CN103415189A - Power supply heat dissipation processing mode - Google Patents
Power supply heat dissipation processing mode Download PDFInfo
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- CN103415189A CN103415189A CN2013103455979A CN201310345597A CN103415189A CN 103415189 A CN103415189 A CN 103415189A CN 2013103455979 A CN2013103455979 A CN 2013103455979A CN 201310345597 A CN201310345597 A CN 201310345597A CN 103415189 A CN103415189 A CN 103415189A
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- heat dissipation
- power supply
- piece
- crystal
- fin
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Abstract
The invention discloses a power supply heat dissipation processing mode. Firstly, a crystal with a heat-conducting piece is fixed on a PCB, the face, with the heat-conducting piece, of the crystal is upward, and an inserting hole is formed in the PCB; secondly, a heat dissipation piece is tightly attached to the heat-conducting piece and fixed on the PCB, and the heat dissipation piece is arranged on the heat-conducting piece; the heat dissipation piece comprises a bottom plate and heat dissipation fins, the two sides of the bottom plate are provided with side wings which protrude out the outmost heat dissipation fin in a stretching out mode, the side wings are provided with fixing holes, and the heat dissipation piece is inserted in the inserting hole in the PCB for fixing through the mode that fixing buckles penetrates through the fixing holes. According to the power supply heat dissipation processing mode, the heat dissipation piece and the crystal are directly fixed in a contact mode, the overall machining process can be finished only through two steps, namely crystal inserting and heat dissipation piece inserting, so that the production technology is greatly simplified, operation can be finished only by few workers, production efficiency is improved by more than 3 times, and production cost is greatly lowered. Due to the fact that the crystal is in direct contact with the heat dissipation piece, the heat dissipation effect is improved, and a power supply can work more stably.
Description
Technical field
The present invention relates to the power supply product technical field, be specifically related to a kind of radiating treatment technology that is applied to power supply.
Background technology
Power supply is the requisite parts of various electric equipments, can the quality of power quality be related to equipment and normally stably work, affect a heat dispersion that key factor is power supply of power quality, the poor power supply of heat dispersion is job insecurity not only, and its useful life is also shorter.At present, each power supply manufacturers normally solves heat dissipation problem by radiation fin, and concrete way is: the first step, diffuse backing; Second step, put insulating trip; The 3rd step, put crystal; The 4th step, string insulation grain are to screw; The 5th step, put screw above electric screwdriver; The 6th step, pinning crystal; The 7th step, slotting crystal are to pcb board.Basically all want seven to eight operations just can complete, not only troublesome poeration, operation are various, need a large amount of workmans' operations, improve production cost, and operating effect are undesirable, causes radiating effect also not ideal enough.
Summary of the invention
The technical problem to be solved in the present invention is to provide that a kind of simple in structure, reasonable in design, technique is simple, good heat dissipation effect, power supply heat sinking processing mode that production cost is low.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of power supply heat sinking processing mode is characterized in that: at first will be fixed on pcb board with the crystal of conducting strip, and have one of conducting strip to face up, and on pcb board, jack is set; Then fin is close to conducting strip and is fixed on pcb board, fin is positioned at the conducting strip top.
Further, described fin comprises base plate and radiating fin, some radiating fins vertically are fixed on base plate, the base plate both sides are extended with the flank that protrudes from the outermost radiating fin, flank is provided with fixing hole, and fin passes fixing hole by clip and is inserted in the jack on pcb board fixing.
Further, described fin adopts metal material to make; Described clip adopts metal, plastic cement or elastomeric material to make.
The present invention is fixing by directly fin being contacted with crystal, whole machining process is as long as two steps can complete, namely insert crystal, then insert fin, so greatly simplified production technology, only need a small amount of workman to get final product complete operation, production efficiency has improved more than 3 times, has greatly reduced production cost; And because crystal directly contacts with fin, improved radiating effect, can guarantee that power supply more stably works.
