12609说 lltwf.d〇c/〇〇6 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱模組(c〇〇 〇 於—種散熱模組，其應用於會發熱之電子元件 用以私除電子元件之熱能。 【先前技術】 产不腦科技的突飛猛進，使得電腦之運作速 : 问並且電腦主機内部之電子元件的發埶功率 攀升。為了預防電腦主機内部之電子“ 豹的^子兀料生暫時性或永久性地失效，所以提供足 熱效能至電_部之電子元件 :失f處理單元極有可能—會發生運算 地失效，如此將導致雷腦 $ 才性 元的、、w声、土、土如* _主枝§枝。此外，當中央處理單12609 said lltwf.d〇c/〇〇6 IX. Description of the invention: [Technical field of the invention] The present invention relates to a heat dissipation module (c〇〇〇-type heat dissipation module, which is applied to heat generation) Electronic components are used to dissipate the thermal energy of electronic components. [Prior Art] The rapid development of the brain-free technology has made the speed of the computer: Ask and increase the power of the electronic components inside the computer. In order to prevent the electronic inside the computer. Leopard's cockroaches are temporarily or permanently ineffective, so provide sufficient thermal performance to the electronic components of the _ department: the loss of the f processing unit is very likely - the operation will fail, which will lead to the Thunderbolt Yuan, w sound, soil, soil such as * _ main branch § branch. In addition, when the central processing order
的工作溫度範圍時，甚至極有可 4壞中央處理單元晶片 H 處理單元永久性地失效，U ^日_因而¥致中央 元，始能恢復電腦主機之就必須更換中央處理單 習知件於運作時所產生的熱能’就 扇/用叫供熱對流形式的散熱作用以外，更可直 月封主機之電源供應器1央處理單元(cpu)及繪圖處理^ 5 1260967 _ 15〇ί ltwf.doc/006 元(GPU)，甚至疋曰日片組等溫度容易升高之電子元件上加 裝散熱模組，用以迅速移除這些電子元件於運作時所產生 的熱能。更$羊細地°兒，散熱為（HeatSink)為散熱模組内 之主要元件，散熱模組要能提供良好的散熱效能，散熱器 的設計就格外地重要。 圖1A繪示習知之一種散熱模組於組裝前的側視圖。 請參照圖1A，散熱模組100包括一散熱片（IntegmtedHeat Spread，簡稱LH.s.)ll〇、一散熱器120與一導熱層13〇， 其中散熱片11〇係連接至中央處理單元30,並具有一散熱 片表面112，而散熱器120包括一底板122及多個鰭片 124,而這些鰭片124乃是利用具有高散熱特性之材質=例 如銅、銅合金或銘合金等金屬材料所製成。此外，散熱模 組100應用於安裝在會發熱之電子元件上，例如是一；央 處理器單元30。 ' 圖1B繪示圖1之散熱模組於組裝後的側視圖。請參 照圖1B，散熱器120係間接地經由導熱層13〇,而密 散熱片110，而整個散熱模組100係經由散熱片而連 接至中央處理單元30。此外，為了將散熱器12〇固定於中 央處理單元30上，散熱模組1〇〇更包括一扣具(未绔示）， 其安裴於散熱器120及主機板1〇之間，用以提供一適各题 力於中央處理單元30與散熱片110間之接合面；以$二= 接合面之密合度。若此接合面之密度不足，散熱片、11〇 散熱效果則會受到影響。 中央處理單元30於運作時所產生之熱能係依序經由 6 I26〇967wfd〇c/〇〇6In the working temperature range, even the extremely bad central processing unit wafer H processing unit is permanently disabled. U ^ 日_ Thus ¥ to the central unit, the central processing unit must be replaced when the computer host can be restored. The heat energy generated during operation is in addition to the heat dissipation effect of the fan/heat convection form, and the power supply unit of the host can be directly sealed to the central processing unit (cpu) and the drawing processing ^ 5 1260967 _ 15〇ί ltwf. Doc/006 (GPU), or even heat-dissipating modules on electronic components that are easy to rise, such as the Japanese film group, to quickly remove the heat generated by these electronic components during operation. The heat sink is the main component in the heat dissipation module, and the heat dissipation module should provide good heat dissipation performance. The design of the heat sink is particularly important. FIG. 1A is a side view of a conventional heat dissipation module before assembly. Referring to FIG. 1A , the heat dissipation module 100 includes a heat sink (Integmated Heat Spread, LH.s.), a heat sink 120 and a heat conductive layer 13 , wherein the heat sink 11 is connected to the central processing unit 30 . The heat sink 120 includes a bottom plate 122 and a plurality of fins 124. The fins 124 are made of a material having high heat dissipation characteristics such as