200825686 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱模組結構，尤其是關於一種雙 熱源散熱模組之結構。 【先前技術】 習用裝設於電腦内之散熱模組，一般多是針對產生熱 量最多之中央處理器（Central Processing Unit，CPU) 進行散熱，通常CPU散熱模組係具有一 CPU散熱片、一熱 管與一組散熱鰭片，CPU散熱片係貼合中央處理器上並藉 由熱管與散熱鰭片相連接，以將中央處理器所產生之熱量 經由熱管傳導至散熱鰭片以散除熱量，但就北橋晶片 (North Bridge Chip )之散熱模式中，多半僅利用一 Chip 散熱片貼合於北橋晶片上，以散除北橋晶片於通電時所產 生的熱量。 但此種散熱方式，只能適用於低耗電功率（大約4W)的 北橋晶片，因為耗電功率越低則北橋晶片所產生的熱量就 越低，然而當耗電功率較高時，北橋晶片係會產生較多的 熱量，以致於一般金屬散熱片無法有效將此熱量散除，因 此，有廠商Chip在散熱片與散熱鰭片之間再增設一傳導熱 量的熱管，或是將熱管延長以橫跨北橋晶片與中央處理器。 6 200825686 而橫跨方式係為將一延長熱管以橫跨北橋晶片與中央 處理器之方式示意圖，其中，延長熱管橫跨北橋晶片與中 央處理器，並分別連接北橋晶片之Chip散熱片與中央處理 器之CPU散熱片，以使北橋晶片與中央處理器所產生的熱 量經由CPU散熱片與Chip散熱片傳導至延長熱管，再經由 延長熱管將熱量傳導至散熱鰭片，來進行熱量散除，以增 加兩散熱片的散熱效能。 然而，增設熱管或延長熱管長度即造成整體散熱模組 配置空間的增加，而且在熱管的配置也需額外增加散熱模 組的設計成本，此外，雖配置熱管以增加散熱效能，但隨 著配置空間的增加，空氣可流動空間亦會有所限制使得熱 氣難以散除，使得散熱效能並未能達到預期的效果，或是 反增加元件配置空間的溫度上昇。 【發明内容】 有鑑於此，本發明所欲解決之問題及目的在於提供一 種可節省配置空間，並可同時對雙發熱元件進行散熱，又 能增加散熱效能的雙熱源散熱模組。 因此，本發明揭露一種雙熱源散熱模組，用以散除第 一發熱元件與第二發熱元件所產生之熱量，此第一與第二 發熱元件係配置於一電路板上，此雙熱源散熱模組則包含 7 200825686 一第一導熱板、一第二導熱板、一熱管以及一散熱元件， 第一導熱板係接觸第一發熱元件，而熱管則是分別連接第 一導熱板與散熱元件，而第二導熱板則是由散熱元件所延 伸形成並接觸第二發熱元件。 其中，第一導熱板係將第一發熱元件所產生之熱量傳 導至第一導熱板，此熱量係再藉由熱管傳導至散熱元件， 第二導熱板則將第二發熱元件所產生之熱量傳導至散熱元 件，而散熱元件係散除由熱管與第二導熱板所傳導而來之 熱量。 本發明更包含一抵壓彈片，抵壓彈片係螺固於電路板 上，並將熱管以抵壓方式固定於第一導熱板上，且抵壓彈 片係能設置一導軌，此導軌之寬度係與該熱管之寬度相 當，以將熱管容置於導執而固定熱管；其次，第一導熱板 與第二導熱板同樣可以螺固之方式固定於電路板上。 本發明更包含一風扇，此風扇係設置於散熱元件旁侧 並產生流通於散熱元件中，用以散除散熱元件之熱量，且 此風扇係能螺固於電路板上；其次，第一導熱板係具有一 凹陷部，此凹陷部係與第一發熱元件貼合部位之形狀相對 應，使第一導熱板與第一發熱元件可緊密貼合，且第二導 熱板係具有一凸面部，此凸面部係與第二發熱元件之發熱 8 200825686 位置相對應並貼合。 本發明係具有先前技術無法達成之功效，即是僅需配 置一熱管，其第二導熱板係是直接由散熱元件延伸而出， 使第二發熱元件所產生之熱量能直接傳導至散熱元件進行 散除，且無需再配置第二個熱管，如此可節省散熱模組的 配置空間，還能增加内空氣之流通以增強散熱效果，同時 還能減少散熱模組的設計成本，而且藉由第二導熱板與散 熱模組之相連並分別利用螺合方式進行固定，可使散熱模 組受外力時不會任意位移，故不會造成其它元件之損壞。 【實施方式】 為使對本發明的目的、構造特徵及其功能有進一步的 了解，茲配合相關實施例及圖式詳細說明如下： 請同時參照【第1A圖】與【第1B圖】，其為本發明之 結構分解圖與組合圖，係將一雙熱源散熱模組100固定一 電路板300上，此電路板300係具有一第一發熱元件301 與一第二發熱元件302，此雙熱源散熱模組100固定於電 路板300時，係用以散除第一發熱元件301與第二發熱元 件302之熱量，而且，此電路板300係可為一主機板，所 以第一發熱元件與第二發熱元件係可為中央處理器 (central processing unit ，CPU)與北橋晶片（north 200825686 崎㈣的組合，當然亦可為其他二個晶片之組合。 錢熱源散熱模組⑽係、包含有-第-導熱板101、 一熱管102、1熱元件103與第二導熱板104。 其中，第—導熱板101係接觸第一發熱元件301之表 面’以將弟-發熱元件3〇1所產生的熱量傳導至第一導教 板^ •，而熱管102係將其-端接合第-導熱板101並壓 掣弟導熱板101 ’使第—導熱板m得以緊密接觸第一 發熱元件301，而接合之方式射㈣歧焊接以使 熱管1G2固定於第一導熱板m，藉以將第一發熱元件肌 之歸經第-導熱板1〇1而傳導至熱管1〇2，再從熱管⑽ 與弟-導熱板101之連接處傳導至熱管1〇2之另一端，而 散熱元件103係'是連接於熱管m之另-端，因此熱量即 再攸…吕102傳導至散熱凡件1〇3，並藉由散熱元件1⑽ 所叹置之魏個Μ而將熱量散除，此散熱元件⑽之散 ^片係採增加散熱面積來提高散除熱量的效果，而第二 物反104係是配置於散熱元件1〇3之-端，並用以接觸 弟一發熱元件302之表面’以將第二發熱元件3〇2所產生 里心由第二導熱板104直接傳導至散熱元件103，以 進行熱量散除作業。 ”人，右熱官102與第一導熱板1〇1以黏貼或僅以接 10 200825686 觸方式貼合時，係可利用一抵壓彈片105將熱管102以抵 壓方式固定於第一導熱板101上，而且為確保熱管102於 抵壓時不至於任意移動，係可在抵壓彈片105上設置一導 • 執108，此導軌108之寬度係與熱管102之寬度相同，以 • 將熱管102容置於導軌108中，以固定熱管102受抵壓時 的位置，而抵壓彈片105除抵壓熱管102時，係間接抵壓 第一導熱板101，並以螺固之方式限定第一導熱板之配置 空間，以使第一導熱板無法任意位移，並可使第一導熱板 101緊密接觸第一發熱元件301，以同時達到三種相異之增 益效果。 再者，為使雙熱源散熱模組100確實固定於電路板300 上，係可分別將第一導熱板101、第二導熱板102、抵壓彈 片105、與散熱元件103以螺合之方式固定於電路板300 、上，而且若有必要，係可在第一導熱板101上設置一凹陷 部（圖中未顯示），此凹陷部之形狀係與第一發熱元件301 貼合部位之形狀相對應，以使第一導熱板101接觸第一發 _ 熱元件301時，係能藉由此凹陷部將第一導熱板101緊密 貼合於第一發熱元件301，同時第二導熱板104係能配置 一凸面部107,此凸面部107之位置係與第二發熱元件302 之發熱位置相對應，使第二導熱板104接觸第二發熱元件 11 200825686 302時，令凸面部107貼合第二發熱元件302之主要發熱 位置，藉以加速散除第二發熱元件302所產生之熱量。 此外，第二導熱板104配置於散熱元件103之方式包 含有黏貼、焊接以及直接由散熱元件103延伸成型等至少 三種之不同的配置方式，不論是以那種方式進行配置，其 主要之目的皆為將第二導熱板104與散熱元件103直接相 連接，以使第二導熱板104與第二發熱元件302接觸之同 時，將第二發熱元件302之熱量藉由第二導熱板104直接 傳導至散熱元件10 3，然而此三種配置方法在導熱效果來 說，一般以直接成型為最、焊接次之，而黏貼或貼合接觸 為末。 請同時參照【第2A圖】與【第2B圖】，此為本發明之 另一實施例之結構分解圖與組合圖，為強化散熱元件103 的散熱效果，係可增加配置一風扇106，此風扇106係是 連接於散熱元件103，其出風口係是對準散熱元件103，此 風扇106於作動時係會產生一氣流，此氣流係由出風口進 行輸出並流動於散熱元件103之間，以藉由空氣的流動帶 走散熱元件103上的熱量並將其熱量排於外界，達到熱量 散除之效果。 因此，本發明之雙熱源散熱模組，係利用抵壓彈片105 12 200825686 與散熱元件103並透過螺合方式以確實地使熱管102、第 一導熱板1(Π、第二導熱板104、第一發熱元件301與第二 發熱元件302確實地接觸，以散除第一發熱元件301與第 二發熱元件302所產生之熱量，並可增設風扇106帶動空 氣之流動以強化散熱效果，達到最高散熱效率。 最後，由於本發明之第二導熱板104係自散熱元件103 所延伸而出並接觸第二發熱元件302，故設計時往往將第 二發熱元件302配置在距離散熱元件103較近的位置，以 縮短其熱傳導之距離，達到較佳之散熱效果。