CN204578942U - Radiating subassembly - Google Patents
Radiating subassembly Download PDFInfo
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- CN204578942U CN204578942U CN201520027588.XU CN201520027588U CN204578942U CN 204578942 U CN204578942 U CN 204578942U CN 201520027588 U CN201520027588 U CN 201520027588U CN 204578942 U CN204578942 U CN 204578942U
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Abstract
The utility model discloses a kind of radiating subassembly, and it is arranged in order to dissipation one heat that the chip unit on a loading plate sends, and radiating subassembly comprises a sheet material and a thin radiating fins.Sheet material is arranged on loading plate, and sheet material is positioned at the top of chip unit, and wherein sheet material has a heat dissipation region.Thin radiating fins is arranged on sheet material, and thin radiating fins is arranged in heat dissipation region.Wherein, the heat sequentially dissipation by sheet material and thin radiating fins that sends of chip unit.The radiating subassembly that the utility model provides is by being arranged at the structural design on a sheet material by thin radiating fins, the heat first in thermo-conducting manner chip unit produced sequentially by sheet material and thin radiating fins from regional area to the even dissipation of periphery, in thermal-radiating mode, heat is removed in external environment by thin radiating fins again, reach the effect of Large-Area-Uniform heat radiation.
Description
Technical field
The utility model relates to a kind of framework of radiating subassembly, espespecially a kind of radiating subassembly with heat transfer and thermal radiation function.
Background technology
Along with the high development of electronic installation, the operation efficiency of the electronic component of electronic installation inside requires more and more higher, causes the temperature of electronic component easily to raise, and then produces the problem of heat radiation.In addition, also along with the designer trends of electronic installation are towards lightening design, easily cause its spatial design extremely compressed and cause the difficulty in heat radiation.
In general, the known practice is by arranging the effect that the element such as fan, radiating fin reaches heat radiation near heating sources.But, for frivolous electronic product, such as ultra-thin notebook computer, panel computer, or even intelligent mobile phone then so cannot arrange fan.Therefore, aforementioned notebook computer, panel computer and intelligent mobile phone is easily caused to cause its system instability because of overheated and then crash.
In addition, generally speaking, radiating fin is usually installed in the mode of face contact and can produces on the electronic component of high heat, and the heat dissipation produced by electronic component by the high surface of radiating fin is in air ambient.But, the surface of radiating fin because of the restriction of processing procedure cannot as expected as smooth, make to have gap between radiating fin and electronic component, allow radiating efficiency significantly reduce (because the conductive coefficient of air is poor).
Utility model content
In view of above problem, the utility model provides a kind of radiating subassembly, by thin radiating fins being arranged at the structural design on a sheet material, the heat first in the mode of heat transfer (heat conductive), chip unit produced sequentially by sheet material and thin radiating fins from regional area to the even dissipation of periphery, in the mode of thermal radiation (heat radiation), heat is removed in external environment by thin radiating fins again, reach the effect of Large-Area-Uniform heat radiation.
To achieve the above object, a wherein embodiment of the present utility model is to provide a kind of radiating subassembly, and be arranged in order to dissipation one heat that the chip unit on a loading plate sends, described radiating subassembly comprises a sheet material and a thin radiating fins.Described sheet material is arranged on described loading plate, and described sheet material is positioned at the top of described chip unit, and wherein said sheet material has a heat dissipation region.Described thin radiating fins to be arranged on described sheet material and to be positioned in described heat dissipation region.Wherein, the heat sequentially dissipation by described sheet material and described thin radiating fins that sends of described chip unit.
An other embodiment of the present utility model is to provide a kind of radiating subassembly, and be arranged in order to dissipation one heat that the chip unit on a loading plate sends, described radiating subassembly comprises a sheet material and a thin radiating fins.Described sheet material is arranged on described loading plate, and described sheet material is positioned at the top of described chip unit, and wherein said sheet material has a heat dissipation region.Described thin radiating fins is arranged at and is positioned in described heat dissipation region.Wherein, the heat sequentially dissipation by described thin radiating fins and described sheet material that sends of described chip unit.
