1308054 九、發明說明： ^ 【發明所屬之技術領域】 _ 本發明係涉及一種散熱模組結構，尤其是關於一種雙 _ 熱源散熱模組之結構。 【先前技術】 按習用裝設於電腦内之散熱模組，一般多係設計為專 用以對產生熱量最多之中央處理器（Central Processing Unit，CPU)進行散熱，且為便於生產與安裝，因此又多將 φ 其中必備之殼體、風扇與熱管等元件予以模組化，如美國 專利公報公告號第6373700號專利以及第6654245號專利 等，均屬此類結構。 前述專利前案中所揭露之模組化散熱裝置，固然均具 有良好之散熱效率，但由於其設計均係源自於加強CPU散 熱效率之需求，因此，即使其達到改善散熱效率之優點， 卻無法對同一電路板上其它也會發出熱量之晶片直接發揮 散熱功能，造成散熱模組雖然效率良好，卻無法有效提昇 ^ 配置有散熱模組之電腦整體效率的情形。 ' 為解決上述之問題，美國專利公報公告號第7120018 - 號專利，係利用組設於一中央處理器之一散熱鰭片上，再 固定一風扇，使風扇運轉時，將空氣由風扇之轴向導至徑 向而吹出，並吹向位於中央處理器旁的一北橋晶片（North Bridge Chip )，且於北橋晶片旁再組設一導流件 (vent i 1 at ion—enhancing member )，另等吹過北橋晶片之空 氣導於其它高發熱源之電子元件，形成一導熱的空氣流通 1308054 路徑，使相關高發熱之電子元件均可經由此空氣流通路徑 而達到整體散熱效果。但是，上述利用空氣流通路徑以使 各個發熱之電子元件均可散熱之方式，除了中央處理器上 利用散熱鰭片再搭配風扇可具有較高的散熱效率之外，且 吹過中央處理器之空氣已具一定之高溫，其餘配置於空氣 流通路徑之高發熱源之電子元件，以高溫之空氣直接吹過 電子元件的方式，使得其散熱效率並不高，無法真正有效 地解決整體的散熱效率。 【發明内容】 鑒於以上的問題，本發明所欲解決之問題及目的在於 提供一種雙熱源散熱模組，藉以同時對雙熱源進行散熱。 因此，本發明揭露一種雙熱源散熱模組，用以散除第 一發熱元件與第二發熱元件所產生之熱量，此第一與第二 發熱元件係配置於一電路板，此雙熱源散熱模組係包含第 一導熱板、第二導熱板、固合件、熱管與抵壓彈片。 其中第一導熱板係接觸於第一發熱元件表面，以傳導 第一發熱元件所產生之熱量至第一導熱板，且第一導熱板 具有第一爪部；第二導熱板係接觸於第二發熱元件表面， 以傳導第二發熱元件所產生之熱量至第二導熱板；固合件 係具有第二爪部，此固合件係固設於電路板，並壓抵第二 導熱板於第二發熱元件，以傳導第二導熱板之熱量至固合 件；熱管之一端係被夾置於第一爪部與第二爪部，以傳導 第一導熱板與固合件之熱量至熱管之另一端；以及抵壓彈 片係具有一抵壓部，此抵壓彈片係受固合件固設於電路板 7 1308054 之牽引，使得抵壓部壓抵第一導熱元件，進而使第一導熱 . 元件壓抵於第一發熱元件。 _ 其中抵壓彈片相對於固合件之另一側係螺固於電路 . 板，且抵壓部開設一第一槽，使第一導熱板之第一爪部穿 . 過第一槽而夾置熱管。其中抵壓彈片受固合件牽引之一端 係固定於固合件之一侧。 本發明之雙熱源散熱模組更包含一風扇與一導熱元 件，導熱元件係固定於風扇一侧，且導熱元件連接熱管， φ 以傳導熱管之熱至導熱元件，並由風扇運轉產生空氣流動 以通過導熱元件，以散除導熱元件之熱。 綜上所述，本發明之雙熱源散熱模組，於固合件固設 於電路板時，除了固合件直接壓抵第二導熱板於第二發熱 元件之外，並一併牽引抵壓彈片以壓抵第一導熱板於第一 發熱元件上，如此可確保第一導熱板與第二導熱板皆可確 實地接觸著第一發熱元件與第二發熱元件，以達到最大的 ^ 散熱效率。 有關本發明的特徵與實作，茲配合圖示作最佳實施例 ' 詳細說明如下。 【實施方式】 請參閱「第1圖」與「第2圖」，所示為本發明組合示 意圖與爆炸示意圖。如「第1圖」與「第2圖」所示，本 發明係一種雙熱源散熱模組100，係固定於一電路板500， 且此電路板500上配置一第一發熱元件510與一第二發熱 元件530，當雙熱源散熱模組100固定於電路板500時， 8 1308054 係用以散除第一發熱元件51〇與第二發熱元件53〇所產生 之熱里，此電路板500可為一主機板，因此，第一發熱元 件510與第二發熱元件53〇可為中央處理器（central P essing Unit ’ CPU)與北橋晶片（n〇rth bridge chip) 的組合。 雙熱源散熱模組100係包含一第一導熱板、一第 ;.、、、板 130、一 固合件 150、一熱管（heat pipe) 170 與一抵壓彈片19〇。 其中第一導熱板110係接觸於第一發熱元件51〇表 面’以傳導第一發熱元件510所產生之熱量至第一導熱板 110 ’且於第一導熱板110相對於第-發熱元件510之另一 側面具有一第-爪部1U，此第-爪部111可形成如軌道 形狀’且此軌道狀的第一爪部U1其寬度實質等同於熱管 之寬度。第—導熱板11G可利用黏貼方式使第一導熱 板110先固定於第一發熱元件51〇表面。 第二導熱板130係接觸於第二發熱元件53〇表面，以 傳導第二發熱元件53G所產生之熱量至第二導熱板⑽。 =固合件150仙設於電路板5⑽，如固合件15()螺固於 魏板50G的方式，並餘第二導熱板⑽於苐二發 ^咖，以傳導第二導熱板⑽之熱量至固合件⑽。且於 :合件卿應第二導熱板13。之另―側面延伸以形成一 ㈣爪^5] ’此第二爪部⑸可為執道狀，且此軌道狀 的弟二爪部151其寬度實質等同於熱管之寬度。 熱管170係其一端依序穿過第二爪部i5i ^一从部 1308054 111，而被第二爪部151與第一爪部Hi夾置，進而固定於 .固合件150與第一導熱板Π0上’用以傳導第一導熱板no - 與固合件150之熱量至熱管170之另一端。 抵壓彈片190係具有一抵壓部191，此抵壓彈片19〇 -之一端係固設於電路板500上’另一端係固設於固合件150 之下方，因此，當固合件15〇鎖固於電路板時，即會 牽引抵壓彈片190之抵壓部191壓抵住第一導熱板11〇 , 進而使第一導熱板110壓抵於第一發熱元件5丨〇。藉由前 • 述牽引結構之設計，抵壓彈片190即具有較高之壓抵力量 施加於第一導熱板與第一發熱元件510，以使得第一 S熱板110與第一發熱元件51〇之間能緊密地接觸，有助 於將第一發熱元件510之所產生之熱量確實傳導至第一導 熱板110。 其中抵壓彈片19〇受固合件15〇牽引之一端係直接可 透過螺固、鉚固或黏固等方式而固定於固合件之一 φ側。抵壓部191之對應於第一爪部111的部份開設有一第 一槽193 ’使得第一爪部111穿過此第一槽193,以夾置熱 ί 170。並且抵墨部191係呈凸出狀，形成一容置空間， -以供第一導熱板no嵌合於形成此容置空間之抵壓部191。 另外’本發明之雙熱源散熱模組100更包含一風扇7〇〇 與-導熱το件71〇，此導熱元件71Q係固定於風扇7〇〇 一 側，且‘熱元件連接於熱管170相對被第一爪部η 1 ，第二爪部151所夹置之另一側，以傳導熱管17〇之熱至 導熱元件710上，並由風们〇〇賴產生空氣流動以通過 10 1308054 導熱元件Ή0並排於外界，以散除導熱元件71〇之熱。 請參閱「第3圖」，所示為本發明之另一實施例爆炸示 意圖。如「第3圖」所示，其組合結構與上述實施例所述 之結構相同，於此不再贅述。唯差異在於固合件於第 二爪部151處係開設一第二槽153 ,且第二導熱板130對 應於第二槽153之侧面延伸一凸出塊丨31，此凸出塊131 相符於第二槽153之形狀，而可嵌於第二槽ι53中，以使 凸出塊131直接接觸著熱管no，可使第二導熱板13〇部 份直接接觸著熱管17〇，以提高散熱效率。 因此，本發明之雙熱源散熱模組， 彈片可確實地絲管、第_導熱板'第二導祕件第發 熱源與第二發㈣確實地接觸，以達最高散熱效率。 雖然本發明以前述之較佳實施例揭露如上，然其並非 用、、限疋本毛明，任何熟習相像技藝者，在不脫離本發明 之精神和圍内，當可作些許之更動與㈣，因此本發明 專利保4 H視本說g月書所附之中請專利範圍所界定 者為準。 【圖式簡單說明】 「第1圖」係顯示本發明之組合圖； 2圖」係顯示本發明之爆炸圖；以及 弟3圖」係顯示本發明之另一實施例爆炸圖。 L主要几件符號說明】 100雙熱源散熱模組 110第一導熱板 1308054 111第一爪部 130第二導熱板 131凸出塊 150固合件 151第二爪部 153第二槽 170熱管 190抵壓彈片 191抵壓部 193第一槽 500電路板 510第一發熱元件 530第二發熱元件 700風扇 710導熱元件1308054 IX. Description of the invention: ^ [Technical field to which the invention pertains] _ The present invention relates to a heat dissipation module structure, and more particularly to a structure of a dual _ heat source heat dissipation module. [Prior Art] The heat-dissipating modules installed in the computer according to the conventional design are generally designed to dissipate heat to the central processing unit (CPU) that generates the most heat, and for the convenience of production and installation, The components such as the necessary housing, the fan, and the heat pipe are modularized, such as the US Patent Publication No. 6373700 and the No. 6654245. The modular heat sink disclosed in the aforementioned patents has good heat dissipation efficiency, but since its design is derived from the need to enhance the heat dissipation efficiency of the CPU, even if it achieves the advantages of improving heat dissipation efficiency, It is impossible to directly use the heat dissipation function on other wafers that emit heat on the same circuit board, which makes the heat dissipation module effective, but cannot effectively improve the overall efficiency of the computer equipped with the heat dissipation module. In order to solve the above problems, U.S. Patent Publication No. 7110018 - is based on a heat dissipating fin of a central processing unit, and then a fan is fixed to make the air flow from the axial direction of the fan when the fan is running. It is blown out in the radial direction and blown to a North Bridge Chip located beside the central processing unit, and a vent i 1 at ion-enhancing member is placed next to the north bridge wafer. The air blown through the north bridge chip is guided to the electronic components of other high heat sources to form a heat-conducting air flow 1308054 path, so that the relevant high-heating electronic components can achieve the overall heat dissipation effect through the air circulation path. However, the above-mentioned air circulation path is used to dissipate heat from each of the heat-generating electronic components, and the air is blown through the central processing unit in addition to the heat dissipation fins on the central processing unit and the fan can have high heat dissipation efficiency. It has a certain high temperature, and the rest of the electronic components disposed in the high heat source of the air circulation path are directly blown through the electronic components by the high temperature air, so that the heat dissipation efficiency is not high, and the overall heat dissipation efficiency cannot be effectively solved. SUMMARY OF THE INVENTION In view of the above problems, the problem and object of the present invention are to provide a dual heat source heat dissipation module for simultaneously dissipating heat from a dual heat source. Therefore, the present invention discloses a dual heat source heat dissipation module for dissipating heat generated by the first heat generating component and the second heat generating component, wherein the