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動和潤飾，因此本發明之保護 範圍當後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1Α圖係本發明之結構分解圖； 第1Β圖係本發明之組合圖； 第2Α圖係本發明之另一實施例之結構分解圖；以及 第2Β圖係本發明之另一實施例之組合圖。 【主要元件符號說明】 100 雙熱源散熱模組 13 200825686 101 第一導熱板 102 献管 /、、、 p 103 散熱元件 104 第二導熱板 105 抵壓彈片 106 風扇 107 凸面部 108 導軌 300 電路板 301 第一發熱元件 302 第二發熱元件 14200825686 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module structure, and more particularly to a structure of a dual heat source heat dissipation module. [Prior Art] The heat dissipation module installed in the computer is generally used for heat dissipation of a central processing unit (CPU) that generates the most heat. Usually, the CPU cooling module has a CPU heat sink and a heat pipe. And a set of heat sink fins, the CPU heat sink is attached to the central processing unit and connected to the heat sink fins by the heat pipe to conduct heat generated by the central processor to the heat sink fins through the heat pipe to dissipate heat, but In the heat dissipation mode of the North Bridge Chip, most of the heat is applied to the Northbridge wafer using only one Chip heat sink to dissipate the heat generated by the North Bridge chip when it is energized. However, this type of heat dissipation can only be applied to Northbridge wafers with low power consumption (about 4W). The lower the power consumption, the lower the heat generated by the Northbridge wafer. However, when the power consumption is high, the Northbridge wafer. The system generates more heat, so that the general metal heat sink cannot effectively dissipate the heat. Therefore, the manufacturer Chip adds a heat-conducting heat pipe between the heat sink and the heat sink fins, or extends the heat pipe. Across the Northbridge chip and the central processor. 6 200825686 The crossover mode is a schematic diagram of an extended heat pipe across the north bridge chip and the central processing unit, wherein the heat pipe extends across the north bridge chip and the central processing unit, and is connected to the chip heat sink of the north bridge chip and the central processing. The CPU heat sink, so that the heat generated by the north bridge chip and the central processing unit is transmitted to the extended heat pipe through the CPU heat sink and the chip heat sink, and then the heat is transmitted to the heat dissipation fin through the extended heat pipe to perform heat dissipation. Increase the heat dissipation performance of the two heat sinks. However, the addition of heat pipes or extension of the heat pipe length results in an increase in the overall heat dissipation module configuration space, and the heat pipe configuration also requires an additional design cost of the heat dissipation module. In addition, although the heat pipe is configured to increase heat dissipation performance, with the configuration space With the increase, the air flowable space is also limited so that the hot air is difficult to dissipate, so that the heat dissipation performance fails to achieve the desired effect, or the temperature of the component arrangement space is increased. SUMMARY OF THE INVENTION In view of the above, the problem and object of the present invention are to provide a dual heat source heat dissipation module that can save configuration space, simultaneously dissipate heat from dual heating elements, and increase heat dissipation performance. Therefore, the present invention discloses a dual heat source heat dissipation module for dissipating heat generated by the first heat generating component and the second heat generating component. The first and second heat generating components are disposed on a circuit board, and the dual heat source dissipates heat. The module comprises 7 200825686 a first heat conducting plate, a second heat conducting plate, a heat pipe and a heat dissipating component, the first heat conducting plate contacting the first heat generating component, and the heat pipe is respectively connected to the first heat conducting plate and the heat dissipating component, The second heat conducting plate is formed by the heat dissipating component and contacts the second heat generating component. The first heat conducting plate conducts heat generated by the first heat generating component to the first heat conducting plate, and the heat is conducted to the heat dissipating component through the heat pipe, and the second heat conducting plate conducts heat generated by the second heat generating component. To the heat dissipating component, the heat dissipating component dissipates the heat conducted by the heat pipe and the second heat conducting plate. The invention further comprises a pressing elastic piece, the pressing elastic piece is screwed on the circuit board, and the heat pipe is fixed on the first heat conducting plate by pressing, and the pressing elastic piece can be provided with a guide rail, and the width of the guiding rail is Corresponding to the width of the heat pipe, the heat pipe is placed in the guide to fix the heat pipe; secondly, the first heat conducting plate and the second heat conducting plate can be screwed to the circuit board. The invention further includes a fan disposed on the side of the heat dissipating component and flowing in the heat dissipating component for dissipating heat of the heat dissipating component, and the fan is screwed to the circuit board; secondly, the first heat conduction The plate system has a recessed portion corresponding to the shape of the first heat-generating component bonding portion, so that the first heat-conducting plate and the first heat-generating component can be closely adhered, and the second heat-conducting plate has a convex surface. The convex surface portion corresponds to the position of the heat generation 8 200825686 of the second heating element. The invention has the effect that the prior art cannot achieve, that is, only one heat pipe needs to be disposed, and the second heat conducting plate is directly extended by the heat dissipating component, so that the heat generated by the second heat generating component can be directly transmitted to the heat dissipating component. Dissipation, and no need to configure a second heat pipe, which can save the configuration space of the heat dissipation module, increase the circulation of the internal air to enhance the heat dissipation effect, and reduce the design cost of the heat dissipation module, and by the second The heat conducting plate is connected to the heat dissipating module and fixed by screwing, respectively, so that the heat dissipating module is not arbitrarily displaced by external force, so no damage to other components is caused. [Embodiment] In order to further understand the objects, structural features and functions of the present invention, the related embodiments and drawings will be described in detail as follows: Please refer to both [Fig. 1A] and [Fig. 1B], which are The structure of the heat dissipation module 100 of the present invention is fixed to a circuit board 300. The circuit board 300 has a first heat generating component 301 and a second heat generating component 302. When the module 100 is fixed on the circuit board 300, it is used to dissipate the heat of the first heating element 301 and the second heating element 302. Moreover, the circuit board 300 can be a motherboard, so the first heating element and the second The heating element can be a combination of a central processing unit (CPU) and a north bridge chip (north 200825686 Saki (4), of course, a combination of the other two chips. The money heat source cooling module (10) system, including - the first The heat conducting plate 101, a heat pipe 102, a heat element 103 and a second heat conducting plate 104. The first heat conducting plate 101 contacts the surface of the first heat generating component 301 to transfer the heat generated by the heat generating component 3〇1. To the first teaching board ^, and the heat pipe 102 is joined to the first heat conducting plate 101 and presses the heat conducting plate 101' so that the first heat conducting plate m is in close contact with the first heat generating element 301, and the joining manner Shooting (four) differential welding to fix the heat pipe 1G2 to the first heat conducting plate m, thereby transferring the first heat generating component muscle to the heat pipe 1〇2 through the first heat conducting plate 1〇1, and then from the heat pipe (10) to the heat conducting plate The junction of 101 is conducted to the other end of the heat pipe 1〇2, and the heat dissipating component 103 is connected to the other end of the heat pipe m, so that the heat is again transferred to the heat dissipating component 1〇3, and by The heat dissipating component 1 (10) dissipates the heat and dissipates the heat. The heat dissipating component (10) adopts a heat dissipating area to increase the heat dissipating effect, and the second object anti-104 is disposed in the heat dissipating component 1 The end of the 〇3 is used to contact the surface of the heating element 302 to transmit the core generated by the second heating element 3〇2 directly from the second heat conducting plate 104 to the heat dissipating element 103 for heat dissipation operation. "People, right heat officer 102 and the first heat conducting plate 1〇1 to stick or only to pick up 10 200825686 When the manner is applied, the heat pipe 102 can be fixed to the first heat conducting plate 101 by pressing the elastic piece 105, and the heat pipe 102 can be arbitrarily moved when the pressure is applied, and the elastic piece 105 can be pressed against the elastic piece 105. A guide 108 is disposed, the width of the guide rail 108 is the same as the width of the heat pipe 102, so that the heat pipe 102 is received in the guide rail 108 to fix the position when the heat pipe 102 is pressed, and the elastic spring 105 is pressed. When the heat pipe 102 is pressed, the first heat conducting plate 101 is indirectly pressed, and the arrangement space of the first heat conducting plate is defined by screwing, so that the first heat conducting plate cannot be arbitrarily displaced, and the first heat conducting plate 101 can be tightly closed. The first heating element 301 is contacted to simultaneously achieve three different gain effects. In addition, in order to ensure that the dual heat source heat dissipation module 100 is fixed on the circuit board 300, the first heat conduction plate 101, the second heat conduction plate 102, the pressing elastic piece 105, and the heat dissipation element 103 are respectively fixed by screwing. On the circuit board 300, above, and if necessary, a recessed portion (not shown) may be disposed on the first heat conducting plate 101, and the shape of the recessed portion is in conformity with the shape of the bonding portion of the first heat generating component 301. Correspondingly, when the first heat conducting plate 101 is in contact with the first heat generating element 301, the first heat conducting plate 101 can be closely attached to the first heat generating component 301 by the recessed portion, and the second heat conducting plate 104 can be A convex portion 107 is disposed. The position of the convex portion 107 corresponds to the heat generating position of the second heat