TWM386528U - Light emitting diode lamp with high heat-dissipation capacity - Google Patents
Light emitting diode lamp with high heat-dissipation capacityInfo
- Publication number
- TWM386528U TWM386528U TW97212430U TW97212430U TWM386528U TW M386528 U TWM386528 U TW M386528U TW 97212430 U TW97212430 U TW 97212430U TW 97212430 U TW97212430 U TW 97212430U TW M386528 U TWM386528 U TW M386528U
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- emitting diode
- high heat
- diode lamp
- dissipation capacity
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97212430U TWM386528U (en) | 2008-07-11 | 2008-07-11 | Light emitting diode lamp with high heat-dissipation capacity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97212430U TWM386528U (en) | 2008-07-11 | 2008-07-11 | Light emitting diode lamp with high heat-dissipation capacity |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM386528U true TWM386528U (en) | 2010-08-11 |
Family
ID=50603266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97212430U TWM386528U (en) | 2008-07-11 | 2008-07-11 | Light emitting diode lamp with high heat-dissipation capacity |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM386528U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI490117B (en) * | 2010-11-24 | 2015-07-01 | Nat Univ Tsing Hua | Heat spreading element with aln film and method for manufacturing the same |
CN104750206A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure |
CN104754916A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation device |
CN104754915A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device |
TWI573520B (en) * | 2013-12-27 | 2017-03-01 | 奇鋐科技股份有限公司 | Heat dissipation structure applied to mobile device and manufacturing method of the heat dissipation structure |
TWI765341B (en) * | 2020-09-10 | 2022-05-21 | 英業達股份有限公司 | Heat sink and thermal dissipation system |
-
2008
- 2008-07-11 TW TW97212430U patent/TWM386528U/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI490117B (en) * | 2010-11-24 | 2015-07-01 | Nat Univ Tsing Hua | Heat spreading element with aln film and method for manufacturing the same |
CN104750206A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device and manufacturing method of heat radiation structure |
CN104754916A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation device |
CN104754915A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device |
TWI573520B (en) * | 2013-12-27 | 2017-03-01 | 奇鋐科技股份有限公司 | Heat dissipation structure applied to mobile device and manufacturing method of the heat dissipation structure |
CN104750206B (en) * | 2013-12-27 | 2019-01-18 | 奇鋐科技股份有限公司 | Radiator structure and its manufacturing method applied to mobile device |
TWI765341B (en) * | 2020-09-10 | 2022-05-21 | 英業達股份有限公司 | Heat sink and thermal dissipation system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |