CN113707622A - Electronic device - Google Patents
Electronic device Download PDFInfo
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- CN113707622A CN113707622A CN202010691156.4A CN202010691156A CN113707622A CN 113707622 A CN113707622 A CN 113707622A CN 202010691156 A CN202010691156 A CN 202010691156A CN 113707622 A CN113707622 A CN 113707622A
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- heat
- heat dissipation
- pad
- circuit board
- main circuit
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 74
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000002918 waste heat Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An electronic device comprises a bearing seat, a main circuit board, a heat dissipation seat, a heat dissipation pad and a heat dissipation frame. The main circuit board comprises a main circuit board body and a heat source. The heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat. The heat dissipation seat is in thermal contact with one side of the heat source far away from the main circuit board body. The heat dissipation pad includes a first portion and a second portion. The first part and the second part are arranged on the heat dissipation seat. The heat dissipation frame is overlapped on the heat dissipation pad, so that the first part and the second part of the heat dissipation pad are clamped between the heat dissipation seat and the heat dissipation frame and are pressed. A gap is maintained between the first portion of the thermal pad and the second portion of the thermal pad.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to an electronic device including a heat dissipation pad.
Background
Generally, a heat source (e.g., a cpu) on a circuit board generates a large amount of waste heat. Therefore, the heat source is often provided with heat dissipation fins, so that waste heat generated by the heat source is dissipated to the outside by the aid of the heat dissipation fins. Moreover, since the height of the heat source relative to the circuit board body is generally lower than the height of other electronic components relative to the circuit board body, the heat sink fins are likely to interfere with other electronic components during the process of mounting the heat sink fins on the heat source, so that the heat sink fins are difficult to mount on the heat source.
Therefore, some manufacturers respectively dispose the heat source and other electronic components on two opposite sides of the circuit board body to facilitate mounting the heat sink fins on the heat source. However, such arrangement of the heat source will cause the circuit board to be expensive in design of wiring and the like. In view of this, some manufacturers still have to dispose the heat source and other electronic components on the same side of the circuit board body and additionally dispose the heat sink and the heat pad connecting the heat source and the heat sink fins, so as to compensate for the height difference between the heat source and the other electronic components.
However, in the case where the heat sink and the heat sink fins clamp the heat sink pad in a tighter manner, the heat source needs to bear a larger pound force. In the case where the heat sink and the heat fins clamp the heat pad in a less tight manner, although the heat source can bear a smaller pound force, the heat source is difficult to effectively dissipate heat through the heat sink, the heat pad and the heat fins. That is, in the case that the heat source and other electronic components are located on the same side of the circuit board, it is difficult to reduce the pound force that the heat source must bear while maintaining the efficiency of heat dissipation of the heat source through the heat sink, the heat pad and the heat sink fins.
Disclosure of Invention
The present invention provides an electronic device, which can reduce the pound force borne by a heat source and maintain the efficiency of heat dissipation of the heat source assisted by a heat dissipation pad and a heat dissipation fin.
The electronic device disclosed by the embodiment of the invention comprises a bearing seat, a main circuit board, a heat dissipation seat, a heat dissipation pad and a heat dissipation frame. The main circuit board comprises a main circuit board body and a heat source. The heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat. The heat dissipation seat is in thermal contact with one side of the heat source far away from the main circuit board body. The heat dissipation pad includes a first portion and a second portion. The first part and the second part are arranged on the heat dissipation seat. The heat dissipation frame is overlapped on the heat dissipation pad, so that the first part and the second part of the heat dissipation pad are clamped between the heat dissipation seat and the heat dissipation frame and are pressed. A gap is maintained between the first portion of the thermal pad and the second portion of the thermal pad.
The electronic device disclosed by the other embodiment of the invention comprises a bearing seat, a main circuit board, a heat dissipation pad and a heat dissipation frame. The main circuit board comprises a main circuit board body and a heat source. The heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat. The heat dissipation pad includes a first portion and a second portion. The first part and the second part are arranged on one side of the heat source far away from the main circuit board body. The heat dissipation frame is overlapped on the heat dissipation pad, so that the first part and the second part of the heat dissipation pad are clamped between the heat source and the heat dissipation frame and are pressed. A gap is maintained between the first portion of the thermal pad and the second portion of the thermal pad.