generating component 302. When the second heat conducting plate 104 contacts the second heat generating component 11 200825686 302, the convex portion 107 is attached to the second heat. The main heat generating position of the component 302 is to accelerate the dissipation of heat generated by the second heat generating component 302. In addition, the second heat conducting plate 104 is disposed on the heat dissipating component 103 in at least three different configurations, such as pasting, soldering, and directly extending from the heat dissipating component 103. The main purpose is to configure the main purpose. In order to directly connect the second heat conducting plate 104 and the heat dissipating component 103 to contact the second heat conducting component 104 with the second heat generating component 302, the heat of the second heat generating component 302 is directly transmitted to the heat through the second heat conducting plate 104. The heat dissipating component 10 3 , however, in the heat conducting effect, generally, the direct forming is the best, the welding is the second, and the bonding or bonding contact is the last. Please refer to [Fig. 2A] and [Fig. 2B] at the same time. This is an exploded view and a combination view of another embodiment of the present invention. To enhance the heat dissipation effect of the heat dissipating component 103, a fan 106 can be added. The fan 106 is connected to the heat dissipating component 103, and the air outlet is aligned with the heat dissipating component 103. When the fan 106 is activated, an airflow is generated, and the airflow is outputted by the air outlet and flows between the heat dissipating components 103. The heat dissipation on the heat dissipating component 103 is carried away by the flow of air and the heat is discharged to the outside to achieve the effect of heat dissipation. Therefore, the dual heat source heat dissipation module of the present invention utilizes the pressing elastic piece 105 12 200825686 and the heat dissipating component 103 to pass through the screwing manner to reliably make the heat pipe 102 and the first heat conducting plate 1 (Π, the second heat conducting plate 104, the first A heating element 301 and the second heating element 302 are in positive contact to dissipate the heat generated by the first heating element 301 and the second heating element 302, and the fan 106 can be added to drive the air to enhance the heat dissipation effect to achieve maximum heat dissipation. Finally, since the second heat conducting plate 104 of the present invention extends from the heat dissipating component 103 and contacts the second heat generating component 302, the second heat generating component 302 is often disposed at a position closer to the heat dissipating component 103. In order to reduce the distance of the heat conduction and achieve a better heat dissipation effect, although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art without departing from the spirit and scope of the present invention. The scope of protection of the present invention is defined by the scope of the appended claims. 1 is a structural exploded view of the present invention; a first drawing is a combined view of the present invention; a second drawing is an exploded view of another embodiment of the present invention; and a second drawing is another embodiment of the present invention. Combination diagram [Main component symbol description] 100 dual heat source heat dissipation module 13 200825686 101 First heat conduction plate 102 pipe / /, p 103 heat dissipation element 104 second heat conduction plate 105 against the elastic piece 106 fan 107 convex surface 108 guide rail 300 circuit board 301 first heating element 302 second heating element 14