CN109517390A - A kind of high performance organo-silicon material and preparation method thereof - Google Patents
A kind of high performance organo-silicon material and preparation method thereof Download PDFInfo
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Abstract
The present invention provides a kind of high performance organo-silicon material, including prepares raw material as follows: silicone oil, conduction powder filler, low modulus auxiliary agent, high temperature resistant auxiliary agent, crosslinking agent and platinum catalyst；The mass ratio of the silicone oil and the conduction powder filler is 95-105:950-1050, the mass ratio of the conduction powder filler and the low modulus auxiliary agent is 100:1-2, the silicone oil, the high temperature resistant auxiliary agent, the crosslinking agent, the platinum catalyst mass ratio be followed successively by 100:0.1-1:5-12:0.1-0.2.The invention belongs to organosilicon technical fields, the heat dissipation long-time stability of heat conduction organosilicon material provided by the invention under the high temperature conditions are good, low modulus, gap easy to attach, thermal resistance is low, oil-tight, non-volatile, dispensing construction can be automated, better interface Heat Conduction Material is provided between electronic apparatus heating element and radiating element or equipment.
Description
Technical field
The invention belongs to organosilicon technical fields more particularly to a kind of high performance organo-silicon material and preparation method thereof.
Background technique
Increasingly developed with electronic enterprises, electronic product is to highly integrated, and high-power and small-sized micromation is constantly more
It is new to regenerate to meet the needs of emerging market.However, highly integrated, high-power and small-sized micromation can make electronic component unit plane
The heat generated in product sharply increases, if conducted not in time, the service performance of electric equipment products and service life all will be by
To serious influence.
For this purpose, in the design and fabrication of electric equipment products, for the heat that generates the heating elements such as chip and
When shed, it will usually install radiator additional to accelerate to radiate, but often there is gap between radiator and heating element, gap is empty
Gas has very big thermal resistance, and the effect for seriously affecting radiator plays, and currently used technical method is using interface heat conduction material
Material filling gap site, reduces the thermal resistance between heating element and radiator, in time dissipates heat, to guarantee equipment
Stablize operate normally.
Traditional interface Heat Conduction Material has heat-conducting silicone grease and two kinds of heat-conducting pad.Heat-conducting silicone grease is usually to use low viscosity silicon
A kind of never curing materials that oil is mixed with conduction powder filler, are easy to a variety of modes of operation, being capable of the fast fast-growing of equipment
It produces, can scrape very thin, to reduce thermal resistance and save the cost, but not chemically reacted between silicone oil and conduction powder filler
Crosslinking so that silicone grease is after being used for a long time and being used for a long time especially under high temperature, silicone oil can slowly separate out, cause silicone grease exsiccation to be split
And enter air, heat transfer resistance is considerably increased, radiation stability is poor, and seriously affect electric equipment products equipment uses the longevity
Life.Chinese patent application CN105400202 discloses a kind of boron nitride/graphene composite heat-conducting silicone grease, each component and mass parts
Array becomes: 10~30 parts of methyl phenyl silicone oil, modified boron nitride/60~90 parts of heat filling of graphene compounding is silane coupled
Agent be heat filling 3%~8%, crosslinking agent be methyl phenyl silicone oil 0.1%~1%, 0.1~1 part of structural improvement auxiliary agent,
0.1~1 part of antioxidant；Although having the advantages that high thermal conductivity coefficient, there are problems that permeability, will lead to heat dissipation after long-time service
Effect is substantially reduced.
The appearance of heat-conducting pad preferably resolves the dry and cracked dusting drawback after heat-conducting silicone grease is heated for a long time, but heat-conducting pad
Thickness is big compared with silicone grease, and thermal resistance is larger, while heat-conducting pad cannot be used for the quick production and construction of equipment, will increase construction cost.
With the miniaturization of electronic product complete machine and the fast development of high-power, heat generating component temperature is constantly increased, to boundary
Face Heat Conduction Material demand is further promoted, it is desirable that also harsher.It provides a kind of both scattered with the stability and high efficiency under hot conditions
The interface Heat Conduction Material that hot property is able to achieve automation rapid construction again is of great significance.
Summary of the invention
(permeability, long-term radiation stability are not ideal enough) to solve problems of the prior art, inventor pass through big
Amount test is screened and is compounded to the component of organosilicon material, unexpected discovery: by adding a small amount of low modulus auxiliary agent,
The surface polarity of changeable conduction powder, the thermal conductive network chain for facilitating heat filling are formed, and the compatibility with silicone oil is improved, moreover it is possible to
Enough realize the performance of soft and low modulus after heat conduction organosilicon material solidification, the heat dissipation long-time stability under hot conditions are good,
Low modulus, gap easy to attach, thermal resistance is low, oil-tight, non-volatile, can automate dispensing construction, is electronic apparatus heating element
Better interface Heat Conduction Material is provided between radiating element or equipment.Based on above-mentioned discovery, thereby completing the present invention.
The purpose of the present invention will be further described in detail below reflect and description.