Further, described radiating subassembly also comprises an adhesion layer further, and described adhesion layer is arranged between described sheet material and described thin radiating fins.
Further, described radiating subassembly also comprises a heat-conducting medium layer further, and described heat-conducting medium layer is arranged between described chip unit and described sheet material.
Further, described thin radiating fins comprises a base material and a thermal diffusion radiating layer, and described thermal diffusion radiating layer is arranged on described base material, and described base material is arranged on described sheet material.
Further, described base material comprises a first substrate and a second substrate, and described thermal diffusion radiating layer is arranged between described first substrate and described second substrate.
Further, one of them of described first substrate and described both second substrates offers multiple being evenly distributed or the louvre of non-uniform Distribution.
Further, described thin radiating fins comprises a carbon composite, the wherein one in the group that wherein said carbon composite is diamond, Delanium, Graphene, CNT (carbon nano-tube), carbon black and carbon fiber form.
Further, described radiating subassembly also comprises a fixture further, and described sheet material comprises a fixed area, and described fixed area is positioned at the side of described heat dissipation region, wherein said fixture is arranged in described fixed area, and described loading plate and described sheet material are bonded to each other by described fixture.
Further, described radiating subassembly also comprises a flexible member further, and described flexible member is arranged on described sheet material, and described fixture is through described flexible member.
Further, described sheet material offers multiple being evenly distributed or the perforated holes of non-uniform Distribution.
The beneficial effects of the utility model can be, the radiating subassembly that the utility model embodiment provides, by thin radiating fins being arranged at the structural design on a sheet material, the heat first in the mode of heat transfer (heatconductive), chip unit produced sequentially by sheet material and thin radiating fins from regional area to the even dissipation of periphery, in the mode of thermal radiation (heat radiation), heat is removed in external environment by thin radiating fins again, reach the effect of Large-Area-Uniform heat radiation.In addition, by fixture, sheet material and loading plate are combined closely, avoid the sheet material for carrying thin radiating fins cannot effectively and the problem that fits tightly of chip unit produce.Furthermore, the thermal diffusion radiating layer provided in this case thin radiating fins can be filled powder by a resin material, a carbon composite and thermal conductivity and formed, wherein carbon composite is diamond grains, synthetic graphite particles, carbon black granules, carbon fiber particles, Graphene, CNT (carbon nano-tube) or its group, and thermal conductivity fill powder its be metallic, oxide particle, nitride particles or its group, thus thermal diffusion radiating layer can have heat conduction and thermal-radiating ability.By this, effectively and remove the heat that chip unit produces in external environment rapidly, the effect of quick heat radiating can be reached.
Further understand feature of the present utility model and technology contents for enable, refer to following about detailed description of the present utility model and accompanying drawing, but institute's accompanying drawings only provides with reference to and use is described, be not used for the utility model in addition limitr.
Accompanying drawing explanation
Fig. 1 is the schematic side view of the radiating subassembly of the utility model first embodiment.
Fig. 2 is the cross-sectional schematic of an aspect of the thin radiating fins of the utility model embodiment.
Fig. 3 is the cross-sectional schematic of another aspect of thin radiating fins of the utility model embodiment.
Fig. 4 is the cross-sectional schematic of the another aspect of thin radiating fins of the utility model embodiment.
Fig. 5 is the schematic side view of the radiating subassembly of the utility model second embodiment.
Fig. 6 is the schematic side view of the radiating subassembly of the utility model the 3rd embodiment.
Fig. 7 is the schematic side view of the radiating subassembly of the utility model the 4th embodiment.
