TWI758900B - Cooling module - Google Patents

Abstract

A cooling module is adapted for plugging in at least one expansion slot. The cooling module includes at least one board, at least one fin set and at least one heat pipe. The at least one board includes at least one plugging portion, wherein the at least one plugging portion is adapted for plugging in the at least one expansion slot. The at least one fin set is arranged on the at least one board. The at least one heat pipe passes through the at least one fin set and includes at least one extension portion, wherein the at least one extension portion extends out of the at least one board and the at least one fin set.

Description

cooling module

The present invention relates to a heat dissipation module, and in particular, to a heat dissipation module with better heat dissipation effect.

At present, disposing the heat sink on the display card is a common means of heat dissipation. However, in actual use, limited by factors such as the space on the motherboard and the configuration of the card slots, even if a heat sink is configured, the graphics cards inserted in different positions will obtain different heat dissipation effects, resulting in uneven heat dissipation. situation. For example, when more than two graphics cards are inserted on the motherboard, due to the good ventilation on the outside, the graphics card located on the outermost side can obtain better heat dissipation effect, and the graphics card located on the inner side can obtain poor heat dissipation effect.

The invention provides a heat dissipation module, which is suitable for being inserted on the expansion interface and has better heat dissipation effect.

The invention provides a heat dissipation module, which is suitable for being inserted into at least one expansion interface. The heat dissipation module includes at least one board card, at least one fin group and at least one heat pipe. At least one board includes at least one plug portion, wherein at least one plug portion is suitable for being inserted into at least one expansion interface. At least one fin group is disposed on at least one board. The at least one heat pipe passes through the at least one fin group and includes at least one extension portion, wherein the at least one extension portion extends beyond the at least one board and the at least one fin group.

In an embodiment of the present invention, the at least one board card includes an expansion card, and the expansion card is electrically connected to the corresponding expansion interface through the plug-in portion.

In an embodiment of the present invention, the above-mentioned expansion card includes a processor, the at least one heat pipe includes a heat pipe corresponding to the expansion card, and the heat pipe directly contacts the processor.

In an embodiment of the present invention, the above-mentioned at least one board includes a dummy card.

In an embodiment of the present invention, the above-mentioned fake card includes a cooling chip, at least one heat pipe includes a heat pipe corresponding to the fake card, and the heat pipe directly contacts the cooling chip.

In an embodiment of the present invention, the at least one board card includes a board card, the at least one heat pipe includes two heat pipes corresponding to the board card, the at least one extension portion includes two extension portions corresponding to the two heat pipes, and the two extension portions are respectively It includes two first sections and two second sections, the two first sections of the two extending parts extend in a first direction and a second direction away from each other, and the two second sections extend in a third direction.

In an embodiment of the present invention, the above-mentioned at least one board includes a plurality of boards, at least one fin group includes a plurality of fin groups, at least one heat pipe includes a plurality of heat pipes, and at least one extension portion includes a plurality of extension portions The fin sets are respectively arranged on the board, the heat pipes are penetrated through the fin sets, and the extension parts of the heat pipes extend beyond the board and the fin sets, and are connected together.

In an embodiment of the present invention, the above-mentioned heat dissipation module further includes at least one heat dissipation block sleeved on at least one extension portion, and each heat dissipation block includes a fixed portion.

In an embodiment of the present invention, each of the above-mentioned heat dissipation blocks includes a butting surface, and each extension portion is exposed to the butting surface of the corresponding heat dissipation block.

In an embodiment of the present invention, the above-mentioned heat dissipation module further includes at least one fan disposed beside at least one fin group.

Based on the above, in the heat dissipation module of the present invention, the heat pipe of the heat dissipation module includes an extension portion, and the extension portion extends beyond the board and the fin group. The extension portion is equivalent to providing an additional heat dissipation path, which further improves the heat dissipation performance of the heat dissipation module.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

FIG. 1 is a perspective view of a heat dissipation module according to an embodiment of the present invention. Please refer to FIG. 1 , the heat dissipation module 100 of this embodiment is suitable for being inserted into an expansion interface (not shown). The heat dissipation module 100 is, for example, a graphics card module, and the expansion interface is, for example, a PCI-E slot, but the types of the heat dissipation module 100 and the expansion interface are not limited thereto.

Referring to FIG. 1 , in this embodiment, the heat dissipation module 100 includes at least one board 110 , at least one fin group 120 and at least one heat pipe 130 . Specifically, in this embodiment, the number of the boards 110 and the fin groups 120 is, for example, four, and the four fin groups 120 are respectively arranged on the four boards 110 . Each fin group 120 is provided with at least two or more heat pipes 130 . Three of these boards 110 are three expansion cards 112 (eg, a display card), and the other is a dummy card 114 (dummy card) for assisting heat dissipation, for example. Of course, the types and numbers of boards 110 are not limited to the above.

