TW201501627A - Fixing assembly - Google Patents

Abstract

A fixing assembly includes a fixing frame, a fixing member, and a fastening member. The fixing frame includes a frame body and a guiding wall portion. The frame body is disposed between a circuit board and a heatsink. The guiding wall portion is connected to the frame body and has an elongated hole. Widths of the guiding wall portion are reduced toward the frame body. The fixing member abuts against the guiding wall portion and is located over the heatsink. The fixing member has a screw hole communicated with the elongated hole. The fastening member is fastened to the screw hole via the elongated hole. The fastening member is retained by the elongated hole to move relative to the guiding wall portion along the elongated hole, so as to move the fixing member relative to the heatsink.

Description

Fixed component

This invention relates to a fixed assembly, and more particularly to a fixed assembly for securing a heat sink to a circuit board.

In recent years, in order to maximize economic benefits, the market has been pursuing high-efficiency computer devices. In order to increase the processing capacity of the computer device as much as possible in a limited space in the computer device, the density of electronic components inside the computer device is continuously increased, and the heat dissipation burden is continuously increased.

For a conventional computer device, many electronic components are inserted on the circuit board, such as a central processing unit (CPU), a north-south bridge chip, a display chip, a memory module, and the like. If the heat generated by these electronic components is not immediately removed, it is easy to cause the computer device to crash, and in severe cases, the circuit board may be burnt.

For example, designers often install heatsinks on the heat-generating electronic components of the board (for example, the central processing unit) to quickly transfer the heat generated by the heat-generating electronic components to the heat sink fins of the heat sink. Chip. Moreover, a fan device is usually provided in a computer device. The main principle of the fan unit is by the method of generating forced convection. The work on the air causes disturbances of the gas molecules, which in turn removes the heat from the heat sink fins, causing the heat-generating electronic components to cool down.

At present, a conventional heat sink substrate is fixed to a circuit board through the fastening of the fixing frame, so that the substrate of the heat sink is in contact with the heat-generating electronic components on the circuit board. However, for the currently designed fixed frame, since the height of the latch structure is fixed, it can only be used to fasten a substrate having a specific thickness, and cannot be applied to substrates having other different thicknesses.

In view of this, it is one of the problems that the industry is currently eager to invest in research and development resources to provide a fixed component that can be adapted to fasten a substrate having heat sinks having different thicknesses.

The present invention provides a securing assembly for securing a heat sink to a circuit board. The circuit board contains a heat source and the heat sink is disposed above the heat source. The fixing assembly includes a fixing frame, a fixing member, and a lock. The fixed frame includes a frame body and a guide wall portion. The frame is disposed between the circuit board and the heat sink and surrounds the heat source. The guiding wall portion is connected to the frame body and has an elongated hole. The thickness of the guide wall portion is gradually decreased toward the frame. The fixing member abuts against the guiding wall and is located above the radiator. The fixing member has a screw hole. The screw hole is in communication with the elongated hole. The fastener is used to lock to the screw hole via the elongated hole. The fastener is restrained by the elongated hole and moves along the elongated hole relative to the guiding wall, thereby driving the fixing member to move toward or away from the heat sink.

In an embodiment of the invention, the frame has opposite first and second faces. The first side is facing the board. Guide wall connection On the edge of the second side.

In an embodiment of the invention, the guiding wall portion has an inner surface and an outer surface. The elongated holes connect the inner surface to the outer surface. The fixture is against the inner surface. The outer surface is perpendicular to the second side.

In an embodiment of the invention, the elongated hole has a major axis on the outer surface and a major axis perpendicular to the second face.

In an embodiment of the invention, the guiding wall portion further has a side surface. The side is perpendicular to the second side and is connected between the inner surface and the outer surface. The fixing member includes a fixing portion and an extending portion. The fixing portion is for abutting against the inner surface and has a fastening surface. The fastening surface is used to fasten the heat sink. A screw hole is formed on the fixing portion. The extension portion is coupled to the fixing portion and abuts against the side surface such that the fastening surface is maintained parallel to the heat sink during movement of the fixing member relative to the guiding wall portion.

In an embodiment of the invention, the thickness of the fixing portion is gradually increased toward the engaging surface.

In an embodiment of the invention, the heat sink has a first through hole. The frame has a second through hole. The stationary assembly also includes fasteners and springs. The fastener is used to sequentially lock to the circuit board via the first through hole and the second through hole. The spring is sleeved to the fastener and compressed by the fastener and the heat sink such that the heat sink closely abuts the heat source.