According to the electronic device disclosed in the above embodiments, since a gap is maintained between the first portion of the thermal pad and the second portion of the thermal pad, the thermal pad can transmit less pound force to the heat source while being kept under pressure. Therefore, by separating different parts of the heat dissipation pad by the gap, the pound force borne by the heat source can be reduced, and meanwhile, the heat dissipation efficiency of the heat dissipation pad assisting the heat source is maintained.
Drawings
Fig. 1 is a perspective view of an electronic device according to a first embodiment of the invention.
Fig. 2 is a schematic side sectional view of the electronic device in fig. 1.
Fig. 3 is an exploded view of the electronic device of fig. 2.
FIG. 4 is a top view of the heat spreader and the heat pad of the electronic device of FIG. 1.
Fig. 5 is a top view showing a projection of the heat dissipation pad of the electronic device in fig. 1 onto the top surface of the heat dissipation base.
FIG. 6 is a top view of a heat spreader and a heat pad according to a second embodiment of the invention.
FIG. 7 is a top view of a heat spreader and a heat pad according to a third embodiment of the present invention.
FIG. 8 is a top view of a heat spreader and a heat pad according to a fourth embodiment of the present invention.
FIG. 9 is a top view of a heat spreader and a heat pad according to a fifth embodiment of the present invention.
Wherein the reference numerals are as follows:
10 … electronic device
100 … bearing seat
200 … main circuit board
201 … main circuit board
202 … Heat Source
300. 300a, 300b, 300c, 300d … heat sink
301 … bottom surface
302. 302a, 302b, 302c, 302d … top surface
400. 400a, 400b, 400c, 400d … heat spreader
401. 401a, 401b, 401c, 401d … first portion
402. 402a, 402b, 402c, 402d … second part
403. 403a, 403b, 403c … third part
404. 404a, 404b, 404c … fourth section
405a, 405b, 405c … fifth part
406a, 406b, 406c … sixth part
407b, 407c … seventh part
408b, 408c … eighth portion
409b, 409c … ninth part
410c … tenth part
420d … engagement part
450. 450a, 450b, 450c, 450d … gap
500 … heat dissipation rack
T1 … compressed thickness
Original thickness of T2 …
Width of W1 …
P1 … first projection
P2 … second projection
P3 … third projection
P4 … fourth projection
P5 … fifth projection
L … outer contour line
Detailed Description
The detailed features and advantages of the embodiments of the present invention are described in detail below in the detailed description, which is sufficient for any person skilled in the art to understand the technical content of the embodiments of the present invention and to implement the embodiments, and the related objects and advantages can be easily understood by any person skilled in the art according to the disclosure, the claims and the attached drawings of the present specification. The following examples are intended to illustrate the aspects of the present invention in further detail, but are not intended to limit the scope of the present invention in any way.
Please refer to fig. 1-2. Fig. 1 is a perspective view of an electronic device according to a first embodiment of the invention. Fig. 2 is a schematic side sectional view of the electronic device in fig. 1.
In the present embodiment, the electronic device 10 includes a carrier 100, a main circuit board 200, a heat sink 300, a heat pad 400, and a heat sink 500.
The main circuit board 200 includes a main circuit board 201 and a heat source 202. The heat source 202 is disposed on the main circuit board 201, and the main circuit board 201 is disposed on the susceptor 100. In this embodiment, the heat source 202 is, for example, a model
A Central Processing Unit (CPU) of G4900T, and the heat source 202 is disposed on the same side of the main circuit board 201 as other electronic components such as a memory and a hard disk.
Please refer to fig. 2, fig. 3 and fig. 4. Fig. 3 is an exploded view of the electronic device of fig. 2. FIG. 4 is a top view of the heat spreader and the heat pad of the electronic device of FIG. 1.
In the present embodiment, the thermal pad 400 includes a first portion 401, a second portion 402, a third portion 403, and a fourth portion 404. The first portion 401, the second portion 402, the third portion 403, and the fourth portion 404 are disposed on the top surface 302 of the heat spreader 300. That is, the first portion 401, the second portion 402, the third portion 403 and the fourth portion 404 are disposed on a side of the heat sink 300 away from the heat source 202, but not limited thereto. In other embodiments, the first portion, the second portion, the third portion and the fourth portion may also be disposed on the side surface of the heat sink adjacent to the top surface and the bottom surface.
