CN203645975U - Heat radiating structure applied to mobile device - Google Patents
Heat radiating structure applied to mobile device Download PDFInfo
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- CN203645975U CN203645975U CN201320879261.6U CN201320879261U CN203645975U CN 203645975 U CN203645975 U CN 203645975U CN 201320879261 U CN201320879261 U CN 201320879261U CN 203645975 U CN203645975 U CN 203645975U
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- mobile device
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Abstract
The utility model relates to a heat radiating structure applied to a mobile device. The heat radiating structure applied to the mobile device comprises a heat conducting body. The heat conducting body has a heat radiating side and a heat absorbing side. A radiation heat radiating layer is formed on the heat radiating side. Due to the fact that the heat radiating structure is arranged in the mobile device, excellent natural radiation and convection heat radiating can be produced on a confined space in the mobile device, and the overall heat radiating efficiency of the mobile device is greatly improved.
Description
Technical field
The present invention relates to a kind of radiator structure that is applied to mobile device, relating in particular to one can, in mobile device enclosure space, improve the radiator structure that is applied to mobile device of heat dissipation by radiation natural heat dissipation.
Background technology
Existing mobile device (as slim pen electricity, flat board, wisdom mobile phone etc.) is along with arithmetic speed is faster, the heat that its internal calculation performance element produces also relatively significantly promotes, and it can prerequisite easy to carry be considered down in order to have again, and these devices are more to do more thinning, in addition described mobile device is for can prevent that foreign matter and aqueous vapor from entering inside, these mobile devices arrange hole except earpiece holes or connector, there is very less the aperture and the outside air that are open and form convection current, therefore under the innate factor because of thinning, this class mobile device inside cannot be discharged to the external world fast because of the heat that calculation execution unit and battery produce, and because the inside of mobile device is confined space, be difficult to produce heat loss through convection, and then be easy to the inner situations such as accumulated heat or heat build-up that produce of mobile device, have a strong impact on the operating efficiency of mobile device or produce the problems such as heat.
Moreover, owing to there being the problems referred to above, also exist this class mobile device inside that passive heat radiation element is set: such as hot plate, temperature-uniforming plate, the passive heat dissipation element such as radiator carries out antipyretic, but still because mobile device is required to design the reason of thinning, the space that causes this device inside is restricted and is narrow, therefore the set heat dissipation element being placed in this space certainly will be reduced to ultra-thin dimensional thickness, can be arranged in narrow limited inner space, but along with the hot plate of size-constrained reduction, temperature-uniforming plate, its inner capillary structure and steam channel are more because be arranged to also identical limited reduction of ultra-thin requirement, cause and make these hot plates, temperature-uniforming plate is had a greatly reduced quality in the heat conducting operating efficiency of entirety, cannot effectively reach heat radiation usefulness, therefore in the time that the internal compute unit power of mobile device is too high, existing hot plate, temperature-uniforming plate all cannot effectively carry out antipyretic or heat radiation because tackling it, therefore how effective solution thermal element is set in narrow confined space, for those skilled in the art primarily need at present improvement technology.
Summary of the invention
Therefore,, for effectively addressing the above problem, main purpose of the present invention is to provide a kind of radiator structure that is applied to mobile device.
Secondary objective of the present invention, is to provide a kind of manufacture method of the radiator structure that is applied to mobile device.
For reaching above-mentioned purpose, the invention provides a kind of radiator structure that is applied to mobile device, comprising: a heat conduction body; A radiator structure that is applied to mobile device, comprising: a heat conduction body, there is a heat radiation side and a heat absorbing side, and described heat radiation side forms a heat loss through radiation layer.
Preferably, described heat conduction body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body contrary side of fitting, and described heat radiation side is located at a contrary side of this aluminium material plate body and aforementioned copper material plate body laminating.
Preferably, the composite material that described heat conduction body is made up of copper and aluminium.
Preferably, described heat conduction body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Preferably, described heat conduction body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Preferably, described heat loss through radiation layer is a kind of loose structure or how rice structure is wherein arbitrary.
