CN209806148U - Electronic assembly with heat dissipation paste layer - Google Patents
Electronic assembly with heat dissipation paste layer Download PDFInfo
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- CN209806148U CN209806148U CN201822028182.XU CN201822028182U CN209806148U CN 209806148 U CN209806148 U CN 209806148U CN 201822028182 U CN201822028182 U CN 201822028182U CN 209806148 U CN209806148 U CN 209806148U
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- heat dissipation
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- paste layer
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Abstract
The utility model provides an electronic component with heat dissipation cream layer, it includes: the electronic component comprises a circuit board, an electronic component arranged on the circuit board, a heat dissipation pad, a heat dissipation seat and at least one heat dissipation paste layer. The heat dissipation pad is located on the electronic component and has a first surface and a second surface opposite to the first surface, and the first surface of the heat dissipation pad is disposed facing the electronic component. The heat dissipation seat is arranged on the heat dissipation pad so that the second surface of the heat dissipation pad faces the heat dissipation seat. The heat dissipation paste layer is disposed on one of the first surface and the second surface of the heat dissipation pad and has a thickness of 0.1mm to 0.2 mm. The utility model discloses an at least position is in this first surface or this heat dissipation cream layer on this second surface of this cooling pad and fills the clearance that this cooling pad and this electron spare part or this cooling pad and this radiating seat caused between, provides the conduction path and reduces the thermal resistance that the clearance caused for the produced heat energy of this electron spare part.
Description
Technical Field
The present invention relates to an electronic component, and more particularly to an electronic component having a heat dissipating paste layer.
background
Referring to fig. 1, a conventional electronic component 1 is disclosed, which includes a Printed Circuit Board (PCB)11, an Integrated Circuit (IC) electronic component 12 disposed on the PCB 11, a thermal pad 13 disposed on the IC electronic component 12, and a heat spreader 14 disposed on the thermal pad 13. In the electronic component 1 shown in fig. 1, the heat generated by the ic component 12 during operation is mainly removed by heat conduction through three heat dissipation paths, i.e., conduction, convection and radiation, through the ic component 12, the electronic heat-dissipating pad 13 and the heat-dissipating seat 14 which are sequentially contacted.
Although heat from the integrated circuit electronic component 12 can be removed via thermal conduction. However, the gaps are formed between the IC electronic component 12 and the pad 13 or between the pad 13 and the base 14 due to the rough structure of the surfaces. Based on the fact that the gaps are filled with air with extremely low heat conductivity (heat conductivity); therefore, these gaps become thermal resistance for heat conduction, so that the heat energy of the ic electronic component 12 itself cannot be effectively removed, thereby reducing the service life of the electronic component.
As can be seen from the above description, it is a subject to be broken by those skilled in the art to improve the structure of the electronic component so that the heat energy generated from the electronic component can be effectively carried away to prolong the service life of the electronic component.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic component with heat dissipation cream layer that can effectively take away heat energy
The utility model discloses electronic component with heat dissipation cream layer, it includes: the electronic component comprises a circuit board, an electronic component arranged on the circuit board, a heat dissipation pad and at least one heat dissipation paste layer. The heat dissipation pad is located on the electronic component and provided with a first surface and a second surface which are opposite, and the first surface of the heat dissipation pad is arranged to face the electronic component. The heat dissipation paste layer is disposed on one of the first surface and the second surface of the heat dissipation pad and has a thickness of 0.1mm to 0.2 mm.
The utility model discloses electronic component with heat dissipation cream layer still including set up in the radiating seat on the radiating pad, so that the second surface of radiating pad is towards the radiating seat sets up.
The utility model discloses electronic component with heat dissipation cream layer, heat dissipation cream layer set up in the cooling pad the first surface is arranged in with the clamp the electron spare part with between the cooling pad.
The utility model discloses electronic component with heat dissipation cream layer, heat dissipation cream layer set up in the cooling pad the second surface to the clamp is arranged in the radiating seat with between the cooling pad.
The utility model discloses electronic component with heat dissipation cream layer, the quantity on heat dissipation cream layer is two, and this two heat dissipation cream layer set up respectively in the cooling pad the first surface with the second surface is arranged in with pressing from both sides respectively the electron spare part with between the cooling pad and press from both sides and arrange in the radiating seat with between the cooling pad.
the beneficial effects of the utility model reside in that: the gap between the heat dissipation pad and the electronic component or between the heat dissipation pad and the heat dissipation seat is filled by the heat dissipation paste layer at least positioned on the first surface or the second surface of the heat dissipation pad, so that a conduction path is provided for heat energy generated by the electronic component and the thermal resistance caused by the gap is reduced.
Drawings
FIG. 1 is a schematic elevational view illustrating a prior art electronic assembly;
FIG. 2 is a schematic front view illustrating a first embodiment of an electronic assembly with a thermal grease layer according to the present invention;
FIG. 3 is a schematic front view illustrating a second embodiment of an electronic assembly with a thermal grease layer according to the present invention;
FIG. 4 is a schematic front view illustrating a third embodiment of an electronic assembly with a thermal grease layer according to the present invention;
Fig. 5 is a temperature-versus-time graph illustrating the temperature profile variation of the electronic component with a heat-dissipating paste layer according to comparative example 1(CE1), specific example 1(E1), specific example 2(E2), specific example 3(E3) and comparative example 2(CE2) obtained from the first embodiment of the present invention;
Fig. 6 is a partially enlarged view of fig. 5, illustrating changes in temperature profiles after 32 minutes of measurement in comparative example 1(CE1), example 1(E1), example 2(E2), example 3(E3) and comparative example 2(CE2) according to the present invention;
fig. 7 is a temperature-versus-time graph illustrating changes in temperature curves of example 4(E4), example 5(E5), example 6(E6) and comparative example 3(CE3) obtained according to the second embodiment in comparative example 1(CE1) and the electronic component having a heat-dissipating paste layer of the present invention;
Fig. 8 is a partially enlarged view of fig. 7, illustrating changes in temperature profiles after measurement for 32 minutes in comparative example 1(CE1), example 4(E4), example 5(E5), example 6(E6), and comparative example 3(CE3) according to the present invention;
Fig. 9 is a temperature-versus-time graph showing changes in temperature curves of comparative example 1(CE1) and the electronic component having a heat-dissipating paste layer according to the third embodiment of the present invention, in example 7(E7), example 8(E8), example 9(E9), and comparative example 4(CE 4); and
Fig. 10 is a partially enlarged view of fig. 9, and illustrates changes in temperature profiles after 37 minutes of measurement in comparative example 1(CE1), example 7(E7), example 8(E8), example 9(E9), and comparative example 4(CE4) according to the present invention.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and embodiments:
Referring to fig. 2, the first embodiment of the electronic component with a heat dissipating paste layer of the present invention includes a circuit board 2, an electronic component 3 disposed on the circuit board 2, a heat dissipating pad 4 and at least one heat dissipating paste layer 5.
The heat dissipation pad 4 is disposed on the electronic component 3 and has a first surface 41 and a second surface 42 opposite to each other, and the first surface 41 of the heat dissipation pad 4 is disposed facing the electronic component 3.
The thermal paste layer 5 can be disposed on one of the first surface 41 and the second surface 42 of the thermal pad 4.
preferably, the first embodiment of the present invention further comprises a heat sink 6 disposed on the heat dissipation pad 4.
As shown in fig. 2, in the first embodiment of the present invention, the number of the heat-dissipating paste layers 5 is one, and the heat-dissipating paste layers are disposed on the first surface 41 of the heat-dissipating pad 4, for example, and sandwiched between the electronic component 3 and the heat-dissipating pad 4. In addition, the first embodiment of the present invention is described by including the heat sink 6, so that the second surface 42 of the heat dissipation pad 4 faces the heat sink 6, but is not limited thereto.
the heat dissipating paste layer 5 of the present invention may be selected from phase change grease (phase change grease) or non-phase change grease. The phase change paste may be a phase change paste such as that available from heney well corporation of america under the model number PCM45M-SP, and the non-phase change paste may be a non-phase change paste such as that available from Dowcorning under the model number TC-5121C LV. In the following specific examples (E) and Comparative Examples (CE) of the present invention, a phase-change type thermal grease using PCM45M-SP is used as an example, but not limited thereto.