[symbol description]
Radiating subassembly P, P ', P ", P " '
Loading plate 1
Chip unit 2
Upper surface 21
Lower surface 22
Sheet material 3,3 '
Upper surface 31
Lower surface 32
Storage tank 33
Perforated holes 34
Thin radiating fins 4,4 ', 4 ", 4 " '
Base material 41
Upper surface 411
Lower surface 412
First substrate 413
Middle section 413a
Thermal diffusion zone 413b
Second substrate 414
Contact area 414a
Thermal diffusion zone 414b
Thermal diffusion radiating layer 42
Resin material 421
Carbon composite 422
Thermal conductivity fills powder 423
Laminating layer 43
Louvre 44
Adhesion layer 5
Heat-conducting medium layer 6
Fixture 7
Flexible member 8
Heat dissipation region H
Fixed area F
Embodiment
The execution mode of " radiating subassembly " disclosed by the utility model is described below by way of specific instantiation, and those of ordinary skill in the art the content disclosed by this specification can understand other advantages of the present utility model and effect easily.The utility model is also implemented by other different specific embodiments or is applied, and the every details in this specification also based on different viewpoints and application, can carry out various modification and change under not departing from spirit of the present utility model.Of the present utility modelly again graphicly be only simple declaration, not describe according to actual size, also namely unreacted goes out be correlated with the actual size of formation, first give chat bright.Following execution mode further describes correlation technique content of the present utility model, but and is not used to limit technology category of the present utility model.
(the first embodiment)
First, refer to shown in Fig. 1, Fig. 1 is the schematic side view of the radiating subassembly of the utility model first embodiment.The utility model first embodiment provides a kind of radiating subassembly P, and be arranged in order to dissipation one heat that the chip unit 2 on a loading plate 1 sends, it comprises sheet material 3 and a thin radiating fins 4.For example, loading plate 1 can be a circuit substrate, and chip unit 2 can be electrically connected at this circuit substrate and be arranged on this circuit substrate, and right the utility model is not as limit.In other words, chip unit 2 also can directly be arranged on loading plate 1, and is interconnected by wire and other electronic components, or by this loading plate 1 institute around.
Then, with the utility model first embodiment, chip unit 2 can have a upper surface 21 and a lower surface 22, and the lower surface 22 of chip unit 2 can be arranged on loading plate 1.Meanwhile, sheet material 3 is also arranged on loading plate 1, and sheet material 3 is positioned at the top of the upper surface 21 of chip unit 2.For example, the composition of sheet material 3 can be one have aluminium material or the sheet material of copper material 3, and right the utility model is not as limit.As shown in Figure 1, sheet material 3 can have a heat dissipation region H, and chip unit 2 is then positioned at the below of heat dissipation region H, by this, and the heat dissipation that chip unit 2 is sent by heat dissipation region H by chip unit 2 and going out.Thin radiating fins 4 can be arranged on sheet material 3, and thin radiating fins 4 is arranged on heat dissipation region H, and by this, the heat that chip unit 2 sends is the dissipation by sheet material 3 and thin radiating fins 4 sequentially.
Hold above-mentioned, for example, with the utility model first embodiment, sheet material 3 can have a upper surface 31 and a lower surface 32, can further an adhesion layer 5 be arranged between the upper surface 31 of sheet material 3 and thin radiating fins 4, with by thin radiating fins 4 and sheet material 3 bonded to each other, and the material of adhesion layer 5 can be such as double faced adhesive tape, heat-conducting glue or bleeding agent.In addition, can further a heat-conducting medium layer 6 be arranged between chip unit 2 and sheet material 3, to increase the heat transference efficiency of chip unit 2.For example, heat-conducting medium layer 6 can be a soft heat-conducting medium material (Thermal InterfaceMaterial), and such as heat-conducting cream, heat-conducting glue etc., right the utility model is not as limit.Such as also can not have an adhesion layer 5 between sheet material 3 and chip unit 2, between sheet material 3 and chip unit 2 by a gas blanket (scheming not illustrate) by the heat trnasfer of chip unit 2 to the thin radiating fins 4 be arranged on sheet material 3.In other words, a gap (scheming not illustrate) can namely be had between sheet material 3 and chip unit 2.In addition, it is worth mentioning that, thin radiating fins 4 can be a thin radiating fins 4 with Graphene material, and right the utility model is not as limit.
For example, refer to shown in Fig. 2, Fig. 2 is the cross-sectional schematic of an aspect of the thin radiating fins of the utility model embodiment.With the utility model embodiment, thin radiating fins 4 ' comprises base material 41 and a thermal diffusion radiating layer 42, and thermal diffusion radiating layer 42 is arranged on base material 41, and base material 41 is arranged on the upper surface 31 of sheet material 3.For example, thermal diffusion radiating layer 42 can utilize the mode attached or be coated with to be incorporated on the upper surface 411 of base material 41.By this, the heat that chip unit 2 produces is transmitted near its upper surface 411 by the lower surface 412 of base material 41, and is effectively emitted to outside via thermal diffusion radiating layer 42.In addition, base material 41 can be (but being not limited to) metal substrate such as aluminium, iron or copper base.
Hold above-mentioned, thermal diffusion radiating layer 42 can be filled powder 423 by resin material 421, carbon composite 422 and thermal conductivity and formed.For example, resin material 421 can be (but being not limited to) epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-to ring diformazan benzene series resin, bismaleimides system resin and polyimide resin form at least one of group.The group that carbon composite 422 can be (but being not limited to) diamond, Delanium, Graphene, CNT (carbon nano-tube), carbon black, carbon fiber or any above-mentioned carbon material forms, its shape comprises graininess, flake and/or dumbbell shaped.In addition, thermal conductivity fills the group that powder 423 can form including (but not limited to) metallic particles, oxide particle, nitride particles or any above-mentioned particle.Wherein, metallic particles can be (but being not limited to) gold, silver, copper, nickel or alumina particles, oxide particle can be (but being not limited to) aluminium oxide or Zinc oxide particles, nitride particles can be (but being not limited to) boron nitride or aluminum nitride particle.
Then, refer to shown in Fig. 3, Fig. 3 is the cross-sectional schematic of another aspect of thin radiating fins of the utility model embodiment.With the utility model embodiment, implement in aspect other one, base material 41 can comprise first substrate 413 and a second substrate 414, and thermal diffusion radiating layer 42 can be arranged between first substrate 413 and second substrate 414.For example, thermal diffusion radiating layer 42 is incorporated between first substrate 413 and second substrate 414 by a laminating layer 43, and the material of laminating layer 43 can be such as double faced adhesive tape, heat-conducting glue or bleeding agent.By this, thermal diffusion radiating layer 42 can maintain good contact with first substrate 413 and second substrate 414 respectively, makes thin radiating fins 4 " radiating effect better.In addition, first substrate 413 and second substrate 414 can be (but being not limited to) metal substrate such as aluminium, iron or copper bases.And thermal diffusion radiating layer 42 can be made up of resin material 421, carbon composite 422 and thermal conductivity filling powder 423.Should be noted that, thermal diffusion radiating layer 42 structure shown in Fig. 3 is identical with the thermal diffusion radiating layer 42 shown in constituent and earlier figures 2, repeats no more in this appearance.
Then, refer to shown in Fig. 4, Fig. 4 is the cross-sectional schematic of the another aspect of thin radiating fins of the utility model embodiment.With the utility model embodiment, implement in aspect other one, for the hot type that can more quickly chip unit 2 be produced is except in external environment, thin radiating fins 4 " ' first substrate 413 and second substrate 414 one of them on can offer multiple being evenly distributed or the louvre 44 of non-uniform Distribution.As shown in Figure 4, with the utility model embodiment, first substrate 413 and second substrate 414 can offer multiple louvre 44, and first substrate 413 can have the thermal diffusion zone 413b that a middle section 413a and two lays respectively at the relative both sides of middle section 413a.And second substrate 414 can have the thermal diffusion zone 414b that a contact area 414a and two lays respectively at the relative both sides of contact area 414a, and the corresponding setting of contact area 414a of the middle section 413a of first substrate 413 and second substrate 414.It is worth mentioning that, the density be placed in set by louvre 44 on first substrate 413 or second substrate 414 also can adjust with demand, for example, the density away from the louvre 44 of the contact area 414a of second substrate 414 can higher than the density of the louvre 44 of the contact area 414a of contiguous second substrate 414.Similarly, the density away from the louvre 44 of the middle section 413a of first substrate 413 can higher than the density of the louvre 44 of the middle section 413a of contiguous first substrate 413.