In addition, as shown in fig. 4, the first portion 401, the second portion 402, the third portion 403 and the fourth portion 404 are arranged side by side on the top surface 302 of the heat sink 300 to form a two-by-two array and are spaced apart from each other by a gap 450. By designing gap 450, thermal pad 400 maintains the thermal conduction efficiency of thermal pad 400 while reducing the pound force experienced by heat source 202.
As shown in fig. 2, the heat sink 500 is stacked on the heat sink 400, such that the first portion 401, the second portion 402, the third portion 403, and the fourth portion 404 of the heat sink 400 are sandwiched between the top surface 302 of the heat sink 300 and the heat sink 500 and are pressed, thereby having a pressed thickness T1. In the present embodiment, the heat dissipation frame 500 is made of aluminum extrusion, for example.
In the present embodiment, the heat dissipation frame 500 is fixed and thermally contacted to the carrier 100 to form a housing of the electronic device 10 together with the carrier 100, but not limited thereto. In other embodiments, the heat dissipation frame may not be fixed and thermally contacted to the carrying seat, and the carrying seat and other components together form a housing of the electronic component, i.e., the heat dissipation frame may be accommodated in the housing.
In addition, the height of the heat sink 300 can be adjusted according to the height of the heat source 202 without the need of re-manufacturing the heat sink 500 at a high cost.
As shown in fig. 2 and 3, the original thickness T2 of the first portion 401, the second portion 402, the third portion 403 and the fourth portion 404 of the thermal pad 400 is greater than the pressed thickness T1, and the difference between the original thickness T2 and the pressed thickness T1 is between thirty percent and fifty percent of the original thickness T2, for example, thirty percent in this embodiment. By the above-mentioned pressing mechanism, the heat conduction efficiency of the heat dissipation pad 400 can be improved.
However, in other embodiments, as long as the heat dissipation pad is pressed, that is, as long as the original thickness is greater than the pressed thickness, the difference between the original thickness and the pressed thickness may be less than thirty percent of the original thickness or greater than fifty percent of the original thickness.
In addition, as shown in fig. 3, when the first portion 401, the second portion 402, the third portion 403 and the fourth portion 404 of the thermal pad 400 are not pressed, the width W1 of the gap 450 is greater than or equal to 4 mm and less than or equal to 8 mm, for example, 4 mm in the embodiment. Setting the width W1 of the gap 450 in the range of 4 mm or more and 8 mm or less increases the pound force that the heat source 202 must bear in order to prevent the portions of the thermal pad 400 from contacting each other after being pressed. Specifically, setting the width W1 of the gap 450 in a range of 4 mm or more and 8 mm or less allows the heat source 202 to bear less than about 3 lbs. of force than if the portions of the pad would contact each other after being pressed.
However, in other embodiments, the width of the gap may be less than 4 mm or greater than 8 mm.
Referring to fig. 4 and 5, fig. 5 is a top view showing a projection of the heat dissipation pad of the electronic device in fig. 1 on the top surface of the heat dissipation base.
As shown in FIGS. 4 and 5, the first portion 401 of the heat spreader 400 has a first projection P1 on the top surface 302 of the heat spreader 300. The second portion 402 of the heat spreader 400 has a second projection P2 on the top surface 302 of the heat spreader 300. The third portion 403 of the heat spreader 400 has a third projection P3 on the top surface 302 of the heat spreader 300. The fourth portion 404 of the heat spreader 400 has a fourth projection P4 on the top surface 302 of the heat spreader 300. The gap 450 has a fifth projection P5 on the top surface 302 of the heat sink 300. Furthermore, the boundaries of the first projection P1, the second projection P2, the third projection P3, the fourth projection P4 and the fifth projection P5 are defined by an outer contour line L. That is, the total area of the first projection P1, the second projection P2, the third projection P3, the fourth projection P4 and the fifth projection P5, i.e., the total area of the heat spreader 400 and the gap 450 projected on the top surface 302, is defined by the outer contour line L. Moreover, the projected area of the heat spreader 400 on the top surface 302 accounts for seventy-five-six to eighty-seven percent of the projected area of the heat spreader 400 and the gap 450 on the top surface 302 defined by the outer contour line L, which is, for example, eighty-seven percent in the present embodiment.
