TWM472182U - Thin type heat sink - Google Patents

Description

Thin heat sink

This creation is about a heat dissipating component, especially a thin heat sink that combines heat conduction and heat radiation.

In recent years, electronic devices such as ultra-thin notebooks (Ultrabooks), tablets, and smart phones have become more and more demanding, resulting in power dissipation and relative heat flow (Heat Flux) of electronic components. It is also getting higher and higher; electronic devices are also facing a light, thin and short design trend, and the design direction of such extreme compression space often causes difficulty in heat dissipation, so the heat dissipation problem has become one of the first problems overcome by the electronics industry.

For example, in the construction of a conventional circuit board, since the number of electronic components and power consumption are low, heat generated by the electronic components can be conducted through the copper foil layer and directly dissipate heat into the ambient air. Nowadays, the number of electronic components disposed on the circuit board is large and the power is high. The problem is that as the current increases and the power consumption increases, the local heat generated excessively rises, so the electronic component contacts the foot ( The heat removal method has been unable to dissipate most of the heat, so that the electronic components and the circuit board cannot be maintained at the normal operating temperature, resulting in a change in the physical characteristics of the electronic components, thereby failing to achieve the predetermined working efficiency. For the user, it is very likely that the local high temperature will cause burns.

A method solved in the prior art is to install a fan near the heat source, and use a fan to accelerate the heat convection of the air to remove heat. The disadvantage of this heat dissipation method is that the fan It will occupy a certain space in the electronic device and affect the miniaturization of the electronic device.

In addition, in the prior art, the heat dissipating fins are mounted in surface contact on electronic components that generate high heat, and the high surface area of the heat dissipating fins dissipates heat into the air environment. However, the surface of the heat sink fin cannot be flattened as expected due to process limitations, so there is a gap between the heat sink fin and the electronic component, so that the heat dissipation performance is greatly reduced (due to the poor thermal conductivity of air).

Although a thermal interface material such as a thermal conductive paste or a thermal conductive paste is filled between the heat dissipation fin and the electronic component, the above problem can be solved. However, the soft thermal conductive material itself varies depending on temperature changes (evaporation due to high temperature, and curing shrinkage due to low temperature), resulting in failure to meet the durability requirements of the product.

The main purpose of this creation is to provide a thin heat sink with both heat conduction and heat radiation functions, and to contact the heat sink with the heat source to eliminate the heat generated by the heat source element and the device during operation, thereby solving the local high temperature. problem.

For the purposes described above, the present invention provides a thin heat sink comprising a sheet material and a thermally diffused radiation layer comprising a carbon composite material, the heat diffusion radiation layer being disposed on the sheet material, wherein the carbon composite material Dispersed in the thermal diffusion radiation layer.

In one embodiment of the present creation, the carbon composite material comprises diamond particles, artificial graphite particles, carbon black particles, carbon fiber particles, graphene sheets, carbon nanotubes, or a group thereof.

In an embodiment of the present invention, a thickness ratio of the plate to the heat diffusion radiation layer is 1:0.05 to 0.2.

In one embodiment of the present invention, the plate material is a first substrate, a second substrate, and a thermal buffer layer disposed between the first substrate and the second substrate.

In one embodiment of the present invention, the thermal buffer layer has a plurality of holes that are uniformly distributed or non-uniformly distributed.

In an embodiment of the present invention, a thickness ratio of the first substrate, the thermal buffer layer, and the second substrate is 0.2 to 0.3:0.1:1.

In an embodiment of the present invention, the plate material includes a first substrate and a second substrate, and the heat diffusion radiation layer is disposed between the first substrate and the second substrate.

In an embodiment of the present invention, the thermally diffused radiation layer has a plurality of holes that are uniformly distributed or non-uniformly distributed.

In an embodiment of the present invention, the heat dissipating powder is further dispersed in the thermal diffusion radiation layer.

In an embodiment of the present invention, the heat dissipating powder comprises gold particles, silver particles, copper particles, nickel particles, aluminum particles, alumina particles, zinc oxide particles, boron nitride particles, aluminum nitride particles or a group thereof. group.

The present invention has at least the following advantages: the thermal diffusion radiation layer of the present invention comprises a carbon composite material, which has both heat diffusion and heat radiation functions, and can directly extract heat from the heat source through direct contact with the electronic component to be cooled. Diffusion, then radiate out to achieve high efficiency heat dissipation.

Furthermore, the electronic product of the thin heat sink of the present invention can reduce the volume of the package, and the reliability and the service life of the electronic product can be increased by effectively dissipating heat.

In order to further understand the techniques, methods and effects of this creation in order to achieve the intended purpose, please refer to the following detailed descriptions and diagrams of this creation. I believe that the purpose, characteristics and characteristics of this creation can be deepened and specific. The drawings and the annexes are provided for reference and description only, and are not intended to limit the present invention.

100, 100a, 100b‧‧‧ thin heat sink

1, 1a, 1b‧‧‧ plates

10‧‧‧ surface

11a, 11b‧‧‧ first substrate

12a‧‧‧ Thermal buffer layer

12b‧‧‧Fitting layer

120a‧‧‧First hole

13a, 13b‧‧‧second substrate

2‧‧‧ Thermal diffusion layer

20‧‧‧Second hole

21‧‧‧Carbon composites

21a‧‧‧Diamond particles

21b‧‧‧Artificial graphite particles

21c‧‧‧carbon black particles

21d‧‧‧carbon fiber particles

21e‧‧‧graphene tablets

21f‧‧‧Nano Carbon Tube

22‧‧‧Dissipating powder

200‧‧‧ circuit substrate

201‧‧‧Electronic components

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing the structure of a heat sink according to an embodiment of the first embodiment of the present invention.

Figure 2 is a cross-sectional view showing the heat sink structure of another embodiment of the first embodiment of the present invention.

FIG. 3 is a perspective view of the heat sink structure of the present invention applied to a circuit substrate.

Figure 4 is a cross-sectional view showing the structure of the heat sink of the second embodiment of the present invention.

Figure 5A is a plan view of one embodiment of the thermal buffer layer of the present invention.

Figure 5B is a plan view of another embodiment of the thermal buffer layer of the present invention.

Figure 5C is a plan view of yet another embodiment of the thermal buffer layer of the present invention.

Figure 5D is a schematic diagram of the heat conduction of the thermal buffer layer of the present invention.

Figure 6 is a cross-sectional view showing the structure of the heat sink of the third embodiment of the present invention.

According to the embodiment of the present invention, the thin heat sink of the present invention is suitable for use in an electronic component that generates high heat (especially a processor chip for high-speed operation), and an electronic device that is difficult to dissipate heat due to a small internal space, such as a mobile device. A tablet, a notebook, etc.; the light can be removed from the heat source to the outside air environment by diffusion and radiation in direct contact with the surface of the heat source.

[First Embodiment]

Please refer to FIG. 1 , which is a cross-sectional view of the thin heat sink of the first embodiment of the present invention. The thin heat sink 100 of the present embodiment comprises a plate 1 and a thermal diffusion radiation layer 2 comprising a carbon composite material 21; the thermal diffusion radiation layer 2 can be printed, coated or tailored. The method is formed on one surface 10 of the sheet material 1. The present invention does not limit the molding manner of the heat diffusion radiation layer, and the other surface of the sheet material 1 is used to contact the heat source, wherein the carbon composite material 21 is dispersed in the heat diffusion radiation layer 2. .

In the embodiment, the thickness of the plate 1 and the heat diffusion radiation layer 2 is preferably 1:0.05 to 0.2, wherein the plate 1 may be a metal plate, such as an aluminum substrate, an iron substrate or a copper substrate, wherein copper is used. A substrate is preferred. The carbon composite material 21 includes One of the group consisting of the diamond particles 21a, the artificial graphite particles 21b, the carbon black particles 21c, the carbon fiber particles 21d, the graphene sheets 21e, and the carbon nanotubes 21f has an average outer diameter of about 10 nm to 20 μm. The function of good thermal conductivity and heat radiation allows heat to be conducted through the carbon composite 21 in the thermally diffused radiation layer 2 and radiated to the outside air environment.

Please refer to FIG. 2, which is a cross-sectional view of a thin heat sink according to a variation of the present invention. In order to enhance the heat radiation capability of the heat diffusion radiation layer 2, the heat diffusion radiation layer 2 may further include a heat dissipation powder 22, that is, both the carbon composite material 21 and the heat dissipation powder 22 are dispersed inside the heat diffusion radiation layer 2. Specifically, the heat dissipating powder 22 may include metal particles, oxide particles, nitride particles or a group of any of the above particles; wherein the metal particles may be, but are not limited to, gold, silver, copper, nickel Or aluminum particles, the oxide particles may be, but are not limited to, aluminum oxide or zinc oxide particles, and the nitride particles may be, but are not limited to, boron nitride or aluminum nitride particles.

