US20120024495A1 - Heat dissipation apparatus - Google Patents
Heat dissipation apparatus Download PDFInfo
- Publication number
- US20120024495A1 US20120024495A1 US12/859,281 US85928110A US2012024495A1 US 20120024495 A1 US20120024495 A1 US 20120024495A1 US 85928110 A US85928110 A US 85928110A US 2012024495 A1 US2012024495 A1 US 2012024495A1
- Authority
- US
- United States
- Prior art keywords
- fasteners
- heat
- abutting portion
- heat dissipation
- dissipation apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to a heat dissipation apparatus.
- Finned heat sinks have been found to be particularly effective for transferring heat through conduction from a heat-generating component such as a semiconductor chip and rapidly dissipating such heat to the environment.
- a heat-generating component such as a semiconductor chip
- various means used to attach a heat sink to the heat-generating component does not allow the heat sink to be in intimate thermal contact with the heat-generating component. As a result, it is difficulty to remove heat generated by the heat-generating component.
- FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation apparatus.
- FIG. 2 is an enlarged, isometric view of a fastener of the heat dissipation apparatus of FIG. 1 .
- FIG. 3 is an assembled, isometric view of the heat dissipation apparatus of FIG. 1 .
- FIG. 4 is a side plan view showing the heat dissipation apparatus of FIG. 3 fixed to a circuit board.
- an exemplary embodiment of a heat dissipation apparatus 1 includes a heat sink 10 , a resilient pressing member 20 , and two fasteners 30 .
- the heat sink 10 includes an elongated, thermal-conductive base 12 , and a plurality of thermal-conductive fins 14 extending substantially perpendicularly from a top of the base 12 .
- a receiving groove 142 is transversely defined in the fins 14 and extends along the length direction of the base 12 .
- Two support portions 16 are respectively formed at opposite ends of the base 12 .
- a fixing hole 162 is defined in each support portion 16 .
- the pressing member 20 includes an abutting portion 22 , and two locking portions 24 respectively extending from opposite ends of the abutting portion 22 .
- the abutting portion 22 is substantially arc-shaped, with the opposite ends of the abutting portion 22 tilted relative to a center of the abutting portion 22 .
- Each locking portion 24 is substantially V-shaped.
- each fastener 30 includes a columnar body 32 and a catch 34 extending from a first end of the body 32 .
- a latching hole 322 is radially defined in a second end of the body 32 opposite to the first end, corresponding to one locking portion 24 of the pressing member 20 .
- the catch 34 is hollowed to be readily flexed.
- Two opposite cutouts 36 are defined in a conjunction of the body 32 and the catch 34 .
- the locking portions 24 of the pressing member 20 are respectively latched in the latching holes 322 of the fasteners 30 , and the pressing member 20 is received in the receiving groove 142 of the heat sink 10 .
- the catches 34 of the fasteners 30 are in alignment with the fixing holes 162 of the corresponding support portions 16 of the heat sink 10 , the catches 34 are urged to extend through the corresponding fixing holes 162 .
- the abutting portion 22 of the pressing member 20 is substantially positioned at a center of the top of the base 12 of the heat sink 10 .
- the catches 34 of the fasteners 30 are in alignment with two through holes 44 defined in the circuit board 40 .
- the catches 34 are urged again to be resiliently flexed and inserted in the corresponding through holes 44 .
- the abutting portion 22 of the pressing member 20 is stretched to be resiliently flexed by the locking portions 24 , which are latched in the latching holes 322 of the fasteners 30 .
- the abutting portion 22 abuts against the center of the top of the base 12 to urge a center of a bottom of the base 12 to be in intimate thermal contact with the heat-generating component 42 .
- the catches 34 When the catches 34 extend through the corresponding through holes 44 , the catches 34 are restored to catch the circuit board 40 . Sides bounding the though holes 44 are respectively held in the corresponding cutouts 36 .
- the heat sink 10 is firmly secured to the circuit board 40 , with the center of the bottom of the base 12 in intimate thermal contact with the heat-generating component 42 , for quickly and efficiently dissipating heat from the heat-generating component 42 .
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to a heat dissipation apparatus.
