CN201436206U - High heat conducting metal-based and copper foil-coated laminated plate - Google Patents
High heat conducting metal-based and copper foil-coated laminated plate Download PDFInfo
- Publication number
- CN201436206U CN201436206U CN2009200522792U CN200920052279U CN201436206U CN 201436206 U CN201436206 U CN 201436206U CN 2009200522792 U CN2009200522792 U CN 2009200522792U CN 200920052279 U CN200920052279 U CN 200920052279U CN 201436206 U CN201436206 U CN 201436206U
- Authority
- CN
- China
- Prior art keywords
- heat conducting
- copper foil
- metal substrate
- copper
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 239000011889 copper foil Substances 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004411 aluminium Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 239000002313 adhesive film Substances 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 229920000459 Nitrile rubber Polymers 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- -1 curing accelerator Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 230000037250 Clearance Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000035512 clearance Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002349 favourable Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Abstract
The utility model discloses a high heat conducting metal-based and copper foil-coated laminated plate, composed of a metal substrate (1), a heat conducting insulating layer (2) and a copper foil (3) by adhering, wherein the heat conducting insulating layer (2) is one layer or more heat conducting glue films which are continuously gummed, and the essential components pf the heat conducting glue films comprise epoxy resin, thermoplastic resin or/and synthesized butadiene nitrile rubber, a curing agent, a curing accelerator and inorganic heat conducting fillers. Compared with general metal-based and copper foil-coated laminated plate, the laminated plate of the utility model has advantages of higher thermal conductivity, punching resistant performance and combination property.
Description
Technical field
The utility model relates to a kind of high heat-conducting type Metal Substrate copper-clad laminate that is used to make printed substrate.
Background technology
Along with electronic product develops to light, thin, little, high density, multifunction, element packing density and integrated level are more and more higher in the printed board, power consumption is increasing, thermal diffusivity to substrate requires more and more urgent, if the thermal diffusivity of substrate is bad, will cause on the printed circuit board components and parts overheated, thereby whole aircraft reliability is descended.High heat radiating metal base copper-clad laminate has been born under this background.
Most widely used genus aluminium-based copper-clad laminate in the Metal Substrate copper-clad laminate, this product be 1969 by the invention of SANYO GS state basic policy, began to be applied to STK series power amplification hydrid integrated circuit in 1974.The beginning of the eighties, China's Metal Substrate copper-clad laminate was mainly used in war products, and the complete dependence on import of metal substrate material cost an arm and a leg at that time.The middle and later periods eighties, expansion along with the widely-used and consumption of aluminium-based copper-clad laminate in automobile, motorcycle electric product, promoted the development of China's metal substrate research and manufacturing technology and in the extensive use of numerous areas such as electronics, telecommunications, electric power, especially in high-power at some, the high capacity electronic devices and components, require aluminium-based copper-clad laminate under 100-250 ℃ of temperature, to have favorable mechanical, electric property.
And the insulating barrier of the centre of existing Metal Substrate copper-clad laminate mainly is the bonding sheet that adopts simple glass cloth impregnation made, in aspect of performance poor effect such as thermal conductivity, anti-hygroscopicity, anti-die-cut property; Other method adopts coated with thermally conductive glue on aluminium sheet, but the method is difficult to guarantee the heat conduction glue-line homogeneous thickness is arranged, and the Metal Substrate copper-clad laminate thermal resistance stability of making is not high.
The utility model content
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, and the high heat-conducting type Metal Substrate copper-clad laminate that a kind of thermal resistance is little and high conformity, anti-hygroscopicity and anti-die-cut property are high is provided.
The technical scheme that the utility model adopted is: the utility model is made up of metal substrate, heat conductive insulating layer and Copper Foil compound sticking, and described heat conductive insulating layer is made up of by the conductive adhesive film of serialization gluing one deck or multilayer.
Described conductive adhesive film main component is that epoxy resin, thermoplastic resin are or/and solid constituent and organic solvents such as synthetic acrylonitrile-butadiene rubber, curing agent, curing accelerator, inorganic heat fillings.
The thickness of described metal substrate is 0.1-10mm, and the thickness of heat conductive insulating layer is 20-2000 μ m, and the thickness of Copper Foil is 9-350 μ m.
Described metal substrate is an aluminium sheet, or copper coin, or galvanized iron sheet, or steel plate.
Metal substrate commonly used adopts aluminium sheet, and in high thermal conductivity aluminium-based copper-clad laminate, because the thermal conductivity of metallic aluminium and copper is very good, so the thermal conductivity of insulating barrier directly determines the thermal conductivity of aluminium base copper-clad plate, core in this programme applies glued membrane for the heat conductive insulating layer adopts by serialization, main component is resin system and filler, specifically be with epoxy resin, thermoplastic resin is or/and synthetic acrylonitrile-butadiene rubber, curing agent, curing accelerator, solid constituents such as inorganic heat filling are dissolved in organic solvent, be coated on the mould release membrance, with the mould release membrance is that carrier cures through shearing the required glued membrane of formation, only mould release membrance be need peel off during hot pressing, PCB press device and aluminium base under certain process conditions, passed through, the Copper Foil pressing is bonding to get final product.
Gluing is according to the viscosity of glue, solids content with to the requirement of bondline thickness, and the left, center, right unanimity is guaranteed in the gap of the strict control of clearance gauge spreading roller, and thickness deviation can reach ± 5 μ m.For 35 μ m Copper Foils commonly used, it is better that bondline thickness is controlled to be 50 μ m ± 150 μ m.When glue-line is too thin, can cause breakdown voltage to descend; And glue-line is when blocked up, and thermal resistance can strengthen, and influences heat-conducting effect.
The beneficial effects of the utility model are: be used for the bonding sheet of the continuous glue film of pressed metal base copper-clad laminate than simple glass cloth impregnation made in the utility model, in many-sides such as thermal conductivity, anti-hygroscopicity, anti-die-cut property remarkable advantages arranged; Than the direct method of coated with thermally conductive glue on aluminium sheet, aspect the uniformity of heat-conducting glue layer thickness and the Metal Substrate copper-clad laminate thermal resistance stability of making remarkable advantages is being arranged.In pressing process, can use general PCB press device and the little process conditions of difference, because the pliability of glued membrane and fluidity control is less, make and suppress the thickness that is easy to control the heat conductive insulating layer in the engineering, thereby guarantee the breakdown voltage of metal base copper-clad laminate and the stability of thermal resistance; Owing to exist a large amount of inorganic fillers can reduce the thermal coefficient of expansion of heat conductive insulating layer in the glued membrane, make its plate face more smooth than common metal base copper-clad laminate.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structural representation of conductive adhesive film in the utility model.
The specific embodiment
As Fig. 1, shown in Figure 2, the utility model is by metal substrate 1, heat conductive insulating layer 2 and Copper Foil 3 compound stickings are formed, described heat conductive insulating layer 2 is made up of one or more layers conductive adhesive film 4 by the serialization gluing, described conductive adhesive film 4 is an epoxy resin, thermoplastic resin is or/and synthetic acrylonitrile-butadiene rubber, curing agent, curing accelerator, solid constituents such as inorganic heat filling are dissolved in organic solvent and pass through gluing then, cure, series of processes such as shearing form, described metal substrate 1 is to adopt the good aluminium sheet of thermal diffusivity, its thickness is 1.5mm, the thickness of heat conductive insulating layer 2 is 100 μ m, and the thickness of Copper Foil 3 is 35 μ m; Concrete preparation process is as follows:
(1) mixes the liquid dispersion that described solid constituent forms composition epoxy resin by described organic solvent, use coating equipment that this dispersion is coated on the mould release membrance 5;
(2) make be coated with this dispersion mould release membrance 5 through drying ovens, remove organic solvent and dry compositions, contain the continuous glue film 4 of semi-solid preparation attitude with formation, baking temperature is 80-180 ℃, 2-10 minute heat time heating time;
(3) with this conductive adhesive film 4, peel off mould release membrance 5, again that the aluminium sheet after electrolytic copper foil and the processing is superimposed, hot pressing under certain process conditions, cooling, discharging promptly make the utility model.
Metal Substrate copper-clad laminate in the present embodiment has excellent thermal conductivity, anti-die-cut property and combination property, and thermal conductivity factor 〉=1.0W/mk, and other performance all reaches the correlation technique requirement.
Claims (3)
1. high heat-conducting type Metal Substrate copper-clad laminate is made up of metal substrate (1), heat conductive insulating layer (2) and Copper Foil (3) compound sticking, and it is characterized in that: described heat conductive insulating layer (2) is made up of by the conductive adhesive film of serialization gluing one deck or multilayer.
2. high heat-conducting type Metal Substrate copper-clad laminate according to claim 1 is characterized in that: the thickness of described heat conductive insulating layer (2) is 20-2000 μ m, and the thickness of described Copper Foil (3) is 9-350 μ m.