Referring to FIG. 3 , the application of the thin heat sink 100 of the present embodiment can be referred to FIG. 3 , wherein the electronic component 201 of the circuit substrate 200 can achieve good heat dissipation through contact with the thin heat sink 100 . The principle is that since the electronic component 201 is a small heat source and generates a large amount of heat during operation, the thin heat sink 100 has excellent heat conduction and heat dissipation effects in the horizontal (XY) direction and the vertical (Z) direction, and is relatively The electronic component 201 has a wide range of heat dissipation surface area, so that the heat generated by the electronic component 201 can be uniformly and quickly removed over a large area.

In a variant embodiment, the thermal diffusion radiation layer 2 of the present embodiment can be provided with flexibility, so that it can be fabricated according to the shape of the heating element and the device to be combined to meet the customization requirements, and can be reduced. manufacturing cost.

[Second embodiment]

Please refer to FIG. 4, which is a cross-sectional view of the thin heat sink of the second embodiment of the present invention. The first embodiment is different from the first embodiment in that the board 1a of the embodiment is a composite board structure, specifically, a first substrate 11a, a second substrate 13a, and a first substrate 11a and a second substrate. a thermal buffer layer 12a between 13a, wherein the first base The plate 11a and the second substrate 13a are preferably copper substrates, but are not limited thereto.

As shown in FIGS. 5A to 5C, the thickness of the first substrate 11a, the thermal buffer layer 12a and the second substrate 13a of the present embodiment is preferably 0.2 to 0.3:0.1:1; further, the thermal buffer layer 12a may be opened. A plurality of first holes 120a are formed, and a local thermal block space is formed on the heat buffer layer 12a due to the filling of the air at the first holes 120a. In this embodiment, the first holes 120a may be uniformly distributed (as shown in FIGS. 5A and 5C) or non-uniformly distributed (as shown in FIG. 5B) on the thermal buffer layer 12a, the first holes 120a. The shape is, for example, a circle, a polygon, or an irregular shape, and the present invention does not limit this. Thus, the thin heat sink 100 of the present invention can achieve the following effects.

As shown in FIG. 5D, when heat is conducted from the heat source having a smaller range to the sheet material 1, it is uniformly transmitted to the periphery of the sheet material 1a through the restriction of the local heat block space on the heat buffer layer 12a (i.e., toward the horizontal direction (i.e., in the horizontal direction ( XY direction) conducts and radiates to the external air environment in a large area by the heat radiation capability of the heat diffusion radiation layer 2; thereby, it is possible to prevent the heat source from rapidly passing through the vertical direction from the heat conduction surface of the thin heat sink 100 (Z direction) heat dissipation path for local heat dissipation, causing local temperature is too high; for the user, it can avoid the danger of burns caused by local high temperature.

It can be understood that the plate 1 of the present invention is not limited to the two substrates (the first and second substrates), and a thermal buffer layer 12a is disposed; the composite form of the plate 1 can be changed according to different application ranges. For example, a three-piece substrate is provided with a composite plate structure of two thermal buffer layers, and so on. Therefore, those who use the thermal diffusion radiation layer to match the composite plate to achieve a large-area uniform heat dissipation are all within the scope of this creation.

[Third embodiment]

Please refer to FIG. 6, which is a cross-sectional view of a thin heat sink according to a third embodiment of the present invention. In order to avoid problems caused by excessive local temperature, such as electronic components, device failure or jeopardy, etc., this creation also proposes another structural type of thin heat sink.

In the present embodiment, the sheet material 1 includes a first substrate 11b and a second substrate 13b, and the heat diffusion radiation layer 2 is formed between the first substrate 11b and the second substrate 13b by means of bonding. Therefore, the first substrate 11b and the second substrate 13b are each heated There is also a bonding layer 12b between the diffusion radiation layers 2, and the bonding layer 12b may be, but not limited to, a thermal conductive adhesive layer.