As mentioned above, the radiating subassembly P that the utility model first embodiment provides, by by thin radiating fins 4, 4 ', 4 ", 4 " the structural design on a sheet material 3 ' is arranged at, the heat first in the mode of heat transfer (heat conductive), chip unit 2 produced is sequentially by sheet material 3 and thin radiating fins 4, 4 ', 4 ", 4 " ' and from regional area to the even dissipation of periphery, in the mode of thermal radiation (heat radiation), heat is passed through thin radiating fins 4 again, 4 ', 4 ", 4 " ' remove in external environment, reach the effect of Large-Area-Uniform heat radiation.
(the second embodiment)
First, refer to shown in Fig. 5, Fig. 5 is the schematic side view of the radiating subassembly of the utility model second embodiment.Relatively can learn by Fig. 5 and Fig. 1, the second embodiment is with the difference of the first embodiment: loading plate 1 and sheet material 3 are combined by a fixture 7 by radiating subassembly P ' that the second embodiment provides each other.Specifically, the utility model second embodiment provides a kind of radiating subassembly P ', and be arranged in order to dissipation one heat that the chip unit 2 on a loading plate 1 sends, it comprises sheet material 3 one thin radiating fins 4.
Then, with the utility model second embodiment, chip unit 2 can have a upper surface 21 and a lower surface 22, and the lower surface 22 of chip unit 2 can be arranged on loading plate 1.Meanwhile, sheet material 3 is also arranged on loading plate 1, and sheet material 3 is positioned at the top of the upper surface 21 of chip unit 2.For example, the composition of sheet material 3 can be one have aluminium material or the sheet material of copper material 3, and right the utility model is not as limit.As shown in Figure 5, sheet material 3 can have the side that a heat dissipation region H and a fixed area F, fixed area F are positioned at heat dissipation region H, and chip unit 2 is then positioned at the below of heat dissipation region H, by this, the heat dissipation that chip unit 2 sent by heat dissipation region H of chip unit 2 and going out.Thin radiating fins 4 can be arranged on sheet material 3, and thin radiating fins 4 is arranged on heat dissipation region H, and by this, the heat that chip unit 2 sends is the dissipation by sheet material 3 and thin radiating fins 4 sequentially.
Hold above-mentioned, radiating subassembly P ' also can comprise a fixture 7 further, and sheet material 3 comprises a fixed area F, and fixed area F is positioned at the side of heat dissipation region H, and wherein fixture 7 is arranged on fixed area F, and loading plate 1 and sheet material 3 are bonded to each other by fixture 7.With the utility model second embodiment, fixture 7 can be a screw, and right the utility model is not as limit, and the combination between actual fixture 7 and loading plate 1 and sheet material 3 can change to some extent in response to the demand of actual product.For example, fixture 7 also can be a fastener, this fastener can include a top and a grab, and loading plate can be provided with a draw-in groove corresponding with aforementioned grab, by the draw-in groove on the grab of fastener and loading plate 1 is fixed mutually, with fixed plate 3 and loading plate 1.
The utility model second embodiment provides a kind of radiating subassembly P ', sheet material 3 and loading plate 1 is combined closely by fixture 7, avoid the sheet material 3 for carrying thin radiating fins 4 cannot effectively and the problem that fits tightly of chip unit 2 produce.In addition, owing to being provided with a heat-conducting medium layer 6 between chip unit 2 and sheet material 3 to increase the heat transference efficiency of chip unit 2, and this heat-conducting medium layer 6 may change to some extent because of the variations in temperature of chip unit 2, such as Yin Gaowen and evaporating, and because of low temperature cure shrinkage, and then cause the durability demand that cannot meet product, and once sheet material 3 and chip unit 2 are separated from each other, will make it cannot the effective heat that produces of dissipation chip unit 2.
