TWM452595U - Thin-type heat dissipator and device structure using the same - Google Patents

Abstract

Disclosure herein is related to a thin-type heat dissipator, and device structure using this heat dissipator. In accordance with one embodiment, the heat dissipator includes a substrate composed of materials with high thermal conductivity, and a thermal diffusion-and-radiation layer. The thermal diffusion-and-radiation layer is adhered to the surface of substrate. This layer is a mixture including radiation articles and glue capable of thermal diffusion. The thin-type heat dissipator is formed when the mixture is coated on the substrate. The device structure using the thin-type heat dissipator includes the inter-locked first member and second member. The heat sources to be heat-dissipated are the electronic components in the device. The thin-type heat dissipator is installed between the first and second member, and contacted with surface of the electronic component.

Description

Thin heat sink and device structure using the thin heat sink

The present invention is a thin heat sink and a device structure using the thin heat sink, and particularly refers to a heat sink disposed in an electronic device with limited heat dissipation space, and a device structure using the heat sink.

In the development of electronic devices, the increasingly higher computing performance requires the processing of high-processing clock processing wafers, but also the problem of more heat dissipation; electronic devices also have a thin and short design trend, but the design of this extremely compressed space The direction also causes difficulty in heat dissipation; however, the problem of heat dissipation encountered by such electronic devices is also related to the complexity of the device. Many current multi-functional and intelligent electronic devices also make the internal circuit design relatively complicated and also affect high-efficiency heat dissipation. the design of.

Traditionally, electronic products, such as computer systems, have been installed with fans, heat sink fins and other components near the heat source to achieve heat dissipation. This is common in the heat dissipation design of desktop computers or notebook computers. For thin and light electronic products, such as ultra-thin notebooks, tablets, and even smart phones, other well-known technologies use hot air convection and heat conduction design by setting the designed openings and heat-conducting structures. .

In view of the heat dissipation requirements of thin and light electronic devices, the present invention proposes a thin heat sink and a device structure using the thin heat sink. One of the design aspects of the creation is applied to heat dissipation in an electronic device with limited heat dissipation space, for example Lightweight design of computer devices, tablets, or An electronic device similar to the need for heat dissipation.

According to one of the embodiments of the present invention, the main component of the thin heat dissipating device has a substrate formed of a material having a high thermal conductivity coefficient, and a thermal diffusion radiation layer directly attached to the surface of the substrate, and the thermally diffused radiation layer includes the radiation. A mixture of particles and a thermal diffusing glue, wherein the radiating particles are black objects or carbon-containing objects uniformly distributed in the heat diffusing radiation layer, and these particles are uniformly mixed with the heat-dispersible glue.

According to an embodiment, the device structure using the thin heat sink includes a first component and a second component that are lockable to each other, the first component may be an upper cover of the electronic device, and the second component may be a lower cover of the electronic device, The created thin heat sink contacts a plurality of electronic components that are partially, wholly or entirely disposed within the device.

According to the embodiment, the thin heat sink can be attached to the surface of the contact electronic component by a double-sided adhesive or a thermal adhesive, and can be supplemented by an auxiliary heat sink disposed on one side of the thin heat sink.

In order to provide a heat dissipating device that effectively dissipates heat inside the device, the present disclosure discloses a thin heat dissipating device. According to an embodiment, the thin device is particularly suitable for an electronic device with less internal space such as a mobile device, a tablet computer or a notebook computer. Because the internal space is relatively small, and the heat generated by the circuit is difficult to dissipate, this creation requires a thin heat sink for the heat dissipation of this type of electronic device. In an embodiment, the thin heat sink is disposed on a main heat source in the electronic device, and may be in contact with the surface of the main heat source or attached to the surface of the heat source through a double-sided adhesive having a heat conductive effect, such as a wafer, especially Processor chip that requires high speed operation, and this author proposes The size of the thin heat sink is usually larger than the size of the heat source to facilitate heat diffusion and radiation.

Generally, the electronic device has a structure with an externally wrapped internal circuit, such as a circuit board and a circuit component disposed thereon, and a protective upper cover or a display module structure on the other side of the device. The heat sink is disposed between the upper structure and the lower circuit component. For example, if it is an electronic device with a touch screen, the thin heat sink of the present invention is disposed between the touch screen and the lower electronic component.

For an embodiment, reference may be made to the structural schematic diagram of the thin heat sink of the present invention shown in FIG.

The figure shows a substrate 101. The substrate 101 is preferably a material having a high thermal conductivity, such as a metal component, preferably a copper plate. A thermal diffusion radiation layer 102 is disposed above the substrate 101, and is bonded to the surface of the substrate 101, or the thermal diffusion radiation layer 102 is coated on the substrate 101 by a process. There is an interface 103 between the thermal diffusion radiation layer 102 and the substrate 101. The substrate 101 will contact the heat source in the device, and the heat is conducted to the vicinity of the interface 103 via the substrate 101, and is conducted to the thermal diffusion radiation layer 102, and is thermally diffused. The function of thermal diffusion and uniform radiation provided by the radiation layer 102 effectively dissipates heat.

2A is a schematic view showing an embodiment of a device structure using the thin heat sink of the present invention. In this example, the thin heat sink 20 is disposed on the electronic components 202, 203 on the circuit substrate 201.

Generally, the electronic components (202, 203) in the electronic device generate hot circuit components during operation, and the heat radiated may affect the operation of the electronic device. When there is not enough space for heat dissipation in the electronic device, this creation proposes Thin heat sink (20) device provides an effective space in a limited space Cooling solution.

For the embodiment, reference may be made to FIG. 2B, which is a schematic diagram of the embodiment of the apparatus for using the thin heat sink of the present invention. This figure is a side view of FIG. 2A, and it can be clearly seen that the surface of the electronic components 202, 203 on the circuit substrate 201 is provided. There is a thin heat sink 20 provided by the present creation. This example shows that the thin heat sink is in direct contact with the surface of each of the electronic components 202, 203.

2C is a schematic view showing an embodiment of a device structure using the thin heat sink of the present invention. In this example, when the thin heat sink 20 is in contact with the electronic components 202, 203 on the circuit substrate 201, the bonding adhesives 204, 205 are respectively bonded to the thin heat sink 20, and the bonding adhesive 204, 205 preferably has a good heat conducting function, except that the bonding type can be fixed. In addition to the heat sink 20, it can still bear the role of heat conduction.

Regarding the structure of the above-mentioned thin heat sink, in addition to the substrate formed by the high thermal conductivity material for transferring heat from the electronic component into the heat sink, a heat diffusion radiation layer having thermal diffusion and radiation functions is further provided, and the related structure may be See the schematic diagram of the embodiment shown in Figures 3A and 3B.

3A shows the function of the heat diffusion radiation layer 30 in the thin heat sink, mainly by diffusing heat originally concentrated in a specific small range to the periphery of the heat diffusion radiation layer 30. According to an embodiment, the thin heat sink proposed by the present invention is suitable for use on an electronic component that generates heat during operation, and the size of the thin heat sink is preferably larger than the size of the applied electronic component, so that the heat source is relatively small. The heat is evenly dissipated through the heat diffusion radiation layer 30, and then the heat is radiated by the radiation function provided by the heat diffusion radiation layer 30.

Next, as shown in FIG. 3B, the mixture of the radiation particles 301 and the thermal diffusion capable glue 302 is physically mixed in the thermal diffusion radiation layer 30. main ingredient. The radiation particles 301 are preferably black objects or carbon-containing objects uniformly distributed in the heat diffusion radiation layer 30. The heat radiation capability of such materials can radiate heat out in a timely manner to achieve the purpose of the thin heat sink. These radiation particles 301 are uniformly mixed with the thermal diffusion capable glue 302.

Referring again to FIG. 3C, a side view of an embodiment of the thin heat sink of the present invention is shown.

In this figure, it can be seen that a plurality of uniformly distributed radiation particles 301 are disposed in the thermal diffusion radiation layer 30, and then uniformly mixed with the glue 302, and then formed on one side of the substrate 32 by a bonding or coating process, and the substrate 32 is formed. It is responsible for deriving heat generated by the internal circuit heat source 303, which then diffuses heat from a small area to the periphery and then radiates the heat out.

