CN211467710U - High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight - Google Patents

High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight Download PDF

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Publication number
CN211467710U
CN211467710U CN201922311743.1U CN201922311743U CN211467710U CN 211467710 U CN211467710 U CN 211467710U CN 201922311743 U CN201922311743 U CN 201922311743U CN 211467710 U CN211467710 U CN 211467710U
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CN
China
Prior art keywords
adhesive film
plate
aluminum plate
copper
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201922311743.1U
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Chinese (zh)
Inventor
林德雄
方展胜
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Dongguan City Tezhan Electronics Co ltd
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Dongguan City Tezhan Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan City Tezhan Electronics Co ltd filed Critical Dongguan City Tezhan Electronics Co ltd
Priority to CN201922311743.1U priority Critical patent/CN211467710U/en
Application granted granted Critical
Publication of CN211467710U publication Critical patent/CN211467710U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a high pressure resistant high heat conduction copper-clad aluminum substrate for LED television backlight source, which comprises an aluminum plate, a first adhesive film, a curing plate, a second adhesive film, a copper foil and a heat dissipation strip, wherein the first adhesive film is pasted on the upper surface of the aluminum plate, the curing plate is pasted on the upper surface of the first adhesive film, the second adhesive film is pasted on the upper surface of the curing plate, the copper foil is pasted on the upper surface of the second adhesive film, the heat dissipation strip is integrally formed on the lower surface of the aluminum plate at equal intervals, the aluminum plate, the first adhesive film, the curing plate, the second adhesive film and the copper foil are connected by hot pressing, nano copper particles are compounded in the first adhesive film and the second adhesive film, bonding bulges are respectively integrally formed on the two sides of the curing plate and the upper surface of the aluminum plate, the bonding bulges are arranged in a grid shape, oxide layers are respectively arranged on the surfaces of the aluminum plate and the copper foil, and the high pressure, and the heat dissipation effect is better, and the people of being convenient for use.

