CN211645107U - Heat conduction silica gel sheet - Google Patents

Heat conduction silica gel sheet Download PDF

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Publication number
CN211645107U
CN211645107U CN201922401757.2U CN201922401757U CN211645107U CN 211645107 U CN211645107 U CN 211645107U CN 201922401757 U CN201922401757 U CN 201922401757U CN 211645107 U CN211645107 U CN 211645107U
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China
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layer
heat conduction
viscous layer
fixedly connected
bottom fixedly
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CN201922401757.2U
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Chinese (zh)
Inventor
叶金强
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Shenzhen Hongda Industry Co ltd
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Shenzhen Hongda Industry Co ltd
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Abstract

The utility model discloses a heat conduction silica gel piece, including first viscous layer, the bottom fixedly connected with filling layer of first viscous layer, the bottom fixedly connected with back up coat of filling layer, the bottom fixedly connected with second viscous layer of back up coat. The first viscous layer is made of silicon rubber, and the second viscous layer is made of silicon rubber. Utility model discloses a set up first viscous layer and second viscous layer for the heat conduction liner can fill the gap with high thermal conductivity and compliance perfect adaptation, on the effectual heat transfer to the radiator with the position that generates heat. These soft interface materials may conform to the mating surface with minimal pressure, resulting in little or no stress on the mating components. Through the self-adhesion of the silica gel of first adhesive layer, the heat conduction liner has inherent sticky characteristic, need not the bond line, thereby covers the surface of microcosmic unevenness simultaneously and makes the abundant contact of cooperation part and improve heat conduction efficiency.

Description

Heat conduction silica gel sheet
Technical Field
The utility model relates to a heat dissipation accessory field especially relates to a heat conduction silica gel piece.
Background
The existing computer CPU mostly adopts heat dissipation silicone grease to dissipate heat, the heat dissipation silicone grease is utilized to fill up the gap between a heat sink and the CPU to achieve the purpose of heat dissipation, and the heat dissipation silicone grease can be dried and then fails after long-time use, so that heat dissipation failure can be caused, and the performance of preventing electric breakdown is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a heat-conducting silica gel sheet.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a heat conduction silica gel piece, includes first adhesive layer, the bottom fixedly connected with filling layer of first adhesive layer, the bottom fixedly connected with back up coat of filling layer, the bottom fixedly connected with second adhesive layer of back up coat.
As a further description of the above technical solution:
the first viscous layer is made of silicon rubber, and the second viscous layer is made of silicon rubber.
As a further description of the above technical solution:
the material of the filling layer is silicon, and the material of the reinforcing layer is glass fiber.
As a further description of the above technical solution:
first viscous layer is for the autohension with the filling layer to glue, the back up coat is for the autohension with the second viscous layer to glue, the filling layer is for the autohension with the back up coat to glue.
As a further description of the above technical solution:
the size of the first adhesive layer is 200mm multiplied by 400mm, the thermal conductivity coefficient of the filling layer is 6.0W/m.k, and the hardness of the reinforcing layer is HS 25-70.
As a further description of the above technical solution:
the compressive strength of the reinforcing layer is greater than 10 KV/mm.
The utility model discloses following beneficial effect has:
1. the utility model discloses a set up first viscous layer and second viscous layer for the heat conduction liner can fill the gap with high thermal conductivity and compliance perfect adaptation, on the effectual heat transfer to the radiator with the position that generates heat. These soft interface materials may conform to the mating surface with minimal pressure, resulting in little or no stress on the mating components.
2. The utility model discloses a self-adhesion of the silica gel of first viscous layer, heat conduction liner have inherent sticky characteristic, need not the bond line, thereby cover the surface of microcosmic unevenness simultaneously and make the abundant contact of cooperation part and improve heat conduction efficiency.
3. The utility model discloses a set up the back up coat, can effectually prevent electric breakdown, compressive strength is greater than 10 KV/mm.
Drawings
Fig. 1 is a schematic structural view of a heat-conducting silicone sheet according to the present invention;
fig. 2 is an overall schematic view of a heat-conducting silicone sheet according to the present invention;
illustration of the drawings:
1. a first adhesive layer; 2. a filling layer; 3. a reinforcement layer; 4. a second adhesive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-2, the present invention provides an embodiment: the utility model provides a heat conduction silica gel piece, includes first viscous layer 1, and the cooperation of second viscous layer 4, glues respectively on CPU and fin, the bottom fixedly connected with filling layer 2 of first viscous layer 1 increases the thickness of whole silica gel piece for fill the space between CPU and the fin, the bottom fixedly connected with back up coat 3 of filling layer 2 uses the glass fiber material, can effectively prevent electric breakdown, the bottom fixedly connected with second viscous layer 4 of back up coat 3.
The first viscous layer 1 is made of silicon rubber, the second viscous layer 4 is made of silicon rubber, and the silicon rubber has self-adhesion and can be well adhered to a CPU (Central processing Unit) and fill up microscopically uneven surfaces. The material of filling layer 2 is silicon, good heat conduction and heat-resisting material, and the material of back up coat 3 is glass fiber, excellent insulating material, can effectively prevent electric breakdown. The first adhesive layer 1 and the filling layer 2 are in self-adhesive bonding, the reinforcing layer 3 and the second adhesive layer 4 are in self-adhesive bonding, and the filling layer 2 and the reinforcing layer 3 are in self-adhesive bonding. The size of the first adhesive layer 1 is 200mm x 400mm, the size of the standard silicone sheet, the thermal conductivity of the filling layer 2 is 6.0W/m.k, which is superior to that of the one-pass heat-conducting silicone grease, and the hardness of the reinforcing layer 3 is HS25-70, which is adjusted according to actual conditions. The compressive strength of the reinforcing layer 3 is greater than 10KV/mm, and the electric breakdown prevention property is good.
The working principle is as follows: the first adhesive layer 1 and the second adhesive layer 4 can be used for adhering fillers to a CPU without using an adhesive, the other side of the first adhesive layer is adhered to the heat sink, so that a gap between the heat sink and the CPU is filled, the purpose of heat conduction and heat dissipation is achieved, the silicon material filling layer 2 has good heat resistance and heat conductivity, and the glass fiber reinforcing layer 3 can effectively prevent electrical breakdown.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims (6)