According to the embodiment of the process, in the process of fabricating the thermally diffused radiation layer 30, a mixture of a uniformly mixed black object and a thermal diffusing adhesive is uniformly applied to the substrate 32, followed by UV Curing. Or a thermal curing program to fix the shape.

Next, in the embodiment described in the disclosure that the thin heat sink is engaged with the internal heat source, in addition to the direct contact, the double-sided adhesive can be coated on the thin heat sink, and the coated area can be coated on the whole surface or coated. All or part of the surface of the thin heat sink that contacts the electronic component is trimmed and bonded to the heat dissipating surface of the electronic component in an appropriate size. In general, the size of the thin heat sink is greater than the size of the electronic components of the application.

The substrate 32 of the above-mentioned thin heat sink is preferably a material having a high thermal conductivity, such as the aforementioned metal copper or a material containing metal copper as a main material. The primary function of this substrate having a high thermal conductivity is to efficiently derive the heat generated by the electronic components in contact, such as the heat generated by the electronic components, which will first conduct into the substrate of the thin heat sink. According to the principle of heat conduction, heat In the substrate, it will be conducted in the shortest path, such as perpendicular to the direction of the electronic component, so when the heat of the heat source (such as electronic components in the electronic device) is conducted into the thin heat sink, it is concentrated in a small range, in order to avoid heat and reverse Returning to the heat source, the heat diffusion radiation layer 30 in the thin heat sink diffuses the heat to the periphery of the large area of the heat diffusion radiation layer 30, and then radiates heat into the air by the radiation capability. Through this heat dissipation process, heat can be effectively extracted and heat can be prevented from being accumulated in the electronic device.

Figure 4 then shows a schematic diagram of an embodiment of the apparatus using the present thin heat sink and auxiliary heat sink.

This figure shows a device structure using a thin heat sink, such as an overview of an electronic device, including a device upper cover member, such as the illustrated first member 43, and a lower cover member, such as the illustrated second member 44. The lower cover member (44) is provided with a circuit substrate 40. The circuit substrate 40 is provided with one or more heat sources, such as various circuit components 41, 42 such as image processing chips, data processing chips, memory chips, etc., due to the need for high speed. The calculation thus produces a hot buildup. The upper cover member (43) may include a general protection structure relative to the lower cover member (44). If the electronic device has a display, the display panel may be provided. In another embodiment, the display panel may be further provided. There are touch modules with embedded or peripherals.

The first component 43 and the second component 44 can be locked together in various ways. The thin heat sink 4 proposed in the present invention is disposed between the first component 43 and the second component 44, and the thin heat sink 4 contacts the circuit substrate. One or some or all of the electronic components 41, 42 on the 40.

In this example, the thin heat sink 4 includes a substrate 401 and a thermal diffusion radiation layer 402. The heat diffusion radiation layer 402 is attached to the surface of the substrate 401. The heat diffusion radiation layer 402 includes the radiation particles 421 as described above. With A mixture of heat-diffusing gels 422, which may be uniformly mixed, or may vary in distribution depending on the need for heat dissipation. The thin heat sink 4 can be directly attached to the electronic components 41, 42 as shown in the figure, and the bonding glue 403, 404 can be formed first and then attached.

According to another embodiment of the invention, one side of the thin heat sink 4 disposed between the first component 43 and the second component 44 in the device (not limited to the position shown in the figure) may further be provided with an auxiliary heat sink 405. It is to help spread the heat quickly.

When heat is rapidly conducted from the heat source to the top surface of the substrate 401, it will enter the thermal diffusion radiation layer 402, diffuse heat to the periphery of the heat dissipation device 4 through the thermal diffusion radiation layer 402, and then radiate heat out by the radiation capability to assist heat dissipation. The heat exchanger 405 is, for example, a heat sink such as a fan or a heat pipe, and can effectively dissipate heat to the outside of the device.

In summary, according to the thin heat sink disclosed in the present creative embodiment, one of the main features is that the heat diffusion radiation layer is designed to have the same plane on a thin structure while having thermal diffusion and heat radiation functions. The thin heat sink can be directly contacted with the electronic component to be cooled, and can be bonded to the electronic component by a bonding layer, such as a double-sided adhesive, a thermal conductive adhesive, etc., through the structure of the thin heat sink, the heat can be effectively It is derived from the heat source, diffused, and then radiated out to achieve the purpose of heat dissipation.

However, the above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, the equivalent structural changes made by using the present specification and the illustrated content are equally included in the present creation. Within the scope of the agreement, Chen Ming.

101‧‧‧Substrate

102‧‧‧ Thermal diffusion radiation layer

103‧‧‧ interface

201‧‧‧ circuit board

202,203‧‧‧Electronic components

20‧‧‧Thin heat sink

204,205‧‧‧Joint adhesive

30‧‧‧ Thermal diffusion layer

301‧‧‧radiation particles

302‧‧‧ glue

32‧‧‧Substrate

303‧‧‧heat source

40‧‧‧ circuit board

4‧‧‧Thin heat sink

41,42‧‧‧Electronic components

403,404‧‧‧Joint adhesive

401‧‧‧Substrate

402‧‧‧ Thermal diffusion layer

421‧‧‧radiation particles

422‧‧‧ glue

405‧‧‧Auxiliary radiator

43‧‧‧First part

44‧‧‧ second part

1 is a schematic view showing a structural embodiment of a thin heat sink according to the present invention; FIG. 2A is a schematic view showing an embodiment of a device structure using the thin heat sink of the present invention; FIG. 2B is a block diagram showing the structure of the device using the thin heat sink of the present invention. FIG. 2C shows a schematic diagram of an embodiment of a device structure using the thin heat sink of the present invention; FIG. 3A shows one of the schematic diagrams of the heat diffusion radiation layer of the thin heat sink of the present invention; FIG. 3B shows FIG. 3C is a side view showing an embodiment of the thin heat sink of the present invention; FIG. 4 is a side view showing an embodiment of the thin heat sink of the present invention; FIG. 4 is a view showing an apparatus using the thin heat sink and the auxiliary heat sink. schematic diagram.

201‧‧‧ circuit board

202,203‧‧‧Electronic components

20‧‧‧Thin heat sink

204,205‧‧‧Joint adhesive

Claims (10)

A thin heat sink comprising: a substrate formed of a material having a high thermal conductivity; and a thermally diffused radiation layer directly attached to the surface of the substrate, the thermally diffused radiation layer comprising radiation particles and a thermal diffusion capable a mixture of gums. The thin heat sink of claim 1, wherein the thin heat sink is larger in size than the electronic component of the application. The thin heat sink according to claim 1, wherein the radiation particles are black objects or carbon-containing objects uniformly distributed in the heat diffusion radiation layer, and are uniformly mixed with the heat diffusion capable glue. The thin heat sink of claim 1, wherein the substrate is a copper plate. An apparatus structure using a thin heat sink includes: a first component; a second component, the first component is locked, and a plurality of electronic components are disposed; and the thin heat sink is disposed on the first component and the Between the second components, the thin heat sink contacts one, some or all of the plurality of electronic components, the thin heat sink comprising: a substrate formed of a high thermal conductivity material; and a thermally diffused radiation layer, Directly attached to the surface of the substrate, the thermally diffused radiation layer comprises a mixture of radiant particles and a thermal diffusing glue. The device structure of claim 5, wherein the first component and the second component are respectively an upper cover portion and a lower cover portion of the electronic device. Pieces. The device structure of claim 5, wherein the thin heat sink has a size greater than a size of the one, some or all of the electronic components that are in contact. The device structure of claim 7, wherein the thin heat sink is attached to the surface of the electronic component of the contact by a double-sided tape. The device structure of claim 7, further comprising an auxiliary heat sink disposed on one side of the thin heat sink. The device structure according to claim 5, wherein the radiation particles in the thin heat dissipation device are black objects or carbon-containing objects uniformly distributed in the thermal diffusion radiation layer, and the thermal diffusion adhesive Mix evenly.