CN210579835U

CN210579835U - Electronic silica gel heat conducting pad

Info

Publication number: CN210579835U
Application number: CN201921228145.1U
Authority: CN
Inventors: 吴路路
Original assignee: SUZHOU HENGKUN PRECISION ELECTRONIC CO Ltd
Current assignee: SUZHOU HENGKUN PRECISION ELECTRONIC CO Ltd
Priority date: 2019-07-31
Filing date: 2019-07-31
Publication date: 2020-05-19
Anticipated expiration: 2029-07-31

Abstract

The utility model discloses an electron silica gel heat conduction pad, including the heat conduction pad, the heat conduction pad comprises first heat-conducting layer, second heat-conducting layer and skin, is equipped with on the first heat-conducting layer and pastes the layer, and a plurality of radiating groove has been seted up on outer top, and the equal fixed mounting in both sides of heat conduction pad has two sheets of rubber, and the bottom of sheet of rubber is seted up flutedly. This kind of electron silica gel heat conduction pad through set up different heat conduction materials in the heat conduction pad, can improve the effect of the heat conduction of heat conduction pad like this, and then improves the radiating effect of heat conduction pad to improve the practicality of heat conduction pad.

Description

Electronic silica gel heat conducting pad

Technical Field

The utility model relates to a heat conduction pad specifically is an electron silica gel heat conduction pad.

Background

The heat conducting pad has good heat conducting capacity and high-grade pressure resistance, is a substitute product for heat conducting silicone grease, has certain flexibility in material, and is well attached between a power device and a heat radiating aluminum sheet or a machine shell, so that the best heat conducting and radiating purposes are achieved.

At present, the heat conducting pad has the function of heat radiation, but most of the existing heat conducting pads have a little defect in the aspect of heat radiation. Therefore, we improve this and propose an electronic silica gel heat conducting pad.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model relates to an electron silica gel heat conduction pad, including the heat conduction pad, the heat conduction pad comprises first heat-conducting layer, second heat-conducting layer and skin, be equipped with on the first heat-conducting layer and paste the layer, a plurality of radiating groove has been seted up on outer top, the equal fixed mounting in both sides of heat conduction pad has two sheets, and the bottom of sheet rubber is seted up flutedly.

As a preferred technical scheme of the utility model, the bottom mounting of first heat-conducting layer is equipped with the one deck film, and scribbles the one deck viscose on the film, be equipped with one deck plastic protection film on the viscose layer.

As a preferred technical solution of the present invention, the first heat conduction layer is embedded with alumina particles.

As an optimized technical scheme of the utility model, the inside of second heat-conducting layer is inlayed and is had the boron nitride granule.

As an optimized technical scheme of the utility model, outer material is the silicon rubber material.

As an optimized technical scheme of the utility model, the radiating groove is square groove.

The utility model has the advantages that: this kind of electron silica gel heat conduction pad through set up different heat conduction materials in the heat conduction pad, can improve the effect of the heat conduction of heat conduction pad like this, and then improves the radiating effect of heat conduction pad to improve the practicality of heat conduction pad.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of an electronic silica gel heat conducting pad of the present invention;

fig. 2 is a schematic structural view of the groove of the electronic silica gel heat conducting pad of the present invention.

In the figure: 1. a thermally conductive pad; 2. a first thermally conductive layer; 3. a second thermally conductive layer; 4. an outer layer; 5. a rubber sheet; 6. a groove; 7. a heat dissipation groove.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Example (b): as shown in fig. 1 and 2, the utility model relates to an electronic silica gel heat conduction pad, including heat conduction pad 1, heat conduction pad 1 comprises first heat-conducting layer 2, second heat-conducting layer 3 and outer 4, is equipped with on the first heat-conducting layer 2 and pastes the layer, and a plurality of radiating groove 7 has been seted up on outer 4's top, and the equal fixed mounting in both sides of heat conduction pad 1 has two sheets of rubber 5, and the bottom of sheet of rubber 5 sets up recess 6.

Wherein, the bottom mounting of first heat-conducting layer 2 is equipped with the one deck film, and scribbles the one deck viscose on the film, is equipped with one deck plastic protection film on the viscose layer, can glue heat-conducting pad 1 on components and parts like this, is convenient for use heat-conducting pad 1.

Alumina particles are embedded in the first heat conduction layer 2, and the alumina particles have better heat conduction performance, so that the heat conduction performance of the heat conduction pad 1 can be improved to a certain degree.

Wherein, the inside of second heat-conducting layer 3 is inlayed and is had the boron nitride granule, and the boron nitride granule also has certain heat conductivility, and certain degree can improve the heat conductivility of heat conduction pad 1 to improve the radiating effect of heat conduction pad 1.

Wherein, the material of outer layer 4 is the silicon rubber material, can play the effect of protection heat conduction pad 1 like this.

The radiating grooves 7 are square grooves, and the radiating areas of the square radiating grooves 7 can be increased, so that the radiating effect is improved.

The during operation, at first tear plastic protection film through manual, glue heat conduction pad 1 on components and parts, can generate heat when components and parts during operation, the heat can be in proper order through first heat-conducting layer 2, second heat-conducting layer 3 and radiating groove 7 remove the heat, because first heat-conducting layer 2 and second heat-conducting layer 3 adopt the material that the heat conductivity is good, can improve heat conduction pad 1 heat dispersion, when needs pull down heat conduction pad 1, the finger is detained in recess 6, and with 1 up-motion of heat conduction pad, make heat conduction pad 1 take place the separation with components and parts, pull down heat conduction pad 1.

Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an electron silica gel heat conduction pad, includes heat conduction pad (1), its characterized in that, heat conduction pad (1) comprises first heat-conducting layer (2), second heat-conducting layer (3) and skin (4), be equipped with on first heat-conducting layer (2) and paste the layer, a plurality of radiating groove (7) have been seted up on the top of skin (4), the equal fixed mounting in both sides of heat conduction pad (1) has two rubber sheets (5), and the bottom of rubber sheet (5) is seted up fluted (6).

2. The electronic silica gel thermal pad according to claim 1, wherein a film is fixed to a bottom end of the first thermal conductive layer (2), and a layer of adhesive is coated on the film, and a plastic protective film is disposed on the adhesive layer.

3. The electronic silica gel thermal pad according to claim 1, wherein the first thermal conductive layer (2) is embedded with alumina particles.

4. The electronic silica gel thermal pad according to claim 1, wherein the second thermal conductive layer (3) is embedded with boron nitride particles.

5. The electronic silica gel thermal pad according to claim 1, wherein the outer layer (4) is made of silicone rubber.

6. The electronic silica gel thermal pad according to claim 1, wherein the heat sink (7) is a square slot.