200824550 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱模組結構，尤其是關於一種雙 熱源散熱模組之結構。 【先前技術】 按習用裝設於電腦内之散熱模組，一般多係設計為專 用以對產生熱量最多之中央處理器（Central Processing Unit，CPU)進行散熱，且為便於生產與安裝，因此又多將 其中必備之殼體、風扇與熱管等元件予以模組化，如美國 專利公報公告號第6373700號專利以及第6654245號專利 等，均屬此類結構。 前述專利前案中所揭露之模組化散熱裝置，固然均具 有良好之散熱效率，但由於其設計均係源自於加強CPU散 熱效率之需求，因此，即使其達到改善散熱效率之優點， 卻無法對同一電路板上其它也會發出熱量之晶片直接發揮 散熱功能，造成散熱模組雖然效率良好，卻無法有效提昇 配置有散熱模組之電腦整體效率的情形。 為解決上述之問題，美國專利公報公告號第7120018 號專利，係利用組設於一中央處理器之一散熱鰭片上，再 固定一風扇，使風扇運轉時，將空氣由風扇之軸向導至徑 向而吹出，並吹向位於中央處理器旁的一北橋晶片（North Bridge Chip )，且於北橋晶片旁再組設一導流件 (vent i 1 at ion—enhancing member)，將吹過北橋晶片之空 氣導於其它高發熱源之電子元件，形成一導熱的空氣流通 6 200824550 路徑，使相關高發熱之電子元件均可經由此空氣流通路徑 而達到整體散熱效果。但是，上述利用空氣流通路徑以使 各個發熱之電子元件均可散熱之方式，除了中央處理器上 利用散熱鰭片再搭配風扇可具有較高的散熱效率之外，且 吹過中央處理器之空氣已具一定之高溫，其餘配置於空氣 流通路徑之高發熱源之電子元件，以高溫之空氣直接吹過 電子元件的方式，使得其散熱效率並不高，無法真正有效 地解決整體的散熱效率。 【發明内容】 鑒於以上的問題，本發明所欲解決之問題及目的在於 提供一種雙熱源散熱模組，藉以同時對雙熱源進行散熱。 因此，本發明揭露一種雙熱源散熱模組，用以散除第 一發熱元件與第二發熱元件所產生之熱量，此第一與第二 發熱元件係配置於一電路板，此雙熱源散熱模組係包含第 一導熱板、第二導熱板、固合件、熱管與抵壓彈片。 其中第一導熱板係接觸於第一發熱元件表面，以傳導 第一發熱元件所產生之熱量至第一導熱板，且第一導熱板 具有第一爪部；第二導熱板係接觸於第二發熱元件表面， 以傳導第二發熱元件所產生之熱量至第二導熱板；固合件 係具有第二爪部，此固合件係固設於電路板，並壓抵第二 導熱板於第二發熱元件，以傳導第二導熱板之熱量至固合 件；熱管之一端係被夾置於第一爪部與第二爪部，以傳導 第一導熱板與固合件之熱量至熱管之另一端；以及抵壓彈 片係具有一抵壓部，此抵壓彈片係受固合件固設於電路板 7 200824550 之牽引，使得抵壓部壓抵第一導熱元件，進而使第一導熱 元件壓抵於第一發熱元件。 其中抵壓彈片相對於固合件之另一側係螺固於電路 板，且抵壓部開設一第一槽，使第一導熱板之第一爪部穿 過第一槽而夾置熱管。其中抵壓彈片受固合件牽引之一端 係固定於固合件之一侧。 本發明之雙熱源散熱模組更包含一風扇與一導熱元 件，導熱元件係固定於風扇一側，且導熱元件連接熱管， 以傳導熱管之熱至導熱元件，並由風扇運轉產生空氣流動 以通過導熱元件，以散除導熱元件之熱。 綜上所述，本發明之雙熱源散熱模組，於固合件固設 於電路板時，除了固合件直接壓抵第二導熱板於第二發熱 元件之外，並一併牽引抵壓彈片以壓抵第一導熱板於第一 發熱元件上，如此可確保第一導熱板與第二導熱板皆可確 實地接觸著第一發熱元件與第二發熱元件，以達到最大的 散熱效率。 有關本發明的特徵與實作，茲配合圖示作最佳實施例 詳細說明如下。 【實施方式】 請參閱「第1圖」與「第2圖」，所示為本發明組合示 意圖與爆炸示意圖。如「第1圖」與「第2圖」所示，本 發明係一種雙熱源散熱模組100，係固定於一電路板500， 且此電路板500上配置一第一發熱元件510與一第二發熱 元件530，當雙熱源散熱模組100固定於電路板500時， 8 200824550 係用=散除第-發熱元件训與第二發熱元件53〇所產生 之熱置，此電路板500可為一主機板，因此，第一發熱元 件510與第一發熱几件53〇可為中央處理器&扣μ P Sing Unit，CPU)與北橋晶片（north bridge chip) 的組合。 雙熱源散熱模組100係包含一第—導熱板11〇、一第 二導熱板130、一固合件15〇、一熱管（heatpipe)i7〇 與一抵壓彈片190。 其中第一導熱板110係接觸於第一發熱元件51〇表 面’以傳導第一發熱元件510所產生之熱量至第一導熱板 110，且於第—導熱板11G相對於第-發熱元件510之另-側面具有一第一爪部111，此第一爪部ill可形成如軌道 形狀，且此執道狀的第一爪部111其寬度實質等同於熱管 17〇之覓度。第一導熱板110可利用黏貼方式使第一導熱 板110先固定於第一發熱元件51〇表面。 第一導熱板130係接觸於第二發熱元件表面，以 傳導第二發熱元件530所產生之熱量至第二導熱板13〇。 而固合件150係固設於電路板5〇〇，如固合件15〇螺固於 電路板500的方式，並壓抵第二導熱板13〇於第二發熱元 件530’以傳導第二導熱板13〇之熱量至固合件15〇。且於 固合件150對應第二導熱板130之另一側面延伸以形成一 第=爪部151，此第二爪部151可為執道狀，且此執道狀 的第二爪部15丨其寬度實質等同於熱管170之寬度。 熱管170係其一端依序穿過第二爪部“I與第一爪部 200824550 111，而被第一爪部151與第一爪部in夾置，進而固定於 固合件150與第一導熱板110上，用以傳導第一導熱板 與固合件150之熱量至熱管170之另一端。 抵壓彈片190係具有一抵壓部191，此抵壓彈片190 之一端係固設於電路板500上，另一端係固設於固合件^ 之下方，因此，當固合件150鎖固於電路板5〇〇時，即會 牽引抵壓彈片19〇之抵壓部191壓抵住第一導熱板11〇， 進而使第一導熱板Π0壓抵於第一發熱元件51〇 ◦藉由前 述牽引結構之設計，抵壓彈片1 9Q即具有較高之壓抵力量 施加於第一導熱板110與第一發熱元件510，以使得第一 導熱板110與第一發熱元件510之間能緊密地接觸，有助 於將第一發熱元件510之所產生之熱量確實傳導至第一導 熱板110。 其中抵壓彈片190受固合件150牽引之一端係直接可 透過螺固、鉚固或黏固等方式而固定於固合件15〇之一 侧。抵壓部191之對應於第一爪部in的部份開設有一第 一槽193，使得第一爪部lu穿過此第一槽193，以夾置熱 管170。並且抵壓部191係呈凸出狀，形成一容置空間， 以供第一導熱板110嵌合於形成此容置空間之抵壓部191。 另外，本發明之雙熱源散熱模組1〇〇更包含一風扇7〇〇 與一導熱元件710，此導熱元件710係固定於風扇700 — 侧’且導熱元件71〇連接於熱管17〇相對被第一爪部m 與第二爪部151所夾置之另一側，以傳導熱管170之熱至 導熱元件710上，並由風扇7〇〇運轉產生空氣流動以通過 10 200824550 導熱元件710並排於外界，以散除導熱元件7i〇之熱。 請參閱「第3圖」，所示為本發明之另一實施例爆炸示 意圖。如「第3圖」所示，其組合結構與上述實施例所述 之結構相同’於此不再贅述。唯差異在於固合件15〇於第 二爪部⑸處係開設—第二槽153，且第二導熱板13〇對 應於第二槽153之側面延伸一凸出塊ΐ3ι，此巴出塊⑶ 相符於第二槽153之形狀，而可嵌於第二槽153中，以使 凸出塊131直接接觸著熱管17〇，可使第二導熱板13〇部 份直接接觸著熱管170，以提高散熱效率。 口此，本發明之雙熱源散熱模組，透過固合件與抵壓 彈片可確實地使熱管、第一導熱板、第二導熱板、第一發 熱源與第二發熱_實地接觸，以達最高散熱效率。 雖然本發明以前述之較佳實施例揭露如上，然其並非 用乂限定本电明’任何熟習相像技藝者’在不脫離本發明 之精神和範圍内，當可作些許之更動與潤飾，因此本發明 專利保4範圍須視本說明書所附之申請專利範圍所界 者為準。 【圖式簡單說明】 「第1圖」係顯示本發明之組合圖； 第2圖」係顯示本發明之爆炸圖；以及 第3圖」係顯示本發明之另一實施例爆炸圖。 【主要元件符號說明】 1〇〇雙熱源散熱模組 H0第一導熱板 200824550 111第一爪部 130第二導熱板 131凸出塊 150固合件 151第二爪部 153第二槽 170熱管 190抵壓彈片 191抵壓部 193第一槽 500電路板 510第一發熱元件 530第二發熱元件 700風扇 710導熱元件200824550 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module structure, and more particularly to a structure of a dual heat source heat dissipation module. [Prior Art] The heat-dissipating modules installed in the computer according to the conventional design are generally designed to dissipate heat to the central processing unit (CPU) that generates the most heat, and for the convenience of production and installation, The components such as the housing, the fan, and the heat pipe are often modularized, such as the US Patent Publication No. 6373700 and the No. 6654245. The modular heat sink disclosed in the aforementioned patents has good heat dissipation efficiency, but since its design is derived from the need to enhance the heat dissipation efficiency of the CPU, even if it achieves the advantages of improving heat dissipation efficiency, It is impossible to directly use the heat dissipation function on other wafers that emit heat on the same circuit board, which makes the heat dissipation module effective, but cannot effectively improve the overall efficiency of the computer equipped with the heat dissipation module. In order to solve the above problems, U.S. Patent Publication No. 7110018 uses a heat dissipating fin disposed on a central processing unit, and then fixes a fan to guide the air from the axis of the fan to the fan. Radially blown out and blown to a North Bridge Chip located next to the central processor, and a vent i 1 at ion-enhancing member is placed next to the North Bridge wafer, which will blow through the North Bridge. The air of the wafer is guided to the electronic components of other high heat sources to form a heat-conducting air circulation path of 200824550, so that the relevant high-heating electronic components can achieve the overall heat dissipation effect through the air circulation path. However, the above-mentioned air circulation path is used to dissipate heat from each of the heat-generating electronic components, and the air is blown through the central processing unit in addition to the heat dissipation fins on the central processing unit and the fan can have high heat dissipation efficiency. It has a certain high temperature, and the rest of the electronic components disposed in the high heat source of the air circulation path are directly blown through the electronic components by the high temperature air, so that the heat dissipation efficiency is not high, and the overall heat dissipation efficiency cannot be effectively solved. SUMMARY OF THE INVENTION In view of the above problems, the problem and object of the present invention are to provide a dual heat source heat dissipation module for simultaneously dissipating heat from a dual heat source. Therefore, the present invention discloses a dual heat source heat dissipation module for dissipating heat generated by the first heat generating component and the second heat generating component, wherein the first and second heat generating components are disposed on a circuit board, and the dual heat source heat sink module The assembly