TWI498078B - Heat conductive plate and heat dissipating module including the heat conductive plate - Google Patents

Description

Thermal conduction plate and heat dissipation module including heat conduction plate

The invention relates to a heat conducting plate and a heat dissipating module comprising the heat conducting plate, in particular to a heat conducting plate with better heat dissipation and a heat dissipating module comprising the heat conducting plate.

As the performance of various electronic components in electronic devices increases, the power consumed by the electronic components and the total amount of heat generated also increases. In the case where the total heat generated by the electronic component increases, the electronic component may malfunction or even be damaged due to excessive temperature. Therefore, in order to improve the performance of the electronic device while maintaining the normal operation of the electronic device, it is necessary to further improve the heat dissipation capability of the electronic device.

In view of the above problems, the present invention relates to a heat conducting plate and a heat dissipating module including the heat conducting plate to improve the heat dissipating capability of the electronic device.

A heat conducting plate according to an embodiment of the invention is for contacting a heat pipe. The heat conducting plate includes a carrier and at least one extension. The heat pipe contacts one of the surfaces of the carrier. The extension is located on the surface of the carrier. The extension member includes a first extension that extends away from the surface.

The heat dissipation module according to an embodiment of the invention is configured to dissipate heat from a heat source. The heat dissipation module includes a heat pipe and a heat conduction plate. The heat conducting plate comprises a carrier and at least one extension Pieces. The carrier has a first side and a second side opposite to each other. The first side contacts the heat pipe and the second side contacts the heat source. The extension is located on the first side of the carrier. The extension member includes a first extension extending in a direction away from the first face.

According to the heat conduction plate and the heat dissipation module including the heat conduction plate disclosed in the above embodiments of the present invention, since the first extension of the extension member of the heat conduction plate extends away from the surface of the carrier member, the heat conduction plate is increased in contact with the air. The surface area can improve the heat dissipation of the heat conducting plate.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

8‧‧‧Electronic devices

9, 9'‧‧‧ Thermal Module

10, 10'‧‧‧ Thermal Conductive Plate

11‧‧‧Carrier

12, 12'‧‧‧Extensions

121‧‧‧First extension

122‧‧‧Second extension

13‧‧‧Lock hole

20‧‧‧heat pipe

30‧‧‧ boards

40‧‧‧heat source

50‧‧‧Locker

FIG. 1A is a schematic structural view of a heat conducting plate according to an embodiment of the invention.

FIG. 1B is a schematic structural view of a heat dissipation module according to an embodiment of the invention.

2A is a schematic structural view of a heat conducting plate according to another embodiment of the present invention.

FIG. 2B is a schematic structural diagram of a heat dissipation module according to another embodiment of the present invention.

FIG. 3A is a partially exploded perspective view of an electronic device according to an embodiment of the invention.

FIG. 3B is a schematic diagram showing a partial structure combination of an electronic device according to an embodiment of the invention.

The detailed features and advantages of the present invention are set forth in the detailed description of the embodiments of the present invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but do not limit the scope of the invention in any way.

First, please refer to FIG. 1A and FIG. 1B. FIG. 1A is a schematic structural view of a heat conducting plate according to an embodiment of the present invention, and FIG. 1B is a schematic structural view of a heat dissipating module according to an embodiment of the invention. . As shown in FIG. 1A, the heat conducting plate 10 of the present invention comprises a carrier 11 and at least one extension 12. In Figure 1A, the number of extensions 12 is two, and the number of extensions 12 is not intended to limit the invention.

The carrier 11 has a first surface F1 and a second surface F2 opposite to each other. The extension member 12 is located on one of the first faces F1 of the carrier member 11 (i.e., one of the surfaces of the carrier member 11). The extensions 12 are located on opposite sides of the carrier 11. The extension member 12 includes a first extension 121 that extends away from the first face F1. The adjacent first extensions 121 are not in contact with each other and maintain a spacing from each other. In detail, since the heat conducting plate 10 of the present embodiment extends the first extending portion 121 and maintains a space between the adjacent first extending portions 121, the heat conducting plate 10 has a large surface area. In this way, the heat conducting plate 10 can have a large surface area for heat exchange with air, and has a better heat dissipation effect.

In this embodiment, the carrier 11 and the extension 12 are integrally formed, but are not limited thereto.

As shown in FIG. 1B, the heat dissipation module 9 includes a heat conduction plate 10 and a heat pipe 20. The first surface F1 of the carrier 11 contacts the heat pipe 20, and the second surface F2 of the carrier 11 contacts a heat source (not shown) to dissipate heat from the heat source.

In the present embodiment, the material of the heat conducting plate 10 is metal, and thus the heat conducting plate 10 has a better heat conducting effect. Further, the material of the heat conducting plate 10 may be, for example, a metal having a high heat dissipation coefficient such as copper or aluminum, but is not limited thereto.

2A and 2B, FIG. 2A is a schematic structural view of a heat conducting plate according to another embodiment of the present invention, and FIG. 2B is a view of another embodiment of the present invention. Schematic diagram of the heat dissipation module. This embodiment is similar to the embodiment of FIG. 1A and FIG. 1B, wherein the same symbols represent the same or similar elements, and the description is not repeated.