It should be added here that, based on the utility model discloses a heat dissipation cream layer 5 of first embodiment adopts phase transition type heat dissipation cream to set up in the first surface 41 of heat dissipation pad 4 and with the clamp arrange in between electronic component 3 and heat dissipation pad 4, and heat dissipation cream layer 5 also can make heat dissipation cream layer 5 produce the phase transition continuously at the produced heat energy of electronic component 3 continuous operation in-process, make electronic component 3, heat dissipation cream layer 5 and heat dissipation pad 4 three's interface because of the phase transition of heat dissipation cream layer 5 produced have the mechanical structure problem that the pine caused. However, the main reason for the foregoing problem is dependent on the thickness of the self-radiating paste layer 5. That is, when the thickness of the heat dissipating paste layer 5 is less than 0.1mm, it is impossible to provide a heat conduction path sufficiently for the first embodiment of the present invention, and when the thickness of the heat dissipating paste layer 5 is more than 0.2mm, there is a problem of a mechanical structure caused by the loosening. Therefore, in the first embodiment of the present invention, the heat dissipating paste layer 5 has a thickness between 0.1mm and 0.2 mm.
Referring to fig. 3, the second embodiment of the electronic device with a heat dissipating paste layer of the present invention is substantially the same as the first embodiment, except that the heat dissipating paste layer 5 of the second embodiment is disposed on the second surface 42 of the heat dissipating pad 4 to be sandwiched between the heat dissipating seat 6 and the heat dissipating pad 4.
referring to fig. 4, the third embodiment of the electronic device with the heat dissipating paste layer of the present invention is substantially the same as the first embodiment, and the difference is that the number of the heat dissipating paste layers 5 of the third embodiment is two, and the heat dissipating paste layers 5 are respectively disposed on the first surface 41 and the second surface 42 of the heat dissipating pad 4, so as to be respectively sandwiched between the electronic component 3 and the heat dissipating pad 4 and between the heat dissipating seat 6 and the heat dissipating pad 4.
< comparative example 1(CE1) >
Referring again to fig. 2, comparative example 1(CE1) of the electronic component with a heat dissipating paste layer according to the present invention was implemented according to the first embodiment. Specifically, comparative example 1(CE1) of the present invention is substantially the same as the first embodiment, except that comparative example 1(CE1) is not provided with the thermal paste layer 5 on the first surface 41 of the thermal pad 4.
< example 1(E1), example 2(E2), example 3(E3), and comparative example 2(CE2) >
referring also to fig. 2, embodiment 1(E1), embodiment 2(E2), embodiment 3(E3) and comparative example 2(CE2) of the electronic component with a heat dissipating paste layer according to the present invention are implemented according to the first embodiment. Specifically, the thicknesses of the heat dissipating paste layer 5 in example 1(E1), example 2(E2), example 3(E3) and comparative example 2(CE2) of the present invention were 0.1mm, 0.15mm, 0.2mm and 0.3mm, respectively.
< example 4(E4), example 5(E5), example 6(E6), and comparative example 3(CE3) >
Referring to fig. 3, example 4(E4), example 5(E5), example 6(E6), and comparative example 3(CE3) of the electronic component with a heat dissipating paste layer according to the present invention are implemented according to the second embodiment. Specifically, the thicknesses of the heat dissipating paste layer 5 in example 4(E4), example 5(E5), example 6(E6) and comparative example 3(CE3) of the present invention were 0.1mm, 0.15mm, 0.2mm and 0.3mm, respectively.
< example 7(E7), example 8(E8), example 9(E9), and comparative example 4(CE4) >
Referring to fig. 4, example 7(E7), example 8(E8), example 9(E9), and comparative example 4(CE4) of the electronic component with a heat dissipating paste layer according to the present invention are implemented according to the third embodiment. Specifically, the thicknesses of the heat dissipating paste layer 5 in example 7(E7), example 8(E8), example 9(E9) and comparative example 4(CE4) of the present invention were 0.1mm, 0.15mm, 0.2mm and 0.3mm, respectively.
< analytical data >
the applicant provides the following fig. 5 to 10 to demonstrate the heat dissipation effect of the heat dissipation paste layer 5 used in the aforementioned embodiments of the present invention.
Referring to fig. 5 and 6, as shown by the temperature vs. time graphs of comparative example 1(CE1), example 1(E1), example 2(E2), example 3(E3) and comparative example 2(CE2) of the present invention, the temperatures obtained after the first and second surfaces 41, 42 of comparative example 1(CE1) are measured for 32 minutes are about 70.95 ℃ and 62.74 ℃ (see table 1. summarized below), respectively, which means that the first surface 41 of the heat dissipation pad 4 contacting with the electronic component 3 lacks the heat dissipation paste layer 5, so that a gap with a very low heat transfer rate is formed between the electronic component 3 and the heat dissipation pad 4, and the heat generated during the operation of the electronic component 3 is not carried away by the conduction path, which also reflects the lower temperature measured by the second surface 42 of the heat dissipation pad 4 contacting with the heat dissipation seat 6.
In contrast to the embodiments of the present invention shown in fig. 5 and 6, the temperatures measured on the first surface 41 of embodiment 1(E1), embodiment 2(E2) and embodiment 3(E3) for 32 minutes were about 70.48 ℃, 69.40 ℃ and 69.90 ℃, the temperatures obtained 32 minutes after the measurement of the corresponding second surfaces 42 are about 64.17 ℃, 64.62 ℃ and 64.46 ℃, respectively, which means that the first surfaces 41 of the heat dissipation pads 4 facing the corresponding electronic components 3 are provided with the corresponding heat dissipation paste layers 5, so that the gap between the corresponding electronic component 3 and the heat dissipation pad 4 can be filled up by the corresponding heat dissipation paste layer 5, and the heat generated by the electronic component 3 during operation can be effectively conducted away by conduction, and the temperature measured is lower than that of the comparative example 1(CE 1); in contrast, the second surface 42 of each thermal pad 4 disposed facing the corresponding heat sink 6 can also measure a higher temperature than in comparative example 1(CE1) because the first surface 41 thereof has previously absorbed a portion of the thermal energy.
Referring to fig. 5 and 6, the temperature (about 70.03 ℃) obtained after the first surface 41 of the comparative example 2(CE2) is measured for 32 minutes is slightly higher than the temperature obtained after the first surface 41 of the comparative example 2 (E2; about 69.40 ℃) and the temperature obtained after the first surface 3 (E3; about 69.90 ℃), which means that the thermal paste layer 5 of the comparative example 2(CE2) causes thermal resistance due to an excessively large thickness (i.e., the thermal paste layer 5 exceeds the thickness required to fill the gap between the electronic component 3 and the first surface 41 of the heat dissipation pad 4), so that the thermal energy generated during the operation of the electronic component 3 can not be taken away through the conduction path of the thermal paste layer 5 as in the embodiments 2-3 (E2-E3). In addition, the excessive heat dissipating paste layer 5 may cause a loosening problem due to the continuous phase change from the solid state to the liquid state.
Referring to fig. 7 and 8 and table 1 summarized below, it can be seen from the temperature vs. time graphs of comparative example 1(CE1), specific example 4(E4), specific example 5(E5), specific example 6(E6) and comparative example 3(CE3) of the present invention that the first surface 41 of comparative example 1(CE1) is lack of the heat dissipating paste layer 5, which results in that the heat energy generated by the electronic component 3 during the operation process cannot be taken away through the conduction path, so the temperatures measured by the first and second surfaces 41 and 42 are about 70.95 ℃ and 62.74 ℃.
