JP2022072518A - Heat dissipation structure - Google Patents

Abstract

To provide a heat dissipation structure capable of suppressing a load applied to an integrated circuit when a housing is sealed.SOLUTION: A heat dissipation structure 1 according to the present disclosure includes a base housing 2 and a cover housing 3, and further includes an integrated circuit 4 fixed to the base housing 2, and a heat dissipation member 5 arranged at a position corresponding to the integrated circuit 4 in the cover housing 3. When the cover housing 3 is sealed in the base housing 2, the heat dissipation member 5 can be moved to the outside or inside of the cover housing 3 in a state where the cover housing 3 is sealed in the base housing 2 according to the pressure applied to the heat dissipation member 5 from the integrated circuit 4.SELECTED DRAWING: Figure 1

Description

The present invention relates to a heat dissipation structure.

In recent years, semiconductor packages mounted on small electronic devices such as personal computers have increased power consumption as the processing speed has increased and functions have increased, and the amount of heat generated during operation has tended to increase proportionally. It is in. Therefore, in order for the semiconductor package to continue stable operation, it is necessary to improve the heat dissipation of the semiconductor package. Therefore, various heat dissipation means for improving the cooling performance of the semiconductor package, such as using a heat sink or the like, are indispensable.

By the way, when the heat receiving portion of the heat sink is fixed so as to be pressed against the semiconductor package, a load is applied to the integrated circuit and the electronic circuit board constituting the semiconductor package. Recent semiconductor packages tend to have a simplified structure due to weight reduction and miniaturization, and some semiconductor packages do not necessarily have the strength to withstand such a load. Patent Document 1 discloses a technique relating to a heat dissipation structure that suppresses pressure on a substrate or an integrated circuit due to a load by providing a back plate on the substrate in a housing including a substrate and an integrated circuit.

Japanese Unexamined Patent Publication No. 2019-125612

As in the technique disclosed in Patent Document 1, in a housing provided with a substrate and an integrated circuit, even if the back plate is provided on the substrate, the pressure on the substrate and the integrated circuit due to the load when sealing the housing is applied. There is a problem that it can be greatly added.

It is an object of the present disclosure to provide a heat dissipation structure for solving such a problem.

The heat radiating structure according to the present disclosure includes a base housing, a cover housing, an integrated circuit fixed to the base housing, and a heat radiating member arranged at a position corresponding to the integrated circuit in the cover housing. The heat radiating member is in a state where the cover housing is sealed in the base housing according to the pressure applied to the heat radiating member from the integrated circuit when the cover housing is sealed in the base housing. It can be moved to the outside or the inside of the cover housing.

According to the present disclosure, it is possible to provide a heat dissipation structure capable of suppressing a load applied to an integrated circuit or an electronic circuit board when sealing a housing.

It is a schematic diagram of the heat dissipation structure which concerns on Embodiment 1 in this disclosure. It is a schematic diagram of the heat dissipation structure which concerns on Embodiment 2 in this disclosure. It is a schematic diagram of the heat dissipation structure which concerns on Embodiment 3 in this disclosure. It is a schematic diagram of a related heat dissipation structure. It is a schematic diagram of a related heat dissipation structure.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Since the drawings are simple, the technical scope of the embodiment should not be narrowly interpreted based on the description of the drawings. Further, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

In the following embodiments, when necessary for convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not unrelated to each other, and one is related to a part or all of the other, a modified example, an application example, a detailed explanation, a supplementary explanation, and the like. Further, in the following embodiments, when the number of elements (including the number, numerical value, quantity, range, etc.) is referred to, when it is specified in particular, or when it is clearly limited to a specific number in principle, etc. Except for, the number is not limited to the specific number, and may be more than or less than the specific number.

Furthermore, in the following embodiments, the components (including operation steps and the like) are not necessarily essential except when explicitly stated and when it is clearly considered to be essential in principle. Similarly, in the following embodiments, when the shape, positional relationship, etc. of the components or the like are referred to, the shape is substantially the same, except when it is clearly stated or when it is considered that it is not clearly the case in principle. Etc., etc. shall be included. This also applies to the above numbers and the like (including the number, numerical value, quantity, range and the like).

<Background of examination until the idea of the heat dissipation structure according to the embodiment>
First, the heat dissipation structure 1 according to the related technique will be described with reference to FIGS. 4 and 5. 4 and 5 are schematic views of the related heat dissipation structure 1.