Preferably, described heat loss through radiation layer is by differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF) wherein arbitrary heat radiation side in this heat conduction body forms a cellular structure.
Preferably, described heat loss through radiation layer is for hitting produced concaveconvex structure by pearl.
Preferably, described heat loss through radiation layer is that a porous ceramic structure or a porousness graphite-structure are wherein arbitrary.
Preferably, it is wherein arbitrary that described heat loss through radiation layer is black or sub-black or the dark color that is.
Preferably, described copper material plate body and aluminium material plate body engage by gummed or engage without Medium Diffusion that wherein either type is bonded to each other.
The present invention, mainly by the heat radiation side of heat conduction body, heat loss through radiation layer being set, so as to providing heat conduction body to be formed with natural radiation heat loss through convection in the accommodation space of this mobile device sealing, significantly increases the heat dissipation of mobile device entirety whereby.
Brief description of the drawings
Fig. 1 is the three-dimensional exploded view of the first embodiment of the radiator structure that is applied to mobile device of the present invention;
Fig. 2 is the assembled sectional view of the first embodiment of the radiator structure that is applied to mobile device of the present invention;
Fig. 3 is the assembled sectional view of the second embodiment of the radiator structure that is applied to mobile device of the present invention;
Fig. 4 is the assembled sectional view of the 3rd embodiment of the radiator structure that is applied to mobile device of the present invention;
Fig. 5 is the assembled sectional view of the 4th embodiment of the radiator structure that is applied to mobile device of the present invention;
Fig. 6 is the flow chart of steps of manufacture method first embodiment of the radiator structure that is applied to mobile device of the present invention.
Symbol description
Be applied to the radiator structure 1 of mobile device
Heat absorbing side 112
Heat loss through radiation layer 113
Copper material plate body 11a
Aluminium material plate body 11b
Copper coating 11c
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Characteristic in above-mentioned purpose of the present invention and structure thereof and function, will be explained according to appended graphic preferred embodiment.
Referring to Fig. 1,2, is stereo decomposing and the assembled sectional view of the first embodiment of the radiator structure that is applied to mobile device of the present invention, and as shown in the figure, the radiator structure 1 that is applied to mobile device of the present invention, comprising: a heat conduction body 11;
Wherein said heat conduction body 11 can be metal material or alloy and constituent or a composite wood with high heat conduction efficiency, it has a heat radiation side 111 and a heat absorbing side 112, and described heat radiation side 111 can be formed directly in or coating is provided with a heat loss through radiation layer 113, described heat conduction body 11 in the present embodiment is selected to be superimposed with each other and to be formed by a copper material plate body 11a and aluminium material plate body 11b two plate bodys, and described heat absorbing side 112 is located at a side of this copper material plate body 11a, be this copper material plate body 11a contrary side bonded to each other with this aluminium material plate body 11b, described heat radiation side 111 is located at a side of this aluminium material plate body 11b, be this aluminium material plate body 11b contrary side bonded to each other with aforementioned copper material plate body 11a, described copper material plate body and aluminium material plate body engage by gummed or engage wherein either type without Medium Diffusion and mutually combine.
Described heat loss through radiation layer 113 be a kind of loose structure or how rice structure or high radiation ceramic structure or high-hardness ceramic structure or porous ceramic structure or porousness graphite-structure wherein arbitrary, and by evaporation or sputter or plating or printing coating or baking vanish or wherein arbitrary heat radiation side 111 that is formed at this heat conduction body 11 such as rice spray painting or surperficial anodic oxidation how, what in this preferred embodiment, take is to make irradiation structure layer with a described how rice structure, it is by differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF) wherein either type forms ceramic (having surface sclerosis and enhanced rad effect) in the heat radiation side 111 of this heat conduction body 11, and for making this heat loss through radiation layer 113 obtain the radiation benefit of goodization, it is that color is wherein arbitrary that heat loss through radiation layer is made as to black or sub-black or dark color, more there is the effect that significantly promotes heat loss through radiation, the present embodiment is using black as illustrating but not regarding it as and be limited, the characteristic of the quick heat loss through conduction by pottery and graphite more contributes to the lifting of the usefulness of natural radiation heat radiation.