In an embodiment of the invention, the fastener includes a rod body, a locking portion, and a stopper. The rod body slidably passes through the first through hole and the second through hole. The spring system is sleeved to the rod body. The locking portion is connected to one end of the rod for locking to the circuit board. The stopper is connected to the other end of the rod. The size of the stopping portion is larger than the size of the first through hole, and the spring is compressed to the stopping portion Between the radiators.

In summary, the fixing assembly of the present invention gradually reduces the thickness of the guiding wall portion of the fixing frame toward the frame body, and correspondingly opens on the guiding wall portion, so that the locking member can be oriented in a specific direction (for example, facing the frame). The elongated hole of the moving direction can move the fixing member to the frame by guiding the guiding wall portion and the elongated hole while the locking member continues to lock the fixing member, thereby being engaged with the frame body. The substrate of the heat sink above. Thereby, the fixing frame included in the fixing assembly of the present invention can be used without any hindrance to fasten the substrate having the heat sinks having different thicknesses, and it is not necessary to specifically change the design of the fixing frame in response to the thickness specification of the substrate. In addition, the fixing member of the present invention further comprises an extension portion for abutting against the side of the guiding wall portion, so that the fastening member can be prevented from being buckled due to unintended rotation while the locking member continues to lock the fixing member. The problem that the surface cannot accurately snap the substrate of the heat sink.

1‧‧‧Computer equipment

10‧‧‧Chassis

12‧‧‧ boards

120‧‧‧heat source

122‧‧‧Lock hole

14‧‧‧Fixed components

140‧‧‧Fixed frame

140a‧‧‧ frame

140a1‧‧‧ first side

140a2‧‧‧ second side

140a3‧‧‧second through hole

140b‧‧‧Guide wall

142a1‧‧‧ screw hole

142a2‧‧‧ fastening surface

142b‧‧‧Extension

144‧‧‧Locker

144a‧‧ Thread Department

144b‧‧‧ head

146‧‧‧fasteners

146a‧‧‧ rod

146b‧‧‧Locking

146c‧‧‧stop

148‧‧ ‧ spring

16‧‧‧ radiator

140b1‧‧‧ inner surface

140b2‧‧‧ outer surface

140b3‧‧‧Long hole

140b4‧‧‧ side

142‧‧‧Fixed parts

142a‧‧‧Fixed Department

160‧‧‧Substrate

160a‧‧‧first through hole

162‧‧‧Transfer Department

164‧‧‧ Heat sink fins

L‧‧‧ long axis

FIG. 1 is a perspective assembled view of a fixing assembly and a heat sink according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view showing the fixing assembly and the heat sink in Fig. 1.

Fig. 3 is a cross-sectional view showing the fixing assembly and the heat sink of Fig. 1 disposed in the computer device along the line segment 3-3'.

Fig. 4 is a side view showing the fixing frame in Fig. 2.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to Figure 1, Figure 2 and Figure 3. FIG. 1 is a perspective assembled view of a fixing assembly 14 and a heat sink 16 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view showing the fixing assembly 14 and the heat sink 16 in FIG. 1. Fig. 3 is a cross-sectional view showing the fixing unit 14 and the heat sink 16 in Fig. 1 disposed in the computer device 1 along the line segment 3-3'.

As shown in FIG. 3, in the present embodiment, the computer device 1 includes a casing 10, a circuit board 12, a fixing assembly 14, and a heat sink 16. The circuit board 12 of the computer device 1 is disposed in the casing 10 and includes a heat source 120, and the heat sink 16 is disposed above the heat source 120. In practical applications, the heat source 120 on the circuit board 12 may be a central processing unit (CPU), a north-south bridge chip, a display chip, a memory module, a power module, etc., but the present invention does not This is limited.

As shown in FIGS. 1 to 3, in the present embodiment, the fixing unit 14 of the computer device 1 includes a fixing frame 140. The fixed frame 140 of the fixing assembly 14 includes a frame 140a. The frame 140a of the fixing frame 140 is disposed between the circuit board 12 and the heat sink 16 and surrounds the heat source 120. The frame 140a of the fixed frame 140 has opposite first faces 140a1 and second faces 140a2. The first face 140a1 of the frame 140a faces the circuit board 12. The heat sink 16 includes a substrate 160. The substrate 160 of the heat sink 16 is disposed above the second surface 140a2 of the frame 140a.

Further, as shown in FIG. 3, the heat sink 16 of the computer device 1 further includes a heat transfer portion 162 and a plurality of heat dissipation fins 164. The heat transfer portion 162 of the heat sink 16 is disposed at the bottom of the substrate 160 and protrudes to the center of the frame 140a of the fixed frame 140, and is in contact with the heat source 120 of the circuit board 12 in a large area. The heat dissipation fins 164 of the heat sink 16 are disposed on the top of the substrate 160. Thereby, the heat sink 16 can absorb heat from the heat source 120 of the circuit board 12 through the heat conducting portion 162, and conduct heat to the heat radiating fins 164 via the substrate 160, and then heat the surface of the heat radiating fins 164. The convection method exchanges heat with the surrounding air to achieve the effect of dissipating heat.

Also shown in FIGS. 1 to 3, the fixing assembly 14 of the computer device 1 further includes a fixing member 142 and a locking member 144. The fixed frame 140 of the fixing assembly 14 further includes a guiding wall portion 140b. The guiding wall portion 140b of the fixing frame 140 is coupled to the frame body 140a (particularly connected to the edge of the second surface 140a2), and has an inner surface 140b1, an outer surface 140b2, and an elongated hole 140b3 (elongated hole). The elongated hole 140b3 of the guide wall portion 140b communicates with the inner surface 140b1 and the outer surface 140b2. The fixing member 142 of the fixing assembly 14 abuts against the inner surface 140b1 of the guiding wall portion 140b and is located above the substrate 160 of the heat sink 16. The fixing member 142 of the fixing assembly 14 includes a fixing portion 142a, and the fixing portion 142a has a screw hole 142a1.

Please refer to FIG. 4, which is a side view of the fixed frame 140 in FIG. As shown in Figure 4, with reference to Figures 1 to 3, In the present embodiment, the elongated hole 140b3 of the guide wall portion 140b has a long axis L on the outer surface 140b2. The fastener 144 of the fixing assembly 14 includes a threaded portion 144a and a head portion 144b that are connected to each other. The length of the elongated hole 140b3 of the guide wall portion 140b parallel to the longitudinal axis L is larger than the diameter of the head portion 144b of the lock 144 and the diameter of the threaded portion 144a. The width of the elongated hole 140b3 perpendicular to the longitudinal axis L is greater than the diameter of the threaded portion 144a, but smaller than the diameter of the head 144b of the fastener 144. Therefore, the locking member 144 of the fixing assembly 14 can pass through the elongated hole 140b3 from the outer surface 140b2 of the guiding wall portion 140b and pass through the inner surface 140b1, but the head 144b of the locking member 144 cannot be worn. The elongated hole 140b3 is only able to abut against the outer surface 140b2.

When the fixing portion 142a of the fixing member 142 abuts against the guiding wall portion 140b of the fixing frame 140, so that the screw hole 142a1 of the fixing portion 142a communicates with the elongated hole 140b3 of the guiding wall portion 140b, the thread portion 144a of the locking member 144 It can be locked to the screw hole 142a1 through the elongated hole 140b3. At this time, the threaded portion 144a of the fastener 144 is restrained by the elongated hole 140b3 of the guiding wall portion 140b, so that it can only move along the elongated hole 140b3 relative to the guiding wall portion 140b, and is locked with the locking member 144. The fixture 142 is also moved by the fastener 144 to move toward or away from the substrate 160 of the heat sink 16.

Specifically, in the present embodiment, the thickness of the guide wall portion 140b of the fixed frame 140 is gradually decreased toward the frame 140a. On the one hand, during the period in which the locking member 144 of the fixing assembly 14 is continuously locked to the screw hole 142a1 of the fixing portion 142a, the distance between the head portion 144b of the locking member 144 and the fixing portion 142a of the fixing member 142 is continuously shortened, Lock firmware 144 and The fixing member 142 moves in a direction in which the thickness of the guide wall portion 140b is gradually decreased (that is, in a direction toward the frame 140a). On the other hand, since the threaded portion 144a of the fastener 144 is restrained by the elongated hole 140b3 of the guide wall portion 140b, the thickness of the fastener 144 and the fixing member 142 decreases along the thickness of the guide wall portion 140b. During the movement, it is also guided by the elongated hole 140b3. In other words, the fixing member 142 of the fixing assembly 14 is guided by the guiding wall portion 140b (one factor is the thickness of the guiding wall portion 140b, and the other factor is the elongated hole 140b3) and is buckled toward the substrate 160 of the heat sink 16. The heat conducting portion 162 of the heat sink 16 is caused to closely abut the heat source 120 on the circuit board 12.