In contrast to the embodiments of the present invention shown in fig. 7, fig. 8 and the following table 1, the temperatures obtained 32 minutes after the second surfaces 42 of the embodiments 4(E4), 5(E5) and 6(E6) are measured are about 64.09 ℃, 64.53 ℃ and 64.44 ℃, respectively, which means that the second surfaces 42 of the heat dissipation pads 4 disposed facing the corresponding heat dissipation seats 6 are filled with the corresponding heat dissipation paste layers 5, respectively, so that the gaps between the corresponding heat dissipation seats 6 and heat dissipation pads 4 can be filled with the corresponding heat dissipation paste layers 5, respectively, and the heat generated by the electronic components 3 during operation can be effectively conducted through the heat dissipation paste layers 5 at the second surfaces 42 when reaching the corresponding heat dissipation pads 4, respectively, and the temperature measured is higher than that of the embodiment 1(CE1), and the temperature of the heat dissipation paste layers 5 with a thickness of 0.15mm (E5) is based on the better heat transfer effect, the temperature measured (about 64.53 ℃ C.) was also relatively higher than that of embodiment 4 (E4; about 64.09 ℃ C.) and embodiment 6 (E6; about 64.44 ℃ C.). In contrast, the temperatures obtained 32 minutes after the measurement of the first surfaces 41 of the example 4(E4), the example 5(E5), and the example 6(E6) are about 70.63 ℃, 69.66 ℃, and 70.03 ℃, respectively, which reflect that the first surfaces 41 of the respective pads 4 disposed facing the respective electronic components 3 fill up the gaps between the respective pads 4 and electronic components 3 due to the absence of the thermal paste layer 5, and therefore, the measured temperatures correspond to the temperatures of the example 1 (E1; about 70.48 ℃), the example 2 (E2; about 69.40 ℃), and the example 3 (E3; about 69.60 ℃), respectively.
referring to fig. 7 and 8, the temperature (about 64.34 ℃) obtained in comparative example 3(CE3) after 32 minutes of measurement at the second surface 42 thereof is slightly lower than that of example 5 (E5; about 64.53 ℃), which means that the thermal paste layer 5 of comparative example 3(CE3) causes thermal resistance due to excessive thickness (i.e., the thermal paste layer 5 exceeds the thickness required to fill the gap between the heat spreader 6 and the second surface 42 of the heat pad 4), so that the heat generated during the operation of the electronic component 3 cannot be carried away through the conduction path of the thermal paste layer 5 as in example 5 (E5). In addition, the excessive heat dissipating paste layer 5 may cause a loosening problem due to the continuous phase change from the solid state to the liquid state.
Referring to fig. 9, fig. 10 and table 1 summarized below, it can be seen from the temperature vs. time graphs of comparative example 1(CE1), specific example 7(E7), specific example 8(E8), specific example 9(E9) and comparative example 4(CE4) of the present invention that the first surface 41 of comparative example 1(CE1) is lack of the heat dissipating paste layer 5, which results in that the heat energy generated by the electronic component 3 during the operation process cannot be taken away through the conduction path, and therefore the temperatures measured by the first and second surfaces 41, 42 are about 70.95 ℃ and 62.74 ℃.
In contrast to the embodiments of the present invention shown in fig. 9, 10 and the following table 1, the temperatures obtained by measuring the first surface 41 of the embodiments 7(E7), 8(E8) and 9(E9) for 37 minutes were about 70.12 ℃, 69.05 ℃ and 69.68 ℃, respectively, which were lower than the temperatures of the first surface 41 of the embodiments 1(E1), 2(E2) and 3(E3) (E1 about 70.48 ℃, E2 about 69.40 ℃, E3 about 69.90 ℃), and also lower than the temperatures of the first surface 41 of the embodiments 4(E4), 5(E5) and 6(E6) (E4 about 70.63 ℃, E5 about 69.66 ℃, E6 about 70.03 ℃). In addition, the temperatures measured 37 minutes on the second surface 42 of examples 7(E7), 8(E8) and 9(E9) were about 64.35 ℃, 65.06 ℃ and 65.57 ℃ respectively, which were higher than the temperatures of the second surface 42 of examples 1(E1), 2(E2) and 3(E3) (E1 about 64.17 ℃, E2 about 64.62 ℃, E3 about 64.46 ℃) and higher than the temperatures of the second surface 42 of examples 4(E4) and 5(E5) 6(E6) (E4 about 64.09 ℃, E5 about 64.53 ℃, E6 about 64.44 ℃). This means that the second surface 42 of each heat dissipation pad 4 disposed facing each corresponding heat dissipation seat 6 and the first surface 41 of each heat dissipation pad 4 disposed facing each corresponding electronic component 3 have two heat dissipation paste layers 5 corresponding to each other, so that the gaps between each corresponding heat dissipation seat 6 and heat dissipation pad 4 and between each corresponding electronic component 3 and heat dissipation pad 4 can be filled up by the corresponding heat dissipation paste layer 5, resulting in that the heat energy generated by each electronic component 3 during the operation process can be effectively carried away by the heat dissipation paste layers 5 at each of the first and second surfaces 41, 42.
