CN107201216A - Controllable heat-conducting interface material of a kind of viscosity and preparation method and application - Google Patents
Controllable heat-conducting interface material of a kind of viscosity and preparation method and application Download PDFInfo
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- CN107201216A CN107201216A CN201710328511.XA CN201710328511A CN107201216A CN 107201216 A CN107201216 A CN 107201216A CN 201710328511 A CN201710328511 A CN 201710328511A CN 107201216 A CN107201216 A CN 107201216A
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- heat
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- conducting interface
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention provides controllable heat-conducting interface material of a kind of viscosity and preparation method and application.The controllable heat-conducting interface material of the viscosity includes the heat-conductive body layer and face coat of close adhesion, and the heat-conductive body layer is 5 in mass ratio by organic siliconresin and micron order conduction powder:95‑40:60 are mixed to form, and the face coat is 60 in mass ratio by organic siliconresin and nanoscale conduction powder:40‑99.99:0.01 is mixed to form.The controllable heat-conducting interface material of the viscosity has good compressibility of materials energy and heat conductivility, and thermal resistance is small, and it is low to prepare cost.
Description
Technical field
The invention belongs to boundary material field, it is related to controllable heat-conducting interface material of a kind of viscosity and preparation method thereof with answering
With.
Background technology
As electronic device becomes less and less, the speed of service is more and more faster, and the energy distributed in the form of heat acutely increases.
The Changjiang river heat-conducting interface material is used for heater members, the excessive heat that transfer interface is dissipated in the industry.
And it is current, in heat-conducting interface material field, the requirement with the development client of industry to product is occurred in that significantly
Change：First, in addition to the requirement of high heat conduction, client increasingly pays close attention to the compressible of the compression performance of material, particularly product
Property, compression stress and compressive residual stress.Customer requirement material will not only have high compressibility, and have low-down pressure
Stress under compression and compressive residual stress.This requires the increasing feature for being defined as material.Secondly, client is increasingly closed
Note the application portability of material.Material will be easily peeled off, while not having stretcher strain problem.Furthermore, different clients are even
Same client is when using with a heat-conducting pad material, it is desirable to which heat-conducting pad material will have dramatically different surface viscosity
Meet its different application scene demand.
In order to meet compressibility requirement of the client to material, it is frequently necessary to when material prescription is designed by expendable material
Thermal conductivity is exchanged for, and this can cause the increase of product cost.Moreover, in order to meet compressibility requirement of the client to material,
Often the hardness control of material, at one, than relatively low scope, this can cause material to be difficult to peel off again, it is difficult to using.In order to
Problem above is solved, laird completely newly develops the sticky control technology of a heat-conducting pad material surface, by being applied in product surface
Cloth organic siliconresin realizes the control to the surface viscosity of material.But how increased surface coating layer can reduce the heat conduction of material
Property, it is less than the ultra-thin heat-conducting interface materials of 10mil especially for thickness.
Therefore, a kind of new heat-conducting interface material is researched and developed, can also be protected while compressibility of materials energy and viscosity is met
The heat conductivility for demonstrate,proving material is extremely urgent.
The content of the invention
In view of the shortcoming of above-mentioned prior art, it is an object of the invention to provide a kind of controllable heat-conducting interface material of viscosity
And preparation method and application, the controllable heat-conducting interface material of the viscosity has good compressibility of materials energy and heat conductivility,
Thermal resistance is small, and it is low to prepare cost.
In order to reach foregoing goal of the invention, the present invention provides a kind of viscosity controllable heat-conducting interface material, and the viscosity can
The heat-conducting interface material of control includes the heat-conductive body layer and face coat of close adhesion, and the heat-conductive body layer is by organic siliconresin
It is 5 in mass ratio with micron order conduction powder:95-40:60 are mixed to form, and the face coat is by organic siliconresin and nanoscale
Conduction powder is 60 in mass ratio:40-99.99:0.01 is mixed to form.
In the controllable heat-conducting interface material of above-mentioned viscosity, the organic siliconresin can common are machine silicon for this area
Resin.
The controllable heat-conducting interface material of above-mentioned viscosity, by the formula of organic siliconresin in control surface coating and organic
Silicones and the mass ratio of conduction powder realize the control of viscosity.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that being shaped as the micron order conduction powder be block,
Spherical, random shape or sheet.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that being shaped as the nanoscale conduction powder be block,
Spherical, monocrystalline is bar-shaped, crystal whisker-shaped, threadiness or sheet.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that 200 μm of the D50 ＜ of the micron order conduction powder,
40 μm of the D50 ＜ of the nanoscale conduction powder, and the average grain diameter of the micron order conduction powder leads more than the nanoscale
The average grain diameter of hot powder.Wherein, 1 μm of the D50 ＞ of the micron order conduction powder.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that the thickness of the face coat is described less than 76 μm
The thickness of heat-conductive body layer is less than 9mm.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that the density of the heat-conductive body layer is 1.5g/cm3-
3.8g/cm3, the density of the face coat is 0.98g/cm3-3.0g/cm3, and the density of the face coat is less than described lead
The density of hot body layer.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that the viscosity of the face coat at normal temperatures is
50cp-800,000cp.The test temperature of the normal temperature is 23 DEG C.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that the micron order conductive powder in the heat-conductive body layer
Body includes one or more of groups in zinc oxide, aluminum oxide, boron nitride, aluminium nitride, carborundum, metal-powder and carbon material
Close；
Preferably, the metal-powder includes aluminium powder, and the carbon material includes graphene；
Preferably, the boron nitride is the aggregate structure of six side's single-crystal platy structures or six side's monocrystalline；
Preferably, the carbon material is sheet or threadiness.
In the controllable heat-conducting interface material of above-mentioned viscosity, it is preferable that the nanoscale conduction powder in the face coat
Including the one or more in nano silicon, nano zine oxide, nano aluminum nitride, nano metal powder and nanometer silicon carbide
Combination.
Preferably, the nano metal powder, which includes nanoscale aluminium powder or other, has the nanoscale of thermal conductivity
Metal-powder.
It is highly preferred that the nano zine oxide is that monocrystalline is bar-shaped；The nano silicon is crystal whisker-shaped.
The controllable heat-conducting interface material of above-mentioned viscosity is to 8mils heat-conducting pads heat radiation power up to 0.122 DEG C of in2/ more than W；
It uses the face coat containing nanoscale conduction powder, has both reached the surface viscosity control to heat-conducting interface material, simultaneously
The influence to heat-conducting interface material hot property is substantially reduced again.
The present invention also provides the preparation method of the controllable heat-conducting interface material of above-mentioned viscosity, and it comprises the following steps：
Organic siliconresin is mixed with micron order conduction powder, the boundary material body glue of stratiform is formed；
Organic siliconresin is mixed with nanoscale conduction powder, the initial rubber of the face coat of stratiform is formed；
The initial rubber of layered face coat is coated to the surface of layered boundary material body glue, then
Press mold shaping, solidification, form the face coat and heat-conductive body layer being brought into close contact, obtain the controllable thermally-conductive interface material of the viscosity
Material.The coating can be realized using this area conventional meanses.
In above-mentioned preparation method, it is described by organic siliconresin mixed with micron order conduction powder or by organic siliconresin with
The initial rubber that nanoscale conduction powder is mixed to form face coat can realize mixed glue using this area conventional technical means
Uniformity.Press mold shaping and solidification can using the conventional solidification means in this area so that the face coat formed with
Heat-conductive body layer is brought into close contact.
In above-mentioned preparation method, it is preferable that the temperature of the press mold shaping is 100 DEG C -150 DEG C.
In above-mentioned preparation method, it is preferable that the temperature of the solidification is 100 DEG C -150 DEG C, and the time is 10min-
40min。
The preparation method for the sticky controllable heat-conducting interface material that the present invention is provided, simple and easy to apply, production cost is low, is adapted to
Large-scale industrialized production.
The present invention also provides the controllable heat-conducting interface material of above-mentioned viscosity answering as filling fin in electronic device
With the filling fin is used between heat radiation chip and structural member housing.
Compared with prior art, the sticky controllable heat-conducting interface material that the present invention is provided and preparation method and application bag
Include advantages below：
(1) the sticky controllable heat-conducting interface material that provides of the present invention is by the micron order conduction powder and described receiving
The control of meter level conduction powder pattern and particle diameter distribution, product is hot caused by greatly reducing the sticky control technology of conventional surface
The loss of energy, the low thickness heat-conducting pad product effect for thickness in below 0.5mm is especially apparent, and is less than especially for thickness
10mils slim heat-conducting pad boundary material, while desirable viscosity is kept, still with good compressibility of materials can and
Heat conductivility, and thermal resistance is small；
(2) the sticky controllable heat-conducting interface material that the present invention is provided solves ultra-thin used in consumer electronics field lead
The problem of heat pad sheet material application difficult, it is particularly suitable for use in the electronic products such as smart mobile phone, tablet personal computer；
(3) preparation method for the sticky controllable heat-conducting interface material that the present invention is provided makes face coat and heat-conductive body layer
One-shot forming, carries out cross-linking and curing reaction at a temperature of 100 DEG C -150 DEG C, and the controllable heat-conducting interface material of surface viscosity is made,
Preparation method is simple and easy to apply, and production cost is low, is adapted to large-scale industrialized production.
Brief description of the drawings
Fig. 1 is the structural representation for the sticky controllable heat-conducting interface material that embodiment 1 is provided；
Fig. 2 is the micron order conduction powder ball-aluminium oxide for the sticky controllable heat-conducting interface material that embodiment 1 is provided
SEM schemes；
Fig. 3 is the nanoscale conduction powder platelet boron nitride for the sticky controllable heat-conducting interface material that embodiment 1 is provided
SEM schemes.
Embodiment
In order to which technical characteristic, purpose and beneficial effect to the present invention are more clearly understood from, now to the skill of the present invention
Art scheme carry out it is described further below, but it is not intended that to the present invention can practical range restriction.
Embodiment 1
The present embodiment provides a kind of preparation method of the controllable thermally-conductive interface material of viscosity, and it comprises the following steps：
Organic siliconresin and micron order conduction powder ball-aluminium oxide are pressed 10:90 mass ratio mixing, is sufficiently mixed
Obtained body glue material after even；
Organic siliconresin and nanoscale conduction powder platelet boron nitride are pressed 95:5 mass ratio is mixed to form face coat
Initial rubber；
The initial rubber of face coat is coated to the surface of heat-conducting interface material body glue, then a press mold at room temperature
Shaping, then solidify 25min at a temperature of 120 DEG C, into the face coat 3 being brought into close contact and heat-conductive body layer 2, obtain viscosity controllable
Heat-conducting interface material 1, its structure is as shown in Figure 1.
Wherein, the scanning electron microscope (SEM) photograph of ball-aluminium oxide is as shown in Fig. 2 the D50 of the ball-aluminium oxide is 40 μm；Sheet is nitrogenized
The surface sweeping electron microscope of boron is as shown in figure 3, the D50 of the platelet boron nitride is 30 μm；
The thickness of the controllable heat-conducting interface material 1 of the viscosity is 8mils, and the thickness of face coat 3 is 1mil, and density is
1.13g/cm3, the thickness of heat-conductive body layer 2 is 7mils, and density is 3.1g/cm3。
The controllable heat-conducting interface material 1 of viscosity made from the present embodiment is carried out to viscosity test, the compression performance under normal temperature
Test and heat conductivility test experiments, its result are as shown in table 1.
Table 1
| Sample sequence number | Top layer viscosity | 30psi pressure-types become | Thermal resistance DEG C under 8mils2/W |
| Embodiment 1 | 700cp | 15.3% | 0.122 |
| Comparative example 1 | 600 | 15.1% | 0.145 |
| Comparative example 2 | / | 15.5% | 0.1 |
As shown in Table 1, the face coat 3 of the controllable heat-conducting interface material 1 of viscosity made from the present embodiment is at normal temperatures
Viscosity is 700cp, and it is 0.122 DEG C of in be changed into 15.3%, 8mils thermal resistance in 30psi pressure-types2/W。
From the foregoing, it will be observed that the controllable heat-conducting interface material of viscosity is while desirable viscosity is kept made from the present embodiment, still
With good compressibility of materials energy and heat conductivility, and thermal resistance is small.In view of what the controllable heat-conducting interface material of the viscosity had
Superperformance, the present embodiment is also provided to be used in smart mobile phone and tablet personal computer as filling fin, and the fin is used
Between heat radiation chip and structural member housing.
Comparative example 1
This comparative example provides a kind of preparation method of sticky thermally-conductive interface material, and it comprises the following steps：
Organic siliconresin and micron order conduction powder ball-aluminium oxide are pressed 10:90 mass ratio is mixed to form boundary material
Body glue, then solidifies 25min shapings at a temperature of 120 DEG C, forms heat-conductive body layer, then pass through on the surface of heat-conductive body layer
Surface is brushed or one layer of silicone resin coating of spraying, and viscosity thermally-conductive interface material is made；
Wherein, the D50 of micron order conduction powder ball-aluminium oxide is respectively 5 μm and 40 μm；
The thickness of the sticky heat-conducting interface material is 8mils, and the thickness of silicone resin coating is 1mil, heat-conductive body layer
Thickness be 7mils.
The viscosity test under normal temperature, compression performance test are carried out to sticky heat-conducting interface material made from this comparative example and is led
Thermal performance test is tested, and as shown in table 1, the viscosity of sticky heat-conducting interface material at normal temperatures is 600cp to its result,
It is 0.145 DEG C of in that 30psi pressure-types, which are changed into 15.1%, 8mils thermal resistance,2/W。
Compared from embodiment 1 with comparative example 1, the controllable heat-conducting interface material of viscosity has more made from embodiment 1
Good heat conductivility, and preparation method is simple, one-shot forming.
Comparative example 2
This comparative example provides a kind of preparation method of heat-conducting interface material, and it comprises the following steps：
Organic siliconresin and micron order conduction powder-ball-aluminium oxide are pressed 10:90 mass ratio is mixed to form interface material
Expect body glue, then solidify 25min shapings at a temperature of 120 DEG C, thermally-conductive interface material is made；
Wherein, the D50 of micron order conduction powder ball-aluminium oxide is respectively 5 μm and 40 μm；
The thickness of the heat-conducting interface material is 8mils.
Performance test and heat conductivility test experiments are compressed to heat-conducting interface material made from this comparative example, its result
As shown in table 1, it is 0.1 DEG C of in that the heat-conducting interface material is changed into 15.5%, 8mils thermal resistance in 30psi pressure-types2/W。
Compared from embodiment 1 with comparative example 2, the heat conduction of the controllable heat-conducting interface material of viscosity made from embodiment 1
Performance is close to the heat-conducting interface material for being not covered with face coat, i.e., the controllable heat-conducting interface material of viscosity made from embodiment 1
With the heat conductivility close to heat-conducting interface material body.
From embodiment 1 and comparative example 1-2, the sticky controllable heat-conducting interface material that the present invention is provided passes through to described
The control of micron order conduction powder and the nanoscale conduction powder pattern and particle diameter distribution, greatly reduces conventional surface viscosity
Product loss of thermal properties caused by control technology, 10mils slim heat-conducting pad boundary material is less than for thickness, is being kept
While desirable viscosity, still with good compressibility of materials energy and heat conductivility, and thermal resistance is small；To solve consumer electronics field
The problem of used ultra-thin heat-conducting pad materials application is difficult is there is provided new approaches, in electronics such as smart mobile phone, tablet personal computers
Product scope has preferable application prospect；And the preparation method of the sticky controllable heat-conducting interface material of the invention provided makes surface
Coating and heat-conductive body layer one-shot forming, preparation method are simple and easy to apply, and production cost is low, is adapted to large-scale industrialized production.
Claims (12)
1. a kind of controllable heat-conducting interface material of viscosity, it is characterised in that：The controllable heat-conducting interface material of the viscosity includes tight
The heat-conductive body layer and face coat of close bonding, the heat-conductive body layer press quality by organic siliconresin and micron order conduction powder
Than for 5:95-40:60 are mixed to form, and the face coat is 60 in mass ratio by organic siliconresin and nanoscale conduction powder:
40-99.99:0.01 is mixed to form.
2. the controllable heat-conducting interface material of viscosity according to claim 1, it is characterised in that：The micron order conduction powder
Be shaped as block, spherical, random shape or sheet.
3. the controllable heat-conducting interface material of viscosity according to claim 1, it is characterised in that：The nanoscale conduction powder
Be shaped as bar-shaped block, spherical, monocrystalline, crystal whisker-shaped, threadiness or sheet.
4. the controllable heat-conducting interface material of viscosity according to claim 1, it is characterised in that：The micron order conduction powder
200 μm of D50 ＜, 40 μm of the D50 ＜ of the nanoscale conduction powder, and the average grain diameter of the micron order conduction powder is more than
The average grain diameter of the nanoscale conduction powder.
5. the controllable heat-conducting interface material of viscosity according to claim 1, it is characterised in that：The thickness of the face coat
Less than 76 μm, the thickness of the heat-conductive body layer is less than 9mm.
6. the controllable heat-conducting interface material of viscosity according to claim 1, it is characterised in that：Heat-conductive body layer it is close
Spend for 1.5g/cm3-3.8g/cm3, the density of the face coat is 0.98g/cm3-3.0g/cm3, and the face coat
Density is less than the density of heat-conductive body layer.