Refer to Fig. 3, for the assembled sectional view of the second embodiment of the radiator structure that is applied to mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned the first embodiment, therefore will repeat no more at this, the just composite material that does not exist together and formed by copper and aluminium for described heat conduction body 11 of the present embodiment and aforementioned the first embodiment, and by selecting the composite material of this copper and aluminium to promote the structural strength of this heat conduction body 11 and the usefulness of heat conduction.
Refer to Fig. 4, for the assembled sectional view of the 3rd embodiment of the radiator structure that is applied to mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned the first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together for described heat conduction body 11 be wherein arbitrary plate body 11b of an aluminium material or ceramic material, and drape over one's shoulders an attached copper coating 11c in this heat absorbing side 112, make this heat conduction body 11 using aluminium material plate body 11b as underlying structure body, the advantage such as there is preferably structural strength and can reduce production costs, and can promote the heat absorption heat conduction efficiency of heat conduction body 11 in the copper coating 11c that this heat absorbing side 112 is draped over one's shoulders an attached copper material.
Refer to Fig. 5, for the assembled sectional view of the 4th embodiment of the radiator structure that is applied to mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned the first embodiment, therefore will repeat no more at this, only not existing together for described heat loss through radiation layer 113 is for hit produced concaveconvex structure by pearl of the present embodiment and aforementioned the first embodiment, so as to the contact area of heat radiation, and in its surface with coating or drape over one's shoulders attached mode and adhere to black pigment in these heat loss through radiation layer 113 surfaces.
Mainly accumulated heat or the heat build-up problem of wish solution mobile device of radiator structure that is applied to mobile device of the present invention, improving existing mobile device enclose inside space cannot really effective antipyretic disappearance.
The present invention is by being sticked with part or part is draped over one's shoulders attached copper metal and is located at heat absorbing side, and so as to promoting the heat absorption efficiency of heat conduction body, the heat loss through radiation layer that black is set in heat radiation side increases its heat radiation contact area and promotes heat-radiation heat-dissipating efficiency.
Refer to Fig. 6, for the flow chart of steps of manufacture method first embodiment of the radiator structure that is applied to mobile device of the present invention, and consult in the lump earlier figures 1～5, as shown in the figure, the manufacture method of the radiator structure that is applied to mobile device of the present invention comprises the following steps:
S1: a heat conduction body is provided, and defines a heat radiation side and a heat absorbing side;
One heat conduction body 11 is provided, and the both sides of this heat conduction body 11 are defined as respectively to a heat radiation side 111 and a heat absorbing side 112.
Selecting of described heat conduction body 11 of the present invention, the present invention discloses the aspect of following several kenels:
Described in one, heat conduction body 11 can be for being draped over one's shoulders the body (as shown in Figure 4) of an attached copper coating 11c in this heat absorbing side by the plate body 11b of an aluminium material or ceramic material.
Its described in three heat conduction body 11 can be the composite material (as shown in Figure 3) being formed by copper and aluminium.
And the structure aspect of the heat conduction body 11 carried of the present embodiment and illustrate that its diagram also can consult aforementioned applications in the lump in the first～tetra-embodiment of the radiator structure of mobile device and graphic.
S2: form a heat loss through radiation layer in the heat radiation side of described heat conduction body.
Form a heat loss through radiation layer 113 in the heat radiation side 111 of aforementioned heat conduction body 11, described heat loss through radiation layer 113 be a kind of loose structure or how rice structure or a porous ceramic structure or a porousness graphite-structure wherein arbitrary, and this heat loss through radiation layer 113 is arranged to be the color of black or sub-black or dark system wherein arbitrary.
And the heat loss through radiation layer 113 of described cellular structure can pass through differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF) either type wherein, and the present invention forms these heat loss through radiation layers 113 in differential arc oxidation mode in the heat radiation side 111 of this heat conduction body 11.