A kind of high performance organo-silicon material, it is characterised in that: including preparing raw material as follows: silicone oil, conduction powder filler, low
Modulus auxiliary agent, high temperature resistant auxiliary agent, crosslinking agent and platinum catalyst；The mass ratio of the silicone oil and the conduction powder filler is
The mass ratio of 95-105:950-1050, the conduction powder filler and the low modulus auxiliary agent is 100:1-2, the silicone oil, institute
State high temperature resistant auxiliary agent, the crosslinking agent, the platinum catalyst mass ratio be followed successively by 100:0.1-1:5-12:0.1-0.2.
The above-mentioned ingredient for preparing raw material and amount ranges are that inventor is determined by a large number of experiments.Using above-mentioned technology
Scheme can be changed the surface polarity of conduction powder, facilitate the thermally conductive network chain of heat filling by adding a small amount of low modulus auxiliary agent
It is formed, improves the compatibility with silicone oil, additionally it is possible to realize the performance of soft and low modulus after heat conduction organosilicon material solidification, it is high
Heat dissipation long-time stability under the conditions of temperature are good, and low modulus, gap easy to attach, thermal resistance is low, oil-tight, non-volatile, can automate a little
Glue construction, provides better interface Heat Conduction Material between electronic apparatus heating element and radiating element or equipment.And it is existing
Technology then mainly realizes low modulus by addition crosslinking agent, but under the high temperature conditions, low modulus can not stablize holding.
In addition, high temperature resistant auxiliary agent added by the present invention belongs to organic silicon metal complex compound, with basic silicon based polymers
Compatibility is good, is added in organosilicon material system of the invention, significantly improves high temperature resistance, and the high-performance of preparation is organic
The problems such as silicon materials can be used for a long time at 260 DEG C, and Heat Conduction Material is not in cracking, dusting, has been effectively ensured hot conditions
Under long-term radiation stability.
Preferably, the mass ratio of the silicone oil and the conduction powder filler is 95-105:900-1050, the conductive powder
The mass ratio of body filler and the low modulus auxiliary agent is 100:0.7-1.5, the silicone oil, the high temperature resistant auxiliary agent, the crosslinking
Agent, the platinum catalyst mass ratio be followed successively by 100:0.2-0.8:8-12:0.12-0.18.
Preferably, the low modulus auxiliary agent is selected from hydroxyvinyl silicone oil, alkoxy vinyl silicone oil or combinations thereof object, glues
Degree is 1-20cp.In organosilicon material technical field, hydroxyvinyl silicone oil and alkoxy vinyl silicone oil are often used as gluing
Connect auxiliary agent.Inventor is had found by creative work, by adding a small amount of hydroxyl second in organosilicon material system of the invention
As low modulus auxiliary agent, viscosity is very low for alkenyl silicone oil and/or alkoxy vinyl silicone oil, contains or the hydroxyl that generates can be with
The reaction of heat filling powder surface hydroxyl changes powder surface polarity, raising and oil compatibility, it is ensured that can drop in mixing
Low material viscosity, improves the dispersion effect and filling rate of heat filling powder, and the thermal conductive network chain for facilitating heat filling is formed；Separately
One side hydroxyvinyl silicone oil and/or alkoxy vinyl silicone oil contain vinyl groups again, occur in silicone oil and crosslinking agent
When cross-linking reaction, energy subparticipation lengthens base polymer strand linearly into cross-linking reaction, then passes through branching and hands over
Connection achievees the purpose that crosslink density and distribution are controllable, helps to realize heat conduction organosilicon material to change network topology structure
The performance of soft and low modulus after solidification, at the same the low modulus base polymer network by hydroxyvinyl silicone oil and/or
Alkoxy vinyl silicone oil is connected chemically with heat filling powder, to make heat conduction organosilicon material obtained while have
The advantages that low modulus, heating conduction are stable, oil-tight and non-volatile.
It is highly preferred that the low modulus auxiliary agent is by hydroxyvinyl silicone oil and alkoxy vinyl silicone oil with the matter of 4-10:1
Amount is than composition, viscosity 1-16cp.Low modulus auxiliary agent is by hydroxyvinyl silicone oil and alkoxy vinyl silicone oil with 4-10:1's
When mass ratio forms, 100% stress at definite elongation is lower, low modulus better effect.
Preferably, the high temperature resistant auxiliary agent is selected from organosilicon copper complex, organosilicon aluminium complex, organosilicon iron complex
With one of organosilicon zirconium complex or a variety of.
Preferably, the silicone oil is methyl vinyl silicon oil, phenyl-vinyl silicon oil or combinations thereof object, viscosity 250-
1000cp。
Preferably, the conduction powder filler be selected from aluminium oxide, zinc oxide, boron nitride, silicon carbide, aluminium nitride, graphene,
One of aluminium powder and carbon nanotube dust are a variety of, and partial size is 0.1-100 μm.It is highly preferred that partial size is 1-20 μm, shape
For ball-type.It is highly preferred that the conduction powder filler is made of aluminium oxide and boron nitride with the mass ratio of 90:2, or by aluminium oxide
It is formed with zinc oxide with the mass ratio of 4:1, or is made of aluminium oxide and graphene with the mass ratio of 90:2.