first and second heat generating components are disposed on a circuit board, and the dual heat source heat sink module The assembly includes a first heat conducting plate, a second heat conducting plate, a fixing member, a heat pipe and a pressing elastic piece. The first heat conducting plate is in contact with the surface of the first heat generating component to conduct heat generated by the first heat generating component to the first heat conducting plate, and the first heat conducting plate has a first claw portion; the second heat conducting plate is in contact with the second heat conducting plate a surface of the heating element for transmitting heat generated by the second heating element to the second heat conducting plate; the fixing member has a second claw portion, the fixing member is fixed on the circuit board and pressed against the second heat conducting plate a heating element for conducting heat of the second heat conducting plate to the fixing member; one end of the heat pipe is sandwiched between the first claw portion and the second claw portion to conduct heat of the first heat conducting plate and the fixing member to the heat pipe The other end; and the pressing elastic piece has a pressing portion, and the pressing elastic piece is fixed by the fixing member to the traction of the circuit board 7 1308054, so that the pressing portion is pressed against the first heat conducting element, thereby making the first heat conduction. The component is pressed against the first heat generating component. _ wherein the pressing elastic piece is screwed to the circuit board with respect to the other side of the fixing member, and a first groove is formed in the pressing portion, so that the first claw portion of the first heat conducting plate passes through the first groove. Heat pipe. The pressing elastic piece is fixed to one side of the fixing member by one end of the fixing member. The dual heat source heat dissipation module of the present invention further comprises a fan and a heat conducting component, the heat conducting component is fixed on one side of the fan, and the heat conducting component is connected to the heat pipe, φ is used to conduct heat of the heat pipe to the heat conducting component, and the fan operates to generate air flow. The heat of the heat conducting element is dissipated by the heat conducting element. In summary, the dual heat source heat dissipation module of the present invention, when the fixing member is fixed on the circuit board, directly presses the second heat conducting plate on the second heat generating component, and pulls the pressing member together. The elastic piece is pressed against the first heat conducting plate on the first heat generating component, so that the first heat conducting plate and the second heat conducting plate can surely contact the first heat generating component and the second heat generating component to achieve maximum heat dissipation efficiency. . The features and implementations of the present invention are described in conjunction with the drawings as a preferred embodiment. [Embodiment] Please refer to "Fig. 1" and "Fig. 2" for a schematic view of the combination and explosion of the present invention. As shown in FIG. 1 and FIG. 2, the present invention is a dual heat source heat dissipation module 100 