In other embodiments, the projected area of the heat sink pad on the top surface may occupy less than seventy-five-six percent or more than eighty-seven-eight percent of the projected area of the heat sink pad and the gap on the top surface defined by the outer contour line.
It should be noted that the larger the projected area of the heat sink pad 400 on the top surface 302, the more heat the heat sink pad 400 can receive from the heat source 202, but the greater the pounds-force the heat source 202 must bear. Therefore, the projected area of the heat dissipation pad 400 on the top surface 302 can be designed according to the heat dissipation requirement and the load limitation of the heat source 202, so as to design a balance point meeting the actual requirement.
Under the condition that the ambient temperature of the system is 45 degrees celsius and the power consumption of the heat source 202 is 35 watts, the heat source 202 can be maintained at 81 degrees celsius under the load of 45.83 pounds of force with the aid of the heat dissipation pad 400 of the present embodiment, which is in line with the industry for the cpu
G4900T should be maintained below 88 degrees celsius and be loaded below 50 pounds force. It should be noted that different models of cpus are suitable for different specifications, which are only used for illustration and not for limitation.
In addition, the heat sink 300 is optional. In the embodiment where the heat source and other electronic components are disposed on opposite sides of the main circuit board or the embodiment where the pound force borne by the heat source needs to be further reduced, the electronic device may not include the heat spreader 300, and the heat pad may directly contact the heat source in thermal contact and be clamped by the heat source and the heat sink.
It should be noted that the heat-dissipating pad 400 of the present invention is not limited to being composed of four portions spaced apart from each other. In other embodiments, the heat pad may be formed of two parts separated from each other. Alternatively, referring to fig. 6, fig. 6 is a top view of a heat spreader and a heat pad according to a second embodiment of the invention.
In the present embodiment, the heat-dissipating pad 400a is composed of six portions separated from each other. In detail, the thermal pad 400a includes a first portion 401a, a second portion 402a, a third portion 403a, a fourth portion 404a, a fifth portion 405a and a sixth portion 406 a. The first portion 401a, the second portion 402a, the third portion 403a, the fourth portion 404a, the fifth portion 405a, and the sixth portion 406a are arranged side by side on the top surface 302a of the heat spreader 300a in a three-by-two array and spaced apart from each other by a gap 450 a.
In addition, in the present embodiment, the projected area of the heat spreader 400a on the top surface 302a occupies eighty-two-dot-seven percent of the projected area of the heat spreader 400a and the gap 450a on the top surface 302a defined by the outer contour line.
Under the condition that the ambient temperature of the system is 45 degrees celsius and the power consumption of the heat source is 35 watts, the heat source can be maintained at 81 degrees celsius under the load of 43.76 pounds of force with the aid of the heat dissipation pad 400a of the present embodiment, which is in line with the cpu in the industry
G4900T should be maintained below 88 degrees celsius and be loaded below 50 pounds force.
Still alternatively, referring to fig. 7, fig. 7 is a top view of a heat spreader and a heat pad according to a third embodiment of the invention.
In the present embodiment, the heat pad 400b is composed of nine parts separated from each other. In detail, the thermal pad 400b includes a first portion 401b, a second portion 402b, a third portion 403b, a fourth portion 404b, a fifth portion 405b, a sixth portion 406b, a seventh portion 407b, an eighth portion 408b, and a ninth portion 409 b. The first portion 401b, the second portion 402b, the third portion 403b, the fourth portion 404b, the fifth portion 405b, and the sixth portion 406b are arranged side by side on the top surface 302b of the heat spreader 300b in a three-by-two array. Seventh portion 407b and eighth portion 408b are side-by-side on top surface 302b of heat spreader 300b and are located on one side of the three-by-two array, and ninth portion 409b is located on top surface 302b of heat spreader 300b and is located on the other side of the three-by-two array. The first portion 401b, the second portion 402b, the third portion 403b, the fourth portion 404b, the fifth portion 405b, the sixth portion 406b, the seventh portion 407b, the eighth portion 408b, and the ninth portion 409b are spaced apart from each other by a gap 450 b.
In addition, in the present embodiment, the projected area of the heat spreader 400b on the top surface 302b occupies eighty three points eight percent of the projected area of the heat spreader 400b and the gap 450b on the top surface 302b defined by the outer contour line.
Under the condition that the ambient temperature of the system is 45 degrees celsius and the power consumption of the heat source is 35 watts, the heat source can be maintained at 81 degrees celsius under the load of 43.07 pounds of force with the aid of the heat dissipation pad 400b of the present embodiment, which is in line with the cpu in the industry
G4900T should be maintained below 88 degrees celsius and be loaded below 50 pounds force.
Referring to fig. 8, fig. 8 is a top view of a heat spreader and a heat pad according to a fourth embodiment of the invention.
In the present embodiment, the heat-dissipating pad 400c is composed of ten parts separated from each other. In detail, the thermal pad 400c includes a first portion 401c, a second portion 402c, a third portion 403c, a fourth portion 404c, a fifth portion 405c, a sixth portion 406c, a seventh portion 407c, an eighth portion 408c, a ninth portion 409c, and a tenth portion 410 c. The first portion 401c, the second portion 402c, the third portion 403c, the fourth portion 404c, the fifth portion 405c, and the sixth portion 406c are arranged side by side on the top surface 302c of the heat spreader 300c in a three-by-two array. The seventh portion 407c and the eighth portion 408c are aligned on the top surface 302c of the heat spreader 300c and located on one side of the three-by-two array, and the ninth portion 409c and the tenth portion 410c are aligned on the top surface 302c of the heat spreader 300c and located on the other side of the three-by-two array. The first portion 401c, the second portion 402c, the third portion 403c, the fourth portion 404c, the fifth portion 405c, the sixth portion 406c, the seventh portion 407c, the eighth portion 408c, the ninth portion 409c, and the tenth portion 410c are spaced apart from each other by a gap 450 c.
In addition, in the present embodiment, the projected area of the heat spreader 400c on the top surface 302c occupies eighty-one-dot-eight percent of the projected area of the heat spreader 400c and the gap 450c on the top surface 302c defined by the outer contour line.
In-systemUnder the condition that the ambient temperature is 45 ℃ and the power consumption of the heat source is 35W, the heat source can be maintained at 79 ℃ under the load of 43.44 pounds of force with the aid of the heat dissipation pad 400c of the embodiment, which is in line with the requirement of the industry for the CPU
G4900T should be maintained below 88 degrees celsius and be loaded below 50 pounds force.
In addition, the portions of the thermal pad of the present invention are not limited to be separated from each other and not connected to each other, please refer to fig. 9, and fig. 9 is a top view of a thermal pad and a thermal seat according to a fifth embodiment of the present invention.
In the present embodiment, the heat pad 400d includes a first portion 401d, a second portion 402d and two connecting portions 420 d. The first portion 401d, the second portion 402d and the two engaging portions 420d are disposed on the top surface 302d of the heat sink 300 d. The first portion 401d and the second portion 402d are spaced apart from each other by a gap 450 d. The two engagement portions 420d connect the first portion 401d and the second portion 402 d. That is, in the present embodiment, the heat dissipation pad 400d is a single-piece structure and the gap 450d can be regarded as an opening formed by removing a portion of the heat dissipation pad 400 d.
The number of the engaging portions 420d is not limited in the present invention. In other embodiments, the first portion and the second portion of the thermal pad may be connected by only one connecting portion.
According to the electronic device disclosed in the above embodiments, since a gap is maintained between the first portion of the thermal pad and the second portion of the thermal pad, the thermal pad can transmit less pound force to the heat source while being kept under pressure. Therefore, by separating different parts of the heat dissipation pad by the gap, the pound force borne by the heat source can be reduced, and meanwhile, the heat dissipation efficiency of the heat dissipation pad assisting the heat source is maintained.