Each of the boards 110 includes a plug-in portion 111 adapted to be inserted into a corresponding expansion port (not shown) of the mainboard (not shown). Among the heat pipes 130 corresponding to the boards 110 , two of the heat pipes 130 include two extension parts 131 , and the two extension parts 131 extend beyond the board 110 and the fin set 120 .

FIG. 2 is a partial schematic diagram of heat conduction of a heat pipe of the heat dissipation module of FIG. 1 . It should be noted that, in order to clearly represent the relationship between the heat pipe 130 and the processor 113 , the fin group 120 is not shown in FIG. 2 . Please refer to FIG. 2 , in this embodiment, the board 110 is an expansion card 112 and includes a processor 113 , and the heat pipe 130 directly contacts the processor 113 . In one embodiment, heat dissipation glue is provided between the heat pipe 130 and the processor 113 , but not limited thereto.

Specifically, the processor 113 generates heat during operation, and the heat will be transferred from the processor 113 to the heat pipe 130 (as shown by the arrow in FIG. 2 ). The heat pipe 130 receives heat from the processor 113 and transfers the heat. to the fin group 120 and the extension part 131 for heat dissipation.

The extension portion 131 of the heat pipe 130 helps to increase the surface area for heat dissipation, and the extension portion 131 is located outside the board 110 and the fin group 120 with good ventilation (see the wind direction diagram in FIG. 1 ), and has good heat dissipation performance. It is equivalent to providing an additional heat dissipation path, thereby improving the heat dissipation performance of the entire heat dissipation module 100 .

It is worth mentioning that, generally speaking, for multiple boards 110, the fan position will affect the heat dissipation effect. Taking FIG. 1 as an example, the wind will blow from left to right. The board 110 in the position (for example, the board 110 on the far left in FIG. 1 ) has better heat dissipation performance, and the other boards 110 are located in a position with poor ventilation, so that the heat dissipation performance is not as good as that of the board 110 on the left. 110 came well.

FIG. 3 is a partially enlarged schematic view of the extension of FIG. 1 . Referring to FIG. 3 , in this embodiment, the two heat pipes 130 corresponding to the respective boards 110 include two extending portions 131 , and the two extending portions 131 respectively include two first sections 131 a and two second sections 131 b.

Specifically, the two extending portions 131 corresponding to each board 110 extend beyond the board 110 and the fin set 120 , and the first sections 131 a respectively extend to both sides of the board 110 away from each other, as shown in the first section in FIG. 3 . The direction D1 and the second direction D2 are shown. The second sections 131b of the extending portions 131 of the board 110 are respectively connected with the second sections 131b of the extending portions 131 of the two-side board 110 and extend toward the third direction D3.

Referring back to FIG. 1 , in this embodiment, the second segments 131 b of the extending portions 131 of the heat pipes 130 corresponding to two adjacent boards 110 are connected together. In addition, the heat dissipation module 100 further includes a plurality of heat dissipation blocks 132 sleeved on the second segments 131 b of the extending portions 131 , respectively.

FIG. 4 is a schematic cross-sectional view of two adjacent heat dissipation blocks and two heat pipes of FIG. 1 . Referring to FIG. 4 , in this embodiment, each extension portion 131 is covered by the corresponding heat dissipation block 132 . In this embodiment, each heat dissipation block 132 includes an abutting surface 134 corresponding to another heat dissipation block 132 , and heat dissipation glue is provided between the two butting surfaces 134 to increase the thermal contact area, but not limited thereto. The two adjacent heat dissipation blocks 132 will be in contact with each other to conduct heat. In the process of heat transfer between the two adjacent extension parts 131 , the heat energy will be transferred from the extension part 131 with the higher temperature to the corresponding heat dissipation block 132 , and then pass through the adjacent extension parts 131 . The heat dissipation block 132 is transferred to the extension part 131 with a lower temperature, so as to thermally couple the two adjacent heat pipes 130 .

In this embodiment, the heat pipes 130 can conduct heat conduction through the extending portions 131 connected together in pairs, and the fin groups 120 and the heat pipes 130 located in the ventilated places can assist the fin groups 120 and 130 located in the poorly ventilated places. The heat pipe 130 dissipates heat, so as to achieve uniform heat dissipation of the entire heat dissipation module 100 and improve heat dissipation efficiency.

In this embodiment, the heat dissipation module 100 dissipates heat by means of air cooling, and the heat pipe 130 includes a little fluid, wherein the fluid coexists with gas and liquid, so as to utilize the heat absorption and heat release of the liquid-vapor two-phase change, so as to achieve a good heat transfer effect. In this embodiment, the fluids in the two adjacent heat pipes 130 do not communicate with each other. Compared with the water-cooled radiator, the heat pipe 130 in this embodiment has only a small amount of fluid, and no joint connection is required between the two heat pipes 130 , so there is no problem of circuit damage caused by liquid leakage.

In addition, in this embodiment, the heat dissipation module 100 further includes at least one fan 140 disposed beside the fin set 120 to cool the fin set 120 and improve the heat dissipation effect, but the type of the heat dissipation module 100 is not limited to this , in other embodiments, the fan 140 may also be omitted, and only the fin group 120 can be used to achieve the effect of heat dissipation.

FIG. 5 is a partial schematic diagram of a heat dissipation block according to another embodiment of the present invention. Referring to FIG. 5 , in this embodiment, each heat dissipation block 132 can optionally include a fixing portion 133 , such as a through hole or a screw hole, and the two heat dissipation blocks 132 can be fixed by the cooperation of screws and studs. together. Of course, the fixing method of the two heat dissipation blocks 132 is not limited to the above-mentioned method, and the two heat dissipation blocks 132 may also be connected by a method such as welding or bonding, or the two heat dissipation blocks 132 may also be just abutted together.

FIG. 6 is a schematic cross-sectional view of another embodiment of the present invention. Referring to FIG. 6 , in this embodiment, the two extending portions 131 are exposed to the butting surfaces 134 of the corresponding heat dissipation blocks 132 , and are in direct contact with the adjacent extending portions 131 . In addition, in this embodiment, the two extension parts 131 are pressed together tightly in a non-circular shape, so as to increase the direct contact area between the two extension parts 131 .

Compared to the two extending portions 131 in FIG. 4 that are separated by two heat dissipation blocks 132 , in this embodiment, the two extending portions 131 are in direct contact with the adjacent extending portions 131 , so the heat will extend from the higher temperature The part 131 is directly transferred to the lower temperature extension part 131 , and the process of heat transfer between the two heat dissipation blocks 132 between the two extension parts 131 can be omitted. Since the thermal conductivity of the heat pipe 130 is greater than the thermal conductivity of the heat dissipation block 132 , in this embodiment, the design in which the extension portion 131 is in direct contact with the adjacent extension portion 131 has better thermal conductivity, and there may be more heat conduction between the two extension portions 131 . Efficient heat transfer for faster uniformity of heat dissipation.

Returning to FIG. 1 , in this embodiment, one of the boards 110 is a dummy card 114 . The dummy card 114 is, for example, a plastic board with a plug-in portion 111 , and can be inserted into the host in the same way as the expansion card 112 . on the expansion port of the board. The plug portion 111 may not have terminals such as gold fingers.

In this embodiment, the fake card 114 does not have a display chip. In addition, in this embodiment, the fake card 114 has to be provided with a circuit, and a simple circuit can also be provided. The fan on the dummy card 114 can be electrically connected to the plug-in portion 111 through a simple circuit to obtain power from the motherboard. Alternatively, a socket may also be provided on the expansion card 112 adjacent to the dummy card 114 , and the fan 140 on the dummy card 114 may be connected to the socket of the adjacent expansion card 112 by wires, so that the fan 140 of the adjacent expansion card 112 can be The plug-in portion 111 is used to obtain power from the motherboard. The fan 140 on the dummy card 114 can also be directly connected to the power supply interface of the motherboard through a wire to obtain power directly from the motherboard.

Since the fake card 114 does not have a display chip or a chip that generates high heat, the fake card 114 does not generate heat or generates very little heat. In this embodiment, the fin set 120 and the heat pipe 130 are also disposed on the dummy card 114, and the heat pipe 130 on the dummy card 114 is thermally coupled with the heat pipe 130 on the adjacent expansion card 112, which is equivalent to providing an additional The heat dissipation path can assist other boards 110 to dissipate heat. Thereby, the entire heat dissipation module 100 can dissipate heat more quickly. Of course, in other embodiments, the heat dissipation module 100 may not have the dummy card 114, and the form of the heat dissipation module 100 is not limited thereto.

FIG. 7 is a partial schematic diagram of heat conduction of a heat pipe according to another embodiment of the present invention. It should be noted that, in order to clearly show the relationship between the heat pipe 130 and the cooling wafer 115 , the fin group 120 is not shown in FIG. 7 . Referring to FIG. 7 , in this embodiment, the dummy card 114 can optionally include a cooling chip 115 , and the heat pipe 130 on the dummy card 114 directly contacts the cooling chip 115 . Therefore, the heat energy of the expansion card 112 ( FIG. 1 ) next to the dummy card 114 will be transferred from the heat pipe 130 on the expansion card 112 to the heat pipe 130 on the dummy card 114 , and then to the cooling chip 115 (as indicated by the arrow direction in FIG. 7 ) shown), the cooling chip 115 can more effectively take away heat energy from the heat pipe 130 , thereby better enhancing the heat dissipation effect of the entire heat dissipation module 100 .

To sum up, in the heat dissipation module of the present invention, the heat pipe of the heat dissipation module includes an extension portion, wherein the extension portion extends beyond the board and the fin set. The extension portion is equivalent to providing an additional heat dissipation path, which further improves the heat dissipation performance of the heat dissipation module.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the appended patent application.

D1: first direction D2: Second direction D3: third direction 100: cooling module 110: Board 111: plug-in part 112: Expansion card 113: Processor 114: Fake card 115: Refrigeration wafer 120: fin group 130: Heat Pipe 131: Extensions 131a: First paragraph 131b: Second paragraph 132: cooling block 133: Fixed part 134: Butt Face 140: Fan

FIG. 1 is a perspective view of a heat dissipation module according to an embodiment of the present invention. FIG. 2 is a partial schematic diagram of heat conduction of a heat pipe of the heat dissipation module of FIG. 1 . FIG. 3 is a partially enlarged schematic view of the extension of FIG. 1 . FIG. 4 is a schematic cross-sectional view of two adjacent heat dissipation blocks and two heat pipes of FIG. 1 . FIG. 5 is a partial schematic diagram of a heat dissipation block according to another embodiment of the present invention. 6 is a schematic cross-sectional view of a heat dissipation block according to another embodiment of the present invention. FIG. 7 is a partial schematic diagram of heat conduction of a heat pipe according to another embodiment of the present invention.

100: cooling module

110: Board

111: plug-in part

112: Expansion card

114: Fake card

120: fin group

130: Heat Pipe

131: Extensions

131a: First paragraph

131b: Second paragraph

132: cooling block

140: Fan

Claims (9)

A heat dissipation module suitable for being inserted into at least one expansion interface, the heat dissipation module comprising: at least one board card, including at least one plug-in portion, wherein the at least one plug-in part is suitable for being inserted into the at least one expansion interface ; At least one fin set is arranged on the at least one board; at least one heat pipe is passed through the at least one fin set and includes at least one extension, wherein the at least one extension extends to the at least one board and the outside the at least one fin set; and a plurality of heat dissipation blocks, wherein the at least one extension part is a plurality of extension parts, the heat dissipation blocks are sleeved on the extension parts, and two adjacent ones of the heat dissipation blocks direct contact. The heat dissipation module of claim 1, wherein the at least one board is an expansion card, and the expansion card is electrically connected to the corresponding expansion interface through the plug portion. The heat dissipation module of claim 2, wherein the expansion card includes a processor, the at least one heat pipe is a heat pipe corresponding to the expansion card, and the heat pipe directly contacts the processor. The heat dissipation module of claim 1, wherein the at least one board is a dummy card. The heat dissipation module of claim 4, wherein the dummy card includes a cooling chip, the at least one heat pipe is a heat pipe corresponding to the dummy card, and the heat pipe directly contacts the cooling chip. The heat dissipation module of claim 1, wherein the at least one board is a board, the at least one heat pipe is two heat pipes corresponding to the board, and the extending portions are two extending portions corresponding to the two heat pipes, The two extending portions respectively include two first sections and two second sections, the two first sections of the two extending sections extend in a first direction and a second direction away from each other, and the two second sections extend toward a first direction Extend in three directions. The heat dissipation module of claim 1, wherein the at least one board is a plurality of boards, the at least one fin group is a plurality of fin groups, the at least one heat pipe is a plurality of heat pipes, and the fin groups are The heat pipes are respectively arranged on the boards, the heat pipes pass through the fin sets, and the extension parts of the heat pipes extend beyond the boards and the fin sets, and are connected together. . The heat dissipation module of claim 1, wherein each of the heat dissipation blocks includes an abutting surface, and each of the extending portions is exposed to the corresponding butt surface of the heat dissipation block. The heat dissipation module of claim 1, further comprising: at least one fan disposed beside the at least one fin group.

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