminum substrate.

The copper foil 220 is used to connect with the LED lamp beads, and the thermal conductive film 100 used for the aluminum substrate 200 can conduct the heat generated by the operation of the lamp beads to the aluminum plate 210 to reduce the accumulation of heat.

The above-mentioned thermal conductive film 100 for aluminum substrate and aluminum substrate 200 are provided with an adhesion enhancement layer 120 on at least one side of the thermal conductive base layer 110 . Among them, the heat-conducting base layer 110 contains glass fiber reinforced material, which has good mechanical strength, can be directly laminated with aluminum plate and copper foil and then hot-pressed, and the process is simple. The adhesion enhancement layer 120 does not contain glass fiber reinforcement material, and has high adhesion strength with metal materials, so as to enhance the adhesion firmness with aluminum plates and/or copper foils, and avoid the occurrence of defects in downstream processes such as the above parts. The problem of device or pad peeling off.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present utility model, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the utility model patent. It should be pointed out that for those of ordinary skill in the art, some modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for this utility model shall be subject to the appended claims.

Claims (10)

1. The heat-conducting film for the aluminum substrate is characterized by comprising a heat-conducting base layer and a bonding force enhancement layer, wherein the heat-conducting base layer is composed of a resin base body, a glass fiber reinforced material and first heat-conducting particles, the bonding force enhancement layer is at least arranged on one side of the heat-conducting base layer, and the glass fiber reinforced material and the first heat-conducting particles are coated in the resin base body.

2. The heat conductive film for the aluminum substrate according to claim 1, wherein the adhesion enhancing layer is disposed on both sides of the heat conductive base layer.

3. The heat conductive sheet according to claim 1, wherein the adhesion enhancing layer has a thickness of 3 μm to 5 μm.

4. The heat conductive film for aluminum substrate of claim 1, wherein the adhesion enhancing layer comprises second heat conductive particles.

5. The heat conductive film for the aluminum substrate according to claim 4, wherein the second heat conductive particles have a particle size of 0.1 μm to 3 μm.

6. The heat conductive film for the aluminum substrate according to claim 4 or 5, wherein the second heat conductive particles have a distribution density of 1 × 10⁴Per mm²～1×10⁹Per mm²。

7. The heat conductive film for the aluminum substrate according to any one of claims 1 to 5, wherein the thickness of the heat conductive base layer is 25 μm to 200 μm.

8. The heat conductive film for the aluminum substrate according to any one of claims 1 to 5, wherein the glass fiber reinforcement material is a glass fiber mat or a glass fiber cloth.

9. The heat conductive film for the aluminum substrate according to claim 8, wherein the glass fiber cloth is 101, 1015, 1017, 1027, 1037 or 106 in specification.

10. An aluminum substrate comprising an aluminum plate, a copper foil and the heat conductive film for an aluminum substrate according to any one of claims 1 to 9, wherein the aluminum plate and the copper foil are respectively disposed on both sides of the heat conductive film for an aluminum substrate.

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