Therefore, in this embodiment, the thermal conductivity of the first substrate 11b and the second substrate 13b is poorer than that of the thermal diffusion radiation layer 2, that is, the heat conduction in the vertical direction is partially restricted, so that the horizontal direction (XY direction) can be improved. Heat conduction to achieve uniform heat dissipation over a large area. Furthermore, the thermal diffusion radiation layer 2 can also be provided with a plurality of second holes 20 uniformly distributed (see FIGS. 5A and 5C) or non-uniformly distributed (see FIG. 5B) to further enhance the horizontal thermal conductivity.

In summary, according to the heat sink structure disclosed in the present embodiment, one of the main features is that the heat diffusion radiation layer formed by the resin material and the carbon filler has both heat diffusion and heat radiation functions. The heat-dissipating electronic components are in direct contact, and can effectively heat, diffuse, and radiate heat from the heat source to achieve heat dissipation. Furthermore, the thermal diffusion radiation layer can further cooperate with a composite plate structure having a thermal buffer layer to greatly enhance the heat conduction capability in the horizontal direction (X-Y direction), thereby achieving the technical effect of uniform heat dissipation over a large area.

It should be noted that, in order to clearly show the detailed features of the fin structures 100, 100a, 100b, the dimensions of the sheets 1, 1a, 1b and the heat diffusion radiation layer 2 in the drawings are different from actual ones.

[Third embodiment]

Compared with the traditional heat dissipating components, the thin heat sink of the present invention has the following effects:

1. The thermal diffusion radiation layer of the present invention comprises a carbon composite material, which has both heat diffusion and heat radiation functions, and can directly extract, diffuse and radiate heat from the heat source through direct contact with the electronic component to be cooled. Achieve high efficiency heat dissipation.

2. The thermal diffusion radiation layer can further cooperate with a composite plate structure having a thermal buffer layer to greatly enhance the heat conduction capability in the horizontal direction (X-Y direction), thereby achieving the technical effect of uniform heat dissipation over a large area.

3. The electronic product of the thin heat sink of the present invention can be used to reduce the size of the body. Accumulation, and through effective heat dissipation can increase the reliability and service life of electronic products.

In summary, this creation has already met the requirements of the new patent and applied in accordance with the law. However, the above disclosures are only preferred embodiments of the present invention, and the scope of rights of the present invention cannot be limited thereto. Therefore, the equal changes or modifications made according to the scope of the application of the present application are still covered by the present application.

100‧‧‧Thin heat sink

1‧‧‧ plates

10‧‧‧ surface

2‧‧‧ Thermal diffusion layer

21a‧‧‧Diamond particles

21b‧‧‧Artificial graphite particles

21c‧‧‧carbon black particles

21d‧‧‧carbon fiber particles

21e‧‧‧graphene tablets

21f‧‧‧Nano Carbon Tube

Claims (10)

A thin heat sink comprising: a plate; and a thermal diffusion radiation layer comprising a carbon composite material disposed on the plate material, wherein the carbon composite material is dispersed in the thermal diffusion radiation layer. The thin heat sink of claim 1, wherein the carbon composite material comprises diamond particles, artificial graphite particles, carbon black particles, carbon fiber particles, graphene sheets, carbon nanotubes, or a group thereof. The thin heat sink according to claim 1, wherein a thickness ratio of the plate to the heat diffusion radiation layer is 1:0.05 to 0.2. The thin heat sink of claim 1, wherein the plate material is a first substrate, a second substrate, and a thermal buffer layer disposed between the first substrate and the second substrate. The thin heat sink of claim 4, wherein the thermal buffer layer has a plurality of holes that are uniformly distributed or non-uniformly distributed. The thin heat sink according to claim 4, wherein a thickness ratio of the first substrate, the thermal buffer layer, and the second substrate is 0.2 to 0.3:0.1:1. The thin heat sink of claim 1, wherein the plate material comprises a first substrate and a second substrate, and the heat diffusion radiation layer is disposed between the first substrate and the second substrate. The thin heat sink according to claim 7, wherein the heat diffusion radiation layer has a plurality of holes which are uniformly distributed or non-uniformly distributed. The thin heat sink according to claim 1, further comprising a heat dissipating powder dispersed in the thermal diffusion radiation layer. The thin heat sink according to claim 9, wherein the heat dissipating powder comprises gold particles, silver particles, copper particles, nickel particles, aluminum particles, alumina particles, zinc oxide particles, boron nitride particles, aluminum nitride particles. Or a group thereof.