CN208521249U - The ultra-thin computer main board insulating trip of heat radiating type - Google Patents
The ultra-thin computer main board insulating trip of heat radiating type Download PDFInfo
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- CN208521249U CN208521249U CN201821254982.7U CN201821254982U CN208521249U CN 208521249 U CN208521249 U CN 208521249U CN 201821254982 U CN201821254982 U CN 201821254982U CN 208521249 U CN208521249 U CN 208521249U
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- main board
- computer main
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- insulating trip
- polyimide film
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Abstract
The utility model discloses a kind of ultra-thin computer main board insulating trip of heat radiating type, including layers of two-sided, and by the first PET base material sum aggregate that the layers of two-sided is mutually bonded is thermally conductive and the polyimide film of insulation characterisitic one, the upper surface of the polyimide film is provided with metal foil layer, the upper surface of the metal foil layer is provided with PET composite heat conduction film, the upper surface of the polyimide film is additionally provided with one group of foam, and the thickness of the foam is greater than the sum of the PET composite heat conduction film and thickness of metal foil layer.The utility model has brilliant insulation effect；With brilliant heat insulation, it is ensured that the reliability of insulation；With brilliant heat dissipation effect, mainboard electronic component is protected；With gradient compressive property, part has high damping compression-resistant, has excellent performance, meet the requirements.
Description
Technical field
The utility model relates to computer peripheral accessories technical fields, particularly relate to a kind of with the ultra-thin of heat sinking function
Computer main board insulating trip.
Background technique
With the rapid development of electronics industry, application of the laptop in various fields is more and more wider, since function is got over
Come abundanter, so that product internal structure increasingly tends to complicate, electronic component develops to numerousization direction, since electronics produces
The extension of product function causes its structure to become increasingly complex multiplicity, and internal kinds of electronic components quantity is also more and more, sometimes together
One part need to combine multiple functions to save computer inner space, for example as computer main board insulating trip, currently on the market
Requirement other than needing to meet basic insulation, function of shielding, also to meet can play resistance to compression damping, heat-insulated thermally conductive etc. more
Kind different function.
The technique generally used in industry at present is all the single production of component for having different function above can only be mentioned
For relatively simple function, production in this way will cause a large amount of wasting of resources, at the same client using when also need repeatedly to be bonded, repeat
Workmanship.Such as Chinese patent application 201711382348.1 discloses a kind of computer main board radiating insulating piece, including off-style paper layer,
The off-style paper layer is equipped with insulation lamella, and the intermediate position between the off-style paper layer and insulation lamella is equipped with graphite linings, institute
It states between off-style paper layer and the lamella that insulate and is surrounded by support froth bed positioned at the graphite linings.Although graphite linings have compared with
High heat dissipation effect, but its manufacture is more inconvenient, size Control is relatively difficult, and is easily broken off since it is more crisp.
In addition, due to the characteristic of material, insulating properties can be with the shadow of temperature using the lamella that insulate made of PET material
It rings and dies down.Therefore, realize that heat insulation and dissipation is a problem to be solved of current insulating trip well.
Utility model content
The purpose of the utility model is to overcome the shortcomings of the prior art, provide a kind of super with heat insulation and dissipation function
Thin computer main board insulating trip.
The purpose of this utility model is achieved through the following technical solutions:
A kind of ultra-thin computer main board insulating trip of heat radiating type, including layers of two-sided, and be mutually bonded by the layers of two-sided
The thermally conductive polyimide film with insulation characterisitic one of first PET base material sum aggregate, first PET base material and polyimide film
And layers of two-sided outer profile is identical and outer profile on include at least one for producing and installing the locating slot of positioning；
The upper surface of the polyimide film is provided with metal foil layer, and the upper surface of the metal foil layer is provided with PET composite heat-conducting
Film, the upper surface of the polyimide film are additionally provided with one group of foam, and the thickness of the foam is greater than the PET composite heat-conducting
The sum of film and the thickness of metal foil layer.
Preferably, between the PET composite heat conduction film and metal foil layer, the metal foil layer and polyimide film it
Between, between the foam and polyimide film be all made of two-sided glue sticking.
Preferably, the upper surface of the PET composite heat conduction film and foam is additionally provided with one layer of double-sided adhesive, is used for and computer master
Plate bonding.
Preferably, the metal foil layer includes two fins, and the fin stretches out in the profile of the polyimide film
Boundary.
It preferably, include at least one elongated slot in the fin.
Preferably, two sides of the PET composite heat conduction film respectively with the first side of the polyimide film and
Second side flushes, and the fin stretches out the first side and second side respectively.
Preferably, the consistent hollow out of electronic component profile with computer main board protrusion is provided on the polyimide film
Portion.
Preferably, insulation Air Filter identical with its shape, the height of the insulation Air Filter are provided in the hollow-out parts
Degree is lower than the height of the hollow-out parts.
Preferably, the outer profile of the polyimide film be in rectangle, the foam be arranged at its it is diagonal on.
Preferably, the following table of first PET base material, which faces out, is disposed with flame-retardant layer, antistatic layer, anti-scratch layer,
And it is consistent with the outer contour shape of first PET base material.
The beneficial effects of the utility model are mainly reflected in:
1, with brilliant insulation effect；
2, with brilliant heat insulation, it is ensured that the reliability of insulation；
3, with brilliant heat dissipation effect, mainboard electronic component is protected；
4, there is gradient compressive property, part has high damping compression-resistant, has excellent performance, meet the requirements；
5, have good dimensional stability, thermal stability, chemical stability, tack and hold viscosity it is good；
6, hollowed out area plays a very good protection to the electronic component on mainboard, greatly in saving laptop
The space in portion；
7, dust tightness, anti-flammability, antistatic property and the hardness of its own are selectively promoted.
Detailed description of the invention
Technical solutions of the utility model are described further with reference to the accompanying drawing:
Fig. 1: the perspective view of the explosion of the utility model embodiment；
Fig. 2: the schematic perspective view of the utility model embodiment.
Specific embodiment
The utility model is described in detail below with reference to specific embodiment shown in the drawings.But these embodiment party
Formula is not limited to the utility model, structure that those skilled in the art are made according to these embodiments, method or
Transformation functionally is all contained in the protection scope of the utility model.
As depicted in figs. 1 and 2, the utility model discloses a kind of ultra-thin computer main board insulating trip of heat radiating type, including two-sided
Glue-line 2, and the thermally conductive polyimides with insulation characterisitic one of 1 sum aggregate of the first PET base material by 2 phase of layers of two-sided bonding
Film layer 3, the layers of two-sided 2 are covered in first PET base material 1 and are completely coincident with it, and the polyimide film 3 covers
It covers in the layers of two-sided 2 and is completely coincident with it.In the present embodiment, first PET base material 1, polyimide film 3,
Layers of two-sided 2 is in black.First PET base material 1 has good insulation effect.
The ceramic powder for having weight percent to be not less than 30%, institute are added in the present embodiment, in the polyimide film 3
Stating ceramic powder has thermally conductive and insulation double attribute, and the granularity of the ceramic powder is not higher than 1000 nanometers.Specifically,
The polyimide film 3 in parts by weight, is made of the following components: 100 parts of polyimide resin, and the two of 60 parts
Methylformamide, 1 part to ten acid dimethyl sodium and 10~35 parts of nanometer silicon carbide；It is described to ten acid dimethyls
Na concn mass percent is 1%.Biaxial tension is made after the polyimide film 3 is mixed by raw material.
The characteristics of the utility model, is that the upper surface 32 of the polyimide film 3 is provided with metal foil layer 11, described
The upper surface 32 of metal foil layer 11 is provided with PET composite heat conduction film 4.As shown in connection with fig. 2, the metal foil layer 11 includes two wings
Piece 12, two sides of the PET composite heat conduction film 4 respectively with the first side 33 of the polyimide film 3 and second side
Side 34 flushes, and the fin 12 stretches out the first side 33 and second side 34 respectively.The metal foil layer 11 is thermal conductivity
In the metal alloy of 50W/mK or more, metallic copper is generally used, is made by way of calendering, height is not higher than 0.1mm.Copper
The unilateral or bilateral surface layer of foil is handled by functional coating, and processing technique includes to be coated with the mixed oil such as graphite, ceramic material
Black material, improves the surface oxidation-resistant performance and heating conduction of copper foil, and the effect of coating is also possible to improve the machinery of copper foil
Intensity improves tensile strength and modulus.
The fin 12 of the metal foil layer 11 stretches out the outer outline area of polyimide film 3, can be quickly by heat
It takes away, certainly preferably reaches fin on the fan on computer main board.It include an elongated slot 13 in the fin 12, it can also
Be it is a plurality of, increase fin 12 heat dissipation area, heat sinking function is better achieved.