The related heat dissipation structure 1 will be described with reference to FIG. The heat dissipation structure 1 includes a substrate 11, an integrated circuit 12, a radiator 13, a heat dissipation sheet 14, and a spring-loaded screw 15. Further, in the heat radiating structure 1, the substrate 11 and the like are attached to and fixed to the base housing 16. Further, the heat dissipation structure 1 includes a cover housing 17 in order to dissipate heat generated from the integrated circuit 12. The heat radiating structure 1 is a substrate in which a plurality of sets of stud parts 18 are pressurized by sandwiching a heat radiating sheet 14 between the cover housing 17 and the radiating device 13 with the radiating device 13 from the cover housing 17 side. It is a structure that pulls up with 11. Details of each of the above parts of the heat dissipation structure 1 shown in FIG. 4 will be described in the description in the embodiment.

By the way, when the heat receiving portion of the radiator 13 is fixed so as to be pressed against the integrated circuit 12 side as in the heat radiating structure 1 shown in FIG. 4, a load is applied to the substrate 11 and the integrated circuit 12. As a result, a load is applied to the substrate 11 and the integrated circuit 12, and there is also a problem that the substrate 11 and the integrated circuit 12 are deformed.

Therefore, as shown in FIG. 5, by adopting the back plate 19 at the lower part of the substrate 11, the pressure on the substrate 11 is dispersed, so that it is easy to avoid the substrate 11 from being deformed.

However, by adopting the structure of the heat dissipation structure 1 shown in FIG. 5, it is a problem that a large load is applied to the integrated circuit 12 even if the pressure on the substrate 11 is dispersed. Further, in the structure of the heat dissipation structure 1 shown in FIG. 5, the manufacturing tolerance and the assembly tolerance of each component including the integrated circuit 12 and the like greatly affect the compression amount of the heat dissipation sheet 14. As a result, when the heat radiation sheet 14 is surely brought into contact with the cover housing 17 in consideration of the stacking tolerance, it is also a problem that excessive pressure is further applied to the integrated circuit 12.

Therefore, a heat radiating structure 1 according to the following embodiment has been found, which can solve such a problem.

<Embodiment 1>
First, the heat dissipation structure 1 according to the present embodiment will be described with reference to FIG. FIG. 1 is a schematic view of a heat dissipation structure 1 according to the present embodiment.

The heat dissipation structure 1 in the present embodiment includes a base housing 2, a cover housing 3, an integrated circuit 4, and a heat dissipation member 5. The base housing 2 and the cover housing 3 are combined and sealed according to the embodiment provided with the integrated circuit 4. The method of sealing is, for example, using screws, but the method is not limited to this, and an adhesive or the like may be used.

The integrated circuit 4 is fixed to the base housing 2. Further, the heat radiating member 5 is arranged at a position corresponding to the integrated circuit 4 in the cover housing 3. The heat radiating member 5 has a floating structure with respect to the cover housing 3. That is, the heat radiating member 5 is in a state where the cover housing 3 is sealed in the base housing 2 according to the pressure applied to the heat radiating member 5 from the integrated circuit 4 when the cover housing 3 is sealed in the base housing 2. The cover housing 3 can be moved to the outside or the inside.

By using the heat dissipation structure 1 in the present embodiment, it is possible to suppress the load applied to the integrated circuit 4 when sealing the housing.

<Embodiment 2>
First, the heat dissipation structure 1 according to the present embodiment will be described with reference to FIG. FIG. 2 is a schematic view of the heat dissipation structure 1 according to the present embodiment.

The heat dissipation structure 1 shown in FIG. 2 includes a substrate 11, an integrated circuit 12, a radiator 13, a heat dissipation sheet 14, and a spring-loaded screw 15. Further, the heat dissipation structure 1 has a structure in which the substrate 11 is attached to and fixed to the base housing 16. Further, the heat dissipation structure 1 includes a cover housing 17 in order to dissipate heat generated from the integrated circuit 12. The heat radiating sheet 14 comes into contact with the floating member 20 when the substrate 11 is fixed. The floating member 20 is fixed to the cover housing 17 via the spring 21. The floating member 20 is arranged at a position corresponding to the integrated circuit 12 in the cover housing 17.

