CN209133491U - Heat conducting pad - Google Patents
Heat conducting pad Download PDFInfo
- Publication number
- CN209133491U CN209133491U CN201822019030.3U CN201822019030U CN209133491U CN 209133491 U CN209133491 U CN 209133491U CN 201822019030 U CN201822019030 U CN 201822019030U CN 209133491 U CN209133491 U CN 209133491U
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- CN
- China
- Prior art keywords
- heat conduction
- graphene
- heat conductive
- conductive pad
- heat
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000004519 grease Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 10
- 229910002804 graphite Inorganic materials 0.000 abstract description 7
- 239000010439 graphite Substances 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- -1 graphite alkene Chemical class 0.000 abstract 6
- 238000010438 heat treatment Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat dissipation technical design field, concretely relates to heat conduction pad, including heat conduction pad substrate and graphite alkene heat conduction structure, graphite alkene heat conduction structure sets up inside the heat conduction pad substrate, perhaps graphite alkene heat conduction structure sets up between the two-layer heat conduction pad substrate that stacks from top to bottom. The graphene heat conduction structure is arranged in the heat conduction pad, so that the characteristic of high transverse heat conductivity of graphene is fully utilized, and the heat conduction effect of the whole heat conduction pad is enhanced; the bottom surface of graphite alkene heat conduction structure and heat conduction pad substrate is certain angle setting again, so set up, has changed the direction with the pressurized of heat conduction pad, has reduced moment, has effectively reduced graphite alkene heat conduction structure's atress size, prevents that graphite alkene heat conduction structure from breaking because of the atress is too big.
Description
Technical field
The utility model relates to heat dissipation technology design fields, and in particular to a kind of heat conductive pad.
Background technique
The thermal interfacial materials such as thermal grease, thermal paste, cooling pad are two kinds of storeroom interface thermal conductivity important bridges, are to determine
The key of system thermal management ability.The most common thermal interfacial material of existing market is heat-conducting silicone grease and thermal conductive silicon rubber mat.State at present
Interior about 90% market of high-end thermal interfacial material is captured by imported product.Japanese SHIN-ETSU HANTOTAI, the high-end silicone grease of Dow corning become in the industry
Generally acknowledged top product, it is expensive, but thermally conductive parameter is typically maintained in 5W/ (mK) hereinafter, module heat dissipating is ineffective；
The hard material that radiates includes graphene etc., has good lateral thermal coefficient, in the left and right 1000W/ (mK), effect is even
More than the thermal coefficient of common metal, but longitudinal heat-conducting effect is bad.
Existing Patent No. CN201620490239.6, patent name are a kind of dissipating for reduction air-conditioner controller chip temperature
Hot device and air-conditioning, it discloses a kind of radiator, including aluminum heat radiator body and graphene dope layer, the graphene dope layers
It is attached to the outer surface of aluminum heat radiator body；The air-conditioning includes mainboard, controller chip and radiator, and the controller chip is logical
It crosses chip pin to be mounted on mainboard, the radiator is close to the upper surface setting of controller chip, and radiator is above-mentioned dissipates
Hot device.The feature that graphene dope layer used in the utility model does not make full use of the lateral thermal conductivity of graphene high, structure have
Wait be further improved.
Utility model content
In order to solve the problems, such as to be unable to fully the feature that radiates using graphene in the prior art, the utility model proposes one
Kind heat conductive pad makes full use of the feature that graphene transverse direction thermal conductivity is high and longitudinal direction thermal conductivity is extremely low, stone is added in heat conductive pad
Black alkene conductive structure, reinforces the heat-conducting effect of heat conductive pad.
The specific technical solution of the utility model is as follows:
A kind of heat conductive pad, including heat conductive pad substrate and graphene conductive structure, the graphene conductive structure setting are being led
Inside heat pad substrate or the graphene conductive structure is arranged between two layers of heat conductive pad substrate of mounted on top.
Wherein, when the graphene conductive structure is arranged inside heat conductive pad substrate, the graphene conductive structure is not dashed forward
Heat conductive pad substrate bottom surface out.
Wherein, described adjacent between two layers of heat conductive pad substrate that mounted on top is arranged in the graphene conductive structure
Graphene conductive structure between be additionally provided with can be thermally conductive filler.
Wherein, the graphene conductive structure is the graphene radiating ribs of sheet.
Wherein, the graphene conductive structure is at least 2, and the graphene radiating ribs of the sheet are parallel to each other.
Wherein, the angle α of the graphene conductive structure and horizontal plane is 15 ° -60 °.
Wherein, the angle α of the graphene conductive structure and horizontal plane is 45 °.
Wherein, the filler that can be thermally conductive is silicone grease.
Wherein, the heat conductive pad is additionally provided with separated structure.
Wherein, the separated structure is the tear line of point off formula.
Beneficial effect
By the way that graphene conductive structure is arranged in heat conductive pad, the characteristic for making full use of graphene transverse direction thermal conductivity high adds
The heat-conducting effect of strong entirety heat conductive pad；Graphene conductive structure and the bottom surface of heat conductive pad substrate are arranged at an angle again, so
Setting, changes direction for the compression of heat conductive pad, reduces torque, effectively reduce the stress size of graphene conductive structure,
Prevent graphene conductive structure from fractureing because stress is too big.
Detailed description of the invention
Fig. 1 is the scheme of installation of the utility model
Fig. 2 is the schematic diagram of the embodiments of the present invention 1
Fig. 3 is the schematic diagram of the embodiments of the present invention 2
Fig. 4 is the schematic diagram of the embodiments of the present invention 3
Wherein, 1 is heat conductive pad, and 2 be heating module, and 3 be radiator, and 11 be graphene conductive structure, and 12 be filler, 13
It is tear line for heat conductive pad substrate, 14.
Specific embodiment
Embodiment 1
As shown in Figure 1, the heat conductive pad 1 of the utility model is used between heating module 2 and radiator 3, divided by heat conductive pad 1
Not with the close contact at 3 interface of 2 interface of heating module and radiator, by heat guide radiator 3 caused by heating module 2,
To be 2 radiating and cooling of heating module.
As shown in Fig. 2, the heat conductive pad 1 of the present embodiment, the graphite being parallel to each other including heat conductive pad substrate 13 and at least two
Alkene conductive structure 11.The heat conductive pad substrate 13 is made of flexible insulation heat-conducting polymer material, such as silica gel.Due to heat conductive pad
Substrate 13 has elasticity and flexibility, it is ensured that close between the upper and lower surface and heating module 2 and radiator 3 of heat conductive pad 1
Fitting.In the present embodiment, the graphene conductive structure 11 is the radiating ribs of sheet.The graphene radiating ribs of sheet are directly arranged
Inside heat conductive pad substrate 13, its height apart from bottom surface of the sheet radiating ribs is less than the thickness of heat conductive pad substrate 13, avoids
The conductivity problems that the graphene radiating ribs of sheet directly may result in the contact of radiator 3 and heating module 2, and
Graphene radiating ribs fracture the problem of influencing integral heat sink effect because of contact.
The graphene radiating ribs and the angled α of horizontal plane slant setting of the sheet, the angular range of the α are
15 ° -60 °, α is 45 ° in the present embodiment.Such setting can utilize the inclination of sheet radiating ribs when about 1 heat conductive pad is pressurized
The stress of vertical direction is decomposed, changes the direction of power by angle [alpha], and cross force has been changed to lateral force, will if compression deformation
Along the direction sliding perpendicular to radiating ribs, torque is reduced, the stress of graphene conductive structure 11 is effectively reduced, it is therefore prevented that
Graphene conductive structure 11 is damaged because of being pressurized.It is maximum on the basis of ensure that the intensity of graphene conductive structure 11
The heat-conducting effect of graphene conductive structure is realized in degree.
The heat conductive pad 1 of the utility model has fully considered the high feature of graphene transverse direction thermal conductivity, by the thermally conductive knot of graphene
Structure 11 is set as the radiating ribs of sheet；By the way that the graphene conductive structure 11 of sheet to be inserted into heat conductive pad substrate 13, ensure that
Graphene conductive structure 11 will not be contacted directly with heating module 2 and radiator 3；And by by the graphene conductive structure of sheet
11 are set as with heat conductive pad substrate 13 at an angle, on the basis of ensure that graphene conductive structure intensity 11, realizing
The heat-conducting effect of graphene conductive structure 11.