1. A heat-conducting silicone rubber sheet comprising a first adhesive layer (1), characterized in that: the bottom fixedly connected with filling layer (2) of first adhesive layer (1), the bottom fixedly connected with back up coat (3) of filling layer (2), the bottom fixedly connected with second adhesive layer (4) of back up coat (3).
2. A thermally conductive silicone sheet according to claim 1, wherein: the first adhesive layer (1) is made of silicon rubber, and the second adhesive layer (4) is made of silicon rubber.
3. A thermally conductive silicone sheet according to claim 1, wherein: the filling layer (2) is made of silicon, and the reinforcing layer (3) is made of glass fiber.
4. A thermally conductive silicone sheet according to claim 1, wherein: first viscous layer (1) is glued for the autohension with filling layer (2), strengthening layer (3) is glued for the autohension with second viscous layer (4), filling layer (2) is glued for the autohension with strengthening layer (3).
5. A thermally conductive silicone sheet according to claim 1, wherein: the size of the first adhesive layer (1) is 200mm multiplied by 400mm, the thermal conductivity of the filling layer (2) is 6.0W/m.k, and the hardness of the reinforcing layer (3) is HS 25-70.
6. A thermally conductive silicone sheet according to claim 1, wherein: the compressive strength of the reinforcing layer (3) is more than 10 KV/mm.
CN201922401757.2U 2019-12-27 2019-12-27 Heat conduction silica gel sheet Active CN211645107U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922401757.2U CN211645107U (en) 2019-12-27 2019-12-27 Heat conduction silica gel sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922401757.2U CN211645107U (en) 2019-12-27 2019-12-27 Heat conduction silica gel sheet

Publications (1)

Publication Number Publication Date
CN211645107U true CN211645107U (en) 2020-10-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922401757.2U Active CN211645107U (en) 2019-12-27 2019-12-27 Heat conduction silica gel sheet

Country Status (1)

Country Link
CN (1) CN211645107U (en)

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