fixed to a circuit board 500, and a first heating element 510 and a first portion are disposed on the circuit board 500. The second heat generating component 530, when the dual heat source heat dissipation module 100 is fixed on the circuit board 500, the 81308054 is used to dissipate heat generated by the first heat generating component 51 and the second heat generating component 53. The circuit board 500 can be As a motherboard, the first heating element 510 and the second heating element 53 can be a combination of a central processing unit (CPU) and a north bridge chip. The dual heat source heat dissipating module 100 includes a first heat conducting plate, a first, a plate, a plate 130, a fixing member 150, a heat pipe 170 and a pressing elastic piece 19〇. The first heat conducting plate 110 is in contact with the surface of the first heat generating component 51 to conduct heat generated by the first heat generating component 510 to the first heat conducting plate 110 ′ and is opposite to the first heat conducting component 110 . The other side has a first claw portion 1U which can be formed in a track shape ' and the track-shaped first claw portion U1 has a width substantially equivalent to the width of the heat pipe. The first heat conducting plate 11G can be fixed to the surface of the first heat generating component 51 by adhesive bonding. The second heat conducting plate 130 is in contact with the surface of the second heat generating component 53 to conduct heat generated by the second heat generating component 53G to the second heat conducting plate (10). The fixing member 150 is disposed on the circuit board 5 (10), such as the way that the fixing member 15 () is screwed to the Wei board 50G, and the second heat conducting board (10) is disposed on the second heat conducting board to conduct the second heat conducting board (10). Heat to the fixing member (10). And: : The piece should be the second heat conducting plate 13. The other side extends to form a (four) claw ^5]. The second claw portion (5) can be in the shape of a track, and the width of the track-shaped two-pronged portion 151 is substantially equal to the width of the heat pipe. The heat pipe 170 is sequentially passed through the second claw portion i5i ^ a portion 1308054 111, and is sandwiched by the second claw portion 151 and the first claw portion Hi, and is fixed to the fixing member 150 and the first heat conducting plate. Π0 'to conduct the first heat conducting plate no - and the heat of the fixing member 150 to the other end of the heat pipe 170. The pressing elastic piece 190 has a pressing portion 191, and one end of the pressing elastic piece 19〇 is fixed on the circuit board 500. The other end is fixed under the fixing member 150. Therefore, when the fixing member 15 is fixed, When the cymbal is fixed to the circuit board, the pressing portion 191 of the pressing elastic 190 is pressed against the first heat conducting plate 11 〇, and the first heat conducting plate 110 is pressed against the first heat generating element 5 丨〇. By pressing the design of the traction structure, the pressing elastic piece 190 has a high pressing force applied to the first heat conducting plate and the first heating element 510, so that the first S hot plate 110 and the first heating element 51 are disposed. The intimate contact