CN104750206A - Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure - Google Patents
Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure Download PDFInfo
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- CN104750206A CN104750206A CN201310741941.6A CN201310741941A CN104750206A CN 104750206 A CN104750206 A CN 104750206A CN 201310741941 A CN201310741941 A CN 201310741941A CN 104750206 A CN104750206 A CN 104750206A
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- radiator structure
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Abstract
The invention relates to a heat radiation structure applied to a mobile device and a manufacturing method of the heat radiation structure. The heat radiation structure applied to the mobile device comprises a heat conductor body, the heat conductor body is provided with a heat radiation side and a heat absorption side, and a heat radiation layer is formed on the heat radiation side. By the heat radiation structure arranged in the mobile device, heat in a closed space of the mobile device can be radiated by generating excellent natural radiant convection, and total heat radiation efficiency of the mobile device is greatly improved.
Description
Technical field
The present invention relates to a kind of radiator structure and the manufacture method thereof that are applied to mobile device, particularly relating to one in mobile device enclosure space, can improve the radiator structure being applied to mobile device and its manufacture method of heat dissipation by radiation natural heat dissipation.
Background technology
Existing mobile device (as slim pen electricity, flat board, wisdom mobile phone etc.) along with arithmetic speed faster, the heat that its internal calculation performance element produces also significantly promotes relatively, and it can prerequisite easy to carry be considered down to have again, these devices more do more thinning, in addition described mobile device is for can prevent foreign matter and aqueous vapor from entering inside, these mobile devices are except the providing holes of earpiece holes or connector, have very less and form convection current in open aperture and outside air, therefore because of under the innate factor of thinning, the heat that this kind of mobile device inside produces because of calculation execution unit and battery cannot outwardly be discharged fast, and because the inside of mobile device is confined space, be difficult to produce heat loss through convection, and then be easy to situation such as mobile device inside generation accumulated heat or heat build-up etc., have a strong impact on the work efficiency of mobile device or produce the problems such as heat.
Moreover, owing to there being the problems referred to above, also there is this kind of mobile device inside and passive heat radiation element is set: such as hot plate, temperature-uniforming plate, the passive heat dissipation element such as heating radiator carries out antipyretic, but still be required to design the reason of thinning due to mobile device, the space of this device inside is caused to be restricted and narrow, therefore the heat dissipation element be placed in set by this space certainly will be reduced to ultra-thin dimensional thickness, can be arranged in narrow limited inner space, but along with the hot plate of size-constrained reduction, temperature-uniforming plate, then the capillary structure of its inside and steam channel are more because be arranged to ultra-thin requirement also identical limited reduction, cause and make these hot plates, temperature-uniforming plate is had a greatly reduced quality in the heat conducting work efficiency of entirety, cannot effectively reach heat radiation usefulness, therefore when the internal compute unit power of mobile device is too high, existing hot plate, temperature-uniforming plate all effectively cannot carry out antipyretic or heat radiation because tackling it, therefore how to arrange in narrow confined space and effectively separate thermal element, then for those skilled in the art primarily need the technology that improves at present.
Summary of the invention
Therefore, for effectively solving the problem, fundamental purpose of the present invention is to provide a kind of radiator structure being applied to mobile device.
Secondary objective of the present invention, is to provide a kind of manufacture method being applied to the radiator structure of mobile device.
For reaching above-mentioned purpose, the invention provides a kind of radiator structure being applied to mobile device, comprising: a heat-conductive body; Be applied to a radiator structure for mobile device, comprise: a heat-conductive body, have a heat radiation side and a heat absorbing side, described heat radiation side forms a heat loss through radiation layer.
Described heat-conductive body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body and is fitted contrary side, and described heat radiation side is located at the contrary side that this aluminium material plate body is fitted with aforementioned copper material plate body.
The compound substance that described heat-conductive body is made up of copper and aluminium.
Described heat-conductive body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Described heat-conductive body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Described heat loss through radiation layer is a kind of porous structure or how rice structure is wherein arbitrary.
Described heat loss through radiation layer is by differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (AnodicSpark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by SparkDeposition, ANOF) wherein arbitrary heat radiation side in this heat-conductive body forms a cellular structure.
Described heat loss through radiation layer is by hitting the concaveconvex structure produced by pearl.
Described heat loss through radiation layer is that a porous ceramic structure or a poriness graphite-structure are wherein arbitrary.
Described heat loss through radiation layer is that the color of black or sub-black or dark system is wherein arbitrary.
Described copper material plate body and aluminium material plate body are engaged by gummed or to engage wherein either type without Medium Diffusion bonded to each other.
For achieving the above object, the invention provides a kind of manufacture method being applied to the radiator structure of mobile device, comprising the following steps: to provide a heat-conductive body, and define a heat radiation side and a heat absorbing side; Heat radiation side in described heat-conductive body forms a heat loss through radiation layer.