The board 11 mounts the integrated circuit 12. That is, the integrated circuit 12 is fixed to the base housing 16 via the substrate 11. As the board 11, for example, a main board of an information processing device or a motherboard is used. As the integrated circuit 12, for example, a semiconductor circuit such as FPGA (Field Programmable Gate Array) may be used. The integrated circuit 12 includes a heat-generating element such as a CPU (Central Processing Unit) and a memory.

The radiator 13 is placed on the heat dissipation surface of the integrated circuit 12. By arranging the radiator 13, the heat dissipation of the integrated circuit 12 is improved. The radiator 13 may be in contact with the heat dissipation surface side of the integrated circuit 12, and may be fixed by a method such as caulking or brazing that does not easily increase the thermal resistance. As the radiator 13, a heat sink is used as an example. The radiator 13 is fixed to the substrate 11 using a spring-loaded screw 15.

The heat radiating sheet 14 is arranged on the upper surface of the radiator 13, that is, on the surface facing the surface on the integrated circuit 12 side. The heat radiating sheet 14 is sandwiched between the radiating device 13 and the floating member 20 and serves as a heat conduction path for the integrated circuit 12 and the radiating device 13. The fixed structure of the heat radiating sheet 14 is not limited, and the dimensions and connection torque of the members are adjusted according to the shape of the integrated circuit 12 and the radiator 13, the predetermined compressibility of the heat radiating sheet 14, the pulling amount of the substrate 11, the tolerance, and the like. Can be determined. As the heat radiating sheet 14, a TIM (Thermal Interface Material) material is used as an example.

The spring-loaded screw 15 fixes the radiator 13 to the substrate 11. The radiator 13 is fixed by using four spring-loaded screws 15, but the fixing is not limited to four. The spring-loaded screw 15 is torque-controlled and may be equipped with a mechanism for avoiding pressure applied to the integrated circuit due to excessive fixing. The substrate 11 is provided with a through hole through which the spring-loaded screw 15 can be inserted. The spring-loaded screw 15 is arranged on the side surface side of the radiator 13 and is pulled up with the substrate 11. Since the lower end of the spring-loaded screw 15 is connected to the substrate 11, the substrate 11, the integrated circuit 12, and the radiator 13 are pulled up at the same time.

In the heat dissipation structure 1, the heat dissipation sheet 14 arranged on the upper surface of the radiator 13 is compressed when the substrate 11 or the like is attached to and fixed to the base housing 16. At this time, downward pressure is applied to the substrate 11 and the integrated circuit 12. This pressure connects the floating member 20 and the cover housing 17, and is absorbed by the compression of the elastic spring 21. Therefore, it is possible to limit the pressure on the integrated circuit.

The board 11 is attached to and fixed to the base housing 16. Further, the cover housing 17 is a structure that releases heat generated from the integrated circuit 12 to the outside of the cover housing 17. The cover housing 17 may be a heat dissipation housing. At this time, the cover housing 17 is preferably made of a material having high thermal conductivity. The cover housing 17 is formed of, for example, a metal having high thermal conductivity such as copper.

The cover housing 17 has an opening 17a. The cover housing 17 may have a heat dissipation function. At this time, the cover housing 17 may be formed of a metal or the like having a high thermal conductivity, but the present invention is not limited to this. The floating member 20 may be provided in the opening 17a.

The floating member 20 may have a heat dissipation function. At this time, the floating member 20 may be formed of, for example, a metal having a high thermal conductivity such as copper, which is the same as that of the cover housing 17, but is not limited to this. The floating member 20 has a floating structure with respect to the cover housing 17. That is, the floating member 20 is in a state where the cover housing 17 is sealed in the base housing 16 according to the pressure applied to the floating member 20 from the integrated circuit 12 when the cover housing 17 is sealed in the base housing 16. The cover housing 17 can be moved to the outside or the inside. The floating member 20 and the cover housing 17 may be fixed in a floating state by using a spring 21.

The cover housing 17 becomes a part of the housing together with the base housing 16. The connection between the cover housing 17 and the base housing 16 is performed by using, for example, screws 22, but the connection is not limited to this, and the connection may be made by adhesion or the like.

Here, a method of attaching the substrate 11 or the like using the heat dissipation structure 1 in the present embodiment will be described. The method of attaching the substrate 11 or the like in the following description is not limited to this.