Referring to fig. 9, fig. 10 and table 1 summarized below, the temperature (about 69.81 ℃) obtained by the comparative example 4(CE4) after measuring the first surface 41 for 37 minutes is slightly higher than the temperature (about 69.81 ℃) obtained by the specific example 8 (E8; about 69.05 ℃) and the specific example 9 (E9; about 69.68 ℃), which means that the thickness of the heat dissipating paste layer 5 at the first surface 41 of the heat dissipating pad 4 of the comparative example 4(CE4) is too thick to exceed the thickness of the heat dissipating paste layer required for filling the gap between the electronic component 3 and the first surface 41 of the heat dissipating pad 4, and the excessive heat dissipating paste forms a thermal resistance, so that the heat energy generated by the electronic component 3 during the operation process can not be taken away through the conduction path of the heat dissipating paste layer 5 like the specific examples 8-9 (E8-E9); in addition, the excessive thermal paste may have a loosening problem due to a continuous phase change from a solid state to a liquid state.
Table 1.
aelectronic component side
bSide of heat dissipation seat
To sum up, the utility model discloses electronic component with heat dissipation cream layer is on the first surface 41 of cooling pad 4 through the position, on second surface 42, or first, heat dissipation cream layer 5 on two surfaces 41, 42 to fill the clearance that causes between cooling pad 4 and electron spare part 3 or cooling pad 4 and radiating seat 6, can provide effectual heat-conduction way and reduce the thermal resistance that the clearance caused for the produced heat energy of electron spare part 3, so can reach the purpose of the utility model with low costs really.
However, the above embodiments are only examples of the present invention, and the scope of the present invention should not be limited thereto, and all the simple equivalent changes and modifications made according to the claims and the contents of the patent specification are still included in the scope of the present invention.
Claims (6)
1. An electronic component having a heat-dissipating paste layer, comprising:
A circuit board;
The electronic component is arranged on the circuit board;
The heat dissipation pad is positioned on the electronic component and provided with a first surface and a second surface which are opposite, and the first surface of the heat dissipation pad is arranged to face the electronic component; and
At least one thermal paste layer disposed on one of the first surface and the second surface of the thermal pad and having a thickness of between 0.1mm and 0.2 mm.
2. The electronic assembly with a thermal paste layer of claim 1, wherein: the heat dissipation pad is characterized by further comprising a heat dissipation seat, wherein the heat dissipation seat is arranged on the heat dissipation pad so that the second surface of the heat dissipation pad faces the heat dissipation seat.
3. The electronic assembly with a thermal paste layer of claim 2, wherein: the heat dissipation paste layer is arranged on the first surface of the heat dissipation pad so as to be clamped between the electronic component and the heat dissipation pad.
4. The electronic assembly with a thermal paste layer of claim 2, wherein: the heat dissipation paste layer is arranged on the second surface of the heat dissipation pad so as to be clamped between the heat dissipation seat and the heat dissipation pad.
5. The electronic assembly with a thermal paste layer of claim 2, wherein: the number of the heat dissipation paste layers is two, and the two heat dissipation paste layers are respectively arranged on the first surface and the second surface of the heat dissipation pad so as to be respectively clamped between the electronic component and the heat dissipation pad and between the heat dissipation seat and the heat dissipation pad.
6. the electronic component having a heat-dissipating paste layer as claimed in any one of claims 1 to 5, wherein: the heat dissipation paste layer is phase-change heat dissipation paste.
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| CN201822028182.XU CN209806148U (en) | 2018-12-04 | 2018-12-04 | Electronic assembly with heat dissipation paste layer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201822028182.XU CN209806148U (en) | 2018-12-04 | 2018-12-04 | Electronic assembly with heat dissipation paste layer |
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| CN209806148U true CN209806148U (en) | 2019-12-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707622A (en) * | 2020-05-22 | 2021-11-26 | 恩斯迈电子(深圳)有限公司 | Electronic device |
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2018
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707622A (en) * | 2020-05-22 | 2021-11-26 | 恩斯迈电子(深圳)有限公司 | Electronic device |
| CN113707622B (en) * | 2020-05-22 | 2023-08-04 | 恩斯迈电子(深圳)有限公司 | Electronic device |
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