Described heat-conductive body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body and is fitted contrary side, and described heat radiation side is located at the contrary side that this aluminium material plate body is fitted with aforementioned copper material plate body.
Described heat-conductive body is by copper and compound substance that aluminium formed.
Described heat-conductive body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Described heat-conductive body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
Described heat loss through radiation layer is a kind of porous structure or how rice structure is wherein arbitrary.
Described heat loss through radiation layer is by differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma E1ectrolytic Oxidation MAO), PEO), anodic spark deposition (AnodicSpark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by SparkDeposition, ANOF) wherein arbitrary heat radiation side in this heat-conductive body forms cellular structure.
Described heat loss through radiation layer is by hitting the concaveconvex structure produced by pearl.
Described heat loss through radiation layer is that a porous ceramic structure or a poriness graphite-structure are wherein arbitrary.
Described heat loss through radiation layer is that the color of black or sub-black or dark system is wherein arbitrary.
Described copper material plate body and aluminium material plate body are engaged by gummed or to engage wherein either type without Medium Diffusion bonded to each other.
The present invention, mainly through arranging heat loss through radiation layer in the heat radiation side of heat-conductive body, so as to providing heat-conductive body to be formed with natural radiation heat loss through convection in the accommodation space that this mobile device is closed, significantly increases the heat dissipation of mobile device entirety whereby.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view being applied to the first embodiment of the radiator structure of mobile device of the present invention;
Fig. 2 is the assembled sectional view being applied to the first embodiment of the radiator structure of mobile device of the present invention;
Fig. 3 is the assembled sectional view being applied to the second embodiment of the radiator structure of mobile device of the present invention;
Fig. 4 is the assembled sectional view being applied to the 3rd embodiment of the radiator structure of mobile device of the present invention;
Fig. 5 is the assembled sectional view being applied to the 4th embodiment of the radiator structure of mobile device of the present invention;
Fig. 6 is the flow chart of steps being applied to manufacture method first embodiment of the radiator structure of mobile device of the present invention.
Symbol description
Be applied to the radiator structure 1 of mobile device
Heat-conductive body 11
Heat radiation side 111
Heat absorbing side 112
Heat loss through radiation layer 113
Copper material plate body 11a
Aluminium material plate body 11b
Copper coating 11c
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Characteristic on above-mentioned purpose of the present invention and structure and fuction thereof, is explained the preferred embodiment according to institute's accompanying drawings.
Refer to Fig. 1,2, be the stereo decomposing and the assembled sectional view that are applied to the first embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the radiator structure 1 being applied to mobile device of the present invention, comprising: a heat-conductive body 11;
Wherein said heat-conductive body 11 can be one and has the metal material of high heat conduction efficiency or alloy and constituent thereof or composite wood, it has heat radiation side 111 and a heat absorbing side 112, and described heat radiation side 111 can be formed directly in or coating is provided with a heat loss through radiation layer 113, described heat-conductive body 11 in the present embodiment is selected to be superimposed with each other by a copper material plate body 11a and aluminium material plate body 11b two plate body to form, and described heat absorbing side 112 is located at the side of this copper material plate body 11a, be the contrary side that this copper material plate body 11a is bonded to each other with this aluminium material plate body 11b, described heat radiation side 111 is located at the side of this aluminium material plate body 11b, be the contrary side that this aluminium material plate body 11b is bonded to each other with aforementioned copper material plate body 11a, described copper material plate body and aluminium material plate body are engaged by gummed or are engaged wherein either type without Medium Diffusion and mutually combine.
Described heat loss through radiation layer 113 be a kind of porous structure or how rice structure or high radiation ceramic structure or high-hardness ceramic structure or porous ceramic structure or poriness graphite-structure wherein arbitrary, and by evaporation or sputter or plating or printing coating or baking vanish or how wherein arbitrary heat radiation side 111 being formed at this heat-conductive body 11 such as rice spray painting or surface anodization, what take in this preferred embodiment is that how rice structure is to make irradiation structure layer with described, it is by differential arc oxidation (Micro Arc Oxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation bySpark Deposition, ANOF) wherein either type forms ceramic (having Surface hardened layer and enhanced rad effect) in the heat radiation side 111 of this heat-conductive body 11, and for making the radiation benefit that this heat loss through radiation layer 113 can be obtained goodization, heat loss through radiation layer being set to black or sub-black or dark color is that color is wherein arbitrary, then more there is the effect significantly promoting heat loss through radiation, the present embodiment is limited using black as illustrating but not regarding it as, the lifting of the usefulness of natural radiation heat radiation is more contributed to by the characteristic of quick heat loss through conduction of pottery and graphite.