The ceramic powder for having weight percent to be not less than 30%, of the ceramic powder are added in the composite heat conduction film 4
Granularity is not higher than 1000 nanometers.The composite heat conduction film 4 in parts by weight, is made of the following components: 40 parts of PET resins,
5 parts of PBT resins, 2 parts of alkene of core-shell type active carbon intercalated graphite, 15 parts of glass fibre, 15 parts of thermal conducting agent.The thermal conducting agent is oxidation
Magnesium or aluminium nitride.
In this way, passing through the effect of composite heat conduction film 4, metal foil layer 11 and polyimide film 3, when the computer main board is exhausted
Embolium has reached brilliant heat insulation and dissipation effect in use, the heat on mainboard can be taken away rapidly.After heat becomes smaller,
The first PET base material 1 can be more set to realize brilliant insulation effect.
First PET base material 1 is identical with the outer profile of polyimide film 3 and layers of two-sided 2 and outer profile
On include at least one for producing and installing the locating slot 6 of positioning.This is because existing insulating trip is substantially manual patch
It is attached on computer main board, after the utility model includes locating slot 6, can be attached automatically using mechanical automation, the locating slot 6
For benchmark.
Be provided on the polyimide film 3 with the consistent hollow-out parts 31 of the electronic component profile of computer main board protrusion,
So that the layers of two-sided 2 is mutually directly contacted with the electronic component of computer main board protrusion.In this way, hollowed out area is to the electricity on mainboard
Subcomponent plays a very good protection, greatly the space inside saving laptop.It is described double in actual product
Face glue-line 2 can play the role of the electronic component being bonded on first PET base material 1 and mainboard, in this way, the first PET base first
Material 1 is totally enclosed structure, can generate insulation effect to the electronic component on mainboard；Secondly, layers of two-sided 2 can prevent first
Electronic component in PET base material 1 and mainboard mutually disengages and dust is caused to enter, so that insulation effect is deteriorated.
Further, insulation Air Filter 7 identical with its shape, the insulation Air Filter are provided in the hollow-out parts 31
7 height is lower than the height of the hollow-out parts 31.7 one side end face of insulation Air Filter described in this way is adhered to the layers of two-sided 2
On, the other side is tightly attached to the upper surface of the electronic component of computer main board protrusion.In this way, hollowed out area is in addition to the electronics on mainboard
Element plays a protective role outer, moreover it is possible to better play a dust-proof effect, not be very good for using time long leakproofness
Computer for, it is dust-proof particularly important.
Another feature of the utility model is that the upper surface 32 of the polyimide film 3 is additionally provided with one group of foam 5,
The shape of the foam 5 is different, thickness is different, has gradient compressive property, and part has high damping compression-resistant, has excellent performance.Institute
The thickness for stating foam 5 is greater than the sum of the PET composite heat conduction film 4 and thickness of metal foil layer 11.Foam 5 is playing damping effect in this way
The use of metal foil layer 11 is not interfered with when fruit.In the present embodiment, the outer profile of the polyimide film 3 is in rectangle, institute
Foam 5 is stated to be arranged in its diagonal sum middle portion location.In this way for loading angle, damping effect is best.
In the present embodiment, between the PET composite heat conduction film 4 and metal foil layer 11, the metal foil layer 11 and polyamides it is sub-
Two-sided glue sticking is all made of between amine film layer 3, between the foam 5 and polyimide film 3.4 He of PET composite heat conduction film
The upper surface of foam 5 is additionally provided with one layer of double-sided adhesive, for Nian Jie with computer main board.
The insulating trip of the utility model can also selectively be promoted dust tightness, anti-flammability, antistatic property and its own
Hardness.As shown in Figure 1, the following table of first PET base material 1, which faces out, is disposed with flame-retardant layer 8, antistatic layer 9, anti-scratch
Layer 10, and it is consistent with the outer contour shape of first PET base material 1, it is mutually bonded between each layer.In the utility model, institute
The flame-retardant layer 8 stated is using acrylic resin.The antistatic layer 9 is the PET release film that antistatic process is crossed.Described
Anti-scratch layer 10 is organic siliconresin.In this way, the performance of the insulating trip of the utility model will more optimize.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiments of understanding.
Tool of the series of detailed descriptions listed above only for the feasible embodiment of the utility model
Body explanation, they are all without departing from made by the utility model skill spirit not to limit the protection scope of the utility model
Equivalent implementations or change should be included within the scope of protection of this utility model.
Claims (10)
1. the ultra-thin computer main board insulating trip of heat radiating type, it is characterised in that: including layers of two-sided (2), and by the layers of two-sided
(2) the thermally conductive polyimide film (3) with insulation characterisitic one of the first PET base material (1) sum aggregate being mutually bonded, the first PET
Substrate (1) is identical with the outer profile of polyimide film (3) and layers of two-sided (2) and outer profile on include at least one
For producing and installing the locating slot (6) of positioning；The upper surface (32) of the polyimide film (3) is provided with metal foil layer
(11), the upper surface (32) of the metal foil layer (11) is provided with PET composite heat conduction film (4), the polyimide film (3)
Upper surface (32) is additionally provided with one group of foam (5), and the thickness of the foam (5) is greater than the PET composite heat conduction film (4) and metal
The sum of the thickness of layers of foil (11).
2. the ultra-thin computer main board insulating trip of heat radiating type according to claim 1, it is characterised in that: the PET composite heat-conducting
Between film (4) and metal foil layer (11), between the metal foil layer (11) and polyimide film (3), the foam (5) and poly-
Acid imide film layer is all made of two-sided glue sticking between (3).
3. the ultra-thin computer main board insulating trip of heat radiating type according to claim 1, it is characterised in that: the PET composite heat-conducting
The upper surface of film (4) and foam (5) is additionally provided with one layer of double-sided adhesive, for Nian Jie with computer main board.
4. the ultra-thin computer main board insulating trip of heat radiating type according to claim 1, it is characterised in that: the metal foil layer (11)
Including two fins (12), the fin (12) stretches out in the profile and border of the polyimide film (3).
5. the ultra-thin computer main board insulating trip of heat radiating type according to claim 4, it is characterised in that: packet in the fin (12)
Include at least one elongated slot (13).
6. the ultra-thin computer main board insulating trip of heat radiating type according to claim 5, it is characterised in that: the PET composite heat-conducting
Two sides of film (4) are flushed with the first side (33) of the polyimide film (3) and second side (34) respectively, described
Fin (12) stretches out the first side (33) and second side (34) respectively.
7. the ultra-thin computer main board insulating trip of heat radiating type according to any one of claims 1 to 6, it is characterised in that: the polyamides
The consistent hollow-out parts of electronic component profile (31) with computer main board protrusion are provided in imines film layer (3).
8. the ultra-thin computer main board insulating trip of heat radiating type according to claim 7, it is characterised in that: in the hollow-out parts (31)
It is provided with insulation Air Filter (7) identical with its shape, the height of insulation Air Filter (7) is lower than the hollow-out parts (31)
Highly.
9. the ultra-thin computer main board insulating trip of heat radiating type according to claim 1, it is characterised in that: the polyimide film
(3) outer profile be in rectangle, the foam (5) be arranged at its it is diagonal on.
10. the ultra-thin computer main board insulating trip of heat radiating type according to claim 1, it is characterised in that: first PET base material
(1) following table, which faces out, is disposed with flame-retardant layer (8), antistatic layer (9), anti-scratch layer (10), and with the first PET
The outer contour shape of substrate (1) is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821254982.7U CN208521249U (en) | 2018-08-06 | 2018-08-06 | The ultra-thin computer main board insulating trip of heat radiating type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821254982.7U CN208521249U (en) | 2018-08-06 | 2018-08-06 | The ultra-thin computer main board insulating trip of heat radiating type |
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| Publication Number | Publication Date |
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| CN208521249U true CN208521249U (en) | 2019-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821254982.7U Active CN208521249U (en) | 2018-08-06 | 2018-08-06 | The ultra-thin computer main board insulating trip of heat radiating type |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108710425A (en) * | 2018-08-06 | 2018-10-26 | 苏州益邦电子材料有限公司 | The ultra-thin computer main board insulating trip of heat radiating type |
-
2018
- 2018-08-06 CN CN201821254982.7U patent/CN208521249U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108710425A (en) * | 2018-08-06 | 2018-10-26 | 苏州益邦电子材料有限公司 | The ultra-thin computer main board insulating trip of heat radiating type |
| CN108710425B (en) * | 2018-08-06 | 2024-03-01 | 苏州益邦电子材料有限公司 | Heat dissipation type ultrathin computer motherboard insulating sheet |
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