Separately, described heat loss through radiation layer also can be a kind of surface relief structure producing by shot peening (as shown in Figure 5)
The present invention mainly applies the application of hot thermal radiation conduction as heat radiation, and hot conduction and convection effect all must, by material as medium, could be propagated heat energy.Thermal radiation does not need medium, can directly propagate heat energy, thus in confined space, be able in the short space of only depositing, heat is passed to the housing of mobile device, then do heat exchange by housing and the external world.
Thermal radiation is exactly that material is propagated with electromagnetic form, but electromagnetic wave is with light velocity propagation, needs medium to propagate, and object can continue to produce thermal radiation, also absorbs the extraneous thermal radiation giving simultaneously.Object sends hot ability, relevant with its surface temperature, color and degree of roughness, therefore the set heat loss through radiation layer of the present invention arranges a heat loss through radiation layer that can promote the natural heat dissipation of surface radiating area and radiating efficiency with related application principle, the caloradiance of body surface, except relevant with temperature, also the characteristic surperficial with it is relevant, the object of for example black surface easily absorbs, also easily send thermal radiation, therefore heat loss through radiation layer of the present invention is set to black or make its surface more can further promote its radiation efficiency for black.
Although the present invention discloses as above with execution mode; so it is not in order to limit the present invention, any person skilled in the art person, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention is worked as with standard that claims are decided to be.
Claims (11)
1. a radiator structure that is applied to mobile device, is characterized in that, comprising:
One heat conduction body, has a heat radiation side and a heat absorbing side, and described heat radiation side forms a heat loss through radiation layer.
2. the radiator structure that is applied to mobile device as claimed in claim 1, it is characterized in that, described heat conduction body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body contrary side of fitting, and described heat radiation side is located at a contrary side of this aluminium material plate body and aforementioned copper material plate body laminating.
3. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, the composite material that described heat conduction body is made up of copper and aluminium.
4. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat conduction body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
5. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat conduction body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
6. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat loss through radiation layer is a kind of loose structure or how rice structure is wherein arbitrary.
7. the radiator structure that is applied to mobile device as claimed in claim 1, it is characterized in that, described heat loss through radiation layer is starched electrolytic oxidation, anodic spark deposition by differential arc oxidation or electricity, and spark deposition anodic oxidation wherein arbitrary heat radiation side in this heat conduction body forms a cellular structure.
8. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat loss through radiation layer is for hitting produced concaveconvex structure by pearl.
9. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat loss through radiation layer is that a porous ceramic structure or a porousness graphite-structure are wherein arbitrary.
10. the radiator structure that is applied to mobile device as described in claim 1 or 9, is characterized in that, described heat loss through radiation layer is that to be the color of black or sub-black or dark system wherein arbitrary.
11. radiator structures that are applied to mobile device as claimed in claim 2, is characterized in that, described copper material plate body and aluminium material plate body engage by gummed or engage without Medium Diffusion that wherein either type is bonded to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320879261.6U CN203645975U (en) | 2013-12-27 | 2013-12-27 | Heat radiating structure applied to mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320879261.6U CN203645975U (en) | 2013-12-27 | 2013-12-27 | Heat radiating structure applied to mobile device |
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| Publication Number | Publication Date |
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| CN203645975U true CN203645975U (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320879261.6U Expired - Fee Related CN203645975U (en) | 2013-12-27 | 2013-12-27 | Heat radiating structure applied to mobile device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104750206A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure |
| CN105208827A (en) * | 2014-06-17 | 2015-12-30 | 奇鋐科技股份有限公司 | Heat dissipation structure of handheld device |
-
2013
- 2013-12-27 CN CN201320879261.6U patent/CN203645975U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104750206A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure |
| CN104750206B (en) * | 2013-12-27 | 2019-01-18 | 奇鋐科技股份有限公司 | Radiator structure and its manufacturing method applied to mobile device |
| CN105208827A (en) * | 2014-06-17 | 2015-12-30 | 奇鋐科技股份有限公司 | Heat dissipation structure of handheld device |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20191227 |