Although the present invention has been described with reference to the foregoing embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. An electronic device, comprising:
a bearing seat;
the main circuit board comprises a main circuit board body and a heat source, wherein the heat source is arranged on the main circuit board body, and the main circuit board body is arranged on the bearing seat;
a heat dissipation seat in thermal contact with one side of the heat source far away from the main circuit board body;
the heat dissipation pad comprises a first part and a second part, and the first part and the second part are arranged on the heat dissipation seat; and
the heat dissipation frame is stacked on the heat dissipation pad, so that the first part and the second part of the heat dissipation pad are clamped between the heat dissipation seat and the heat dissipation frame and are pressed;
wherein a gap is maintained between the first portion of the thermal pad and the second portion of the thermal pad.
2. The electronic device of claim 1, wherein the heat sink further comprises a third portion and a fourth portion, the first portion, the second portion, the third portion and the fourth portion being arranged side by side on the heat sink to form a two-by-two array and spaced apart from each other by the gap.
3. The electronic device of claim 1, wherein the heat sink further comprises a third portion, a fourth portion, a fifth portion, a sixth portion, a seventh portion, an eighth portion, a ninth portion, and a tenth portion, the first portion, the second portion, the third portion, the fourth portion, the fifth portion and the sixth portion are arranged side by side on the heat sink to form a three-by-two array, the seventh portion and the eighth portion are arranged side by side on the heat sink and are located at one side of the three-by-two array, the ninth portion and the tenth portion are arranged side by side on the heat sink and located on the other side of the three-by-two array, the first portion, the second portion, the third portion, the fourth portion, the fifth portion, the sixth portion, the seventh portion, the eighth portion, the ninth portion, and the tenth portion are spaced apart from each other by the gap.
4. The electronic device of claim 1, wherein the heat sink further comprises a connecting portion connecting the first portion and the second portion.
5. The electronic device of claim 1, wherein the first portion and the second portion of the thermal pad are sandwiched between the heat spreader and the heat frame to have a compressed thickness, an original thickness of the first portion and the second portion of the thermal pad is greater than the compressed thickness, and a difference between the original thickness and the compressed thickness is thirty percent to fifty percent of the original thickness.
6. The electronic device of claim 1, wherein the width of the gap is greater than or equal to 4 mm and less than or equal to 8 mm when the first portion of the thermal pad and the second portion of the thermal pad are not under compression.
7. The electronic device as recited in claim 1, wherein the first portion of the thermal pad and the second portion of the thermal pad are disposed on a side of the heat spreader away from the heat source.
8. The electronic device of claim 1, wherein the heat spreader has a bottom surface and a top surface opposite to each other, the bottom surface is in thermal contact with the heat source, the heat spreader is disposed on the top surface, the first portion of the heat spreader has a first projection on the top surface, the second portion of the heat spreader has a second projection on the top surface, the gap has a third projection on the top surface, and a total area of the first projection and the second projection is seventy-five to eighty-seven percent of a total area of the first projection, the second projection, and the third projection.
9. The electronic device as claimed in claim 1, wherein the heat sink is fixed to the main circuit board body.
10. An electronic device, comprising:
a bearing seat;
the main circuit board comprises a main circuit board body and a heat source, wherein the heat source is arranged on the main circuit board body, and the main circuit board body is arranged on the bearing seat;
the heat dissipation pad comprises a first part and a second part, and the first part and the second part are arranged on one side of the heat source, which is far away from the main circuit board body; and
the heat dissipation frame is stacked on the heat dissipation pad, so that the first part and the second part of the heat dissipation pad are clamped between the heat source and the heat dissipation frame and are pressed;
wherein a gap is maintained between the first portion of the thermal pad and the second portion of the thermal pad.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109117103 | 2020-05-22 | ||
| TW109117103A TWI738353B (en) | 2020-05-22 | 2020-05-22 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113707622A true CN113707622A (en) | 2021-11-26 |
| CN113707622B CN113707622B (en) | 2023-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010691156.4A Active CN113707622B (en) | 2020-05-22 | 2020-07-17 | Electronic device |
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| CN (1) | CN113707622B (en) |
| TW (1) | TWI738353B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113707622B (en) | 2023-08-04 |
| TW202145868A (en) | 2021-12-01 |
| TWI738353B (en) | 2021-09-01 |
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