7. the controllable heat-conducting interface material of viscosity according to claim 1, it is characterised in that：The face coat is in normal temperature
Under viscosity be 50cp-800,000cp.
8. the controllable heat-conducting interface material of viscosity according to claim 1 or 2, it is characterised in that：The heat-conductive body layer
In micron order conduction powder include zinc oxide, aluminum oxide, boron nitride, aluminium nitride, carborundum, metal-powder and carbon material in
One or more of combinations；
Preferably, the metal-powder includes aluminium powder, and the carbon material includes graphene；
Preferably, the boron nitride is the aggregate structure of six side's single-crystal platy structures or six side's monocrystalline；
Preferably, the carbon material is sheet or threadiness.
9. the sticky controllable heat-conducting interface material according to claim 1 or 3, it is characterised in that：In the face coat
Nanoscale conduction powder include nano silicon, nano zine oxide, nano aluminum nitride, nano metal powder and nano silicon carbide
One or more of combinations in silicon；
Preferably, the nano metal powder includes nanoscale aluminium powder；
Preferably, the nano zine oxide is that monocrystalline is bar-shaped；The nano silicon is crystal whisker-shaped.
10. the preparation method of the controllable heat-conducting interface material of any one of the claim 1-9 viscosity, it comprises the following steps：
Organic siliconresin is mixed with micron order conduction powder, the boundary material body glue of stratiform is formed；
Organic siliconresin is mixed with nanoscale conduction powder, the initial rubber of the face coat of stratiform is formed；
The initial rubber of layered face coat is coated to the surface of layered boundary material body glue, then press mold
Shaping, solidification, form the face coat and heat-conductive body layer being brought into close contact, obtain the controllable heat-conducting interface material of the viscosity.
11. preparation method according to claim 10, it is characterised in that：The temperature of the press mold shaping is 100 DEG C -150
℃；
Preferably, the temperature of the solidification is 100 DEG C -150 DEG C, and the time is 10min-40min.
12. the controllable heat-conducting interface material of any one of the claim 1-9 viscosity is used as filling fin in electronic device
Application, the filling fin be used between heat radiation chip and structural member housing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710328511.XA CN107201216A (en) | 2017-05-11 | 2017-05-11 | Controllable heat-conducting interface material of a kind of viscosity and preparation method and application |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710328511.XA CN107201216A (en) | 2017-05-11 | 2017-05-11 | Controllable heat-conducting interface material of a kind of viscosity and preparation method and application |
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Cited By (4)
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| CN110607071A (en) * | 2019-09-05 | 2019-12-24 | 上海阿莱德实业股份有限公司 | High-performance heat-conducting interface material and application thereof |
| CN111592863A (en) * | 2019-02-21 | 2020-08-28 | 天津莱尔德电子材料有限公司 | Thermal interface material |
| CN111761049A (en) * | 2019-04-01 | 2020-10-13 | 广州力及热管理科技有限公司 | Metal paste for manufacturing capillary structure in uniform temperature plate |
| CN113631505A (en) * | 2019-03-27 | 2021-11-09 | 富士胶片株式会社 | Heat sink precursor and method for manufacturing heat sink |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111592863A (en) * | 2019-02-21 | 2020-08-28 | 天津莱尔德电子材料有限公司 | Thermal interface material |
| CN113631505A (en) * | 2019-03-27 | 2021-11-09 | 富士胶片株式会社 | Heat sink precursor and method for manufacturing heat sink |
| CN113631505B (en) * | 2019-03-27 | 2024-01-16 | 富士胶片株式会社 | Heat sink precursor and method for manufacturing heat sink |
| CN111761049A (en) * | 2019-04-01 | 2020-10-13 | 广州力及热管理科技有限公司 | Metal paste for manufacturing capillary structure in uniform temperature plate |
| CN111761049B (en) * | 2019-04-01 | 2022-08-05 | 广州力及热管理科技有限公司 | Metal paste for manufacturing capillary structure in uniform temperature plate |
| CN110607071A (en) * | 2019-09-05 | 2019-12-24 | 上海阿莱德实业股份有限公司 | High-performance heat-conducting interface material and application thereof |
| CN110607071B (en) * | 2019-09-05 | 2022-09-02 | 上海阿莱德实业股份有限公司 | High-performance heat-conducting interface material and application thereof |
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Application publication date: 20170926 |