includes a first heat conducting plate, a second heat conducting plate, a fixing member, a heat pipe and a pressing elastic piece. The first heat conducting plate is in contact with the surface of the first heat generating component to conduct heat generated by the first heat generating component to the first heat conducting plate, and the first heat conducting plate has a first claw portion; the second heat conducting plate is in contact with the second heat conducting plate a surface of the heating element for transmitting heat generated by the second heating element to the second heat conducting plate; the fixing member has a second claw portion, the fixing member is fixed on the circuit board and pressed against the second heat conducting plate a heating element for conducting heat of the second heat conducting plate to the fixing member; one end of the heat pipe is sandwiched between the first claw portion and the second claw portion to conduct heat of the first heat conducting plate and the fixing member to the heat pipe The other end; and the pressing elastic piece has a pressing portion, and the pressing elastic piece is fixed by the fixing member on the circuit board 7 200824550, so that the pressing portion is pressed against the first heat conducting element, thereby making the first heat conducting element Pressed against the first heating element. The pressing elastic piece is screwed to the circuit board with respect to the other side of the fixing member, and the pressing portion defines a first groove, so that the first claw portion of the first heat conducting plate passes through the first groove to sandwich the heat pipe. The pressing elastic piece is fixed to one side of the fixing member by one end of the fixing member. The dual heat source heat dissipation module of the present invention further comprises a fan and a heat conducting component, the heat conducting component is fixed on one side of the fan, and the heat conducting component is connected to the heat pipe to conduct the heat of the heat pipe to the heat conducting component, and the fan operates to generate air flow to pass A thermally conductive element to dissipate heat from the thermally conductive element. In summary, the dual heat source heat dissipation module of the present invention, when the fixing member is fixed on the circuit board, directly presses the second heat conducting plate on the second heat generating component, and pulls the pressing member together. The elastic piece is pressed against the first heat conducting plate on the first heat generating component, so that the first heat conducting plate and the second heat conducting plate can surely contact the first heat generating component and the second heat generating component to achieve maximum heat dissipation efficiency. The features and implementations of the present invention are described in detail with reference to the preferred embodiments. [Embodiment] Please refer to "Fig. 1" and "Fig. 2" for a schematic view of the combination and explosion of the present invention. As shown in FIG. 1 and FIG. 2, the present invention is a dual heat source heat dissipation module 100 fixed to a circuit board 500, and a first heating element 510 and a first portion are disposed on the circuit board 500. The second heating element 530, when the dual heat source heat dissipation module 100 is fixed on the circuit board 500, 8 200824550 is used to dissipate the heat generated by the first heat generating component and the second heat generating component 53 , and the circuit board 500 can be A motherboard, therefore, the first heating element 510 and the first heat generating member 53 can be a combination of a central processing unit and a north bridge chip. The dual heat source heat dissipation module 100 includes a first heat conducting plate 11A, a second heat conducting plate 130, a fixing member 15A, a heat pipe i7〇 and a pressing elastic piece 190. The first heat conducting plate 110 is in contact with the surface of the first heat generating component 51 to conduct the heat generated by the first heat generating component 510 to the first heat conducting plate 110, and the first heat conducting plate 11G is opposite to the first heat generating component 510. The other side has a first claw portion 111, and the first claw portion ill can be formed in a track shape, and the first claw portion 111 of the obedience shape has a width substantially equivalent to the temperature of the heat pipe 17〇. The first heat conducting plate 110 can be fixed to the surface of the first heat generating component 51 by adhesive bonding. The first heat conducting plate 130 is in contact with the surface of the second heat generating component to conduct heat generated by the second heat generating component 530 to the second heat conducting plate 13A. The fixing member 150 is fixed to the circuit board 5, such as the fixing member 15 is screwed to the circuit board 500, and pressed against the second heat conducting plate 13 to the second heating element 530' to conduct the second. The heat of the heat conducting plate 13 is turned to the fixing member 15A. And extending on the other side of the second heat conducting plate 130 to form a first claw portion 151, the second claw portion 151 can be in the shape of a track, and the second claw portion 15 of the track shape Its width is substantially equivalent to the width of the heat pipe 170. The heat pipe 170 is sequentially passed through the second claw portion "I and the first claw portion 200824550 111, and is sandwiched by the first claw portion 151 and the first claw portion in, and is fixed to the fixing member 150 and the first heat conduction. The plate 110 is configured to conduct the heat of the first heat conducting plate and the fixing member 150 to the other end of the heat pipe 170. The pressing elastic piece 190 has a pressing portion 191, and one end of the pressing elastic piece 190 is fixed on the circuit board. On the 500, the other end is fixed under the fixing member ^. Therefore, when the fixing member 150 is locked on the circuit board 5, the pressing portion 191 of the pressing elastic piece 19 is pressed against the first portion. a heat conducting plate 11 〇, and then the first heat conducting plate Π0 is pressed against the first heat generating component 51. By the design of the traction structure, the pressing elastic piece 19 9 has a high pressing force applied to the first heat conducting plate. The first heat generating component 510 is in close contact with the first heat generating component 510 to facilitate the conduction of the heat generated by the first heat generating component 510 to the first heat conducting board 110. The pressing elastic piece 190 is directly spliced and spliced by one end of the fixing member 150. One side of the fixing member 15 is fixed to the side of the fixing member 15 by a fixing or the like. A portion corresponding to the first claw portion in the first pressing portion 191 defines a first groove 193, so that the first claw portion lu passes through the first groove. 