KR20140044112A - High efficiency heat transfer adhesive materials and manufacturing thereof - Google Patents
High efficiency heat transfer adhesive materials and manufacturing thereof Download PDFInfo
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- KR20140044112A KR20140044112A KR1020120110100A KR20120110100A KR20140044112A KR 20140044112 A KR20140044112 A KR 20140044112A KR 1020120110100 A KR1020120110100 A KR 1020120110100A KR 20120110100 A KR20120110100 A KR 20120110100A KR 20140044112 A KR20140044112 A KR 20140044112A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/01—Magnetic additives
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- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a high-efficiency heat-dissipating adhesive material and a method for manufacturing the same, and more particularly, the thermal conductivity can be maximized through selective high integration and high density of the heat transfer fillers, and thus the heat transfer interface can be improved by the excellent adhesion properties of the polymer resin. The present invention relates to a high-efficiency heat-dissipating adhesive material capable of minimizing the contact resistance at the same time and having a high thermal conductivity and excellent fluidity at the same time, and a method of manufacturing the same. To this end, the high-efficiency heat dissipation adhesive material according to the present invention is characterized in that it comprises a polymer resin, a heat transfer filler, and magnetic particles.
Description
The present invention relates to a high-efficiency heat-dissipating adhesive material and a method for manufacturing the same, and more particularly, the thermal conductivity can be maximized through selective high integration and high density of the heat transfer fillers, and thus the heat transfer interface can be improved by the excellent adhesion properties of the polymer resin. The present invention relates to a high-efficiency heat-dissipating adhesive material capable of minimizing the contact resistance at the same time and having a high thermal conductivity and excellent fluidity at the same time, and a method of manufacturing the same.
In general, heat is generated during the use of electronic components or devices, and in particular, as the use of portable module devices has recently increased rapidly, the thinning and shortening and high integration of electronic components have resulted in heat dissipation at the device level and electronic components or ICs. At the IC package level, awareness and demand for heat dissipation is increasing.
The IC package uses a heat spreader to dissipate heat generated from the chip or inserts an interfacial charge material for heat transfer between the heat sink fins to achieve efficient heat transfer, thereby preventing performance degradation due to the package's temperature rise. Doing. As such interfacial filler materials, composite materials containing high thermal conductivity inorganic additives are generally used in polymer resins.
Conventionally, a paste type interfacial filling material for heat transfer has been used, but as the IC package is light and simple, the control range of the structural dimension of the package itself is becoming precise from tens to hundreds of mm. Therefore, the problem of using a paste-type material causing a difference in the BLT (Bond Line Thickness) of several tens of mm has been highlighted. In addition, since the paste type is fixed by a curing process after dispensing on the surface, a thin and small IC package has a problem of warpage due to hardening shrinkage, and thus there is a limitation in application.
In order to overcome these problems, interfacial filling materials for heat transfer in the form of sheets or films have been developed (Korean Patent Publication Nos. 2010-0038115, 2011-7016122, and 2004-0023520). However, in the case of the heat transfer / heat radiation adhesive sheet, unlike the paste form, the interfacial adhesion is inferior, and thus the roughness of the surface of the chip, the heat spreader, or the heat radiation fin cannot be filled. In other words, it contains the air interface with the poorest thermal conductivity, resulting in a significantly lower heat transfer efficiency when applied to an IC package than the heat transfer efficiency of the actual material. Eventually, in order to compensate for the workability or fluidity of the heat transfer sheet, the content of the heat conductive additive is reduced and the amount of the polymer resin having good moldability is increased. In this case, the heat transfer at the interface can be improved, but in the interfacial filler material itself. The contact probability between the heat transfer additives is reduced, making it difficult to form a smooth heat path, thereby reducing the heat transfer efficiency. Thus, the content of thermally conductive additives exhibits the opposite relationship of an increase in contact resistance or an increase in resistance in the filling material, which simultaneously increases the thermal conductivity of the filling material itself and the flowability of the filling material for the two applied interfaces. There is a problem that is not satisfied.