between them helps to reliably transfer the heat generated by the first heating element 510 to the first heat conducting plate 110. The pressing elastic piece 19〇 is directly fixed to one side of the fixing member by the screwing, riveting or fixing of one end of the fixing member 15〇. A portion of the pressing portion 191 corresponding to the first claw portion 111 defines a first groove 193' such that the first claw portion 111 passes through the first groove 193 to sandwich the heat. Further, the ink-receiving portion 191 is formed in a convex shape to form an accommodation space for fitting the first heat-conducting plate no to the pressing portion 191 which forms the accommodation space. In addition, the dual heat source heat dissipation module 100 of the present invention further includes a fan 7 〇〇 and a heat conduction τ 件 71 〇, the heat conducting element 71Q is fixed to the side of the fan 7 ,, and the 'thermal element is connected to the heat pipe 170 opposite The first claw portion η 1 and the other side of the second claw portion 151 are sandwiched to conduct the heat of the heat pipe 17 to the heat conducting member 710, and the air flows by the wind to pass the 10 1308054 heat conducting member Ή0 Side by side to dissipate heat from the heat conducting element 71. Please refer to Fig. 3, which shows an exploded view of another embodiment of the present invention. As shown in Fig. 3, the combined structure is the same as that described in the above embodiment, and will not be described again. The difference is that the fixing member defines a second slot 153 at the second claw portion 151, and the second heat conducting plate 130 extends a convex block 31 corresponding to the side of the second slot 153. The protruding block 131 is consistent with The shape of the second groove 153 can be embedded in the second groove ι53 so that the protruding block 131 directly contacts the heat pipe no, so that the second heat conducting plate 13 can directly contact the heat pipe 17 〇 to improve heat dissipation efficiency. . Therefore, in the dual heat source heat dissipating module of the present invention, the shrapnel can surely contact the first heat source and the second hair (four) of the second heat guide plate to obtain the highest heat dissipation efficiency. Although the present invention has been disclosed above in the above preferred embodiments, it is not intended to be limited to the invention, and any skilled person skilled in the art can make some changes and (4) without departing from the spirit and scope of the present invention. Therefore, the patent of the present invention is subject to the definition of the patent scope attached to the g-month book. BRIEF DESCRIPTION OF THE DRAWINGS "FIG. 1" shows a combination of the present invention; 2" shows an exploded view of the present invention; and FIG. 3 shows an exploded view of another embodiment of the present invention. L main symbols: 100 dual heat source cooling module 110 first heat conducting plate 1308054 111 first claw portion 130 second heat conducting plate 131 protruding block 150 fixing member 151 second claw portion 153 second groove 170 heat pipe 190 Ball spring 191 against portion 193 first slot 500 circuit board 510 first heat generating component 530 second heat generating component 700 fan 710 heat conducting component