CN104754915A - Heat radiation structure applied to mobile device - Google Patents
Heat radiation structure applied to mobile device Download PDFInfo
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- CN104754915A CN104754915A CN201310741419.8A CN201310741419A CN104754915A CN 104754915 A CN104754915 A CN 104754915A CN 201310741419 A CN201310741419 A CN 201310741419A CN 104754915 A CN104754915 A CN 104754915A
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Abstract
The invention relates to a heat radiation structure applied to a mobile device. The heat radiation structure comprises a heat conduction body. The heat conduction body has a heat radiation side and a heat absorption side. The heat radiation side forms a radiant heat radiation layer. By arranging the heat radiation structure in the mobile device, extremely excellent natural radiation thermal convection is achieved in enclosed space in the mobile device, and the heat radiation efficiency of the whole mobile device is greatly improved.
Description
Technical field
The present invention relates to a kind of radiator structure being applied to mobile device, espespecially one in mobile device enclosure space, can improve the radiator structure being applied to mobile device of heat dissipation by radiation natural heat dissipation.
Background technology
Existing mobile device (as slim pen electricity, flat board, wisdom mobile phone etc.) along with arithmetic speed faster, the heat that its internal calculation performance element produces also significantly promotes relatively, and it can prerequisite easy to carry be considered down to have again, this kind of device more does more thinning; In addition described mobile device is for can prevent foreign matter and aqueous vapor from entering inside, this kind of mobile device is except the providing holes of earpiece holes or connector, have very less and form convection current in open aperture and outside air, therefore because of under the innate factor of thinning, the heat that this kind of mobile device inside produces because of calculation execution unit and battery cannot outwardly be discharged fast, and because the inside of mobile device is confined space, be difficult to produce heat loss through convection, and then be easy to situation such as mobile device inside generation accumulated heat or heat build-up etc., have a strong impact on operating efficiency or the heat dissipation problem of mobile device.
Moreover, also wish owing to there being the problems referred to above to arrange passive heat radiation element such as hot plate in this kind of mobile device inside, temperature-uniforming plate, the passive heat dissipation element such as radiator carries out antipyretic, but still cause device inherent space constraints due to the reason of mobile device thinning, also ultra-thin dimensional thickness certainly will be reduced to based on the heat dissipation element arranged, can be arranged in limited inner space, but along with the hot plate of size-constrained reduction, the capillary structure of temperature-uniforming plate inside and steam channel are because be arranged to ultra-thin then because of the limited reduction of above-mentioned requirements, make above-mentioned hot plate, temperature-uniforming plate is had a greatly reduced quality in the heat conducting operating efficiency of entirety, cannot effectively reach heat radiation usefulness, therefore when the internal compute unit power of mobile device is too high, existing hot plate, temperature-uniforming plate all effectively cannot carry out antipyretic or heat radiation because tackling it, therefore how to arrange in narrow confined space and effectively separate thermal element, then the technology primarily improved at present for these those skilled in the art.
Summary of the invention
Therefore, for effectively solving the problem, main purpose of the present invention is to provide a kind of radiator structure being applied to mobile device.
For reaching above-mentioned purpose, the invention provides a kind of radiator structure being applied to mobile device, comprising: a heat-conductive body, have a heat radiation side and a heat absorbing side, described heat radiation side forms a heat loss through radiation layer.
Described heat-conductive body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body and is fitted contrary side, and described heat radiation side-line is located at the contrary side that this aluminium material plate body is fitted with aforementioned copper material plate body.
The composite material that described heat-conductive body is made up of copper and aluminium.
Described heat-conductive body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Described heat-conductive body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Described heat loss through radiation layer is a kind of loose structure or how rice structure is wherein arbitrary.
Described heat loss through radiation layer is by differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (AnodicSpark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by SparkDeposition, ANOF) wherein arbitrary heat radiation side in this heat-conductive body forms cellular structure.
Described heat loss through radiation layer is by hitting the concaveconvex structure produced by pearl.
