CN205920959U - Temperature of air conditioner controller chip is reduced radiator and air conditioner - Google Patents
Temperature of air conditioner controller chip is reduced radiator and air conditioner Download PDFInfo
- Publication number
- CN205920959U CN205920959U CN201620490239.6U CN201620490239U CN205920959U CN 205920959 U CN205920959 U CN 205920959U CN 201620490239 U CN201620490239 U CN 201620490239U CN 205920959 U CN205920959 U CN 205920959U
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- Prior art keywords
- radiator
- controller chip
- heat
- graphene
- layer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Abstract
The utility model discloses a reducing the radiator of air conditioner controller chip temperature and using the air conditioner of this radiator, this radiator includes aluminium system heat dissipation body and graphite alkene dope layer, graphite alkene dope layer is attached to the surface of aluminium system heat dissipation body, this air conditioner includes mainboard, controller chip and radiator, controller chip passes through chip fin and installs on the mainboard, controller chip's upper surface setting is hugged closely to the radiator, and the radiator is foretell radiator. The utility model discloses a surface at aluminium system heat dissipation body adheres to graphite alkene dope layer, increases the slin emissivity of whole radiator to increase the radiating efficiency, make air conditioner controller chip's temperature reduce speed obtain fine improvement, not only can increase the life of chip, can also improve the reliability of air conditioner complete machine, reduce the size of radiator, optimize structural design, reduce the manufacturing cost of radiator.
Description
Technical field
This utility model is related to a kind of technical field of heat dissipation, especially a kind of radiating reducing air-conditioner controller chip temperature
Device, and the air-conditioning using this radiator.
Background technology
With scientific and technological development, electronic product is increasingly intelligent and complicates, and the volume of electronic component tends to microminiaturization, unit
Component density on area is more and more high.For air-conditioner controller, because air-conditioning needs multiple chips in running
Support, these chips can produce very big heat in running, must carry out cooling process during use, to ensure
The normal operation of chip, especially in bad working environments, becomes apparent to the demand of cooling.
At present, the radiating of the controller chip of domestic air conditioning, especially convertible frequency air-conditioner mostly adopts Aluminium Radiator real
Existing, such as rectifier bridge, radiator of igbt etc..The design of radiator needs the temperature requirement operationally waited with chip, Yi Jikong
Premised on adjusting indoor set and the structure of off-premises station, meanwhile, chip runs in the too high environment of temperature, can greatly reduce controller
The service life of chip.In prior art, common Aluminium Radiator is above the electrical appliance kit within air-conditioning or internal, due to knot
The impact of structure design it is impossible to radiator is installed additional with forced-convection heat transfer fan, thus leading to the common Aluminium Radiator of air-conditioning
Radiation processes major part is to be carried out by way of heat transfer free convection and heat loss through radiation.Therefore, in order to prevent airconditioning control
Device chip temperature is too high, that is, in order to ensure good radiating effect, it is to avoid due to radiate the bad chip temperature causing too high and
Produce high temperature protection or air-conditioning frequency reducing operation etc., on the one hand, designer passes through to increase heat sink size size, that is, scattered by increasing
Hot area is to realize more preferable radiating effect, but this design can increase the volume of electrical appliance kit, increases the complex structure of air-conditioning
Degree, increased the overall construction design difficulty of air-conditioning；On the other hand, by Aluminium Radiator surface is carried out oxidation processes,
Increase slin emissivity, but the effect that this improved procedure obtains is unsatisfactory, air-conditioner controller chip cooling still can not meet
Produce and need.
Utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies in the prior art, provides a kind of radiating effect preferable
Reduction air-conditioner controller chip temperature radiator, and using this radiator air-conditioning.
For solving above-mentioned technical problem, this utility model using the basic conception of technical scheme is:
On the one hand, embodiment of the present utility model discloses a kind of radiator reducing air-conditioner controller chip temperature, bag
Include heat radiator body and graphene layer, described graphene layer is attached to the outer surface of heat radiator body.
Further, the partly non-cohesive graphene layer that described heat radiator body is contacted with chip.
Further, the adhesive strength of described graphene layer is: iso grade 0, astm class 5 b.
Further, described graphene layer passes through spraying or brushing is attached to heat radiator body outer surface.
Further, described graphene layer is pure Graphene coating or the composite coating containing Graphene.
Further, the position that described graphene layer is contacted with chip positioned at heat radiator body.
Further, described graphene layer is single-layer graphene or the heat conducting film comprising Graphene.
Further, the thickness of described Graphene dope layer is 30 microns.
Further, the slin emissivity of described graphene layer is more than 0.95.
Further, the outer surface frosted of described heat radiator body is processed.
On the other hand, embodiment of the present utility model also discloses a kind of air-conditioning, and it includes mainboard, controller chip and dissipates
Hot device, described controller chip is arranged on mainboard by chip pin, and the surface that described radiator is close to controller chip sets
Put, described radiator is any one radiator above-mentioned.
After technique scheme, this utility model compared with prior art has the advantages that
This utility model passes through to adhere to Graphene dope layer in the outer surface of aluminum heat radiator body, increases whole radiator
Slin emissivity, thus increasing radiating efficiency, makes the temperature reducing rate of air-conditioner controller chip be improved well, not only
The service life of chip can be increased, the reliability of air conditioner can also be improved, reduce the size of radiator, optimize structure and set
Meter, reduces the production cost of radiator.
Below in conjunction with the accompanying drawings specific embodiment of the present utility model is described in further detail.
Brief description
Fig. 1 is the structural representation of this utility model one embodiment；
Fig. 2 is the structural representation of the another embodiment of this utility model.
Wherein, 1, graphene layer, 2, heat radiator body, 3, controller chip, 4, chip pin, 5, mainboard.
Specific embodiment
As shown in figure 1, an embodiment of the present utility model discloses a kind of dissipating of reduction air-conditioner controller chip temperature
Hot device, including heat radiator body 2 and graphene layer 1, described graphene layer 1 is attached to the outer surface of heat radiator body 2.The present embodiment leads to
Cross in common heat radiator body surface attachment graphene layer, using the high feature of the heat conductivity of Graphene, increase heat radiator body
Slin emissivity, compared with common coating, the thermal contact resistance between coating and metal is relatively low, and coating material is graphene layer itself
Thermal resistance less, preferably, radiating effect is more preferable for heat conductivility.
This is because in the case of being not provided with forced-convection heat transfer fan, chip cooling is mainly by the side of heat loss through radiation
Formula is realized, and the principal element affecting heat loss through radiation is exactly the slin emissivity of radiator, specifically, existing heat radiator body table
Surface launching rate is very low, and, its slin emissivity only 0.05 about, leads to spoke after testing taking smooth Aluminium Radiator as a example
Penetrate power very low, radiating effect is poor；After aluminum material surface oxidation, its slin emissivity is also only up to 0.3；Surface applies
After common coating, slin emissivity improves, but coating itself heat conductivity is low, integrates the raising to radiating efficiency
Help and little.After the present embodiment attachment Graphene dope layer, slin emissivity highest can reach 0.99, and itself heat conduction system
Number is also very high, and horizontal direction can reach 5300w/m.k, and vertical direction even can reach more than 10w/m.k.
Preferred as above-described embodiment, described graphene layer is arranged on heat radiator body outer surface, and heat radiator body and core
, it is preferable that being the adhesive strength ensureing graphene layer, graphene layer can be by spray for the partly non-cohesive graphene layer of piece contact
The mode applying or brushing makes it firmly be attached to the outer surface of heat radiator body, in production, typically requires the attachment of graphene layer strong
Spend for iso grade: 0, astm grade: 5b.On the premise of this adhesive strength, the thickness of graphene layer can select according to species
Different-thickness, typically can be in 30 microns.
Further, the coating of doped graphene, it has the slin emissivity of super large and higher heat conductivity, because
This, graphene layer can be pure Graphene coating or the composite coating containing Graphene.Specifically, graphene layer
Slin emissivity is more than 0.95, preferably more than 0.98, you can meet the cooling requirements of air-conditioner controller chip.
As shown in Fig. 2 in another embodiment of the present utility model, the position that graphene layer is contacted with chip positioned at heat radiator body
Put.The present embodiment adopts graphene layer as thermal interfacial material, is positioned between chip and radiator, Graphene is as heat conducting film
There is outstanding heat conductivility in the horizontal direction, rapidly by heat diffusion, and heat radiator body can be conducted to, finally by
The mode of heat convection or heat loss through radiation distributes.
Preferably, graphene layer can be single-layer graphene or the heat conducting film comprising Graphene.
It is further preferred that the present embodiment can the embodiment shown in Fig. 1 be combined, that is, in the other parts of heat radiator body
Spraying or brushing graphene layer, the position contacting with chip in heat radiator body disposes graphene layer as thermal interfacial material.Permissible
Realize more preferable radiating effect.
Taking aluminum heat radiator body as a example, although the Aluminium Radiator of common idle call has had preferable heat conductivility,
, probably in 239w/m.k, aluminium alloy class heat conductivity is lower for the heat conductivity of fine aluminium.And the heat conductivity of single-layer graphene then can
Enough reach 5300w/m.k.The heat conductivity of the finished product of Graphene heat conducting film commonly made also have 2000w/m.k about heat conduction
Coefficient.Heat conductivility, considerably beyond aluminum, Graphene heat conducting film is put into as thermal interfacial material between chip and radiator, can
The scattering of even heat chip being produced with general higher than common Aluminium Radiator 10 times of speed.
Additionally, using the graphene layer of the present embodiment, can also avoid not exclusively connecing between common heat radiator body and chip
The thermal resistance problems of too that touch, there is micro-air and lead to, compared with tradition painting heat-conducting cream, it may have very big advantage, existing
The heat conductivity of heat-conducting cream be substantially all in 2w/m.k, the heat conductivity that some add the heat-conducting cream of argentum powder also exists at most
5w/m.k, the relatively low transmission hindering heat of heat conductivity, and the heat conductivity of graphene layer is significantly larger than heat-conducting cream.
It is further preferred that in another embodiment of the present utility model, on the premise of attachment Graphene dope layer, first
Frosted process is done to the outer surface of aluminum heat radiator body, more preferable radiating effect can be reached.First contrast of the present utility model
In example, the radiator of air-conditioner controller chip is Aluminium Radiator, spreader surface flat smooth, and its slin emissivity is 0.02
Left and right, heat conductivity is the heat conductivity of fine aluminium, probably in 237w/m.k about；In the second comparative example of the present utility model,
Compared with the first comparative example, spreader surface first passes through frosted and processes, and after testing, its slin emissivity is 0.3 about, heat conduction system
Number is the heat conductivity of fine aluminium, probably in 237w/m.k about；In the 3rd comparative example of the present utility model, in Aluminium Radiator
Surface be coated with black paint, after testing, its slin emissivity be 0.9 about, heat conductivity be paint heat-conducting layer heat conduction
Coefficient, general 0.05w/m.k, in three comparative examples, the volume of radiator is identical.
In an embodiment of the present utility model, there is provided a kind of air-conditioning, this air conditioner structure is as shown in figure 1, it includes mainboard
5th, controller chip 3 and radiator, controller chip 3 is arranged on mainboard 5 by chip pin 4, upper in controller chip 3
Surface arranges radiator, and based on aluminum heat radiator body 2, the one side of aluminum heat radiator body 2 is tightly fitted in control to this radiator
The upper surface of device chip 3, the other parts outer surface of aluminum heat radiator body 2 is coated with pure Graphene by way of spraying and applies
Material, thus forming graphene layer 1 in aluminum heat radiator body outer surface, the thickness of graphene layer is 30 microns, adhesive strength
For iso grade: 0, astm grade: 5b, the slin emissivity of this Graphene dope layer is more than 0.95, and heat conductivity is Graphene
The heat conductivity of heat-conducting layer, about 5w/m.k, significantly larger than comparative example.
In the air-conditioning that another embodiment of the present utility model provides, the graphite that are, adopted different from a upper embodiment
Alkene layer is the composite coating containing Organic substances such as graphene powder, resins, and the thickness of graphene layer is 30 microns, and attachment is strong
Spend for iso grade: 0, astm grade: 5b, the slin emissivity of this Graphene dope layer is more than 0.95, and heat conductivity is 5w/
More than m.k.
The air conditioner structure that another embodiment of the present utility model provides is as shown in Fig. 2 the radiator of this air-conditioning includes radiating
Body and graphene layer, and the part that graphene layer is contacted with chip positioned at heat radiator body.The thickness of graphene layer heat conducting film can
Arrive millimeter to be tens microns, the area according to chip and the surface roughness of radiator are determining it is ensured that heat conducting film
It is clipped between chip and radiator, will not have the presence of air by extruding.When chip produces heat, heat passes through Graphene
Outstanding heat conductivility in heat conducting film horizontal direction, rapidly by the heat transfer of thermal source to whole heat conducting film, makes entirely to lead
Hotting mask is in an equal temperature state, is distributed heat by radiator afterwards.
The size of heat conducting film can determine in two ways, and a kind of chip area with chip and radiator contact surface is as base
Standard, another kind is on the basis of the area of the bottom of the radiator that radiator is contacted with chip.If with the area of chip as base
Standard, then directly heat conducting film is placed in the middle of chip and radiator, to fix by way of screw extrudes.If
It is defined by the area of radiator, then as needed heat dissipation film can be fixed on spreader surface by glue, or adopt other
Structure heat dissipation film is fixed on above radiator.The thermal resistance of glue itself may hinder heat transfer, so glue is to utilize
Just use when other structures cannot be fixed.Because the heat-conducting effect of Graphene heat conducting film is very good, therefore, it is possible to by chip
The heat producing spreads rapidly, prevents heat build-up, improves service life and the reliability of chip.
In sum, embodiment provided by the utility model is passed through to adhere to graphene layer, increased traditional heat-dissipating body
Slin emissivity, thus increased radiator heat loss through radiation efficiency it is ensured that air-conditioner controller chip at a lower temperature
Run, it is to avoid cause because temperature is too high overheat protector and frequency reducing to run, meanwhile, increased the service life of controller chip,
Reduce the size of radiator, the overall volume of electrical appliance kit reduces, and is that air conditioner structure design optimization has laid good basis.
Embodiment in above-described embodiment can be further combined or replace, and embodiment is only new to this practicality
The preferred embodiment of type is described, and not spirit and scope of the present utility model is defined, new without departing from this practicality
On the premise of type design philosophy, various change that professional and technical personnel in the art make to the technical solution of the utility model and
Improve, belong to protection domain of the present utility model.
Claims (10)
1. a kind of reduce air-conditioner controller chip temperature radiator it is characterised in that it includes heat radiator body and graphene layer,
Described graphene layer is attached to the outer surface of heat radiator body, the partly non-cohesive Graphene that described heat radiator body is contacted with chip
Layer.
2. a kind of radiator reducing air-conditioner controller chip temperature according to claim 1 is it is characterised in that described stone
The adhesive strength of black alkene layer is: iso grade 0, astm class 5 b.
3. according to claim 1 and 2 a kind of reduce air-conditioner controller chip temperature radiator it is characterised in that: institute
State graphene layer to pass through to spray or brush to be attached to heat radiator body outer surface.
4. a kind of radiator reducing air-conditioner controller chip temperature according to claim 3 is it is characterised in that described stone
Black alkene layer is pure Graphene coating or the composite coating containing Graphene.
5. a kind of radiator reducing air-conditioner controller chip temperature according to claim 1 is it is characterised in that described stone
The position that black alkene layer is contacted with chip positioned at heat radiator body.
6. a kind of radiator reducing air-conditioner controller chip temperature according to claim 5 is it is characterised in that described stone
Black alkene layer is single-layer graphene or the heat conducting film comprising Graphene.
7. according to claim 1 or 5 a kind of radiator reducing air-conditioner controller chip temperature it is characterised in that institute
The thickness stating graphene layer is 30 microns.
8. according to claim 1 or 5 a kind of radiator reducing air-conditioner controller chip temperature it is characterised in that institute
The slin emissivity stating graphene layer is more than 0.95.
9. a kind of radiator reducing air-conditioner controller chip temperature according to claim 1 is it is characterised in that described dissipate
The outer surface frosted of hot body is processed.
10. it is characterised in that it includes mainboard, controller chip and radiator, described controller chip passes through core to a kind of air-conditioning
Piece pin is arranged on mainboard, and described radiator is close to the upper surface setting of controller chip, and described radiator is any of the above-described
Radiator described in claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620490239.6U CN205920959U (en) | 2016-05-25 | 2016-05-25 | Temperature of air conditioner controller chip is reduced radiator and air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620490239.6U CN205920959U (en) | 2016-05-25 | 2016-05-25 | Temperature of air conditioner controller chip is reduced radiator and air conditioner |
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| CN205920959U true CN205920959U (en) | 2017-02-01 |
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| CN201620490239.6U Expired - Fee Related CN205920959U (en) | 2016-05-25 | 2016-05-25 | Temperature of air conditioner controller chip is reduced radiator and air conditioner |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107202353A (en) * | 2017-08-05 | 2017-09-26 | 袁小强 | The controller of lampblack absorber |
| CN108663876A (en) * | 2017-04-01 | 2018-10-16 | 江苏艾洛维显示科技股份有限公司 | A kind of cooling fin with graphite ene coatings |
| CN109030727A (en) * | 2018-06-25 | 2018-12-18 | 湖州博立科技股份有限公司 | Vehicle intelligent data acquisition device |
| CN109302828A (en) * | 2018-08-23 | 2019-02-01 | 广东思泉新材料股份有限公司 | A kind of heat radiation type heat dissipation handware and preparation method thereof for electronic product |
| CN110300508A (en) * | 2019-06-24 | 2019-10-01 | 上海正泰电源系统有限公司 | Applied to the graphene radiator and preparation method thereof in photovoltaic combining inverter |
| CN110873538A (en) * | 2018-09-01 | 2020-03-10 | 广西大学 | Graphene reinforced heat exchange type automobile engine finned tube radiator |
| CN112164680A (en) * | 2020-08-24 | 2021-01-01 | 杰群电子科技（东莞）有限公司 | Bare chip packaging structure and packaging method thereof |
-
2016
- 2016-05-25 CN CN201620490239.6U patent/CN205920959U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108663876A (en) * | 2017-04-01 | 2018-10-16 | 江苏艾洛维显示科技股份有限公司 | A kind of cooling fin with graphite ene coatings |
| CN107202353A (en) * | 2017-08-05 | 2017-09-26 | 袁小强 | The controller of lampblack absorber |
| CN109030727A (en) * | 2018-06-25 | 2018-12-18 | 湖州博立科技股份有限公司 | Vehicle intelligent data acquisition device |
| CN109302828A (en) * | 2018-08-23 | 2019-02-01 | 广东思泉新材料股份有限公司 | A kind of heat radiation type heat dissipation handware and preparation method thereof for electronic product |
| CN110873538A (en) * | 2018-09-01 | 2020-03-10 | 广西大学 | Graphene reinforced heat exchange type automobile engine finned tube radiator |
| CN110300508A (en) * | 2019-06-24 | 2019-10-01 | 上海正泰电源系统有限公司 | Applied to the graphene radiator and preparation method thereof in photovoltaic combining inverter |
| CN112164680A (en) * | 2020-08-24 | 2021-01-01 | 杰群电子科技（东莞）有限公司 | Bare chip packaging structure and packaging method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170201 |
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| CF01 | Termination of patent right due to non-payment of annual fee |