In the present embodiment, the long axis L of the elongated hole 140b3 is perpendicular to the second surface 140a2 of the frame 140a. However, the present invention is not limited thereto. In practical applications, the long axis L of the elongated hole 140b3 is continuously locked to the fixed portion 144 of the fixing assembly 14 as long as it is not parallel to the second surface 140a2 of the frame 140a. During the screw hole 142a1 of the portion 142a, the lock 144 is guided by the guide wall portion 140b to move toward the second surface 140a2 of the frame 140a, and is engaged with the substrate 160 of the heat sink 16.

As shown in FIG. 3, in the present embodiment, the outer surface 140b2 of the guiding wall portion 140b is perpendicular to the second surface 140a2 of the frame 140a, and the inner surface 140b1 of the guiding wall portion 140b is away from the second surface. The direction of the face 140a2 is inclined toward the heat sink 16. However, the present invention is not limited thereto. In practical applications, the inner surface of the guiding wall portion 140b may be made to achieve the effect of moving the fixing member 142 vertically toward or away from the substrate 160 of the heat sink 16. 140b1 is perpendicular to the second surface 140a2 of the frame 140a, and the outer surface 140b2 of the guiding wall portion 140b is along the distance from the second surface 140a2. The direction is inclined away from the heat sink 16.

As shown in FIGS. 1 , 3 , and 4 , in the present embodiment, the guide wall portion 140 b of the fixed frame 140 further has a side surface 140 b 4 . The side surface 140b4 of the guiding wall portion 140b is perpendicular to the second surface 140a2 of the frame 140a and is connected between the inner surface 140b1 and the outer surface 140b2. The fixture 142 of the fixation assembly 14 also includes an extension 142b. The fixing portion 142a of the fixing member 142 further has a fastening surface 142a2. The fastening surface 142a2 of the fixing portion 142a is for engaging the substrate 160 of the heat sink 16. The extending portion 142b of the fixing member 142 is coupled to the fixing portion 142a and abuts against the side surface 140b4 of the guiding wall portion 140b. Since both the long axis L of the elongated hole 140b3 and the side surface 140b4 of the guiding wall portion 140b are perpendicular to the second surface 140a2 of the frame 140a (as shown in FIG. 4), the fixing member 142 is opposite to the fixing frame 140. During the movement of the guide wall portion 140b, the engagement surface 142a2 of the fixing portion 142a can be maintained parallel to the substrate 160 of the heat sink 16.

As shown in FIG. 3, in the present embodiment, the thickness of the fixing portion 142a of the fixing member 142 is gradually increased toward the fastening surface 142a2, but the invention is not limited thereto.

Also shown in FIG. 3, in the present embodiment, the heat sink 16 of the computer device 1 further has a first through hole 160a formed on the substrate 160 of the heat sink 16. The frame 140a of the fixing frame 140 further has a second through hole 140a3 communicating with the first surface 140a1 and the second surface 140a2. The circuit board 12 has a locking hole 122. The securing assembly 14 also includes a fastener 146 and a spring 148. The fasteners 146 of the fixing component 14 are sequentially locked to the locking of the circuit board 12 via the first through holes 160a of the substrate 160 and the second through holes 140a3 of the frame 140a. Hole 122. The spring 148 of the stationary assembly 14 is sleeved to the fastener 146 and is compressed by the fastener 146 and the substrate 160 of the heat sink 16 such that the thermally conductive portion 162 of the heat sink 16 abuts against the heat source 120.

Further, the fastener 146 of the fixing assembly 14 includes a rod body 146a, a locking portion 146b, and a stopper portion 146c. The rod body 146a of the fastener 146 slidably passes through the first through hole 160a of the substrate 160 and the second through hole 140a3 of the frame body 140a. The spring 148 of the fixed assembly 14 is sleeved to the shaft 146a of the fastener 146. The locking portion 146b of the fastener 146 is coupled to one end of the rod body 146a for locking to the locking hole 122 of the circuit board 12. The stopper portion 146c of the fastener 146 is coupled to the other end of the rod body 146a. The size of the stopper portion 146c is larger than the size of the first through hole 160a (for example, the diameter of the stopper portion 146c is larger than the diameter of the first through hole 160a), and the spring 148 is compressed to the stopper portion 146c and the substrate 160 of the heat sink 16. between. Thereby, the compressed spring 148 can generate sufficient downforce to push the heat sink 16 toward the circuit board 12, so that the heat conducting portion 162 of the heat sink 16 can be pressed more closely against the heat source 120, thereby increasing the heat sink 16 for The heat conductivity of the heat source 120.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the fixing assembly of the present invention gradually reduces the thickness of the guiding wall portion of the fixing frame toward the frame body, and correspondingly on the guiding wall portion. An elongated hole is formed for moving the fastener in a specific direction (for example, in a direction toward the frame), so that the fixing member is subjected to the guiding wall portion and the elongated hole while the locking member continues to lock the fixing member. Guided to move toward the frame, and then fasten the heat sink located above the frame. Thereby, the fixing frame included in the fixing component of the present invention can be used without any hindrance to fasten the substrate having the heat sinks having different thicknesses, and It is not necessary to specifically change the design of the fixed frame in order to comply with the thickness specification of the substrate. In addition, the fixing member of the present invention further comprises an extension portion for abutting against the side of the guiding wall portion, so that the fastening member can be prevented from being buckled due to unintended rotation while the locking member continues to lock the fixing member. The problem that the surface cannot accurately snap the substrate of the heat sink.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

1‧‧‧Computer equipment

10‧‧‧Chassis

12‧‧‧ boards

120‧‧‧heat source

122‧‧‧Lock hole

14‧‧‧Fixed components

140‧‧‧Fixed frame

140a‧‧‧ frame

140a1‧‧‧ first side

140a2‧‧‧ second side

140a3‧‧‧second through hole

140b‧‧‧Guide wall

140b1‧‧‧ inner surface

140b2‧‧‧ outer surface

140b3‧‧‧Long hole

142‧‧‧Fixed parts

142a‧‧‧Fixed Department

142a1‧‧‧ screw hole

142a2‧‧‧ fastening surface

142b‧‧‧Extension

144‧‧‧Locker

144a‧‧ Thread Department

144b‧‧‧ head

146‧‧‧fasteners

146a‧‧‧ rod

146b‧‧‧Locking

146c‧‧‧stop

148‧‧ ‧ spring

16‧‧‧ radiator

160‧‧‧Substrate

160a‧‧‧first through hole

162‧‧‧Transfer Department

164‧‧‧ Heat sink fins

Claims (8)

A fixing component for fixing a heat sink to a circuit board, the circuit board includes a heat source, and the heat sink is disposed above the heat source, the fixing component comprises: a fixing frame, comprising: a frame body Between the circuit board and the heat sink, and surrounding the heat source; and a guiding wall portion connecting the frame and having an elongated hole, wherein the thickness of the guiding wall portion faces the frame a fixing member abutting against the guiding wall portion and located above the heat sink, the fixing member has a screw hole communicating with the elongated hole; and a locking member for locking through the elongated hole The screw hole is fixed to the screw hole, and the locking member is restricted by the elongated hole to move along the elongated hole relative to the guiding wall portion, thereby driving the fixing member to move toward or away from the heat sink. The fixing assembly of claim 1, wherein the frame has an opposite first surface and a second surface, the first surface facing the circuit board, the guiding wall portion being connected to the first The edge of the two sides. The fixing assembly of claim 2, wherein the guiding wall portion has an inner surface and an outer surface, the elongated hole communicating with the inner surface and the outer surface, the fixing member abutting the inner surface And the outer surface is perpendicular to the second side. The fixing assembly of claim 3, wherein the elongated hole has a major axis on the outer surface and the major axis is perpendicular to the second surface. The fixing assembly of claim 4, wherein the guiding wall portion further has a side surface perpendicular to the second surface and connected between the inner surface and the outer surface, the fixing member comprising a fixing portion for abutting against the inner surface and having a fastening surface for engaging the heat sink, wherein the screw hole is formed on the fixing portion; and an extending portion connecting the fixing portion, and Abutting the side surface causes the fastening surface to remain parallel to the heat sink during movement of the fixing member relative to the guiding wall portion. The fixing assembly of claim 5, wherein the thickness of the fixing portion is gradually increased toward the fastening surface. The fixing assembly of claim 1, wherein the heat sink has a first through hole, the frame has a second through hole, and the fixing component further comprises: a fastener for sequentially passing the first a through hole and the second through hole are locked to the circuit board; and a spring is sleeved to the fastener and compressed by the fastener and the heat sink, so that the heat sink closely abuts the heat source. The fixing component of claim 7, wherein the fastening component The firmware includes: a rod slidably passing through the first through hole and the second through hole, wherein the spring is sleeved to the rod body; and a locking portion is connected to one end of the rod body for Locking to the circuit board; and a blocking portion connected to the other end of the rod body, wherein the stopping portion has a size larger than a size of the first through hole, and the spring is compressed to the stopping portion and the Between the radiators.