TWM474954U - Heat dissipation structure for mobile device - Google Patents

Description

Heat dissipation structure applied to mobile devices

A heat dissipation structure applied to a mobile device, in particular, a heat dissipation structure applied to a mobile device capable of improving heat dissipation performance by radiating natural heat dissipation in a closed space of the mobile device.

According to the current mobile devices (such as thin notebooks, tablets, smart phones, etc.), the faster the calculation rate, the heat generated by the internal computing execution unit is relatively increased, and it is also considered to be portable. The devices are made thinner and thinner; in addition, the mobile device prevents foreign matter and moisture from entering the interior, and the mobile device has few open apertures except for the hole of the earphone hole or the connector. The outside air forms convection. Therefore, due to the congenital factors of thinning, the heat generated by the calculation execution unit and the battery cannot be quickly discharged to the outside, and the convection is difficult to generate due to the closed space inside the mobile device. The heat dissipation is easy to cause heat accumulation or heat accumulation inside the mobile device, which seriously affects the working efficiency or heat of the mobile device.
Furthermore, due to the above problems, passive heat dissipating components such as a hot plate, a temperature equalizing plate, and a heat sink are disposed inside the mobile device for deheating, but the internal space of the device is still caused by the thinning of the mobile device. Restricted, the heat dissipating component set here is bound to be reduced to an ultra-thin size and thickness, and can be set in a limited internal space, but with the limited size reduction of the hot plate, the capillary structure inside the uniformity plate and the steam passage Because it is set to be ultra-thin, the above requirements are limited and reduced, so that the heat plates and the uniform temperature plates are greatly reduced in the overall heat transfer efficiency, and the heat dissipation performance cannot be effectively improved; therefore, when the internal calculation unit of the mobile device is powered At high altitudes, the conventional hot plate and the uniform temperature plate are not effective in relieving heat or heat dissipation. Therefore, how to set up an effective antipyretic component in a narrow confined space is the first technology to be improved by the industry. .

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation structure applied to a mobile device.
In order to achieve the above object, the present invention provides a heat dissipation structure applied to a mobile device, comprising: a heat conducting body;
The heat conducting body has a heat dissipating side and a heat absorbing side, and the heat dissipating side forms a radiating heat dissipating layer.
The present invention mainly provides a radiating heat dissipation layer on the heat dissipating side of the heat conducting body, thereby providing a heat radiating body to form a natural radiation convection heat dissipation in the enclosed space of the mobile device, thereby greatly increasing the overall heat dissipation performance of the mobile device.

1‧‧‧Solution structure for mobile devices
11‧‧‧thermal body
111‧‧‧heat side
112‧‧‧heat side
113‧‧‧radiation heat sink
11a‧‧‧Bronze plate
11b‧‧‧Aluminum plate
11c‧‧‧copper plating

1 is an exploded perspective view of a first embodiment of a heat dissipation structure applied to a mobile device according to the present invention;
2 is a combined cross-sectional view of a first embodiment of a heat dissipation structure applied to a mobile device according to the present invention;
3 is a combined cross-sectional view of a second embodiment of a heat dissipation structure applied to a mobile device according to the present invention;
Figure 4 is a combined cross-sectional view of a third embodiment of the heat dissipation structure applied to the mobile device of the present invention;
Figure 5 is a combined cross-sectional view of a fourth embodiment of the heat dissipation structure applied to the mobile device of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
Please refer to FIGS. 1 and 2, which are perspective exploded and combined cross-sectional views of the first embodiment of the heat dissipation structure applied to the mobile device. As shown in the figure, the heat dissipation structure 1 of the present application applied to the mobile device is Including: a heat conducting body 11;
The heat-conducting body 11 can be a metal material or alloy having high heat conduction efficiency and a composition or composite thereof; the heat-dissipating side 111 has a heat-dissipating side 111 and a heat-absorbing side 112, and the heat-dissipating side 111 can be directly formed or affixed with a The heat-dissipating heat-dissipating layer 113 is formed by stacking two plates of a copper material plate 11a and an aluminum material plate 11b, and the heat-absorbing side 112 is disposed on the copper material. One side of the plate body 11a is the opposite side of the copper material plate body 11a and the aluminum material plate body 11b, and the heat dissipation side 111 is disposed on one side of the aluminum material plate body 11b, that is, On the opposite side of the aluminum material plate body 11b and the copper material plate body 11a, the copper material plate body and the aluminum material plate system are combined with each other by either gluing or dielectric diffusion bonding.
The radiation heat dissipation layer 113 is a porous structure or a nanostructure or a high-radiation ceramic structure or a high-hardness ceramic structure or a porous ceramic structure or a porous graphite structure, and is vapor-deposited or sputtered or plated or Any one of the heat-dissipating side 111 of the heat-conducting body 11 is formed by printing coating or baking paint or nano-coating or surface anodizing. In the preferred embodiment, the nanostructure is used for radiation. The structural layer is subjected to Micro Arc Oxidation (MAO) or Plasma Electrolytic Oxidation (PEO), Anodic Spark Deposition (ASD), and Anodic Oxidation by Spark Deposition. , ANOF) any of the heat-dissipating side 111 of the heat-conducting body 11 is ceramized (having surface hardening and radiation enhancement effect), and in order to obtain better radiation benefits for the radiation heat dissipation layer 113, the radiation heat dissipation layer Set to black or sub-black or dark color, it will greatly enhance the effect of radiation heat dissipation. This embodiment uses black as an illustration but does not Limited, fast heat conduction through the characteristics of ceramics and graphite but also help enhance the effectiveness of natural radiation of heat.
Referring to FIG. 3, it is a combined sectional view of a second embodiment of the heat dissipation structure applied to the mobile device. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, so Further, the difference between the embodiment and the first embodiment is that the heat conducting body 11 is a composite material composed of copper and aluminum, and the heat conducting body 11 is raised by using the composite material of copper and aluminum. Structural strength and thermal conductivity.
Referring to FIG. 4, it is a sectional view of a third embodiment of the heat dissipation structure applied to the mobile device of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, and therefore will not be herein. Further, the difference between the embodiment and the first embodiment is that the heat conducting body 11 is an aluminum plate body 11b, and a copper plating layer 11c is attached to the heat absorbing side 112 to make the heat conducting body 11 The aluminum plate body 11b is used as the base structure body, which has the advantages of better structural strength and lowering the production cost, and the copper plating layer 11c of the copper material is attached to the heat absorbing side 112 to improve the heat absorbing heat transfer efficiency of the heat conductive body 11.
Referring to FIG. 5, it is a sectional view of a fourth embodiment of the heat dissipation structure applied to the mobile device of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, and therefore will not be herein. Further, the difference between the embodiment and the first embodiment is that the radiation heat dissipation layer 113 is a concave-convex structure generated by a bead strike, thereby improving the contact area of the heat dissipation and coating or coating the surface thereof. A black pigment is attached to the surface of the radiation heat dissipation layer 113 in a draped manner.
The heat dissipation structure applied to the mobile device of the present invention mainly aims to solve the problem of heat accumulation or heat accumulation of the mobile device, and improves the lack of effective heat dissipation inside the closed space of the conventional mobile device.
The creation system is designed to enhance the heat absorption efficiency of the heat-conducting body by partially or partially attaching copper metal to the heat absorption side, and the black radiation heat dissipation layer is disposed on the heat dissipation side to increase the heat radiation contact area and improve the heat radiation heat dissipation efficiency.
This creation uses thermal heat radiation conduction as a heat sink application, and heat conduction and convection must rely on matter as a medium to propagate heat. Thermal radiation does not require a medium, that is, it can directly transmit thermal energy, so that heat can be transferred to the housing of the mobile device in the only small space in the confined space, and then exchange heat with the outside through the housing.
Thermal radiation means that matter propagates in the form of electromagnetic waves, but electromagnetic waves propagate at the speed of light, which requires the propagation of the medium. The object will continue to generate heat radiation and also absorb the heat radiation given by the outside. The ability of an object to emit heat is related to its surface temperature, color and roughness. Therefore, the radiation heat dissipation layer set by this creation is based on the relevant application principle to provide a radiation heat dissipation layer that can enhance the surface heat dissipation area and heat dissipation efficiency. The thermal radiation intensity of the surface, in addition to temperature, is also related to the characteristics of its surface. For example, objects on a black surface are easily absorbed, and heat radiation is easily emitted. Therefore, the radiation layer of the present invention is set to black or the surface thereof is black. It can further improve its heat radiation efficiency.

1‧‧‧Solution structure for mobile devices

11‧‧‧thermal body

111‧‧‧heat side

112‧‧‧heat side

113‧‧‧radiation heat sink

11a‧‧‧Bronze plate

11b‧‧‧Aluminum plate

Claims (12)

A heat dissipation structure applied to a mobile device, comprising:
A heat conducting body has a heat dissipating side and a heat absorbing side, and the heat dissipating side forms a radiating heat dissipating layer. The heat dissipation structure applied to the mobile device according to claim 1, wherein the heat conduction system is composed of a copper material plate body and an aluminum material plate body, and the heat absorption side is disposed on the copper material plate body. On the opposite side of the aluminum material plate body, the heat dissipation side is disposed on the opposite side of the aluminum material plate body and the copper material plate body. The heat dissipation structure applied to the mobile device according to claim 1, wherein the heat conduction system is a composite material composed of copper and aluminum. The heat dissipation structure applied to the mobile device according to claim 1, wherein the heat conduction system is an aluminum plate body, and a copper plating layer is attached to the heat absorption side. The heat dissipation structure applied to the mobile device according to claim 1, wherein the heat conduction system is a ceramic plate body, and a copper plating layer is attached to the heat absorption side. The heat dissipation structure applied to the mobile device according to claim 1, wherein the radiation heat dissipation layer is any one of a porous structure or a nanostructure. The heat dissipation structure applied to the mobile device according to claim 1, wherein the radiation heat dissipation layer is subjected to Micro Arc Oxidation (MAO) or Plasma Electrolytic Oxidation (PEO), and anode spark deposition ( Anodic Spark Deposition (ASD), any of the Anodic Oxidation by Spark Deposition (ANOF) forms a porous structure on the heat dissipating side of the thermally conductive body. The heat dissipation structure applied to the mobile device according to claim 1, wherein the radiation heat dissipation layer is a concave-convex structure generated by the bead impact. The heat dissipation structure applied to the mobile device according to claim 1, wherein the radiation heat dissipation layer is any one of a porous ceramic structure or a porous graphite structure. The heat dissipation structure applied to the mobile device according to any one of claims 1 to 9, wherein the radiation heat dissipation layer is in the form of black or sub-black or dark color. The heat dissipation structure applied to the mobile device according to claim 2, wherein the copper material plate and the aluminum material plate system are adhered to each other by either glue bonding or medium diffusion bonding. The heat dissipation structure applied to the mobile device according to claim 1, wherein the radiation heat dissipation layer is any one of a high-radiation ceramic structure or a high-hardness ceramic structure.