copper, copper alloy or alloy. production. In addition, the heat dissipation module 100 is applied to an electronic component that generates heat, such as a central processor unit 30. FIG. 1B is a side view of the heat dissipation module of FIG. 1 after assembly. Referring to Fig. 1B, the heat sink 120 is indirectly connected via the heat conducting layer 13 to the heat sink 110, and the entire heat sink module 100 is connected to the central processing unit 30 via the heat sink. In addition, in order to fix the heat sink 12A to the central processing unit 30, the heat dissipation module 1 further includes a buckle (not shown) installed between the heat sink 120 and the motherboard 1 A suitable surface is provided for the bonding surface between the central processing unit 30 and the heat sink 110; and the thickness of the bonding surface is $2. If the density of the joint is insufficient, the heat sink and 11 散热 heat dissipation effect will be affected. The thermal energy generated by the central processing unit 30 during operation is sequentially passed through 6 I26〇967wfd〇c/〇〇6
散熱片110而傳導至散熱器120，其中散熱片110更間接 經由一配設於散熱片110及散熱器120之間的導熱層 130,來將熱能傳導至散熱器12〇。因此，中央處理單元3〇 於運作時所產生的熱能將可經由散熱模組1〇〇而傳遞至外 部的大氣環境。此外，為了增強散熱模組1〇〇之散熱效果， 更可增設散熱風扇（未繪示)於散熱模組1〇〇之散熱器12〇 的上方或旁側，並藉由散熱風扇來提供主動氣流，使得散 熱裔120之鰭片124與外部大氣環境有更好的熱對流效 果，進而提升散熱模組10〇之整體散熱效能。 值得注意的是，習知之散熱器12〇的底板122與散埶 片表面112皆為平面式設計，並且底板122之底面係間接 經由導熱層130而密合至散熱片表面112，其中導熱層13〇 之用處在於提供散熱片11G及散熱器12() 曰 衝，用以提高散熱片m及散熱器120之間的穷人;:構| 熱阻抗值較一般金屬材質高，而導熱“值 二、异度成正比。因此，導熱層130之厚度愈厚， 將熱能傳導出去。為了提高散顏組f =Γ3ΓΓ來愈小的趨勢，藉以降低散熱= 及政;^、、片130之間的導熱阻抗值。 請參照圖1C，圖1C繪示圖1Α之今办ρ 常的側視圓。在機械加工上，可能因:力== 題導致散熱器120或散熱片no發生變 i在攻樣的情況之下，既使有導熱層^义 但在導熱層U0之厚度越來越小的趨勢，且或 7 1260967 15011twf.doc/006 散熱為120之加工精度維持 底面與散熱片表面112可能&況之下，底板122之 122與散熱片表面n2之間有、、’ ^全密合，因而造成底板 導致t央處理單元3G於運作L G產生°由於間隙6將 藉由散熱器120與散熱片13() 生的熱能無法有效地 當工作溫度不斷升高時，令央傳導至外部環境。因此， 失效甚至是永久損壞之風險處理早兀3G會面臨到暫時性 【發明内容】 有鑑於此，本發明之目的 其能夠以人工的方絲她灿供—種散熱模組， 裝至散熱模組之散熱片上輪顧組之散熱器是否正常組 適用=於^目的或其他目的，本發明提供-種散处 中散熱片連接至此括—散熱片與—散熱器，其 1合面ίίΐ电子兀件並具有一第一嵌合面，而此第 二栽合面？ ΐ/ :第一嵌合部。此外’散熱器具有-第 且^於第’、山^二嵌合面具有至少一第二嵌合部，並 合部;散細至散熱片，且第； 上密合至第I:;之弟二敌合部時’第一嵌合面係實質 依照本發明的實施例所述之散熱模組，其中 山 4之表面更實質上密合至第二I合部之表面。 少依照本發明的實施例所述之散熱模組，其中 山 部係為一凹槽，其形成於該第一嵌合面上，而第二嵌:ς l5〇lltwf.doc/〇〇6 係為一凸緣，其形成於第二嵌合面上。 依照本發明的實施例所述之散熱模組，其中第一嵌人 部係為一凸緣，其形成於第一嵌合面上，而第二嵌合部伏 為一凹槽，其形成於該第二嵌合面上。 T' 依照本發明的實施例所述之散熱模組，更包括一導熱 層，其配置於第一嵌合面及第二嵌合面之間，使得至少部 分第一嵌合面係間接地經由導熱層，而密合至第二嵌合面。 依照本發明的實施例所述之散熱模組，其中散埶哭至 少包括-底板與多個鰭片，其中底板具有上述之第H 面’而鰭片延伸自底板之第二嵌合面以外的表面。^ 一十^上^，本發明將散熱片和散鮮之兩嵌合部分別 組裝散熱模組之散熱器與散敎 ；二:的方式 彼此嵌合時，此時即;;’當兩嵌合部可以 斷散熱片和散敎哭兩^面為正常密合，意即判 任一變形、ΐ二1化裝。相反地’若兩叙合部有 合，此時即4=;:良時，因而導致兩嵌合部無法嵌 片和散熱器係為不正法正常密合’意即判斷散熱 易懂^下和其他目的、特徵和優點能更明顯 明如下。文特舉較佳貫施例，並配合所附圖式，作詳細說 【實施方式】 【第一實施例】 12609§〇7〗 ltwf.doc/〇〇6 壯么:A繪示本發明之第一實施例之一種散熱模組於組 M則現圖，圖2B繪示圖2A之散熱模組於正常組裝後 勹二。凊同時參照 2A與圖2B，散熱模組200主要 ^ H 熱片210、一散熱器220與一導熱層230,其中散 •、二一山包括一第一嵌合面212，而第一嵌合面212具有 奋^ I合部214 ’其形成於第-欲合面212上。在第-貝二：，第一嵌合部214為一凹槽。一般而言，散熱片 疋連接至一會發熱之電子元件，例如一中央處理單元 而中央處理單元3G係安裝至—位於主機板iq之插座 ζυ ° 月欠熱裔220包括一底板222及多個鰭片224，豆中底 =22具有—第二嵌合面挪，而第二欲合面具有：：= 肷合部 228，JtK ^ μ _山”少成於弟二嵌合面216上。在第一實施例 =「肷合部228為-凸緣。此外，這些則224係延 伸自底板222之第. 亡古私為4士 α 一甘人3面226以外的表面，並可利用具 材二i:。之材質’例如是銅、銅合金或銘合金等金屬 導熱層23(M系適於配置於第1戈合面212及第二敌合 面226之間以作為散熱片210及散熱器220之間的一缓衝 層，使得至少部分笫山人品衝 ㈣，⑽人^ 肷合面係間接地經由此導熱層 山口弟—嵌合面226。在第一實施例中，導埶异 230例如是一散熱塾或是-層散熱膏。 層 如圖2B所示，在將散熱器22〇組裝至散熱 且導熱層謂係配置於散熱片210及散熱器22〇之間以 10 1260967 ^Olltwf.doc/ooe ㈣作稍魅之熱能可料經由散 熱器220夕冰:€ 30將傳導至散熱器220，並傳遞至散 Τ' 1° 卜㈣大氣環境’進而降低中央處理單元30 Η ΓΓ:此1卜’由於第—嵌合面212與第二嵌合面226之 互嵌合之第一嵌合部214及第二嵌合部228，所 結二及 於組合之後更能_ 如圖2Β所示’當以人工的方式將散熱器22 陳嵌合部228對梅至第^ 才〇果弟一肷合面226係實質上密合至第—嵌合面 ，此日讀可判定散熱片21〇及散熱器22〇為正常虹裝。 相反，，當以人工的方式將散鮮22()組裝至散熱片別， =將第二嵌合部228對應嵌合至第一嵌合部214時，如果 第=嵌合部228與第一嵌合部214無法實質上密合，即第 二嵌合面226亦無法實質上密合至第一嵌合面212的話， 此時便可判定散熱片210及散熱器22〇為不正常組裝。 ^在本發明之第-實施中，可以人工的方式來判定散熱 器220是否可以正常地組裝至散熱片21〇，以確保散熱^ 220能夠正常地組裝至散熱片21〇。因此，在導熱層23〇 之厚度越來越小的情況之下，這樣的機制可確保^熱片 21〇及散熱器220之間不會產生間隙（即圖ic之間^、^)， 或確保散熱片210及散熱器220之間的間隙其面積低於— 容許值。 、一、 1260967 15011twf.doc/006 【弟二實施例】 圖3A繪示本發明之第二實施例之一種散熱模組於組 裝前的側視圖，圖3B繪示圖3A之散熱模組於組裝後的側 視圖。請同時參照圖3A與圖3B，相較於第一實施例之散 熱模組200，第二實施例之散熱模組3⑻之差異在於散熱 片之310第一嵌合部314係為一凸緣，而散熱器32〇之對 應的第一嵌合部328為一凹槽。因此，在以人工的方式將 政熱為320組裝至散熱片31〇時，同樣可利用第一嵌合部 314是否可與第二嵌合部328正常地嵌合，來判斷散埶哭 320與散熱片310是否正常地組裝。 …如 綜上所述，本發明之散熱模組至少具有以下之優點·· J"、在以人工方式將散熱器組裝至散熱片的過程期間， 可藉由散熱片之後合部及散熱器之嵌合部是否能夠正碟私 因而判斷散熱片之嵌合—合至散熱器之對應的 欣合面，進而判斷散熱片與散熱器是否正常組裝。The heat sink 110 is conducted to the heat sink 120. The heat sink 110 is further indirectly conducted to the heat sink 12 through a heat conducting layer 130 disposed between the heat sink 110 and the heat sink 120. Therefore, the thermal energy generated by the central processing unit 3 during operation can be transferred to the external atmospheric environment via the heat dissipation module 1 . In addition, in order to enhance the heat dissipation effect of the heat dissipation module 1 , a cooling fan (not shown) may be added to the upper or side of the heat sink 12 散热器 of the heat dissipation module 1 , and the heat dissipation fan is used to provide the initiative. The airflow makes the fins 124 of the heat sink 120 have better thermal convection effect with the external atmosphere, thereby improving the overall heat dissipation performance of the heat dissipation module 10. It should be noted that the bottom plate 122 and the diffuser surface 112 of the conventional heat sink 12 are planar, and the bottom surface of the bottom plate 122 is indirectly adhered to the heat sink surface 112 via the heat conductive layer 130, wherein the heat conductive layer 13 The utility of the utility model is to provide the heat sink 11G and the heat sink 12() buffer for improving the poor between the heat sink m and the heat sink 120; the heat resistance value is higher than that of the general metal material, and the heat conduction value is two. The degree of heterogeneity is proportional. Therefore, the thicker the thickness of the heat conducting layer 130, the heat energy is conducted out. In order to increase the tendency of the group of f = Γ3 ΓΓ, the heat dissipation between the heat sink and the film is reduced. See Figure 1C, Figure 1C shows the side view circle of Figure Α. In machining, the heat sink 120 or the heat sink no may change due to the force == problem. In the case of a heat-conducting layer, but the thickness of the heat-conducting layer U0 is getting smaller and smaller, and or 7 1260967 15011twf.doc/006 heat dissipation is 120. The processing precision maintains the bottom surface and the heat sink surface 112 possible & In the case, there is a gap between the 122 of the bottom plate 122 and the surface n2 of the heat sink. , ^ ^ full close, thus causing the bottom plate to cause the t-stage processing unit 3G to operate in the LG. Since the gap 6 will be heat generated by the heat sink 120 and the heat sink 13 () can not effectively be effective when the operating temperature is rising Therefore, the central government is transmitted to the external environment. Therefore, the risk of failure or even permanent damage will be temporarily treated as soon as possible. [Inventive content] In view of the above, the object of the present invention is to provide an artificial square wire. The heat dissipating module is mounted on the heat sink of the heat dissipating module, and the heat sink of the group is suitable for the purpose of the group. For the purpose of the purpose or other purposes, the present invention provides a heat sink connecting the heat sink to the heat sink and the heat sink. , the 1 面 ί ΐ ΐ ΐ ΐ 并 并 并 并 并 并 并 并 并 并 ΐ ΐ ΐ ΐ ΐ ΐ ΐ 第二 第二 第二 第二 第二 第二 : : : : : : : : : : : : : : : : The second fitting surface has at least one second fitting portion, the merging portion; the fineness is radiated to the heat sink, and the first fitting surface is substantially adhered to the first enemy portion of the first: The heat dissipation module according to the embodiment of the present invention, wherein the surface of the mountain 4 is more solid The heat-dissipating module according to the embodiment of the present invention, wherein the mountain portion is a groove formed on the first fitting surface, and the second surface is embedded The ςl5〇lltwf.doc/〇〇6 is a flange formed on the second fitting surface. The heat dissipation module according to the embodiment of the present invention, wherein the first embedded portion is a convex The edge is formed on the first fitting surface, and the second fitting portion is formed as a groove formed on the second fitting surface. T' The heat dissipation module according to the embodiment of the present invention, The method further includes a heat conducting layer disposed between the first mating surface and the second mating surface such that at least a portion of the first mating surface is indirectly adhered to the second mating surface via the heat conducting layer. According to the heat dissipation module of the embodiment of the present invention, the dissipating crying includes at least a bottom plate and a plurality of fins, wherein the bottom plate has the above-mentioned H-th surface and the fin extends beyond the second fitting surface of the bottom plate surface. ^一十^上^, the invention combines the heat sink and the two loose fitting portions respectively to assemble the heat sink and the heat sink of the heat dissipation module; two: the manner of fitting each other, at this time;; The joint can break the heat sink and dissipate the two sides of the face to be a normal close, which means that any deformation, ΐ 2 1 dressing. Conversely, 'if the two combined parts are combined, then 4=;: good time, thus causing the two fitting parts to be inseparable and the heat sink is not properly normalized, which means that the heat dissipation is easy to understand. Other objects, features, and advantages will be apparent from the following. The present invention is described in detail with reference to the accompanying drawings. [First Embodiment] 12609§〇7〗 ltwf.doc/〇〇6 Strong: A shows the present invention A heat dissipation module of the first embodiment is shown in the group M, and FIG. 2B shows the heat dissipation module of FIG. 2A after the normal assembly. Referring to FIG. 2A and FIG. 2B, the heat dissipation module 200 mainly includes a heat sheet 210, a heat sink 220, and a heat conducting layer 230, wherein the first and second sides of the mountain include a first fitting surface 212, and the first fitting portion The face 212 has a portion 214' formed on the first-to-be-joined surface 212. In the first-beet two: the first fitting portion 214 is a groove. In general, the heat sink 疋 is connected to a heat generating electronic component, such as a central processing unit, and the central processing unit 3G is mounted to the socket of the motherboard iq. The owing heat 220 includes a bottom plate 222 and a plurality of The fins 224, the midsole = 22 have a second mating surface, and the second mating surface has::= 肷 228, JtK ^ μ _ ” 少 少 于 。 。 。 。 。 。 。 。 。. In the first embodiment, the "the splicing portion 228 is a flange. In addition, these 224 systems extend from the bottom plate 222. The surface of the slab is 222. The material of the material i: is, for example, a metal heat conductive layer 23 such as copper, a copper alloy or a metal alloy (the M system is suitably disposed between the first contact surface 212 and the second enemy surface 226 as the heat sink 210 and A buffer layer between the heat sinks 220 causes at least a portion of the Laoshan people to punch (4), and the (10) human joint surface indirectly passes through the heat conducting layer Yamaguchi-fitting surface 226. In the first embodiment, The difference 230 is, for example, a heat sink or a layer of thermal grease. The layer is as shown in FIG. 2B, and the heat sink 22 is assembled to dissipate heat and conduct heat. The system is disposed between the heat sink 210 and the heat sink 22〇 with 10 1260967 ^Olltwf.doc/ooe (4) for the slightly enchanting heat energy. The heat sink 220: 30 will be conducted to the heat sink 220 and transmitted to the heat sink 220 Diffusion '1° Bu (4) Atmospheric environment' and then lowering the central processing unit 30 Η 此 此 此 此 此 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于The two fitting portions 228, which are combined with the second and after the combination, can be _ as shown in FIG. 2A. 'When the heat sink 22 and the fitting portion 228 are artificially connected to the mei to the 〇 〇 〇 〇 226 226 226 It is substantially close to the first mating surface. On this day, it can be determined that the heat sink 21〇 and the heat sink 22 are normal rainbow. Conversely, when the fresh 22() is manually assembled to the heat sink When the second fitting portion 228 is fitted to the first fitting portion 214, if the first fitting portion 228 and the first fitting portion 214 are not substantially in close contact with each other, the second fitting surface 226 cannot be When it is substantially in close contact with the first fitting surface 212, it can be determined that the heat sink 210 and the heat sink 22 are improperly assembled. ^ In the first embodiment of the present invention, It can be determined manually whether the heat sink 220 can be properly assembled to the heat sink 21A to ensure that the heat sink 220 can be properly assembled to the heat sink 21A. Therefore, the thickness of the heat conductive layer 23 is getting smaller and smaller. Under such a mechanism, it is ensured that there is no gap between the hot sheet 21〇 and the heat sink 220 (ie, between the figures ic, ^), or that the gap between the heat sink 210 and the heat sink 220 is low. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Side view of the heat sink module after assembly. Referring to FIG. 3A and FIG. 3B simultaneously, the difference between the heat dissipation module 3 (8) of the second embodiment is that the first fitting portion 314 of the heat sink 310 is a flange, compared to the heat dissipation module 200 of the first embodiment. The corresponding first fitting portion 328 of the heat sink 32 is a groove. Therefore, when the thermal heat 320 is assembled to the heat sink 31 by manual means, whether the first fitting portion 314 can be normally fitted with the second fitting portion 328 can be used to determine the divergence cry 320 and Whether the heat sink 310 is assembled normally. As described above, the heat dissipation module of the present invention has at least the following advantages: J", during the process of manually assembling the heat sink to the heat sink, by means of the heat sink after the joint and the heat sink Whether the fitting portion can be positively discured and thus determines the fitting of the heat sink - the corresponding merging surface of the heat sink is combined, thereby determining whether the heat sink and the heat sink are properly assembled.
一、相早父於習知之散熱片及散熱器為平面密合之嗖計， 可藉由散熱片之嵌合部及散熱器之兩嵌^部二的 敗。4來提高散熱片及散舖在結構上的穩定性。 太^發批以較佳實施例揭露如上，然其並非用以限定 本七月，任何熟習此技藝者，在不脫離本發明之 =、，當可作些許之更動與潤飾，因此，本發明=護= 圍虽視後附之申請專利範圍所界定者為準。 一 【圖式簡單說明】 1260967 15011twf.doc/006 圖1A给示習知之一種散熱模組於組裝前的侧視圖。 圖1Β繪不圖1Α之散熱模組於組裝後的側視圖。 圖1C繪示圖1Α之散熱模組於組裝異常的側視圖。 圖2Α繪示本發明之第一實施例之一種散熱模組於組 裝前的側視圖。 圖2Β繪示圖2Α之散熱模組於組裝後的側視圖。 圖3Α繪示本發明之第二實施例之一種散熱模組於組 裝前的側視圖。 圖3Β繪示圖3Α之散熱模組於組裝後的側視圖。 【主要元件符號說明】 10 ··主機板 20 :插座 30 ··中央處理單元 100、 ‘200、 • 300 :散熱模組 110、 •210、 .310 :散熱片 112 ： :散熱 片表面 120、 ‘220、 ‘320 :散熱器 122、 •222、 •322 •底板 124、 ‘224、 ‘324 :鰭片 130、 、230、 ‘330 :導熱層 212， 、312 ： :第一 鼓合面 214 、314 ： :第一 1银:合部 226 、326 ： :第二 -嵌合面 228， 、328 ： :第二嵌合部First, the early father and the known heat sink and the heat sink are plane-closed devices, which can be defeated by the fitting portion of the heat sink and the two embedded portions of the heat sink. 4 to improve the structural stability of the heat sink and the spread. The present invention is disclosed in the above preferred embodiments. However, it is not intended to limit the present invention. Any skilled person skilled in the art can make some modifications and retouching without departing from the invention. Therefore, the present invention = 护 = 围 围 围 围 围 围 围 围 围 围 围 围 围 围 围 围 围A simple description of the drawing 1260967 15011twf.doc/006 FIG. 1A is a side view showing a heat dissipating module of the prior art before assembly. Figure 1 is a side view of the heat dissipation module of Figure 1 after assembly. FIG. 1C is a side view showing the assembly of the heat dissipation module of FIG. 2A is a side view of a heat dissipating module of the first embodiment of the present invention before being assembled. FIG. 2 is a side view of the heat dissipation module of FIG. 2 after assembly. Fig. 3 is a side elevational view showing a heat dissipating module of the second embodiment of the present invention before assembly. FIG. 3 is a side view of the heat dissipation module of FIG. 3 after assembly. [Description of main component symbols] 10 · Motherboard 20: Socket 30 · · Central processing unit 100, '200, • 300: Thermal module 110, • 210, .310: Heat sink 112: : Heat sink surface 120, ' 220, '320: heat sink 122, • 222, • 322 • bottom plate 124, '224, '324: fins 130, 230, '330: heat conducting layer 212, 312: : first drum surface 214, 314 : : First 1 silver: joints 226 , 326 : : second - fitting faces 228 , , 328 : : second fitting