The accompanying drawing explanation
Fig. 1 is installment state structure chart of the present invention.
In figure, 1 is pcb board, and 2 is fin, and 3 is crystal, and 4 is conducting strip, and 5 is flank, and 6 is clip.
Embodiment
In the present embodiment, with reference to Fig. 1, described power supply heat sinking processing mode, at first will be fixed on pcb board 1 with the crystal 3 of conducting strip 4, has one of conducting strip 4 to face up, and on pcb board 1, jack is set; Then fin 2 is close to conducting strip 4 and is fixed on pcb board 1, fin 2 is positioned at conducting strip 4 tops.
Described fin 2 comprises base plate and radiating fin, some radiating fins vertically are fixed on base plate, the base plate both sides are extended with the flank 5 that protrudes from the outermost radiating fin, and flank 5 is provided with fixing hole, and fin 2 passes fixing hole by clip 6 and is inserted in the jack on pcb board 1 fixing.
Fin 2 adopts metal material to make; Clip 6 adopts metal, plastic cement or elastomeric material to make.
Below the present invention is described in detail, the above, only be the present invention's preferred embodiment, when not limiting the scope of the present invention, namely allly according to the application's scope, does impartial change and modify, and all should still belong in covering scope of the present invention.
Claims (3)
1. a power supply heat sinking processing mode, is characterized in that: at first will be fixed on pcb board with the crystal of conducting strip, and have one of conducting strip to face up, and on pcb board, jack is set; Then fin is close to conducting strip and is fixed on pcb board, fin is positioned at the conducting strip top.
2. power supply heat sinking processing mode according to claim 1, it is characterized in that: described fin comprises base plate and radiating fin, some radiating fins vertically are fixed on base plate, the base plate both sides are extended with the flank that protrudes from the outermost radiating fin, flank is provided with fixing hole, and fin passes fixing hole by clip and is inserted in the jack on pcb board fixing.
3. power supply heat sinking processing mode according to claim 1 is characterized in that: described fin adopts metal material to make; Described clip adopts metal, plastic cement or elastomeric material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103455979A CN103415189A (en) | 2013-08-09 | 2013-08-09 | Power supply heat dissipation processing mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103455979A CN103415189A (en) | 2013-08-09 | 2013-08-09 | Power supply heat dissipation processing mode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103415189A true CN103415189A (en) | 2013-11-27 |
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ID=49608165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103455979A Pending CN103415189A (en) | 2013-08-09 | 2013-08-09 | Power supply heat dissipation processing mode |
Country Status (1)
| Country | Link |
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| CN (1) | CN103415189A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201450460U (en) * | 2009-08-10 | 2010-05-05 | 杜长福 | Small and medium power inverted power supply with good heat dissipation |
| CN101720183A (en) * | 2008-12-12 | 2010-06-02 | 四川虹欧显示器件有限公司 | Heat radiating method for circuit board |
| CN101902892A (en) * | 2009-05-26 | 2010-12-01 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator fixing device |
| CN201766071U (en) * | 2010-07-23 | 2011-03-16 | 天津市鼎曦光学科技有限公司 | Heat dissipation structure of power semiconductor |
| CN102348364A (en) * | 2010-08-02 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | Cooling device |
-
2013
- 2013-08-09 CN CN2013103455979A patent/CN103415189A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720183A (en) * | 2008-12-12 | 2010-06-02 | 四川虹欧显示器件有限公司 | Heat radiating method for circuit board |
| CN101902892A (en) * | 2009-05-26 | 2010-12-01 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator fixing device |
| CN201450460U (en) * | 2009-08-10 | 2010-05-05 | 杜长福 | Small and medium power inverted power supply with good heat dissipation |
| CN201766071U (en) * | 2010-07-23 | 2011-03-16 | 天津市鼎曦光学科技有限公司 | Heat dissipation structure of power semiconductor |
| CN102348364A (en) * | 2010-08-02 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | Cooling device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131127 |