- 2. Description of Related Art
- Finned heat sinks have been found to be particularly effective for transferring heat through conduction from a heat-generating component such as a semiconductor chip and rapidly dissipating such heat to the environment. However, in the past, various means used to attach a heat sink to the heat-generating component does not allow the heat sink to be in intimate thermal contact with the heat-generating component. As a result, it is difficulty to remove heat generated by the heat-generating component.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation apparatus. -
FIG. 2 is an enlarged, isometric view of a fastener of the heat dissipation apparatus ofFIG. 1 . -
FIG. 3 is an assembled, isometric view of the heat dissipation apparatus ofFIG. 1 . -
FIG. 4 is a side plan view showing the heat dissipation apparatus ofFIG. 3 fixed to a circuit board. - The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to
FIG. 1 , an exemplary embodiment of aheat dissipation apparatus 1 includes aheat sink 10, a resilient pressingmember 20, and twofasteners 30. - The
heat sink 10 includes an elongated, thermal-conductive base 12, and a plurality of thermal-conductive fins 14 extending substantially perpendicularly from a top of thebase 12. Areceiving groove 142 is transversely defined in thefins 14 and extends along the length direction of thebase 12. Twosupport portions 16 are respectively formed at opposite ends of thebase 12. Afixing hole 162 is defined in eachsupport portion 16. - The
pressing member 20 includes anabutting portion 22, and twolocking portions 24 respectively extending from opposite ends of theabutting portion 22. Theabutting portion 22 is substantially arc-shaped, with the opposite ends of theabutting portion 22 tilted relative to a center of theabutting portion 22. Eachlocking portion 24 is substantially V-shaped. - Referring to
FIG. 2 , eachfastener 30 includes acolumnar body 32 and acatch 34 extending from a first end of thebody 32. Alatching hole 322 is radially defined in a second end of thebody 32 opposite to the first end, corresponding to onelocking portion 24 of thepressing member 20. Thecatch 34 is hollowed to be readily flexed. Twoopposite cutouts 36 are defined in a conjunction of thebody 32 and thecatch 34. - Referring to
FIGS. 1-3 , in assembly, thelocking portions 24 of the pressingmember 20 are respectively latched in thelatching holes 322 of thefasteners 30, and the pressingmember 20 is received in the receivinggroove 142 of theheat sink 10. When thecatches 34 of thefasteners 30 are in alignment with thefixing holes 162 of thecorresponding support portions 16 of theheat sink 10, thecatches 34 are urged to extend through thecorresponding fixing holes 162. Thus, theabutting portion 22 of thepressing member 20 is substantially positioned at a center of the top of thebase 12 of theheat sink 10. - Referring to
FIG. 4 , in mounting theheat dissipation apparatus 1 to acircuit board 40 for transferring heat from a heat-generatingcomponent 42 mounted on thecircuit board 40, thecatches 34 of thefasteners 30 are in alignment with two throughholes 44 defined in thecircuit board 40. Thecatches 34 are urged again to be resiliently flexed and inserted in the corresponding throughholes 44. Meanwhile, theabutting portion 22 of thepressing member 20 is stretched to be resiliently flexed by thelocking portions 24, which are latched in thelatching holes 322 of thefasteners 30. - Thus, the
abutting portion 22 abuts against the center of the top of thebase 12 to urge a center of a bottom of thebase 12 to be in intimate thermal contact with the heat-generatingcomponent 42. - When the
catches 34 extend through the corresponding throughholes 44, thecatches 34 are restored to catch thecircuit board 40. Sides bounding the thoughholes 44 are respectively held in thecorresponding cutouts 36. Thus, theheat sink 10 is firmly secured to thecircuit board 40, with the center of the bottom of thebase 12 in intimate thermal contact with the heat-generating component 42, for quickly and efficiently dissipating heat from the heat-generating component 42. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the present disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010242516.9 | 2010-08-02 | ||
CN2010102425169A CN102348364A (en) | 2010-08-02 | 2010-08-02 | Cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120024495A1 true US20120024495A1 (en) | 2012-02-02 |
Family
ID=45525518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/859,281 Abandoned US20120024495A1 (en) | 2010-08-02 | 2010-08-19 | Heat dissipation apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120024495A1 (en) |
CN (1) | CN102348364A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120074077A1 (en) * | 2010-09-23 | 2012-03-29 | Hon Hai Precision Industry Co., Ltd. | Heat sink bracket |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103415189A (en) * | 2013-08-09 | 2013-11-27 | 曾震 | Power supply heat dissipation processing mode |
CN111029317A (en) * | 2019-11-21 | 2020-04-17 | 深圳兴奇宏科技有限公司 | Water cooling head fastener structure |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7729123B2 (en) * | 2008-05-26 | 2010-06-01 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating assembly and electronic device having same |
US20100172102A1 (en) * | 2009-01-07 | 2010-07-08 | International Business Machines Corporation | Solderless heatsink anchor |
US20100232113A1 (en) * | 2009-03-13 | 2010-09-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with fastener |
-
2010
- 2010-08-02 CN CN2010102425169A patent/CN102348364A/en active Pending
- 2010-08-19 US US12/859,281 patent/US20120024495A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7729123B2 (en) * | 2008-05-26 | 2010-06-01 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating assembly and electronic device having same |
US20100172102A1 (en) * | 2009-01-07 | 2010-07-08 | International Business Machines Corporation | Solderless heatsink anchor |
US20100232113A1 (en) * | 2009-03-13 | 2010-09-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with fastener |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120074077A1 (en) * | 2010-09-23 | 2012-03-29 | Hon Hai Precision Industry Co., Ltd. | Heat sink bracket |
US8272609B2 (en) * | 2010-09-23 | 2012-09-25 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink bracket |
Also Published As
Publication number | Publication date |
---|---|
CN102348364A (en) | 2012-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, XIAO-ZHU;YE, ZHEN-XING;REEL/FRAME:024857/0304 Effective date: 20100815 Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, XIAO-ZHU;YE, ZHEN-XING;REEL/FRAME:024857/0304 Effective date: 20100815 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |