CN109553908A - Heat-conducting interface material for electronic equipment dissipating heat - Google Patents
Heat-conducting interface material for electronic equipment dissipating heat Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 80
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 69
- 239000003292 glue Substances 0.000 claims abstract description 38
- 239000002131 composite material Substances 0.000 claims abstract description 34
- 239000000945 filler Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000002360 preparation method Methods 0.000 claims abstract description 25
- 239000011230 binding agent Substances 0.000 claims abstract description 24
- 230000000694 effects Effects 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 11
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 11
- 238000011049 filling Methods 0.000 claims abstract description 11
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000000498 ball milling Methods 0.000 claims description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 18
- 239000011231 conductive filler Substances 0.000 claims description 18
- 229910002804 graphite Inorganic materials 0.000 claims description 14
- 239000010439 graphite Substances 0.000 claims description 14
- 239000012948 isocyanate Substances 0.000 claims description 8
- 150000002513 isocyanates Chemical group 0.000 claims description 8
- 150000001336 alkenes Chemical class 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000003701 mechanical milling Methods 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229920003180 amino resin Polymers 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 229910003978 SiClx Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000011159 matrix material Substances 0.000 abstract description 3
- 238000009776 industrial production Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 23
- 239000000203 mixture Substances 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 10
- 239000007787 solid Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- -1 graphite alkene Chemical class 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000007792 addition Methods 0.000 description 4
- 238000010907 mechanical stirring Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat-conducting interface materials for electronic equipment dissipating heat, belong to new material technology field.The present invention utilizes simple technique, is used cooperatively using graphene and conventional fillers as heat filling, has prepared graphene composite heat-conducting binder material as matrix using acrylic resin and other auxiliary agents, and as heat-conducting interface material.Graphene and conventional fillers are evenly dispersed in the heat-conducting interface material, graphene itself high-termal conductivity is given full play to and the characteristics of conventional fillers can realize a large amount of fillings, the thermoconductive glue of preparation has the performance for being significantly better than conventional thermal conductive binder, can be obviously improved the radiating and cooling effect of electronic device.Such graphene composite heat-conducting binder preparation process is simple, can large-scale industrial production, can be used as new and effective heat-conducting interface material individually or cooperation substrate be applied to electronic equipment dissipating heat.
Description
Technical field
The present invention relates to new material technology fields, and in particular to a kind of heat-conducting interface material for electronic equipment dissipating heat.
Background technique
With the development of science and technology, the micromation of electronic component and multifunction the thermal diffusivity of device is proposed it is higher
It is required that.The heat dissipation problem of device has become the technology " bottleneck " that the telecommunication industry of rapid development faces.Thermal resistance analysis shows device
Interface resistance between radiator is larger.Tracing it to its cause is that the surface of solids is rough on a microscopic scale, even if two solids
In the case where contact pressure is up to 10MPa, real contact area only accounts for the 1~2% of apparent contact area, remaining part on surface
Dividing then is the micro-pore full of air.Therefore, the interface resistance how reduced between electronic component and radiator is to mention
One of the key of high electronic element radiating efficiency.In order to reduce interface resistance, it is developed heat-conducting interface material.Interface is led
Hot material is filled between contact surface, can remove the intrapore air of contact interface, is formed on entire contact interface continuous
Passage of heat, improve the radiating efficiency of electronic component.
Binder material is mainly to be suitable for the needs that gap thickness is 0.5-30 μm to be adhesively fixed for field of radiating
Interface.For traditional binder due to being not added with heat filling, the heating conduction of organic polymer matrix itself is very poor, generally exists
0.2W/mK influences device radiating efficiency hereinafter, so low heating conduction can cause larger interface resistance.Individually addition tradition
It is larger (30 μm or more) that heat filling generally requires packing material size, and needs a large amount of additions.Not only increase thermoconductive glue
Cost and weight, and the adhesive property of material can be made to decline, but heating conduction is hardly resulted in and is obviously improved.
Studies have shown that graphene has excellent heating conduction, thermal coefficient is up to 5300W m-1K-1, it is much higher than carbon
Nanotube and diamond.Furthermore graphene is the honeycomb perfection lattice being made of single layer of carbon atom, has very high structure steady
Qualitative and chemical stability.Therefore graphene has very big application potential as a kind of new and effective heat filling.But
It is easy to reunite since grapheme material radius-thickness ratio is big, the conventional methods difficulties in dispersion such as mechanical stirring are utilized as nano material;Simultaneously
It is used separately as heat filling, to meet the requirement such as binder material coating layer thickness and cohesive force, additive amount is restricted, raw
It is also very high to produce cost.
Summary of the invention
The purpose of the present invention is to provide a kind of heat-conducting interface material for electronic equipment dissipating heat, by by graphene with
Conventional thermal conductive filler is used cooperatively, and using techniques such as ball-milling method or mechanical milling methods, is prepared for the thermoconductive glue of containing graphene,
And it is used for heat-conducting interface material.The technique overcomes using common process such as mechanical stirrings during the preparation process due to graphene material
The problem of material diameter thickness rate is big, easy to reunite, as nano material difficulties in dispersion.Meanwhile being matched using graphene and typical thermal-conductive fillers
It closes and uses, the heating conduction of thermoconductive glue can be obviously improved, graphene exclusive use additive amount can also be overcome to be limited, cost
The problems such as high.
The technical scheme is that
A kind of heat-conducting interface material for electronic equipment dissipating heat, the heat-conducting interface material are the thermally conductive viscous of containing graphene
Tie agent;The thermoconductive glue is made of composite heat-conducting filler, acrylic resin and auxiliary agent;Wherein: the composite heat-conducting filler
Weight percentage be 5~65%;The composite heat-conducting filler is made of graphene and typical thermal-conductive fillers, and graphene exists
Shared weight percent is 0.5~20% in thermoconductive glue;The heat-conducting interface material directly applies to electronic equipment dissipating heat;
Alternatively, the heat-conducting interface material and substrate fit applications are in electronic equipment dissipating heat.
The weight ratio of the acrylic resin and auxiliary agent is 100:(1~6).
In the thermoconductive glue, graphene and typical thermal-conductive fillers are evenly dispersed, between graphene and typical thermal-conductive fillers
Mutually overlap joint forms uniformly and effectively heat conduction network structure.
The graphene is graphene, the graphite oxide of graphene, graphene oxide, the electrolysis method preparation of graft process preparation
One or more of the graphene of alkene and chemical vapour deposition technique preparation;The typical thermal-conductive fillers be aluminium oxide, zinc oxide,
The mixing of one or more of aluminium nitride, boron nitride and silicon carbide;The particle size range of the typical thermal-conductive fillers is 0.1~10 μ
m。
When the typical thermal-conductive fillers are same filler, using the combination of a variety of particle size ranges;Alternatively, described normal
When rule heat filling is particle size range of the same race, the combination of different types of a variety of fillers is selected.
The auxiliary agent is isocyanates, pyridine, amino resins, band epoxy group resin or tetraisopropoxy titanium.
The heat-conducting interface material for electronic equipment dissipating heat the preparation method comprises the following steps: first by graphene, typical thermal-conductive
Filler, acrylic resin and auxiliary agent mix in proportion, obtain mixed material;And utilize ball-milling method or mechanical milling method (preferably ball
Grinding process) processing after, that is, obtain the heat-conducting interface material.
The gap thickness at the interface for needing to be adhesively fixed in electronic equipment applied by the heat-conducting interface material is 0.5-30 μ
m。
For the thermal conductivity of the heat-conducting interface material up to 1.5W/mK, the blank glue for being relatively not added with filler has up to 7 times to mention
It rises;Composite radiating film is made in the heat-conducting interface material and PET and graphite radiating film, cooling effect is significantly better than blank binder
(there is compared with blank binder up to 15 DEG C of cooling under the test environment with composite radiating film made of PET and graphite radiating film
Effect).
Design Mechanism of the present invention is as follows:
The present invention utilizes simple technique, is used cooperatively using graphene and conventional fillers as heat filling, with resin and
Auxiliary agent has prepared graphene composite heat-conducting binder material as matrix, and is used for heat-conducting interface material.Stone in composite material
Black alkene and conventional fillers are evenly dispersed, have given full play to graphene itself high-termal conductivity and conventional fillers can be realized and largely be filled
Feature, for the heat-conductive composite material thermal conductivity of preparation up to 1.5W/mK, the blank glue for being relatively not added with filler has up to 7 times of promotion.
Such graphene composite heat-conducting binder preparation process is simple, can large-scale industrial production, can be used as new and effective thermally conductive boundary
Plane materiel material is directly or cooperation substrate applications are in electronic equipment dissipating heat.
The present invention select graphene be used cooperatively with typical thermal-conductive fillers, given full play to graphene as heat filling oneself
Height leads thermal property;The nanoscale lamellar spacing of graphene is conducive to control adhesive layer thickness simultaneously, reduces interface resistance;
The addition of conventional fillers is mutually promoted with graphene heating conduction, while overcoming the problem of graphene can not be added largely, and
It can effectively reduce cost.
In heat-conducting interface material preparation process of the present invention, to make graphene obtain more uniform stable dispersion, using ball
Mill, mechanical grinding method make heat filling be evenly distributed in the base.Wherein preferred ball-milling method.
Graphene and conventional fillers are evenly dispersed in heat-conducting interface material of the present invention, have given full play to graphene and have led from height
Such graphene composite heat-conducting binder preparation process of the characteristics of hot and conventional fillers can realize a large amount of fillings is simple, can advise greatly
Mould industrialized production can be used as new and effective heat-conducting interface material directly or with substrate fit applications in electronic equipment dissipating heat.
The present invention has the advantage that
1, graphene and typical thermal-conductive fillers is selected to be used cooperatively.Graphene has been given full play to as heat filling from height
Lead thermal property;The nanoscale lamellar spacing of graphene is conducive to control adhesive layer thickness simultaneously, reduces interface resistance.;Often
The addition of rule filler is mutually promoted with graphene heating conduction, while overcoming the limitation of graphene additive amount, and can be effectively reduced
Cost.
2, it using techniques such as ball-milling method or mechanical milling methods, overcomes and utilizes the techniques such as conventional mechanical stirring in preparation process
It is easy to reunite since grapheme material radius-thickness ratio is big, the problem of as nano material difficulties in dispersion.This method simple process, is easy to
Industry's enlarging production.
3, the thermoconductive glue can be used as heat-conducting interface material directly or with substrate fit applications in electronic equipment dissipating heat.It is multiple
Graphene and conventional fillers are evenly dispersed in condensation material, and having given full play to graphene itself high-termal conductivity and conventional fillers can realize
The characteristics of a large amount of fillings, up to 1.5W/mK, the blank glue for being relatively not added with filler has up to the heat-conductive composite material thermal conductivity of preparation
7 times of promotion.
Detailed description of the invention
Fig. 1 is the optical photograph of the heat conduction adhesive (ball-milling method preparation) of containing graphene.
Fig. 2 is the stereoscan photograph of the thermoconductive glue of containing graphene.
Fig. 3 is the composite radiating membrane structure diagram that binder and PET and graphite film form.
Fig. 4 is the optical photograph that binder and PET and graphite film form.
Fig. 5 is cooling effect test device schematic diagram.
Fig. 6 is the optical photograph of the heat conduction adhesive (mechanical mixing method preparation) of containing graphene.
Specific embodiment
Being shone using the LFA 467 of German NETZSCH company, (electronic product produces this instrument method conductometer at home at present
Enterprise and R&D institution are widely used, and detection executes 1461 standard of ASTM E), test prepared thermoconductive glue
Heating conduction.The present invention is described in detail with reference to the accompanying drawings and embodiments.
Embodiment 1:
By 1g intercalated graphite alkene powder, the ball-aluminium oxide filler that 20g average grain diameter is 3 μm, 100g solid content is 45%
Acrylic resin and 1g isocyanates be put into ball grinder, stirred 10 minutes with 100 revs/min of revolving speeds.Add into ball grinder
Enter 100g zirconia ball.Ball milling is carried out to said mixture with 400 revs/min of revolving speed, Ball-milling Time is 10 hours.Ball milling is complete
Cheng Hou takes out mixture, and the thermoconductive glue composite material of containing graphene can be obtained.
Fig. 1 is the optical photograph of prepared thermoconductive glue, and Fig. 2 is that its stereoscan photograph can from photo
Out, graphene is evenly dispersed with aluminium oxide in composite material, mutually overlaps, acts synergistically between graphene and aluminium oxide, is formed
Uniformly and effectively heat conduction network structure.Due to thermoconductive glue prepared in subsequent embodiment macro-and micro-structure and this
Example is similar, therefore repeats no more.
The heating conduction of prepared thermoconductive glue (after dry out solvent) is tested, prepared graphite is measured
The thermal conductivity of alkene thermoconductive glue is 1.1W/mK.Graphene promotes composite material heating conduction obvious.By such conducting adhesive
Agent is coated on pet sheet face, and constituting composite radiating film together with graphite film (plane thermal rate 1100W/mK), (structure and pattern are shown in
Fig. 3, Fig. 4).Cooling effect test is carried out using Fig. 5 shown device.Wherein ceramic heating plate used is 1cm x 1cm area, electricity
Hinder about 18 Ω.About 320 DEG C of any heat dissipation film ceramic heating plate surface temperature is not added in heated current used about 0.3A.Heating sheet back
It is 100.1 DEG C that face paste, which covers 3cm x 3cm to prepare heat dissipation film rear surface temperature using blank binder,.Paste same homalographic, thickness
It is 84.9 DEG C using composite radiating film rear surface temperature prepared by embodiment 1.Leading cooling effect and blank binder comparison can drop
Low 15 DEG C.Since cooling test is consistent in aftermentioned embodiment, repeat no more.
Embodiment 2:
By 1g intercalated graphite alkene powder, 15g average grain diameter is 1 μm of aluminium nitride powder, the propylene that 100g solid content is 45%
Acid resin and 1g isocyanates are put into ball grinder, are stirred 10 minutes with 100 revs/min of revolving speeds.100g is added into ball grinder
Zirconia ball.Ball milling is carried out to said mixture with 400 revs/min of revolving speed, Ball-milling Time is 10 hours.After the completion of ball milling,
Mixture is taken out, the thermoconductive glue composite material of containing graphene can be obtained.
The thermal conductivity for measuring prepared graphene thermoconductive glue is 0.95W/mK.It is dropped using Fig. 5 shown device
Temp effect test.It is radiated using the composite radiating film of this thermoconductive glue preparation, ceramic heating plate central temperature is 88.2 DEG C.
Embodiment 3:
By 1g electrolysis method graphene powder, 15g average grain diameter is 1 μm of boron nitride powder, and 100g solid content is the third of 45%
Olefin(e) acid resin and 1g isocyanates are put into ball grinder, are stirred 10 minutes with 100 revs/min of revolving speeds.It is added into ball grinder
100g zirconia ball.Ball milling is carried out to said mixture with 400 revs/min of revolving speed, Ball-milling Time is 10 hours.Ball milling is completed
Afterwards, mixture is taken out, the thermoconductive glue composite material of containing graphene can be obtained.
The thermal conductivity for measuring prepared graphene thermoconductive glue is 0.88W/mK.It is dropped using Fig. 5 shown device
Temp effect test.It is radiated using the composite radiating film of this thermoconductive glue preparation, ceramic heating plate central temperature is 90.4 DEG C.
Comparative example 1:
Use the acrylic resin virgin rubber that solid content is 45% as binder comparative sample.To the virgin rubber (after dry out solvent)
Heating conduction be tested, measure blank glue thermal conductivity be 0.18W/mK.Cooling effect is carried out using Fig. 5 shown device
Test.It is radiated using the composite radiating film of this blank binder preparation, ceramic heating plate central temperature is 100.1 DEG C.
Comparative example 2:
Be 3 μm of ball-aluminium oxide filler by 40g average grain diameter, acrylic resin glue that 100g solid content is 45% and
1g isocyanates is put into ball grinder, is stirred 10 minutes with 100 revs/min of revolving speeds.100g zirconia ball is added into ball grinder.
Ball milling is carried out to said mixture with 400 revs/min of revolving speed, Ball-milling Time is 10 hours.After the completion of ball milling, mixture is taken
Out, the thermoconductive glue composite material of comparison can be obtained.
The heating conduction of the composite heat-conducting binder (after dry out solvent) is tested, prepared binder is measured
Thermal conductivity be 0.52W/mK.Cooling effect test is carried out using Fig. 5 shown device.Utilize the compound of this thermoconductive glue preparation
Heat dissipation film heat dissipation, ceramic heating plate central temperature are 95.3 DEG C.
Comparative example 3:
By 2g intercalated graphite alkene powder, the acrylic resin glue and 1g isocyanates that 100g solid content is 45% are put into ball
In grinding jar, stirred 10 minutes with 100 revs/min of revolving speeds.100g zirconia ball is added into ball grinder.With 400 revs/min turn
Speed carries out ball milling to said mixture, and Ball-milling Time is 10 hours.After the completion of ball milling, mixture is taken out, comparison can be obtained
Thermoconductive glue composite material.
The heating conduction of the composite heat-conducting binder (after dry out solvent) is tested, prepared binder is measured
Thermal conductivity be 0.78W/mK.Cooling effect test is carried out using Fig. 5 shown device.Utilize the compound of this thermoconductive glue preparation
Heat dissipation film heat dissipation, ceramic heating plate central temperature are 92.5 DEG C.
Comparative example 4:
By 1g intercalated graphite alkene powder, the ball-aluminium oxide filler that 20g average grain diameter is 3 μm, 100g solid content is 45%
Acrylic resin and 1g isocyanates be put into ball grinder, stirred 10 hours with 1000 revs/min of revolving speeds.After the completion of stirring,
Mixture is taken out, the thermoconductive glue composite material of comparison can be obtained.
As can be seen that gained comparative sample has obvious granular sensation from optical photograph shown in Fig. 6.Show conventional mechanical stirring
Mode can not be to graphene powder full and uniform dispersion.
The heating conduction of the composite heat-conducting binder (after dry out solvent) is tested, prepared binder is measured
Thermal conductivity be 0.85W/mK.Cooling effect test is carried out using Fig. 5 shown device.Utilize the compound of this thermoconductive glue preparation
Heat dissipation film heat dissipation, ceramic heating plate central temperature are 91.1 DEG C.
In conclusion graphene system is than the heat dissipation film of non-graphite alkene system, surface temperature will be obvious low.Illustrate stone
It is apparent that black alkene thermoconductive glue, which leads heat dissipation effect,.
Examples provided above is only the mode illustrated, is not considered as limiting the scope of the present invention, appoint
What is subject to the method for equivalent substitution or change according to the technical scheme of the invention and its inventive conception, should all cover of the invention
Within protection scope.
Claims (9)
1. a kind of heat-conducting interface material for electronic equipment dissipating heat, it is characterised in that: the heat-conducting interface material is graphitiferous
The thermoconductive glue of alkene;The thermoconductive glue is made of composite heat-conducting filler, acrylic resin and auxiliary agent;Wherein: described multiple
The weight percentage for closing heat filling is 5~65%;The composite heat-conducting filler is by graphene and typical thermal-conductive fillers group
At graphene shared weight percent in thermoconductive glue is 0.5~20%;The heat-conducting interface material directly applies to electricity
Sub- equipment cooling;Alternatively, the heat-conducting interface material and substrate fit applications are in electronic equipment dissipating heat.
2. the heat-conducting interface material according to claim 1 for electronic equipment dissipating heat, it is characterised in that: the acrylic acid
The weight ratio of resin and auxiliary agent is 100:(1~6).
3. the heat-conducting interface material according to claim 1 for electronic equipment dissipating heat, it is characterised in that: the conducting adhesive
In agent, graphene and typical thermal-conductive fillers are evenly dispersed, mutually overlap between graphene and typical thermal-conductive fillers, and formation uniformly has
The heat conduction network structure of effect.
4. the heat-conducting interface material according to claim 1 for electronic equipment dissipating heat, it is characterised in that: the graphene
For graphene, graphene oxide and the chemical vapour deposition technique of graphene, graphene oxide, the electrolysis method preparation of graft process preparation
One or more of graphene of preparation;The typical thermal-conductive fillers are aluminium oxide, zinc oxide, aluminium nitride, boron nitride and carbon
The mixing of one or more of SiClx;The particle size range of the typical thermal-conductive fillers is 0.1~10 μm.
5. the heat-conducting interface material according to claim 4 for electronic equipment dissipating heat, it is characterised in that: the routine is led
When hot filler is same filler, using the combination of a variety of particle size ranges;Alternatively, the typical thermal-conductive fillers are grain of the same race
When diameter range, the combination of different types of a variety of fillers is selected.
6. the heat-conducting interface material according to claim 1 or 2 for electronic equipment dissipating heat, it is characterised in that: described to help
Agent is isocyanates, pyridine, amino resins, band epoxy group resin or tetraisopropoxy titanium.
7. the heat-conducting interface material according to claim 1 for electronic equipment dissipating heat, it is characterised in that: the thermally-conductive interface
The preparation process of material are as follows: graphene, typical thermal-conductive fillers, acrylic resin and auxiliary agent are mixed in proportion first, mixed
Close material;And after handling using ball-milling method or mechanical milling method, that is, obtain the heat-conducting interface material.
8. the heat-conducting interface material according to claim 1 for electronic equipment dissipating heat, it is characterised in that: the thermally-conductive interface
The gap thickness at the interface for needing to be adhesively fixed in electronic equipment applied by material is 0.5-30 μm.
9. the heat-conducting interface material according to claim 8 for electronic equipment dissipating heat, it is characterised in that: the thermally-conductive interface
For the thermal conductivity of material up to 1.5W/mK, the blank glue for being relatively not added with filler has up to 7 times of promotion;By the heat-conducting interface material
Composite radiating film is made with PET and graphite radiating film, cooling effect is significantly better than blank binder and PET and graphite radiating film system
At composite radiating film.
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CN110305443A (en) * | 2019-06-03 | 2019-10-08 | 泰能环保科技(浙江)有限公司 | A kind of graphene composite heat conducting material and preparation method thereof |
CN110577716A (en) * | 2019-09-23 | 2019-12-17 | 南通伟越电器有限公司 | Preparation method of high-impact-resistance polystyrene special material for television shell |
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KR20140044112A (en) * | 2012-10-04 | 2014-04-14 | 도레이첨단소재 주식회사 | High efficiency heat transfer adhesive materials and manufacturing thereof |
KR20160073684A (en) * | 2014-12-17 | 2016-06-27 | 부산지역대학연합기술지주 주식회사 | Alumina and graphite composite including a thermally conductive resin composition and dissipative products |
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KR20140044112A (en) * | 2012-10-04 | 2014-04-14 | 도레이첨단소재 주식회사 | High efficiency heat transfer adhesive materials and manufacturing thereof |
KR20160073684A (en) * | 2014-12-17 | 2016-06-27 | 부산지역대학연합기술지주 주식회사 | Alumina and graphite composite including a thermally conductive resin composition and dissipative products |
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