(the 3rd embodiment)
First, refer to shown in Fig. 6, Fig. 6 is the schematic side view of the radiating subassembly of the utility model the 3rd embodiment.Relatively can learn by Fig. 6 and Fig. 1, the difference of the 3rd embodiment and the second embodiment is: the radiating subassembly P that the 3rd embodiment provides " in thin radiating fins 4 can be embedding attached or be arranged in sheet material 3 '; specifically; sheet material 3 ' can have a storage tank 33, thin radiating fins 4 can be arranged in storage tank 33.The utility model the 3rd embodiment provides a kind of radiating subassembly P ", be arranged in order to dissipation one heat that the chip unit 2 on a loading plate 1 sends, it comprises a sheet material 3 ' and a thin radiating fins 4.
Then, with the utility model the 3rd embodiment, sheet material 3 ' can have a storage tank 33, thin radiating fins 4 can be arranged in storage tank 33.And the upper surface of thin radiating fins 4 can flush mutually with the upper surface 31 of sheet material 3 ', or protrude from the upper surface 31 of sheet material 3 '.By this, thin radiating fins 4 can be placed in the analog-U shaped storage tank 33 on sheet material 3 '.Go out with the heat dissipation that chip unit 2 is sent.
Hold above-mentioned, chip unit 2 can have a upper surface 21 and a lower surface 22, and the lower surface 22 of chip unit 2 can be arranged on loading plate 1.Meanwhile, sheet material 3 ' is also arranged on loading plate 1, and sheet material 3 ' is positioned at the top of the upper surface 21 of chip unit 2.As shown in Figure 6, sheet material 3 ' can have the side that a heat dissipation region H and a fixed area F, fixed area F are positioned at heat dissipation region H, and chip unit 2 is then positioned at the below of heat dissipation region H, by this, the heat dissipation that chip unit 2 sent by heat dissipation region H of chip unit 2 and going out.Thin radiating fins 4 can be arranged on sheet material 3 ', and thin radiating fins 4 is arranged on heat dissipation region H, and by this, the heat that chip unit 2 sends is the dissipation by sheet material 3 ' and thin radiating fins 4 sequentially.Should be noted that, the radiating subassembly P that the 3rd embodiment provides ", structure and the previous embodiment of its loading plate 1, chip unit 2, fixture 7 and thin radiating fins 4 are similar, repeat no more in this appearance.
Furthermore, as shown in Figure 6, fixture 7 can arrange flexible member 8, such as a spring further, and flexible member 8 can be arranged on sheet material 3 ', and fixture 7 is through flexible member 8.By this, flexible member 8 is arranged on fixture 7, and is positioned between its top and sheet material 3 '.When fixture 7 be combined with each other with sheet material 3 ' and loading plate 1, flexible member 8 can be positioned on the upper surface 31 of sheet material 3 ', to apply a strength on sheet material 3 ', sheet material 3 ' and chip unit 2 is fitted tightly.The elastic force that simultaneously also can be had by this flexible member 8, avoids excessive pressure directly to put on chip unit 2, to prevent the damage of chip unit 2.
In addition, it is worth mentioning that, as shown in Figure 6, sheet material 3 ' can offer multiple being evenly distributed or the perforated holes 34 of non-uniform Distribution, with the effective heat that produces of dissipation chip unit 2 further.Should be noted that, perforated holes 34 can be opened in the upper heat dissipation region H or fixed area F of sheet material 3 ', also perforated holes 34 can be arranged at heat dissipation region H and fixed area F simultaneously.
The utility model the 3rd embodiment provides a kind of radiating subassembly P ", by fixture 7, sheet material 3 ' and loading plate 1 are combined closely, avoid the sheet material 3 ' for carrying thin radiating fins 4 cannot effectively and the problem that fits tightly of chip unit 2 produce.In addition, by being arranged at by thin radiating fins 4 in the storage tank 33 on sheet material 3 ', the distance between thin radiating fins 4 and chip unit 2 can be made more close, so more can the effective heat that produces of dissipation chip unit 2.