Description

High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight
Technical Field
The utility model relates to a cover copper aluminium base board technical field specifically is a LED TV backlight is with high pressure resistant high heat conduction cover copper aluminium base board.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. The high-end application is also designed to be a double-sided board, and the structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. At present, the aluminum-based circuit board of the LED backlight source for the television has the defects, defects and shortcomings of high pressure resistance or high heat conduction but not both high pressure resistance and high heat conduction due to the structural reason of the aluminum-based circuit board, and the high pressure resistance and high heat conduction performance are poor. Therefore, a high-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for an LED television backlight source is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a LED TV backlight is with high pressure resistant high heat conduction copper-clad aluminium base board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LED TV backlight is with high pressure resistant high heat conduction copper-clad aluminium base board, includes aluminum plate, first glued membrane, curing plate, second glued membrane, copper foil and heat dissipation strip, aluminum plate upper surface paste has first glued membrane, first glued membrane upper surface paste has the curing plate, curing plate upper surface paste has the second glued membrane, second glued membrane upper surface paste has the copper foil, aluminum plate lower surface equidistance integrated into one piece has the heat dissipation strip.
Preferably, the aluminum plate, the first adhesive film, the curing plate, the second adhesive film and the copper foil are connected in a hot-pressing manner in a gluing mode.
Preferably, the first adhesive film and the second adhesive film are compounded with nano-copper particles.
Preferably, the two sides of the curing plate and the upper surface of the aluminum plate are respectively integrally formed with bonding protrusions, and the bonding protrusions are arranged in a grid shape.
Preferably, the surfaces of the aluminum plate and the copper foil are both subjected to oxidation layer treatment.
Compared with the prior art, the beneficial effects of the utility model are that:
1. when the utility model is produced, the aluminum plate, the first adhesive film, the curing plate, the second adhesive film and the copper foil are stacked in sequence and then are formed by hot pressing, so that the first adhesive film and the second adhesive film are melted to bond the copper foil with the curing plate and the curing plate with the aluminum plate, the curing plate can improve the insulating strength between the copper foil and the aluminum plate and the high pressure resistance, and the two sides of the curing plate and the upper surface of the aluminum plate are respectively and integrally formed with bonding bulges, so that when the curing plate and the aluminum plate are bonded with the first adhesive film and the second adhesive film, the contact area, the bonding strength and the heat conduction effect are improved, and aluminum plate lower surface equidistance integrated into one piece has the heat dissipation strip for improve the area of contact of aluminum plate lower surface and air, the radiating effect when improving aluminum plate's natural ventilation, this cover high pressure resistant and high heat conductivity of copper-clad aluminum base board is better, and the radiating effect is better, and the people of being convenient for use.
Drawings
Fig. 1 is the overall sectional structure diagram of the present invention.
In the figure: 1. an aluminum plate; 2. a first adhesive film; 3. curing the plate; 4. a second adhesive film; 5. copper foil; 6. a heat dissipating strip; 7. and bonding the bumps.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a high-pressure-resistant high-heat-conductivity copper-clad aluminum substrate for an LED television backlight comprises an aluminum plate 1, a first adhesive film 2, a curing plate 3, a second adhesive film 4, a copper foil 5 and heat dissipation strips 6, wherein the first adhesive film 2 is pasted on the upper surface of the aluminum plate 1, the curing plate 3 is pasted on the upper surface of the first adhesive film 2, the second adhesive film 4 is pasted on the upper surface of the curing plate 3, the copper foil 5 is pasted on the upper surface of the second adhesive film 4, the heat dissipation strips 6 are integrally formed on the lower surface of the aluminum plate 1 at equal intervals, the aluminum plate 1, the first adhesive film 2, the curing plate 3, the second adhesive film 4 and the copper foil 5 are glued and connected in a hot-pressing mode, during production, the aluminum plate 1, the first adhesive film 2, the curing plate 3, the second adhesive film 4 and the copper foil 5 are sequentially stacked and then subjected to hot-pressing molding, so that the first adhesive film 2 and the second adhesive film 4 are melted to bond the copper foil 5 with the curing, improve high pressure resistance, aluminum plate 1 lower surface equidistance integrated into one piece has heat dissipation strip 6 for improve the area of contact of aluminum plate 1 lower surface and air, the radiating effect when improving aluminum plate 1's natural ventilation, this cover copper aluminium base board high pressure resistant and high heat conductivity are better, and the radiating effect is better, and the people of being convenient for use.
Nanometer copper particles are compounded in the first adhesive film 2 and the second adhesive film 4, so that the heat conduction effect of the first adhesive film 2 and the second adhesive film 4 is improved.
3 both sides of curing plate and 1 upper surface of aluminum plate integrated into one piece respectively have bonding arch 7, and bonding arch 7 is latticed setting, improves curing plate 3 and 1 and aluminum plate and 2 and the second glued membrane 4 area of contact when bonding, improves bonding strength and heat conduction effect of first glued membrane.
And oxide layers are respectively processed on the surfaces of the aluminum plate 1 and the copper foil 5, so that the aluminum plate 1 and the copper foil 5 are prevented from being corroded.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a LED TV backlight is with copper aluminium base board of high pressure resistant high heat conduction, includes aluminum plate (1), first glued membrane (2), curing plate (3), second glued membrane (4), copper foil (5) and heat dissipation strip (6), its characterized in that: aluminum plate (1) upper surface paste has first glued membrane (2), first glued membrane (2) upper surface paste has curing plate (3), curing plate (3) upper surface paste has second glued membrane (4), second glued membrane (4) upper surface paste has copper foil (5), aluminum plate (1) lower surface equidistance integrated into one piece has heat dissipation strip (6).
2. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 1, wherein: the aluminum plate (1), the first adhesive film (2), the curing plate (3), the second adhesive film (4) and the copper foil (5) are connected in a hot-pressing mode in a gluing mode.
3. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 1, wherein: the first adhesive film (2) and the second adhesive film (4) are compounded with nano-copper particles.
4. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 1, wherein: the two sides of the curing plate (3) and the upper surface of the aluminum plate (1) are respectively integrally formed with bonding bulges (7), and the bonding bulges (7) are arranged in a grid shape.
5. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 1, wherein: and the surfaces of the aluminum plate (1) and the copper foil (5) are subjected to oxidation layer treatment.
CN201922311743.1U 2019-12-20 2019-12-20 High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight Expired - Fee Related CN211467710U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922311743.1U CN211467710U (en) 2019-12-20 2019-12-20 High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922311743.1U CN211467710U (en) 2019-12-20 2019-12-20 High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight

Publications (1)

Publication Number Publication Date
CN211467710U true CN211467710U (en) 2020-09-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922311743.1U Expired - Fee Related CN211467710U (en) 2019-12-20 2019-12-20 High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight

Country Status (1)

Country Link
CN (1) CN211467710U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200911

Termination date: 20211220

CF01 Termination of patent right due to non-payment of annual fee