CN201436206U - High heat conducting metal-based and copper foil-coated laminated plate - Google Patents

High heat conducting metal-based and copper foil-coated laminated plate Download PDF

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Publication number
CN201436206U
CN201436206U CN2009200522792U CN200920052279U CN201436206U CN 201436206 U CN201436206 U CN 201436206U CN 2009200522792 U CN2009200522792 U CN 2009200522792U CN 200920052279 U CN200920052279 U CN 200920052279U CN 201436206 U CN201436206 U CN 201436206U
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CN
China
Prior art keywords
heat conducting
copper foil
copper
metal substrate
heat
Prior art date
Application number
CN2009200522792U
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Chinese (zh)
Inventor
罗君
林晨
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珠海全宝电子科技有限公司
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Priority to CN2009200522792U priority Critical patent/CN201436206U/en
Application granted granted Critical
Publication of CN201436206U publication Critical patent/CN201436206U/en

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Abstract

The utility model discloses a high heat conducting metal-based and copper foil-coated laminated plate, composed of a metal substrate (1), a heat conducting insulating layer (2) and a copper foil (3) by adhering, wherein the heat conducting insulating layer (2) is one layer or more heat conducting glue films which are continuously gummed, and the essential components pf the heat conducting glue films comprise epoxy resin, thermoplastic resin or/and synthesized butadiene nitrile rubber, a curing agent, a curing accelerator and inorganic heat conducting fillers. Compared with general metal-based and copper foil-coated laminated plate, the laminated plate of the utility model has advantages of higher thermal conductivity, punching resistant performance and combination property.

Description

High heat-conducting type Metal Substrate copper-clad laminate

Technical field

The utility model relates to a kind of high heat-conducting type Metal Substrate copper-clad laminate that is used to make printed substrate.

Background technology

Along with electronic product develops to light, thin, little, high density, multifunction, element packing density and integrated level are more and more higher in the printed board, power consumption is increasing, thermal diffusivity to substrate requires more and more urgent, if the thermal diffusivity of substrate is bad, will cause on the printed circuit board components and parts overheated, thereby whole aircraft reliability is descended.High heat radiating metal base copper-clad laminate has been born under this background.

Most widely used genus aluminium-based copper-clad laminate in the Metal Substrate copper-clad laminate, this product be 1969 by the invention of SANYO GS state basic policy, began to be applied to STK series power amplification hydrid integrated circuit in 1974.The beginning of the eighties, China's Metal Substrate copper-clad laminate was mainly used in war products, and the complete dependence on import of metal substrate material cost an arm and a leg at that time.The middle and later periods eighties, expansion along with the widely-used and consumption of aluminium-based copper-clad laminate in automobile, motorcycle electric product, promoted the development of China's metal substrate research and manufacturing technology and in the extensive use of numerous areas such as electronics, telecommunications, electric power, especially in high-power at some, the high capacity electronic devices and components, require aluminium-based copper-clad laminate under 100-250 ℃ of temperature, to have favorable mechanical, electric property.

And the insulating barrier of the centre of existing Metal Substrate copper-clad laminate mainly is the bonding sheet that adopts simple glass cloth impregnation made, in aspect of performance poor effect such as thermal conductivity, anti-hygroscopicity, anti-die-cut property; Other method adopts coated with thermally conductive glue on aluminium sheet, but the method is difficult to guarantee the heat conduction glue-line homogeneous thickness is arranged, and the Metal Substrate copper-clad laminate thermal resistance stability of making is not high.

The utility model content

Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, and the high heat-conducting type Metal Substrate copper-clad laminate that a kind of thermal resistance is little and high conformity, anti-hygroscopicity and anti-die-cut property are high is provided.

The technical scheme that the utility model adopted is: the utility model is made up of metal substrate, heat conductive insulating layer and Copper Foil compound sticking, and described heat conductive insulating layer is made up of by the conductive adhesive film of serialization gluing one deck or multilayer.

Described conductive adhesive film main component is that epoxy resin, thermoplastic resin are or/and solid constituent and organic solvents such as synthetic acrylonitrile-butadiene rubber, curing agent, curing accelerator, inorganic heat fillings.

The thickness of described metal substrate is 0.1-10mm, and the thickness of heat conductive insulating layer is 20-2000 μ m, and the thickness of Copper Foil is 9-350 μ m.

Described metal substrate is an aluminium sheet, or copper coin, or galvanized iron sheet, or steel plate.

Metal substrate commonly used adopts aluminium sheet, and in high thermal conductivity aluminium-based copper-clad laminate, because the thermal conductivity of metallic aluminium and copper is very good, so the thermal conductivity of insulating barrier directly determines the thermal conductivity of aluminium base copper-clad plate, core in this programme applies glued membrane for the heat conductive insulating layer adopts by serialization, main component is resin system and filler, specifically be with epoxy resin, thermoplastic resin is or/and synthetic acrylonitrile-butadiene rubber, curing agent, curing accelerator, solid constituents such as inorganic heat filling are dissolved in organic solvent, be coated on the mould release membrance, with the mould release membrance is that carrier cures through shearing the required glued membrane of formation, only mould release membrance be need peel off during hot pressing, PCB press device and aluminium base under certain process conditions, passed through, the Copper Foil pressing is bonding to get final product.

Gluing is according to the viscosity of glue, solids content with to the requirement of bondline thickness, and the left, center, right unanimity is guaranteed in the gap of the strict control of clearance gauge spreading roller, and thickness deviation can reach ± 5 μ m.For 35 μ m Copper Foils commonly used, it is better that bondline thickness is controlled to be 50 μ m ± 150 μ m.When glue-line is too thin, can cause breakdown voltage to descend; And glue-line is when blocked up, and thermal resistance can strengthen, and influences heat-conducting effect.

The beneficial effects of the utility model are: be used for the bonding sheet of the continuous glue film of pressed metal base copper-clad laminate than simple glass cloth impregnation made in the utility model, in many-sides such as thermal conductivity, anti-hygroscopicity, anti-die-cut property remarkable advantages arranged; Than the direct method of coated with thermally conductive glue on aluminium sheet, aspect the uniformity of heat-conducting glue layer thickness and the Metal Substrate copper-clad laminate thermal resistance stability of making remarkable advantages is being arranged.In pressing process, can use general PCB press device and the little process conditions of difference, because the pliability of glued membrane and fluidity control is less, make and suppress the thickness that is easy to control the heat conductive insulating layer in the engineering, thereby guarantee the breakdown voltage of metal base copper-clad laminate and the stability of thermal resistance; Owing to exist a large amount of inorganic fillers can reduce the thermal coefficient of expansion of heat conductive insulating layer in the glued membrane, make its plate face more smooth than common metal base copper-clad laminate.

Description of drawings

Fig. 1 is a structural representation of the present utility model;

Fig. 2 is the structural representation of conductive adhesive film in the utility model.

The specific embodiment

As Fig. 1, shown in Figure 2, the utility model is by metal substrate 1, heat conductive insulating layer 2 and Copper Foil 3 compound stickings are formed, described heat conductive insulating layer 2 is made up of one or more layers conductive adhesive film 4 by the serialization gluing, described conductive adhesive film 4 is an epoxy resin, thermoplastic resin is or/and synthetic acrylonitrile-butadiene rubber, curing agent, curing accelerator, solid constituents such as inorganic heat filling are dissolved in organic solvent and pass through gluing then, cure, series of processes such as shearing form, described metal substrate 1 is to adopt the good aluminium sheet of thermal diffusivity, its thickness is 1.5mm, the thickness of heat conductive insulating layer 2 is 100 μ m, and the thickness of Copper Foil 3 is 35 μ m; Concrete preparation process is as follows:

(1) mixes the liquid dispersion that described solid constituent forms composition epoxy resin by described organic solvent, use coating equipment that this dispersion is coated on the mould release membrance 5;

(2) make be coated with this dispersion mould release membrance 5 through drying ovens, remove organic solvent and dry compositions, contain the continuous glue film 4 of semi-solid preparation attitude with formation, baking temperature is 80-180 ℃, 2-10 minute heat time heating time;

(3) with this conductive adhesive film 4, peel off mould release membrance 5, again that the aluminium sheet after electrolytic copper foil and the processing is superimposed, hot pressing under certain process conditions, cooling, discharging promptly make the utility model.

Metal Substrate copper-clad laminate in the present embodiment has excellent thermal conductivity, anti-die-cut property and combination property, and thermal conductivity factor 〉=1.0W/mk, and other performance all reaches the correlation technique requirement.

Claims (3)

1. high heat-conducting type Metal Substrate copper-clad laminate is made up of metal substrate (1), heat conductive insulating layer (2) and Copper Foil (3) compound sticking, and it is characterized in that: described heat conductive insulating layer (2) is made up of by the conductive adhesive film of serialization gluing one deck or multilayer.
2. high heat-conducting type Metal Substrate copper-clad laminate according to claim 1 is characterized in that: the thickness of described heat conductive insulating layer (2) is 20-2000 μ m, and the thickness of described Copper Foil (3) is 9-350 μ m.
3. high heat-conducting type Metal Substrate copper-clad laminate according to claim 1, it is characterized in that: described metal substrate (1) is an aluminium sheet, or copper coin, or galvanized iron sheet, or steel plate.
CN2009200522792U 2009-03-09 2009-03-09 High heat conducting metal-based and copper foil-coated laminated plate CN201436206U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200522792U CN201436206U (en) 2009-03-09 2009-03-09 High heat conducting metal-based and copper foil-coated laminated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200522792U CN201436206U (en) 2009-03-09 2009-03-09 High heat conducting metal-based and copper foil-coated laminated plate

Publications (1)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102029745A (en) * 2010-08-31 2011-04-27 广东生益科技股份有限公司 High-heat-conductivity metal-base copper foil coated laminated board and making method thereof
CN102514348A (en) * 2012-01-09 2012-06-27 郭长奇 Method for manufacturing high thermal conductivity metal-base copper-clad plate
CN102700187A (en) * 2012-05-28 2012-10-03 珠海亚泰电子科技有限公司 Double-sided release film, heat-conducting rubber film including release film, and application of such release film in production process of aluminum substrate
CN103879087A (en) * 2014-04-09 2014-06-25 太仓泰邦电子科技有限公司 Heat-conducting copper foil
CN104149471A (en) * 2014-07-10 2014-11-19 腾辉电子(苏州)有限公司 Preparation method of resin coated copper foil and copper foil coated laminated board manufactured by resin coated copper foil
CN105196645A (en) * 2015-11-05 2015-12-30 惠州市煜鑫达科技有限公司 Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate
CN105835467A (en) * 2016-03-26 2016-08-10 林俊宝 Aluminum substrate material being bendable randomly and production method thereof
CN109327957A (en) * 2018-12-05 2019-02-12 景旺电子科技(龙川)有限公司 A kind of conduction copper substrate and preparation method thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102029745A (en) * 2010-08-31 2011-04-27 广东生益科技股份有限公司 High-heat-conductivity metal-base copper foil coated laminated board and making method thereof
CN102029745B (en) * 2010-08-31 2013-09-18 广东生益科技股份有限公司 High-heat-conductivity metal-base copper foil coated laminated board and making method thereof
CN102514348A (en) * 2012-01-09 2012-06-27 郭长奇 Method for manufacturing high thermal conductivity metal-base copper-clad plate
CN102514348B (en) * 2012-01-09 2014-07-23 郭长奇 Method for manufacturing high thermal conductivity metal-base copper-clad plate
CN102700187A (en) * 2012-05-28 2012-10-03 珠海亚泰电子科技有限公司 Double-sided release film, heat-conducting rubber film including release film, and application of such release film in production process of aluminum substrate
CN102700187B (en) * 2012-05-28 2015-04-22 珠海亚泰电子科技有限公司 Production process of aluminum substrate
CN103879087A (en) * 2014-04-09 2014-06-25 太仓泰邦电子科技有限公司 Heat-conducting copper foil
CN104149471A (en) * 2014-07-10 2014-11-19 腾辉电子(苏州)有限公司 Preparation method of resin coated copper foil and copper foil coated laminated board manufactured by resin coated copper foil
CN105196645A (en) * 2015-11-05 2015-12-30 惠州市煜鑫达科技有限公司 Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate
CN105835467A (en) * 2016-03-26 2016-08-10 林俊宝 Aluminum substrate material being bendable randomly and production method thereof
CN109327957A (en) * 2018-12-05 2019-02-12 景旺电子科技(龙川)有限公司 A kind of conduction copper substrate and preparation method thereof

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Address after: 519125 Guangdong Province, Zhuhai city Doumen District Baijiao Industrial Park New Road No. 23

Patentee after: Guangdong all treasures Polytron Technologies Inc

Address before: 519000 No. three, No. 6, Gongbei port, Guangdong, Zhuhai

Patentee before: Zhuhai Totking Electron Technology Co., Ltd.

C56 Change in the name or address of the patentee
CX01 Expiry of patent term

Granted publication date: 20100407

CX01 Expiry of patent term