(the 4th embodiment)
First, refer to shown in Fig. 7, Fig. 7 is the schematic side view of the radiating subassembly of the utility model the 4th embodiment.Relatively can learn by Fig. 7 and Fig. 5, the difference of the 4th embodiment and the second embodiment is: the radiating subassembly P that the 4th embodiment provides " ' in the thin radiating fins 4 be arranged on sheet material 3 can put upside down setting; make thin radiating fins 4 be contacted with on chip unit 2, the heat produced with dissipation chip unit 2.
Specifically, the utility model the 4th embodiment provides a kind of radiating subassembly P " ', be arranged in order to dissipation one heat that the chip unit 2 on a loading plate 1 sends, it comprises sheet material 3 and a thin radiating fins 4.Chip unit 2 can have a upper surface 21 and a lower surface 22, and the lower surface 22 of chip unit 2 can be arranged on loading plate 1.Meanwhile, sheet material 3 is also arranged on loading plate 1, and sheet material 3 is positioned at the top of the upper surface 21 of chip unit 2.In addition, adhesion layer 5 is arranged between the lower surface 32 of sheet material 3 and thin radiating fins 4, with by thin radiating fins 4 and sheet material 3 bonded to each other.By this, thin radiating fins 4 contacts with each other with chip unit 2 by being arranged on the heat-conducting medium layer 6 of chip unit 2 upper surface 21, the heat produced with dissipation chip unit 2.Sheet material 3 can have the side that a heat dissipation region H and a fixed area F, fixed area F are positioned at heat dissipation region H, and chip unit 2 is then positioned at the below of heat dissipation region H, by this, and the heat dissipation that chip unit 2 is sent by heat dissipation region H by chip unit 2 and going out.Thin radiating fins 4 can be arranged on sheet material 3 and to be positioned on the lower surface 32 of sheet material 3, and thin radiating fins 4 is arranged on heat dissipation region H, and by this, the heat that chip unit 2 sends is the dissipation by thin radiating fins 4 and sheet material 3 sequentially.Should be noted that, the kind radiating subassembly P that the utility model the 4th embodiment provides " ' other thin portion architectural features and previous embodiment similar, repeat no more in this appearance.
(the possible effect of embodiment)
In sum, the beneficial effects of the utility model can be, the radiating subassembly P that the utility model embodiment provides, P ', P ", P " ', by fixture 7 by sheet material 3,3 ' and loading plate 1 combine closely, avoid the sheet material 3,3 ' for carrying thin radiating fins 4 cannot effectively and the problem that fits tightly of chip unit 2 produce.In addition, the thermal diffusion radiating layer 42 provided in the utility model thin radiating fins 4 can be filled powder 423 by resin material 421, carbon composite 422 and thermal conductivity and formed, wherein carbon composite is diamond grains, synthetic graphite particles, carbon black granules, carbon fiber particles, Graphene, CNT (carbon nano-tube) or its group, and thermal conductivity fill powder 423 its be metallic, oxide particle, nitride particles or its group, thus thermal diffusion radiating layer can have heat conduction and thermal-radiating ability.By this, effectively and remove the heat that chip unit 2 produces in external environment rapidly, the effect of quick heat radiating can be reached.
The foregoing is only preferred possible embodiments of the present utility model, non-ly therefore limit to the scope of the claims of the present utility model, therefore the equivalence techniques change of such as using the utility model specification and graphic content to do, be all contained in protection range of the present utility model.
Claims (11)
1. a radiating subassembly, be arranged in order to dissipation one heat that the chip unit on a loading plate sends, it is characterized in that, described radiating subassembly comprises:
One sheet material, described sheet material is arranged on described loading plate, and described sheet material is positioned at the top of described chip unit, and wherein said sheet material has a heat dissipation region; And
One thin radiating fins, described thin radiating fins to be arranged on described sheet material and to be positioned in described heat dissipation region;
Wherein, the heat sequentially dissipation by described sheet material and described thin radiating fins that sends of described chip unit.
2. radiating subassembly according to claim 1, is characterized in that, described radiating subassembly also comprises an adhesion layer further, and described adhesion layer is arranged between described sheet material and described thin radiating fins.
3. radiating subassembly according to claim 1, is characterized in that, described radiating subassembly also comprises a heat-conducting medium layer further, and described heat-conducting medium layer is arranged between described chip unit and described sheet material.
4. radiating subassembly according to claim 1, is characterized in that, described thin radiating fins comprises a base material and a thermal diffusion radiating layer, and described thermal diffusion radiating layer is arranged on described base material, and described base material is arranged on described sheet material.
5. radiating subassembly according to claim 4, is characterized in that, described base material comprises a first substrate and a second substrate, and described thermal diffusion radiating layer is arranged between described first substrate and described second substrate.
6. radiating subassembly according to claim 5, is characterized in that, one of them of described first substrate and described both second substrates offers multiple being evenly distributed or the louvre of non-uniform Distribution.
7. radiating subassembly according to claim 1, is characterized in that, described thin radiating fins comprises a carbon composite, and wherein said carbon composite is diamond, Delanium, Graphene, CNT (carbon nano-tube), carbon black or carbon fiber.
8. radiating subassembly according to claim 1, it is characterized in that, described radiating subassembly also comprises a fixture further, described sheet material comprises a fixed area, described fixed area is positioned at the side of described heat dissipation region, wherein said fixture is arranged in described fixed area, and described loading plate and described sheet material are bonded to each other by described fixture.
9. radiating subassembly according to claim 8, is characterized in that, described radiating subassembly also comprises a flexible member further, and described flexible member is arranged on described sheet material, and described fixture is through described flexible member.
10. radiating subassembly according to claim 1, is characterized in that, described sheet material offers multiple being evenly distributed or the perforated holes of non-uniform Distribution.
11. 1 kinds of radiating subassemblies, it is arranged in order to dissipation one heat that the chip unit on a loading plate sends, and it is characterized in that, described radiating subassembly comprises:
One sheet material, described sheet material is arranged on described loading plate, and described sheet material is positioned at the top of described chip unit, and wherein said sheet material has a heat dissipation region; And
One thin radiating fins, described thin radiating fins to be arranged on described sheet material and to be positioned in described heat dissipation region;
Wherein, the heat sequentially dissipation by described thin radiating fins and described sheet material that sends of described chip unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520027588.XU CN204578942U (en) | 2015-01-15 | 2015-01-15 | Radiating subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520027588.XU CN204578942U (en) | 2015-01-15 | 2015-01-15 | Radiating subassembly |
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| CN204578942U true CN204578942U (en) | 2015-08-19 |
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| CN201520027588.XU Expired - Fee Related CN204578942U (en) | 2015-01-15 | 2015-01-15 | Radiating subassembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514059A (en) * | 2016-01-23 | 2016-04-20 | 北京大学 | Efficient cooling system of graphene composite/silicon nitride/silicon chip |
| WO2017079889A1 (en) * | 2015-11-10 | 2017-05-18 | 华为技术有限公司 | Thermally conductive adhesive, heat dissipation device of communication terminal and communication terminal |
-
2015
- 2015-01-15 CN CN201520027588.XU patent/CN204578942U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017079889A1 (en) * | 2015-11-10 | 2017-05-18 | 华为技术有限公司 | Thermally conductive adhesive, heat dissipation device of communication terminal and communication terminal |
| CN108353516A (en) * | 2015-11-10 | 2018-07-31 | 华为技术有限公司 | The radiator and communication terminal of a kind of heat conduction bonding agent, communication terminal |
| CN105514059A (en) * | 2016-01-23 | 2016-04-20 | 北京大学 | Efficient cooling system of graphene composite/silicon nitride/silicon chip |
| CN105514059B (en) * | 2016-01-23 | 2019-11-22 | 北京大学 | A kind of graphene composite material/silicon nitride/silicon chip high efficiency and heat radiation system |
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