First, the integrated circuit 12 is attached to the substrate 11. A radiator 13 is attached to the upper part of the integrated circuit 12. A spring-loaded screw 15 is used to fix the radiator 13. The radiator 13 is fixed by using four spring-loaded screws 15, but the fixing is not limited to four. The spring-loaded screw 15 is torque-controlled, and may be equipped with a mechanism for avoiding pressure applied to the integrated circuit 12 due to excessive fixing. A heat radiating sheet 14 is attached to the upper part of the radiating device 13.

Next, the cover housing 17 is used to cover the radiator 13 and the like. At this time, when the base housing 16 and the cover housing 17 are fixed by using the screws 22, the floating member 20 comes into contact with the heat dissipation sheet 14. The heat radiating sheet 14 is compressed until the floating member 20 comes into contact with the upper part of the radiating device 13. At this time, downward pressure is applied to the substrate 11 and the integrated circuit 12. This pressure fixes the floating member 20 to the cover housing 17, and is absorbed by the compression of the elastic spring 21.

By using the heat radiating structure 1 in the present embodiment, from the viewpoint of reliable contact between the heat radiating sheet 14 and the floating member 20, the dimensional tolerance of the heat radiating sheet 14 may be examined only in the upper part of the radiator 13. Therefore, in order to secure the performance of the heat dissipation sheet 14, the amount of compression can be easily adjusted.

Further, the load due to the pressure when the cover housing 17 is used to cover the radiator 13 and the like can be adjusted by the elastic spring 21 of the floating member 20. Therefore, it is possible to suppress the load on the substrate 11 and the integrated circuit 12.

<Embodiment 3>
The heat dissipation structure 1 according to the present embodiment will be described with reference to FIG. FIG. 3 is a schematic view of the heat dissipation structure 1 according to the present embodiment.

The heat dissipation structure 1 shown in FIG. 3 includes a substrate 11, an integrated circuit 12, a radiator 13, a heat dissipation sheet 14, a screw with a spring 15, a base housing 16, a cover housing 17, a back plate 19, a floating member 20, and a spring 21. Be prepared. Since each part except the back plate 19 is the same as the case of the first embodiment, the description thereof will be omitted.

That is, the difference between the structure of the heat radiating structure 1 in the present embodiment and the structure of the heat radiating structure 1 of the first embodiment is that the back plate 19 is used on the lower portion of the substrate 11, that is, on the opposite surface of the surface on the integrated circuit 12 side. That is. By using the back plate 19, the pressure on the substrate 11 is dispersed. Therefore, the structure of the heat radiating structure 1 in the present embodiment can further suppress the load on the substrate 11 and the integrated circuit 12 as compared with the structure of the heat radiating structure 1 of the first embodiment.

<Other embodiments>
In the above-described embodiment, the heat dissipation structure 1 has been described as being provided with the integrated circuit 12, but the heat dissipation structure 1 is not limited to the integrated circuit 12, and may be provided with a circuit equipped with an element that generates heat.

Although the embodiments of the present disclosure have been described in detail with reference to the drawings, the specific configuration is not limited to the above, and various design changes are made without departing from the gist of the present disclosure. Etc. are possible.

1 Heat-dissipating structure 2, 16 Base housing 3, 17 Cover housing 4, 12 Integrated circuit 5 Heat-dissipating member 11 Board 13 Dissipator 14 Heat-dissipating sheet 15 Spring-loaded screw 17a Opening 18 Stud part 19 Back plate 20 Floating member 21 Spring 22 screws

Claims (6)

With the base housing
With the cover housing
The integrated circuit fixed to the base housing and
A heat radiating member arranged at a position corresponding to the integrated circuit in the cover housing,
Equipped with
When the cover housing is sealed in the base housing, the heat radiating member is in a state where the cover housing is sealed in the base housing in response to the pressure applied to the heat radiating member from the integrated circuit. Movable to the outside or inside of the housing,
Heat dissipation structure. The cover housing has a heat dissipation function.
The heat dissipation structure according to claim 1. The integrated circuit is fixed to the base housing via a substrate.
The heat dissipation structure according to claim 1 or 2. The substrate includes a back plate on the opposite side of the surface on the integrated circuit side.
The heat dissipation structure according to claim 3. A radiator is mounted on the heat dissipation surface of the integrated circuit.
The heat dissipation structure according to any one of claims 1 to 4. The radiator is provided with a heat dissipation sheet on a surface facing the surface on the integrated circuit side.
The heat dissipation structure according to claim 5.

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