Refer to Fig. 3, for the assembled sectional view being applied to the second embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, the just compound substance do not existed together for described heat-conductive body 11 is made up of copper and aluminium of the present embodiment and aforementioned first embodiment, and by selecting the compound substance of this copper and aluminium to promote the structural strength of this heat-conductive body 11 and the usefulness of heat conduction.
Refer to Fig. 4, for the assembled sectional view being applied to the 3rd embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned first embodiment do not exist together for described heat-conductive body 11 is the wherein arbitrary plate body 11b of an aluminium material or ceramic material, and drape over one's shoulders an attached copper coating 11c in this heat absorbing side 112, make this heat-conductive body 11 using aluminium material plate body 11b as underlying structure body, there is preferably structural strength and also can reduce the advantages such as production cost, and the heat absorption heat conduction efficiency of heat-conductive body 11 can be promoted in the copper coating 11c that this heat absorbing side 112 drapes over one's shoulders an attached copper material.
Refer to Fig. 5, for the assembled sectional view being applied to the 4th embodiment of the radiator structure of mobile device of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned first embodiment do not exist together for described heat loss through radiation layer 113 is for hitting produced concaveconvex structure by pearl, so as to the contact area of heat radiation, and in its surface with coating or drape over one's shoulders attached mode and adhere to black pigment in this heat loss through radiation layer 113 surface.
The main accumulated heat for solution mobile device of radiator structure or the heat build-up problem being applied to mobile device of the present invention, improves the disappearance that existing mobile device internal closed space cannot be really effectively antipyretic.
The present invention passes through partly to be sticked or locally draping over one's shoulders attached copper metal is located at heat absorbing side, and so as to promoting the heat absorption efficiency of heat-conductive body, the heat loss through radiation layer arranging black in heat radiation side increases its heat radiation contact area lifting heat-radiation heat-dissipating efficiency.
Refer to Fig. 6, for the flow chart of steps being applied to manufacture method first embodiment of the radiator structure of mobile device of the present invention, and consult earlier figures 1 ~ 5 in the lump, as shown in the figure, the manufacture method being applied to the radiator structure of mobile device of the present invention comprises the following steps:
S1 a: heat-conductive body is provided, and define a heat radiation side and a heat absorbing side;
One heat-conductive body 11 is provided, and the both sides of this heat-conductive body 11 is defined as respectively heat radiation side 111 and a heat absorbing side 112.
Selecting of described heat-conductive body 11 of the present invention, the present invention discloses the aspect of following several kenel:
Heat-conductive body 11 described in one can to drape over one's shoulders the body (as shown in Figure 4) of an attached copper coating 11c for the plate body 11b by an aluminium material or ceramic material in this heat absorbing side.
Its heat-conductive body 11 described in two also can by a copper material plate body 11a and an aluminium material plate body 11b be superimposed forms, described heat absorbing side 112 is located at this copper material plate body 11a and this aluminium material plate body 11b and is fitted contrary side, described heat radiation side 111 is located at the contrary side that this aluminium material plate body 11b fits with aforementioned copper material plate body 11a, and described copper material plate body 11a and aluminium material plate body 11b is engaged by gummed or engages wherein either type (as shown in Figure 1, 2) bonded to each other without Medium Diffusion.
Its heat-conductive body 11 described in three can for the compound substance (as shown in Figure 3) be made up of copper and aluminium.
And the structure aspect of heat-conductive body 11 carried of the present embodiment and illustrate that its diagram also can consult aforementioned applications in the lump in the first ~ tetra-embodiment of the radiator structure of mobile device and graphic.
S2: the heat radiation side in described heat-conductive body forms a heat loss through radiation layer.
Heat radiation side 111 in aforementioned heat-conductive body 11 forms a heat loss through radiation layer 113, described heat loss through radiation layer 113 be a kind of porous structure or how rice structure or a porous ceramic structure or a poriness graphite-structure wherein arbitrary, and this heat loss through radiation layer 113 is arranged in black or the color of sub-black or dark system wherein arbitrary.
And the heat loss through radiation layer 113 of described cellular structure is by differential arc oxidation (Micro ArcOxidation, or electricity slurry electrolytic oxidation (Plasma Electrolytic Oxidation MAO), PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF) wherein either type, and the present invention forms this heat loss through radiation layer 113 in differential arc oxidation mode in the heat radiation side 111 of this heat-conductive body 11.
Separately, described heat loss through radiation layer also can be a kind of surface relief structure (as shown in Figure 5) produced by shot peening
The present invention mainly applies the application of heat radiation conduction as heat radiation of heat, and heat transfer and convection action, material all must be leaned on as medium, could heat energy be propagated.Heat radiation does not then need medium, directly can propagate heat energy, therefore in confined space, be able to housing heat being passed to mobile device in the short space only deposited, then does heat interchange by housing and the external world.
Heat radiation is exactly that material is propagated in the form of an electromagnetic wave, but electromagnetic wave is with light velocity propagation, needs Medium Propagation, and object can continue to produce heat radiation, also absorbs the extraneous heat radiation given simultaneously.Object sends the ability of heat, relevant with its surface temperature, color and degree of roughness, therefore the heat loss through radiation layer set by the present invention then arranges with related application principle the heat loss through radiation layer that can promote the natural heat dissipation of surface radiating area and radiating efficiency, the caloradiance of body surface, except relevant with temperature, also relevant with the characteristic on its surface, the object of such as black surface easily absorbs, also easily send heat radiation, therefore heat loss through radiation layer of the present invention is set to black or make its surface more can promote its radiation efficiency further for black.
Although the present invention discloses as above with embodiment; so itself and be not used to limit the present invention, any person skilled in the art person, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention is when being decided to be standard with claims.
Claims (22)
1. be applied to a radiator structure for mobile device, comprise:
One heat-conductive body, has a heat radiation side and a heat absorbing side, and described heat radiation side forms a heat loss through radiation layer.
2. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat-conductive body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body and is fitted contrary side, and described heat radiation side is located at the contrary side that this aluminium material plate body is fitted with aforementioned copper material plate body.
3. be applied to the radiator structure of mobile device as claimed in claim 1, the compound substance that wherein said heat-conductive body is made up of copper and aluminium.
4. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat-conductive body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
5. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat-conductive body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
6. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat loss through radiation layer is a kind of porous structure or how rice structure is wherein arbitrary.
7. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat loss through radiation layer is by differential arc oxidation or electricity slurry electrolytic oxidation, anodic spark deposition, and spark deposition anodic oxidation wherein arbitrary heat radiation side in this heat-conductive body forms a cellular structure.
8. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat loss through radiation layer is for hitting produced concaveconvex structure by pearl.
9. be applied to the radiator structure of mobile device as claimed in claim 1, wherein said heat loss through radiation layer is that a porous ceramic structure or a poriness graphite-structure are wherein arbitrary.
10. the radiator structure being applied to mobile device as described in claim 1 or 9, wherein said heat loss through radiation layer be in black or sub-black or the color of dark system wherein arbitrary.
11. radiator structures being applied to mobile device as claimed in claim 2, wherein said copper material plate body and aluminium material plate body are engaged by gummed or to engage wherein either type without Medium Diffusion bonded to each other.
12. 1 kinds of manufacture methods being applied to the radiator structure of mobile device, comprise the following steps:
One heat-conductive body is provided, and defines a heat radiation side and a heat absorbing side;
Heat radiation side in described heat-conductive body forms a heat loss through radiation layer.
13. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, wherein said heat-conductive body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body and is fitted contrary side, and described heat radiation side is located at the contrary side that this aluminium material plate body is fitted with aforementioned copper material plate body.
14. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, the compound substance that wherein said heat-conductive body is made up of copper and aluminium.
15. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, wherein said heat-conductive body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
16. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, wherein said heat-conductive body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.
17. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, wherein heat loss through radiation layer is a kind of porous structure or how rice structure is wherein arbitrary.
18. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, wherein said heat loss through radiation layer is by differential arc oxidation or electricity slurry electrolytic oxidation, anodic spark deposition, and spark deposition anodic oxidation wherein arbitrary heat radiation side in this heat-conductive body forms cellular structure.
19. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, wherein said heat loss through radiation layer is for hitting produced concaveconvex structure by pearl.
20. methods processed being applied to the radiator structure of mobile device as claimed in claim 12, wherein said heat loss through radiation layer is that a porous ceramic structure or a poriness graphite-structure are wherein arbitrary.
21. methods processed being applied to the radiator structure of mobile device as described in claim 12 or 20, wherein said heat loss through radiation layer is that the color of black or sub-black or dark system is wherein arbitrary.
22. methods processed being applied to the radiator structure of mobile device as claimed in claim 13, wherein said copper material plate body and aluminium material plate body are engaged by gummed or to engage wherein either type without Medium Diffusion bonded to each other.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310741941.6A CN104750206B (en) | 2013-12-27 | 2013-12-27 | Radiator structure and its manufacturing method applied to mobile device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310741941.6A CN104750206B (en) | 2013-12-27 | 2013-12-27 | Radiator structure and its manufacturing method applied to mobile device |
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| CN104750206A true CN104750206A (en) | 2015-07-01 |
| CN104750206B CN104750206B (en) | 2019-01-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358418A (en) * | 2015-07-14 | 2017-01-25 | 徐夫子 | Radiating device with damping property |
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| CN104750206B (en) | 2019-01-18 |
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