193, in order to sandwich the heat pipe 170, and the pressing portion 191 is convex, forming an accommodating space for the first heat conducting plate 110 to be fitted to the pressing portion 191 forming the accommodating space. The dual heat source heat dissipation module 1 further includes a fan 7 〇〇 and a heat conducting element 710 fixed to the side of the fan 700 and the heat conducting element 71 〇 is connected to the heat pipe 17 〇 relative to the first claw The other side of the m and the second claw portion 151 is disposed to conduct the heat of the heat pipe 170 to the heat conducting member 710, and is operated by the fan 7 to generate air flow to pass through the 10 200824550 heat conducting member 710 and to be discharged to the outside. In addition to the heat of the heat conducting element 7i, please refer to "Fig. 3", which is a schematic exploded view of another embodiment of the present invention. As shown in Fig. 3, the combined structure is the same as that described in the above embodiment, and the details are not described herein. The difference is that the fixing member 15 is opened at the second claw portion (5) - the second groove 153, and the second heat conducting plate 13 延伸 extends corresponding to the side of the second groove 153 to protrude from the side of the second groove 153, and the block (3) Corresponding to the shape of the second slot 153, it can be embedded in the second slot 153, so that the protruding block 131 directly contacts the heat pipe 17〇, so that the second heat conducting plate 13 can directly contact the heat pipe 170 to improve Cooling efficiency. In this way, the dual heat source heat dissipation module of the present invention can reliably contact the heat pipe, the first heat conduction plate, the second heat conduction plate, the first heat source and the second heat source through the fixing member and the pressing elastic piece to reach Maximum heat dissipation efficiency. Although the present invention has been described above in the above preferred embodiments, it is not intended to limit the scope of the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the patent protection of the present invention is subject to the scope of the patent application attached to the present specification. BRIEF DESCRIPTION OF THE DRAWINGS "FIG. 1" shows a combination of the present invention; FIG. 2 shows an exploded view of the present invention; and FIG. 3 shows an exploded view of another embodiment of the present invention. [Main component symbol description] 1〇〇 dual heat source heat dissipation module H0 first heat conduction plate 200824550 111 first claw portion 130 second heat conduction plate 131 protruding block 150 fixing member 151 second claw portion 153 second groove 170 heat pipe 190 Pressing the elastic piece 191 against the pressing portion 193, the first groove 500, the circuit board 510, the first heating element 530, the second heating element 700, the fan 710, the heat conducting element