The present invention has been made to solve the above problems, an object of the present invention is to deviate from the passive heat path formation method of the heat transfer fillers depending on the probability of the content of the heat transfer filler of the conventional heat transfer / heat-resistant adhesive materials, It is an object of the present invention to provide an active heat transfer / heat-dissipating adhesive material capable of forming rapid heat transfer paths by minimizing the distance between heat transfer fillers with a minimum additive content through partial high integration or high density of heat transfer fillers, and a method of manufacturing the same.
These and other objects and advantages of the present invention will become more apparent from the following description of a preferred embodiment thereof.
The purpose of the present invention includes a polymer resin and a heat transfer filler, wherein the heat transfer filler moves in accordance with a predetermined external magnetic pole pattern to form a relatively highly integrated or densified pattern in the polymer resin. Is achieved by
Here, the pattern of the external stimulus is characterized by being formed by a magnetic field.
Preferably, the heat transfer filler is a magnetic material, which moves directly according to a magnetic field applied in a predetermined pattern, and is formed in a predetermined pattern relatively high density or high density in the polymer resin.
Preferably, the method further comprises magnetic particles, wherein the heat transfer filler is a nonmagnetic material that is relatively highly integrated or densified in the polymer resin by a secondary movement according to the magnetic particles moving in accordance with a magnetic field applied in a predetermined pattern. Characterized in that the pattern is formed.
Preferably, the heat transfer filler is iron, aluminum, nickel, silver, gold, aluminum oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, silicon nitride, silicon oxide (silica), aluminum hydroxide, magnesium oxide, alumina, diamond , At least one selected from the group consisting of carbon fibers, carbon nanotubes, and graphene.
Preferably, the magnetic particles are at least one selected from the group consisting of iron, nickel, cobalt, chromium, platinum, manganese, aluminum, lead, copper and zinc.
In addition, the above object, the heat transfer filler is moved in accordance with the pattern of the external magnetic pole formed by the magnetic field in the high-efficiency heat-dissipating adhesive material containing the polymer resin and the heat transfer filler to form a predetermined pattern relatively high integration or high density in the polymer resin It is achieved by a method for producing a high efficiency heat-dissipating adhesive material characterized in that.
Here, the heat transfer filler is characterized in that it moves directly in accordance with the pattern of the external magnetic pole formed by the magnetic field as a magnetic material.
Preferably, the heat dissipation adhesive material further comprises magnetic particles, and the heat transfer filler is non-magnetically characterized by being moved by the magnetic particles moving in accordance with a pattern of an external magnetic pole formed by a magnetic field.
According to the present invention, the thermal conductivity can be maximized through the selective high density and high density of the heat transfer fillers, and thus the contact resistance at the heat transfer interface can be minimized due to the excellent adhesion property of the polymer resin, which is relatively improved, and also the high thermal conductivity and It has the effect of having excellent fluidity at the same time.
1 is a schematic view showing a probabilistic distribution of heat transfer fillers and a limited heat transfer path in a conventional heat adhesive material.
Figure 2 is a schematic diagram showing the partial integration and efficient heat transfer path of the heat transfer fillers in the high efficiency heat radiation adhesive material according to the present invention.
3 is a schematic view showing a method of manufacturing a high-efficiency heat dissipation adhesive material according to the present invention.
Hereinafter, the present invention will be described in detail with reference to embodiments and drawings of the present invention. It will be apparent to those skilled in the art that these embodiments are provided by way of illustration only for the purpose of more particularly illustrating the present invention and that the scope of the present invention is not limited by these embodiments .
The present invention relates to a high-efficiency heat-dissipating adhesive material and a method for manufacturing the same, which not only have excellent thermal conductivity of the material itself, but also have excellent workability and fluidity so as to have excellent thermal conductivity even in a state where the actual material is bonded between a high heat source and a low heat source. It is characterized by excellent.