Described heat loss through radiation layer is that a porous ceramic structure or porousness graphite-structure are wherein arbitrary.
Described heat loss through radiation layer be in black or sub-black or the color of dark system wherein arbitrary.
Described copper material plate body and aluminium material plate body are engaged by gummed or to engage wherein either type without Medium Diffusion bonded to each other.
Described heat loss through radiation layer is that a kind of high radiation ceramic structure or high-hardness ceramic structure are wherein arbitrary.
The present invention, mainly through arranging heat loss through radiation layer in the heat radiation side of heat-conductive body, so as to providing heat-conductive body to be formed with natural radiation heat loss through convection in the accommodation space that this mobile device is closed, significantly increases the heat dissipation of mobile device entirety whereby.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view being applied to the first embodiment of the radiator structure of mobile device of the present invention;
Fig. 2 is the assembled sectional view being applied to the first embodiment of the radiator structure of mobile device of the present invention;
Fig. 3 is the assembled sectional view being applied to the second embodiment of the radiator structure of mobile device of the present invention;
Fig. 4 is the assembled sectional view being applied to the 3rd embodiment of the radiator structure of mobile device of the present invention;
Fig. 5 is the assembled sectional view being applied to the 4th embodiment of the radiator structure of mobile device of the present invention.
Symbol description
Be applied to the radiator structure 1 of mobile device
Heat-conductive body 11
Heat radiation side 111
Heat absorbing side 112
Heat loss through radiation layer 113
Copper material plate body 11a
Aluminium material plate body 11b
Copper coating 11c
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Characteristic on above-mentioned purpose of the present invention and structure and fuction thereof, is explained the preferred embodiment according to institute's accompanying drawings.
Refer to Fig. 1,2, be the stereo decomposing and the assembled sectional view that are applied to the first embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the radiator structure 1 being applied to mobile device of the present invention, comprising: a heat-conductive body 11;
Wherein said heat-conductive body 11 can be one and has the metal material of high heat conduction efficiency or alloy and constituent thereof or composite wood, it has heat radiation side 111 and a heat absorbing side 112, and described heat radiation side 111 can be formed directly in or coating is provided with a heat loss through radiation layer 113, described heat-conductive body 11 in the present embodiment is selected to be superimposed with each other by a copper material plate body 11a and aluminium material plate body 11b two plate body to form, and described heat absorbing side 112 is located at the side of this copper material plate body 11a, be the contrary side that this copper material plate body 11a is bonded to each other with this aluminium material plate body 11b, described heat radiation side 111 is located at the side of this aluminium material plate body 11b, be the contrary side that this aluminium material plate body 11b is bonded to each other with aforementioned copper material plate body 11a, described copper material plate body and aluminium material plate body are engaged by gummed or engaged wherein either type without Medium Diffusion mutually to combine.
Described heat loss through radiation layer 113 be a kind of loose structure or how rice structure or high radiation ceramic structure or high-hardness ceramic structure or porous ceramic structure or porousness graphite-structure wherein arbitrary, and by evaporation or sputter or plating or printing coating or baking vanish or how wherein arbitrary heat radiation side 111 being formed at this heat-conductive body 11 such as rice spray painting or surface anodization, what take in this preferred embodiment is that how rice structure is to make irradiation structure layer with described, it is by differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation bySpark Deposition, ANOF) wherein arbitrary heat radiation side 111 in this heat-conductive body 11 forms ceramic (having Surface hardened layer and enhanced rad effect), and for making the radiation benefit that this heat loss through radiation layer 113 can be obtained goodization, heat loss through radiation layer being set to black or sub-black or dark color is that color is wherein arbitrary, then more there is the effect significantly promoting heat loss through radiation, the present embodiment is limited using black as illustrating but not regarding it as, the lifting of the usefulness of natural radiation heat radiation is more contributed to by the characteristic of quick heat loss through conduction of pottery and graphite.
Refer to Fig. 3, for the assembled sectional view being applied to the second embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, the only composite material do not existed together for described heat-conductive body 11 is made up of copper and aluminium of the present embodiment and aforementioned first embodiment, and by selecting the composite material of this copper and aluminium to promote the structural strength of this heat-conductive body 11 and the usefulness of heat conduction.
Refer to Fig. 4, for the assembled sectional view being applied to the 3rd embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned first embodiment do not exist together for described heat-conductive body 11 is an aluminium material plate body 11b, and drape over one's shoulders an attached copper coating 11c in this heat absorbing side 112, make this heat-conductive body 11 using aluminium material plate body 11b as underlying structure body, there is preferably structural strength and also can reduce the advantages such as production cost, and the heat absorption heat conduction efficiency of heat-conductive body 11 can be promoted in the copper coating 11c that this heat absorbing side 112 drapes over one's shoulders an attached copper material.
Refer to Fig. 5, for the assembled sectional view being applied to the 4th embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned first embodiment do not exist together for described heat loss through radiation layer 113 is for hitting produced concaveconvex structure by pearl, so as to the contact area of heat radiation, and in its surface with coating or drape over one's shoulders attached mode and adhere to black pigment in this heat loss through radiation layer 113 surface.
The radiator structure being applied to mobile device of the present invention is mainly accumulated heat or the heat build-up problem that wish solves mobile device, improves the disappearance that existing mobile device internal closed space cannot be really effectively antipyretic.
The present invention passes through partly to be sticked or locally draping over one's shoulders attached copper metal is located at heat absorbing side, and so as to promoting the heat absorption efficiency of heat-conductive body, the heat loss through radiation layer arranging black in heat radiation side increases its heat radiation contact area lifting heat-radiation heat-dissipating efficiency.
The present invention is the application of thermal radiation conduction as heat radiation of application heat, and heat transfer and convection action, material all must be leaned on as medium, could heat energy be propagated.Thermal radiation does not then need medium, directly can propagate heat energy, therefore in confined space, be able to housing heat being passed to mobile device in the short space only deposited, then does heat exchange by housing and the external world.
Thermal radiation is exactly that material is propagated in the form of an electromagnetic wave, but electromagnetic wave is with light velocity propagation, needs Medium Propagation, and object can continue to produce thermal radiation, also absorbs the extraneous thermal radiation given simultaneously.Object sends the ability of heat, relevant with its surface temperature, color and degree of roughness, therefore the heat loss through radiation layer set by the present invention is then arrange with related application principle the heat loss through radiation layer that can promote the natural heat dissipation of surface radiating area and radiating efficiency, the caloradiance of body surface, except relevant with temperature, also relevant with the characteristic on its surface, the object of such as black surface easily absorbs, also easily send thermal radiation, therefore heat loss through radiation layer of the present invention is set to black or make its surface more can promote its radiation efficiency further for black.
Although the present invention discloses as above with execution mode; so itself and be not used to limit the present invention, any person skilled in the art person, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention is when being decided to be standard with claims.
Claims (12)
1. be applied to a radiator structure for mobile device, comprise:
One heat-conductive body, has a heat radiation side and a heat absorbing side, and described heat radiation side forms a heat loss through radiation layer.
2. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat-conductive body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body and is fitted contrary side, and described heat radiation side is located at the contrary side that this aluminium material plate body is fitted with aforementioned copper material plate body.
3. be applied to the radiator structure of mobile device as claimed in claim 1, the composite material that wherein said heat-conductive body is made up of copper and aluminium.
4. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat-conductive body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
5. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat-conductive body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
6. be applied to the radiator structure of mobile device as claimed in claim 1, be applied to the radiator structure of mobile device, wherein said heat loss through radiation layer is a kind of loose structure or how rice structure is wherein arbitrary.
7. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat loss through radiation layer is by differential arc oxidation or electricity slurry electrolytic oxidation, anodic spark deposition, and spark deposition anodic oxidation wherein arbitrary heat radiation side in this heat-conductive body forms cellular structure.
8. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat loss through radiation layer is for hitting produced concaveconvex structure by pearl.
9. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat loss through radiation layer is that a porous ceramic structure or porousness graphite-structure are wherein arbitrary.
10. as claim 1 or 9 radiator structure being applied to mobile device according to any one of it, wherein said heat loss through radiation layer be in black or the color of sub-black or dark system wherein arbitrary.
11. radiator structures being applied to mobile device as claimed in claim 2, wherein said copper material plate body and aluminium material plate body are engaged by gummed or to engage wherein either type without Medium Diffusion bonded to each other.
12. radiator structures being applied to mobile device as claimed in claim 1, wherein said heat loss through radiation layer is that a kind of high radiation ceramic structure or high-hardness ceramic structure are wherein arbitrary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310741419.8A CN104754915A (en) | 2013-12-27 | 2013-12-27 | Heat radiation structure applied to mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310741419.8A CN104754915A (en) | 2013-12-27 | 2013-12-27 | Heat radiation structure applied to mobile device |
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| Publication Number | Publication Date |
|---|---|
| CN104754915A true CN104754915A (en) | 2015-07-01 |
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| CN201310741419.8A Pending CN104754915A (en) | 2013-12-27 | 2013-12-27 | Heat radiation structure applied to mobile device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764310A (en) * | 2016-04-29 | 2016-07-13 | 许继集团有限公司 | Relay protection device and functional plug-in thereof |
| CN107306489A (en) * | 2016-04-20 | 2017-10-31 | 美思菲林股份有限公司 | The manufacture method of fin and fin |
| CN112802811A (en) * | 2021-03-31 | 2021-05-14 | 度亘激光技术（苏州）有限公司 | Semiconductor device heat dissipation structure and preparation method thereof |
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| TWM386528U (en) * | 2008-07-11 | 2010-08-11 | Hon-Wen Chen | Light emitting diode lamp with high heat-dissipation capacity |
| CN201854544U (en) * | 2011-01-12 | 2011-06-01 | 东南大学 | Condensing radiation heat dissipation plate |
| TW201139928A (en) * | 2010-05-05 | 2011-11-16 | Foxsemicon Integrated Tech Inc | Heat sink and illumination apparatus using same |
| TWM452595U (en) * | 2012-09-12 | 2013-05-01 | Cheng-En Cai | Thin-type heat dissipator and device structure using the same |
| CN203633052U (en) * | 2013-12-27 | 2014-06-04 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device |
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2013
- 2013-12-27 CN CN201310741419.8A patent/CN104754915A/en active Pending
Patent Citations (6)
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|---|---|---|---|---|
| JP2002022378A (en) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | Heat pipe |
| TWM386528U (en) * | 2008-07-11 | 2010-08-11 | Hon-Wen Chen | Light emitting diode lamp with high heat-dissipation capacity |
| TW201139928A (en) * | 2010-05-05 | 2011-11-16 | Foxsemicon Integrated Tech Inc | Heat sink and illumination apparatus using same |
| CN201854544U (en) * | 2011-01-12 | 2011-06-01 | 东南大学 | Condensing radiation heat dissipation plate |
| TWM452595U (en) * | 2012-09-12 | 2013-05-01 | Cheng-En Cai | Thin-type heat dissipator and device structure using the same |
| CN203633052U (en) * | 2013-12-27 | 2014-06-04 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107306489A (en) * | 2016-04-20 | 2017-10-31 | 美思菲林股份有限公司 | The manufacture method of fin and fin |
| CN105764310A (en) * | 2016-04-29 | 2016-07-13 | 许继集团有限公司 | Relay protection device and functional plug-in thereof |
| CN112802811A (en) * | 2021-03-31 | 2021-05-14 | 度亘激光技术（苏州）有限公司 | Semiconductor device heat dissipation structure and preparation method thereof |
| CN112802811B (en) * | 2021-03-31 | 2021-06-25 | 度亘激光技术（苏州）有限公司 | Semiconductor device heat dissipation structure and preparation method thereof |
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Application publication date: 20150701 |