In this embodiment, the extension 12' of the heat conducting plate 10' further includes a second extension 122. The second extension section 122 extends from the first extension section 121 away from one end of the first surface F1, and the extension direction of the second extension section 122 is substantially parallel to the first surface F1. As shown in FIG. 2A, the extending direction D1 of the first extending portion 121 and the extending direction D2 of the second extending portion 122 are substantially orthogonal. In this way, the second extending section 122 and the carrier 11 have an accommodating space S, and for example, a heat pipe 20 can be accommodated in the accommodating space S, and the second extending section 122 and the carrier 11 can be shared. The movement of the heat pipe 20 in the direction Z is restricted.

In the present embodiment, the number of the extension members 12' is exemplified by two. The distance L1 between the first extensions 121 of the extensions 12' corresponds to the width W of the heat pipe 20. That is, the two first extensions 121 can collectively limit the movement of the heat pipe 20 in the direction Y to collectively clamp the heat pipe 20 with the effect of positioning.

On the other hand, the distance L2 from the second extension section 122 to the first face F1 of the carrier 11 (i.e., the surface of the carrier 11) corresponds to the thickness T of the heat pipe 20. In this way, the thickness T of the heat pipe 20 is sandwiched between the two second extensions 122, and has the effect of positioning.

Finally, please refer to FIG. 3A and FIG. 3B , FIG. 3A is a partial exploded view of the electronic device according to an embodiment of the invention, and FIG. 3B is a portion of the electronic device according to an embodiment of the invention. Schematic diagram of structure combination. As shown, the electronic device 8 is provided with a heat conducting plate 10', a heat pipe 20, a circuit board 30, a heat source 40, and at least one fastener 50. The combination of the heat conducting plate 10' and the heat pipe 20 is the heat dissipation module 9' described in FIG. 2B. The configuration of the heat conducting plate 10' and the heat pipe 20 and the arrangement relationship between the heat conducting plate 10' and the heat pipe 20 are as described above, and therefore will not be repeatedly described. Heat source The heat source 40 is disposed on the circuit board 30, and the heat source 40 is, for example, an electronic component of the north bridge chip, but is not limited thereto. The heat dissipation module 10 ′ and the heat pipe 20 constituting the heat dissipation module 9 ′ are disposed on the circuit board 30 , and the heat source 40 is sandwiched between the heat dissipation module 9 ′ and the circuit board 30 . The carrier 11 of the heat dissipation module 9 ′ has at least one locking hole 13 . Therefore, the heat dissipation module 9 ′ can be assembled in the electronic device 8 through the locking hole 30 through the locking hole 30 . The electronic device 8 of the embodiment has a heat dissipation capability because it includes a heat dissipation module 9'. As a result, even if the performance of the heat source 40 requires a large amount of power, the electronic device 8 can maintain normal operation.

According to the heat conduction plate and the heat dissipation module including the heat conduction plate disclosed in the above embodiments of the present invention, since the first extension of the extension member of the heat conduction plate extends away from the surface of the carrier member, the heat conduction plate is increased in contact with the air. The surface area can improve the heat dissipation of the heat conducting plate.

In addition, since the adjacent first extensions do not contact each other to maintain a spacing, the heat conducting plate has a large surface area and has a better heat dissipation effect.

Furthermore, since the distance between the two first extensions of the two extensions of the heat conducting plate corresponds to the width of the heat pipe, and the distance from the second extension to the surface of the carrier corresponds to the thickness of the heat pipe. In this way, in addition to having better heat dissipation capability, the heat conducting plate has the effect of fixing the heat pipe.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.

9'‧‧‧ Thermal Module

10'‧‧‧heat conducting plate

11‧‧‧Carrier

12'‧‧‧Extensions

121‧‧‧First extension

122‧‧‧Second extension

13‧‧‧Lock hole

20‧‧‧heat pipe

Claims (7)

a heat conducting plate for contacting a heat pipe, the heat conducting plate comprising: a carrier member contacting a surface of the carrier member; and at least one extension member located on the surface of the carrier member, the at least one extension member comprising a a first extension and a second extension, the first extension extending away from the surface, the second extension extending from the first extension away from one end of the surface, the extension of the second extension The direction is substantially parallel to the surface, and the direction of extension of the first extension is substantially orthogonal to the direction of extension of the second extension. The heat conducting plate of claim 1, wherein the number of the at least one extending member is two and is located at two opposite sides of the carrier, and the distance between the two first extending portions of the two extending members corresponds to the heat pipe. The width, the distance from the second extension to the surface corresponds to the thickness of the heat pipe. The heat conducting plate of claim 1, wherein the at least one extending member is arranged along opposite sides of the carrying member, and the first extending portions of the adjacent at least one extending member are not in contact with each other. The heat conducting plate of claim 1, wherein the carrier member is integrally formed with at least one extension member. A heat dissipation module for dissipating heat to a heat source, the heat dissipation module comprising: a heat pipe; and a heat conduction plate comprising: a carrier having an opposite first surface and a second surface, the first surface Contacting the heat pipe, the second surface is in contact with the heat source; and at least one extension member is located on the first surface of the carrier member, the at least one extension member includes a first extension portion and a second extension portion, the first extension The segment extends away from the first face, the second extension extends from the first extension away from the one end of the first face, and the second The extension of the extension is substantially parallel to the first face. The heat dissipation module of claim 5, wherein the extending direction of the first extension is substantially orthogonal to the extending direction of the second extension. The heat dissipation module of claim 5, wherein the number of the at least one extension member is two and is located on opposite sides of the carrier member, and the distance between the two first extension portions of the two extension members corresponds to the heat pipe The width of the second extension to the surface corresponds to the thickness of the heat pipe.