Embodiment 2
As shown in figure 3, in the present embodiment, heat conductive pad 1 includes heat conductive pad substrate 13, graphene conductive structure 11 and thermally conductive fills out
Object 12 is filled, the heat conductive pad substrate 13 is silica gel, and graphene conductive structure 11 is the radiating ribs of sheet.The heat conductive pad of the present embodiment
1, which clips sheet radiating ribs by upper layer and lower layer heat conductive pad substrate 13, is constituted, and heat-conducting filler 12, piece are filled between adjacent heat radiation muscle
Two parts up and down of shape radiating ribs are inserted into respectively in bilevel heat conductive pad substrate 13, sheet radiating ribs and heat conductive pad substrate 13
It is obliquely installed angled.The heat-conducting filler 12 is thermal grease, such as silicone grease.
By filling thermal grease between sheet radiating ribs, the effect for reinforcing radiating ribs intensity is on the one hand played, is guaranteed
Sheet radiating ribs are not broken, and it is whole on the other hand to increase heat-conducting pad since the heating conduction of thermal grease is better than silica gel again
Heat dissipation effect.
Embodiment 3
As shown in figure 4, the heat conductive pad 1 is provided with separated structure, so that heat conductive pad 1 is divided into multiple segments, this
Separated structure described in embodiment is the tear line 14 of point off formula, so that it is L that heat conductive pad 1, which can be broken down into several sections of width,
Heat conductive pad segment, each section of heat conductive pad segment be both provided at least one graphene conductive structure.Such setting facilitates thermally conductive
The installation of pad can be fast arranged for different size of heating module, while in turn avoid traditional scheme for thermally conductive
The graphene conductive structure that the cutting of pad 1 may cause is destroyed.
Claims (9)
1. a kind of heat conductive pad, which is characterized in that including heat conductive pad substrate and graphene conductive structure, the graphene conductive structure
Be arranged inside heat conductive pad substrate or the graphene conductive structure be arranged in mounted on top two layers of heat conductive pad substrate it
Between；
Wherein, the graphene conductive structure is the graphene radiating ribs of sheet.
2. heat conductive pad according to claim 1, which is characterized in that when the graphene conductive structure is arranged in heat conductive pad base
Inside material, the graphene conductive structure does not protrude heat conductive pad substrate bottom surface.
3. heat conductive pad according to claim 1, which is characterized in that when the graphene conductive structure is arranged in mounted on top
Two layers of heat conductive pad substrate between, filler that can be thermally conductive is additionally provided between the adjacent graphene conductive structure.
4. heat conductive pad according to claim 1 to 3, which is characterized in that the graphene conductive structure is at least 2,
The graphene radiating ribs of the sheet are parallel to each other.
5. heat conductive pad according to claim 1 to 3, which is characterized in that the graphene conductive structure and horizontal plane
Angle α is 15 ° -60 °.
6. heat conductive pad according to claim 5, which is characterized in that the angle α of the graphene conductive structure and horizontal plane
It is 45 °.
7. heat conductive pad according to claim 1 to 3, which is characterized in that the filler that can be thermally conductive is silicone grease.
8. heat conductive pad according to claim 1, which is characterized in that the heat conductive pad is additionally provided with separated structure.
9. heat conductive pad according to claim 8, which is characterized in that the separated structure is the tear line of point off formula.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822019030.3U CN209133491U (en) | 2018-12-04 | 2018-12-04 | Heat conducting pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822019030.3U CN209133491U (en) | 2018-12-04 | 2018-12-04 | Heat conducting pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209133491U true CN209133491U (en) | 2019-07-19 |
Family
ID=67247816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822019030.3U Active CN209133491U (en) | 2018-12-04 | 2018-12-04 | Heat conducting pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209133491U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040741A (en) * | 2020-09-07 | 2020-12-04 | 中国科学院广州能源研究所 | Heat dissipation cooling device for high heat flow heating element |
-
2018
- 2018-12-04 CN CN201822019030.3U patent/CN209133491U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040741A (en) * | 2020-09-07 | 2020-12-04 | 中国科学院广州能源研究所 | Heat dissipation cooling device for high heat flow heating element |
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