3. high heat-conducting type Metal Substrate copper-clad laminate according to claim 1, it is characterized in that: described metal substrate (1) is an aluminium sheet, or copper coin, or galvanized iron sheet, or steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200522792U CN201436206U (en) | 2009-03-09 | 2009-03-09 | High heat conducting metal-based and copper foil-coated laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200522792U CN201436206U (en) | 2009-03-09 | 2009-03-09 | High heat conducting metal-based and copper foil-coated laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201436206U true CN201436206U (en) | 2010-04-07 |
Family
ID=42372663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200522792U Expired - Lifetime CN201436206U (en) | 2009-03-09 | 2009-03-09 | High heat conducting metal-based and copper foil-coated laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201436206U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN102514348A (en) * | 2012-01-09 | 2012-06-27 | 郭长奇 | Method for manufacturing high thermal conductivity metal-base copper-clad plate |
| CN102700187A (en) * | 2012-05-28 | 2012-10-03 | 珠海亚泰电子科技有限公司 | Double-sided release film, heat-conducting rubber film including release film, and application of such release film in production process of aluminum substrate |
| CN103879087A (en) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | Heat-conducting copper foil |
| CN104149471A (en) * | 2014-07-10 | 2014-11-19 | 腾辉电子（苏州）有限公司 | Preparation method of resin coated copper foil and copper foil coated laminated board manufactured by resin coated copper foil |
| CN105196645A (en) * | 2015-11-05 | 2015-12-30 | 惠州市煜鑫达科技有限公司 | Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate |
| CN105835467A (en) * | 2016-03-26 | 2016-08-10 | 林俊宝 | Aluminum substrate material being bendable randomly and production method thereof |
| CN108940797A (en) * | 2018-08-10 | 2018-12-07 | 焦作市高森建电子科技有限公司 | A kind of aluminum-based copper-clad plate copper foil coating technique |
| CN109327957A (en) * | 2018-12-05 | 2019-02-12 | 景旺电子科技(龙川)有限公司 | A kind of conduction copper substrate and preparation method thereof |
| CN111029452A (en) * | 2019-12-10 | 2020-04-17 | 合肥彩虹蓝光科技有限公司 | Ultraviolet light emitting diode packaging structure and packaging method thereof, and ultraviolet lamp |
| WO2020133965A1 (en) * | 2018-12-29 | 2020-07-02 | 广东生益科技股份有限公司 | Metal base copper foil-coated laminate and preparation method therefor |
| CN111823693A (en) * | 2020-06-09 | 2020-10-27 | 湖北宏洋电子股份有限公司 | Preparation method and device of high-thermal-conductivity copper-clad plate |
-
2009
- 2009-03-09 CN CN2009200522792U patent/CN201436206U/en not_active Expired - Lifetime
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN102029745B (en) * | 2010-08-31 | 2013-09-18 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN102514348A (en) * | 2012-01-09 | 2012-06-27 | 郭长奇 | Method for manufacturing high thermal conductivity metal-base copper-clad plate |
| CN102514348B (en) * | 2012-01-09 | 2014-07-23 | 郭长奇 | Method for manufacturing high thermal conductivity metal-base copper-clad plate |
| CN102700187A (en) * | 2012-05-28 | 2012-10-03 | 珠海亚泰电子科技有限公司 | Double-sided release film, heat-conducting rubber film including release film, and application of such release film in production process of aluminum substrate |
| CN102700187B (en) * | 2012-05-28 | 2015-04-22 | 珠海亚泰电子科技有限公司 | Production process of aluminum substrate |
| CN103879087A (en) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | Heat-conducting copper foil |
| CN104149471A (en) * | 2014-07-10 | 2014-11-19 | 腾辉电子（苏州）有限公司 | Preparation method of resin coated copper foil and copper foil coated laminated board manufactured by resin coated copper foil |
| CN105196645A (en) * | 2015-11-05 | 2015-12-30 | 惠州市煜鑫达科技有限公司 | Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate |
| CN105835467A (en) * | 2016-03-26 | 2016-08-10 | 林俊宝 | Aluminum substrate material being bendable randomly and production method thereof |
| CN108940797A (en) * | 2018-08-10 | 2018-12-07 | 焦作市高森建电子科技有限公司 | A kind of aluminum-based copper-clad plate copper foil coating technique |
| CN109327957A (en) * | 2018-12-05 | 2019-02-12 | 景旺电子科技(龙川)有限公司 | A kind of conduction copper substrate and preparation method thereof |
| CN109327957B (en) * | 2018-12-05 | 2021-03-12 | 景旺电子科技(龙川)有限公司 | Heat-conducting copper substrate and manufacturing method thereof |
| WO2020133965A1 (en) * | 2018-12-29 | 2020-07-02 | 广东生益科技股份有限公司 | Metal base copper foil-coated laminate and preparation method therefor |
| CN111029452A (en) * | 2019-12-10 | 2020-04-17 | 合肥彩虹蓝光科技有限公司 | Ultraviolet light emitting diode packaging structure and packaging method thereof, and ultraviolet lamp |
| CN111823693A (en) * | 2020-06-09 | 2020-10-27 | 湖北宏洋电子股份有限公司 | Preparation method and device of high-thermal-conductivity copper-clad plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 519125 Guangdong Province, Zhuhai city Doumen District Baijiao Industrial Park New Road No. 23 Patentee after: Guangdong all treasures Polytron Technologies Inc Address before: 519000 No. three, No. 6, Gongbei port, Guangdong, Zhuhai Patentee before: Zhuhai Totking Electron Technology Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100407 |
|
| CX01 | Expiry of patent term |