In order to realize the above characteristics, the heat transfer fillers contained in the polymer resin serving as the structure constituting the material are not dispersed by simple mixing and formed stochastically to form a heat transfer path (Korean Patent Publication No. 10-A). 2005-0104280, see Fig. 1), the high-efficiency heat-dissipating adhesive material according to the present invention and a method for manufacturing the same, as shown in Figure 2, artificially adjust the distribution of the fillers to create a site where the fillers are efficiently integrated and relatively polymer resin It is possible to maintain the fluidity of the material while ensuring a high efficiency heat transfer path than the conventional simple mixing method with a minimum amount of filler by generating a portion of the increased content of.
Also, rather than the orientation of each of the directional heat transfer fillers (Korean Patent Publication No. 10-2007-0003626), the high-efficiency heat-dissipating adhesive material and its manufacturing method according to the present invention, as shown in Figure 3, has a non-uniform or specific pattern Partial high integration through the physical movement of heat transfer fillers by applying an excitation magnetic field ensures directivity from the macroscopic perspective to the non-directional heat transfer fillers and additionally fluidity of the polymer resin to the adherends of heat transfer / heat dissipation materials. It is possible to minimize the contact resistance.
High-efficiency heat-resistant adhesive material according to the invention is characterized in that it comprises a polymer resin and a heat transfer filler. That is, it basically consists of a polymer resin for forming the skeleton of the material, the adhesive force and an additive or filler having heat transfer characteristics.
The polymer resin may be a commonly used adhesive resin or phase change materials such as silicone resin, epoxy resin, acrylic resin, thermoplastic resin, and the like.
In addition, additives or fillers, which are the core materials of heat transfer, include iron, aluminum, nickel, silver, gold, aluminum nitride, zinc oxide, boron nitride, silicon carbide, silicon nitride oxide, silicon oxide (silica), aluminum hydroxide, magnesium oxide, diamond, At least one selected from carbon fiber, carbon nanotube, and graphene may be used.
In addition, other components include a curing agent for curing the polymer resin, an additive dispersant, a surfactant, an antifoaming agent, and the like.
In addition, in order to form an adhesive material having excellent thermal conductivity, the heat transfer fillers must be well dispersed in the polymer resin, and a heat transfer path must be secured to allow heat transfer through the heat transfer fillers. On the other hand, as the content of the filler increases, the contact probability between the filler increases and the heat transfer path is also secured, thereby increasing the thermal conductivity of the adhesive material itself, but the interface between the high heat source and the low heat source, which ultimately needs to be transferred due to the increase in the hardness of the material itself, The adhesion property of is lowered and the actual thermal conductivity is reduced.
For this reason, the manufacture of adhesive materials in order to produce an adhesive material that meets all of the characteristics of the opposite relationship in which a relatively small amount of filler is introduced and the contact probability between them is maximized to maximize thermal conductivity while maintaining fluidity of the adhesive material. During the process, the fillers have a specific pattern and can be partially forcedly integrated to improve the filler density.
In order to satisfy all of the characteristics of these opposing relationships, a mixed solution containing magnetic particles together with a polymer resin and a heat transfer filler is prepared, and the mixed solution is dried or cured in the form of a material while being dried on a substrate having a release property. A magnetic field is applied to a specific site before the movement, causing the movement or flow of the magnetic particles, and the primary movement of such magnetic particles leads to the movement of secondary heat transfer fillers, ultimately improving the partial density of the heat transfer fillers. As such, after the transfer of the heat transfer fillers to the designated position is completed, the drying or curing process may be performed to fix the heat transfer fillers in the polymer resin.
As the magnetic material of the magnetic particles, at least one selected from ferromagnetic iron, nickel, cobalt, paramagnetic chromium, platinum, manganese, aluminum, and diamagnetic lead, copper, zinc, and the like.
In addition, it is possible to form a domain of the heat transfer particles arranged in the material or pattern of the network structure according to the shape or pattern of the applied magnetic field. It is also possible to use a mixture of domain and network structure. However, the present invention is not limited to the illustrated form. Depending on the structure and surface characteristics of the high and low heat sources to heat transfer, an array structure of heat transfer particles capable of more efficient heat transfer can be designed.
In addition, the degree of integration of the heat transfer fillers can be controlled by the intensity or time of the applied magnetic field. As the time of increasing or applying the magnetic field increases, more magnetic particles move to the position where the magnetic field affects and thus more heat transfer fillers can move to form a high density heat transfer filler pattern. Of course, if the heat transfer filler is a magnetic material, instead of being moved to the secondary movement by the movement of the magnetic particles, it may be directly affected by the magnetic field.
Hereinafter, the structure and effect of the present invention will be described in more detail with reference to examples and comparative examples. However, this embodiment is intended to explain the present invention more specifically, and the scope of the present invention is not limited to these embodiments.
[Example]
The material used in the following Examples (the same Comparative Example) is as follows.
Acrylic resin: ternary, AT5100
Thermal Curing Agent: Isocyanate (Dow Coating, CE138)
Heat Transfer Filler: Aluminum Hydroxide (KC Corp., SH-17W)
Magnetic Particles: Spherical Aluminum Particles (Alpha Corporation, Al (10-14))
30% by weight of the acrylic resin was dissolved in 29% by weight of ethyl acetate, 1% by weight of the thermosetting agent, 25% by weight of the heat transfer filler, and 15% by weight of the magnetic particles were mixed and stirred for 1 hour using a homodispers type stirrer. A composition was obtained. The heat dissipation adhesive material composition after stirring was applied so as to have a thickness of 45 mm on the PET film on which the release coating layer was formed. A magnetic field was applied to the surface of the coated heat-dissipating adhesive material on the opposite side of the PET film, with an N pole on one side and an S pole and a bar magnet on the other. The height of each surface was about 1mm and the magnetic field was applied for about 3 minutes. The cross section of the bar magnet, which was located perpendicular to the surface of the heat-dissipating adhesive material and the surface of the PET release film, was about 10 mm long and about 2 mm wide. Thereafter, the heat-dissipating adhesive material was dried in an 80 ° C. dryer for about 30 minutes.
[Comparative Example 1]
A heat dissipation adhesive material was formed in the same manner as in Example 1 except that the heat dissipation adhesive material having the same composition as in Example 1 was dried without application of a magnetic field.
[Comparative Example 2]
The bar magnet was applied to the heat-dissipating adhesive material having the same composition as Example 1 by applying a magnetic field for about 3 minutes at a distance of about 10 mm from the surface of the heat-dissipating adhesive material and the surface of the PET release film, and then dried to form a heat-dissipating adhesive material.
[Comparative Example 3]
The heat-dissipating adhesive material having the same composition as in Example 1 was applied after applying a magnetic field in the same manner for about 30 minutes and dried to form a heat-dissipating adhesive material.
[Comparative Example 4]
Dissolve 15% by weight of acrylic resin in 29% by weight of ethyl acetate, mix 1% by weight of thermosetting agent, 35% by weight of heat transfer filler, and 20% by weight of magnetic particles, and stir for 1 hour using a homodispers stirrer. A composition was obtained. After the stirring, the heat-dissipating adhesive composition was applied on a PET film having a release coating layer to have a thickness of 45 mm, and then dried in an 80 ° C. dryer for about 30 minutes.
Physical properties were measured through the following experimental examples using the heat-dissipating adhesive materials according to the above Examples and Comparative Examples 1 to 4 and the results are shown in Table 1 below.
[Experimental Example]
The dried heat-dissipating adhesive materials according to Examples and Comparative Examples were sampled at a size of about 30 mm x 30 mm based on the position at which the cross section of the bar magnet was projected, and randomly when the magnetic field was not applied. The same size was sampled at the position of. Each of the heat-dissipating adhesive materials was separated from the PET release film, laminated on a 1 mm thick aluminum plate using a roller of 2 kg, and again laminated at a pressure of 0.1 MPa on a hot press heated to 100 ° C.
In order to confirm the heat dissipation characteristics of the heat dissipation adhesive materials, the heat dissipation adhesive materials laminated on the aluminum plate as described above is brought into contact with the aluminum plate on a hot plate heated to 150 ° C, and then the temperature of the heat dissipation adhesive material surface is 100 ° C. The time it takes to measure was measured. The heat transfer efficiency or heat dissipation characteristics were compared and ranked according to the measured time.
Table 1 summarizes the heat dissipation characteristics of the heat dissipation adhesive materials according to the Examples and Comparative Examples. The heat dissipation characteristic results are realized by including thermal conductivity or heat dissipation characteristics and lamination characteristics of the heat dissipation adhesive material. In particular, the same method was applied to all materials without checking the lamination state or optimizing lamination conditions or methods for each material. A total of five evaluations were made and compared using the average of the results.
Regarding the lamination characteristics, bubbles were included in the interface between the heat-dissipating adhesive material and the glass substrate using an optical microscope after laminating each heat-dissipating adhesive material in the above manner on a glass plate having a thickness of about 1 mm in a separate experiment. The qualitative comparison was based on the degree of.
(Low number is excellent characteristic)
No
As can be seen in Table 1, the embodiment according to the present invention was confirmed that the thermal conductivity or heat dissipation characteristics of the heat dissipation adhesive material is relatively improved due to the magnetic field properly applied to the heat dissipation adhesive material containing the magnetic particles. .
However, as can be seen in Comparative Examples 1 to 3, the case where the magnetic field is not applied or the magnetic field is too weak, or the magnetic field is applied for too long or too long, has no magnetic field effect or adverse effects. In other words, in Comparative Example 2, the heat transfer path was not efficient because the partial density increase and alignment effect of the heat transfer fillers were not realized, and in Comparative Example 3, the heat transfer fillers interfaced with the heat-dissipating adhesive material as the magnetic field application time increased. It was judged to be so heavy that the gap between the heat-transfer fillers occurred in the middle of the adhesive material, resulting in breakage of the heat-transfer passage. In the case of Comparative Example 4, the content of heat transfer filler, which is a passive method for improving general heat conductivity or heat dissipation characteristics, was increased, and the heat dissipation characteristics were relatively excellent due to the large number of heat transfer paths formed by the increased heat transfer fillers. However, as can be seen from the lamination properties, the possibility of bubble inclusion was confirmed, and if the pressure, temperature, and other conditions at the time of lamination were inadequate, there was a possibility that the heat dissipation characteristics could be greatly degraded due to the increase in contact resistance due to the inclusion of bubbles. .
Thus, by applying an appropriate magnetic field to the heat-dissipating adhesive material containing magnetic particles, the heat transfer passage is formed with a relatively small amount of heat transfer filler by forming a forced heat transfer passage to improve the partial density of the heat transfer fillers and to effect alignment. It can be seen that high heat transfer or heat dissipation effect can be realized by minimizing contact resistance by maintaining fluidity and lamination workability of the polymer resin.
It is to be understood that the present invention is not limited to the above embodiments and various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.
A1: polymer resin
A2: heat transfer filler
A3: Rapid heat transfer path formed through adjacent heat transfer fillers
A4: Magnetic Particles
A5: magnetic field source
Claims (9)
Polymer resin and heat transfer filler,
The heat transfer filler is moved according to a predetermined external magnetic pole pattern to form a relatively highly integrated or densified pattern in the polymer resin, high efficiency heat-resistant adhesive material.
The external magnetic pole pattern is formed by a magnetic field, high efficiency heat-resistant adhesive material.
The heat transfer filler is a magnetic material, which moves directly according to a magnetic field applied in a predetermined pattern, and is formed in a predetermined pattern relatively high density or densification in the polymer resin.
More magnetic particles,
The heat transfer filler is a nonmagnetic material and is formed in a predetermined pattern relatively high density or high density in the polymer resin by secondary movement according to the magnetic particles moving in accordance with a magnetic field applied in a predetermined pattern. Heat dissipation adhesive material.
The heat transfer filler may be iron, aluminum, nickel, silver, gold, aluminum oxide, aluminum nitride, zinc oxide, boron nitride, silicon carbide, silicon nitride, silicon oxide (silica), aluminum hydroxide, magnesium oxide, alumina, diamond, carbon fiber, At least one selected from the group consisting of carbon nanotubes and graphene, high efficiency heat-dissipating adhesive material.
The magnetic particles are at least one selected from the group consisting of iron, nickel, cobalt, chromium, platinum, manganese, aluminum, lead, copper and zinc, high efficiency heat-resistant adhesive material.
In the high-efficiency heat-dissipating adhesive material including a polymer resin and a heat transfer filler, the heat transfer filler is moved in accordance with a pattern of an external magnetic pole formed by a magnetic field to form a predetermined pattern that is relatively highly integrated or densified in the polymer resin. , Manufacturing method of high efficiency heat dissipation adhesive material.
The heat transfer filler is a magnetic material, characterized in that to move directly in accordance with the pattern of the external magnetic pole formed by the magnetic field, high efficiency heat dissipation adhesive material manufacturing method.
The heat dissipation adhesive material further comprises magnetic particles,
The heat transfer filler is a non-magnetic material, characterized in that the secondary movement by the magnetic particles moving in accordance with the pattern of the external magnetic pole formed by the magnetic field, a high efficiency heat-dissipating adhesive material manufacturing method.
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| WO2016024671A1 (en) * | 2014-08-12 | 2016-02-18 | 주식회사 테토스 | Core-shell structured filler for heat-releasing adhesive, having ain-deposited polymeric ball surface, and manufacturing method therefor |
| KR20160119004A (en) | 2016-09-22 | 2016-10-12 | 중앙대학교 산학협력단 | Heat Dissipation Films with Vertically Assembled Filler Materials and Preparation Method Thereof |
| CN106046862A (en) * | 2016-05-10 | 2016-10-26 | 雅安百图高新材料股份有限公司 | Boron nitride-covered spherical aluminum oxide and a preparing method thereof |
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| CN106046862A (en) * | 2016-05-10 | 2016-10-26 | 雅安百图高新材料股份有限公司 | Boron nitride-covered spherical aluminum oxide and a preparing method thereof |
| KR20160119004A (en) | 2016-09-22 | 2016-10-12 | 중앙대학교 산학협력단 | Heat Dissipation Films with Vertically Assembled Filler Materials and Preparation Method Thereof |
| CN108659536A (en) * | 2018-03-23 | 2018-10-16 | 昆山德睿懿嘉电子材料科技有限公司 | Heat Conduction Material and preparation method thereof |
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| CN109553908A (en) * | 2018-11-30 | 2019-04-02 | 中国科学院金属研究所 | Heat-conducting interface material for electronic equipment dissipating heat |
| KR102213106B1 (en) * | 2020-07-06 | 2021-02-05 | 주식회사태인 | Film Capacitor and Manufacturing method thereof |
| CN113584671A (en) * | 2021-07-30 | 2021-11-02 | 四川大学 | Heat-conducting polymer, heat-conducting polymer composite material, and preparation method and application thereof |
| CN115820183A (en) * | 2022-12-23 | 2023-03-21 | 深圳市道尔科技有限公司 | Preparation method of high-temperature-resistant high-strength high-heat-conductivity adhesive |
| CN115820183B (en) * | 2022-12-23 | 2023-06-27 | 深圳市道尔科技有限公司 | Preparation method of high-temperature-resistant high-strength high-heat-conductivity adhesive |
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