Preferably, the crosslinking agent is made of end containing hydrogen silicone oil and side containing hydrogen silicone oil with the mass ratio of 1:1.5-2, the end
The hydrogen content of containing hydrogen silicone oil is 0.05-0.2wt%, and the hydrogen content of the side containing hydrogen silicone oil is 0.1-0.3wt%.
Preferably, the platinum catalyst is Karst platinum catalyst, and platinum content is 5000ppm.
Correspondingly, the present invention also provides the preparation methods of high performance organo-silicon material, comprising the following steps:
S1 puts into silicone oil in dispersion machine, and conduction powder filler and low modulus auxiliary agent are added in batches, stirs evenly；
Then S2 puts into high temperature resistant auxiliary agent, crosslinking agent in dispersion machine, stir evenly；
It is warming up to 105-115 DEG C under the conditions of S3 vacuum protection, vacuumizes and is dispersed with stirring reaction 40-80min；
S4 is cooled to 68-72 DEG C after reaction, to material, and platinum catalyst is added, vacuumizes and is stirred to react 25-
40min then cools to room temperature to get high performance organo-silicon material is arrived.
By adopting the above technical scheme, it by the way that conduction powder filler and low modulus auxiliary agent is first added in batches into silicone oil, stirs
High temperature resistant auxiliary agent and crosslinking agent are added after mixing uniformly, the thermal conductive network chain for facilitating heat filling is formed and product heat conduction organosilicon
The holding of the excellent performances such as material soft, low modulus, oil-tight.
Compared with prior art, the beneficial effect comprise that
(1) by adding a small amount of hydroxyvinyl silicone oil and/or alkoxy second in organosilicon material system of the invention
For alkenyl silicone oil as low modulus auxiliary agent, viscosity is very low, and the hydroxyl for containing or generating can be with heat filling powder surface hydroxyl
Reaction changes powder surface polarity, raising and oil compatibility, it is ensured that can reduce material viscosity in mixing, improves thermally conductive
The dispersion effect and filling rate of filler powder, the thermal conductive network chain for facilitating heat filling are formed；Another aspect hydroxyvinyl silicon
Oil and/or alkoxy vinyl silicone oil contain vinyl groups again, when silicone oil and crosslinking agent crosslink reaction, can partially join
It linearly lengthens, is then crosslinked by branching to change network topology knot with base polymer strand into cross-linking reaction, is made
Structure achievees the purpose that crosslink density and distribution are controllable, helps to realize soft and low mould after heat conduction organosilicon material solidification
The performance of amount, at the same the low modulus base polymer network by hydroxyvinyl silicone oil and/or alkoxy vinyl silicone oil with
Heat filling powder is connected chemically, to make heat conduction organosilicon material obtained while have low modulus, heating conduction steady
The advantages that fixed, oil-tight and non-volatile.
(2) by adding a small amount of high temperature resistant auxiliary agent in organosilicon material system of the invention --- organic silicon metal network
Object is closed, it is good with basic silicon based polymers compatibility, high temperature resistance is significantly improved, the high performance organo-silicon material of preparation can
It is used for a long time, the problems such as Heat Conduction Material is not in cracking, dusting, has been effectively ensured long-term under hot conditions at 260 DEG C
Radiation stability.
(3) not only heating conduction is reliable and stable under high temperature for high performance organo-silicon material provided by the invention, but also can be by
Arbitrary dimension is cut, and to adequately fill up the gap between electronic package surface and installation part surface, forms efficient heat exchange
Channel, moreover it is possible to damping vibration attenuation be played to electronic equipment and conveniently nondestructively carry out the effects of device reprocesses recycling.The present invention
The high performance organo-silicon material of offer can realize the substitution to existing heat-conducting pad and heat-conducting silicone grease, can be to avoid because of temperature and humidity
Variation and lead to the risk of the fluctuation of thickness, dusting, the reduction of thermal conductive contact face, realize automatically dropping glue pipelining, improve
Construction efficiency can be widely applied to the fever electronics such as integrated chip, power supply, power battery, computer, communication apparatus and controller
The heat dissipation of component.
(4) preparation method of high performance organo-silicon material provided by the invention is simple, heat conduction organosilicon material matter obtained
Amount is stablized, and performance is good.
Specific embodiment
Below by specific embodiment, the present invention is described in further detail.
A kind of high performance organo-silicon material, it is characterised in that: including preparing raw material as follows: silicone oil, conduction powder filler, low
Modulus auxiliary agent, high temperature resistant auxiliary agent, crosslinking agent and platinum catalyst；The mass ratio of the silicone oil and the conduction powder filler is
The mass ratio of 95-105:950-1050, the conduction powder filler and the low modulus auxiliary agent is 100:1-2, the silicone oil, institute
State high temperature resistant auxiliary agent, the crosslinking agent, the platinum catalyst mass ratio be followed successively by 100:0.1-1:5-12:0.1-0.2.
The above-mentioned ingredient for preparing raw material and amount ranges are that inventor is determined by a large number of experiments.Using above-mentioned technology
Scheme can be changed the surface polarity of conduction powder, facilitate the thermally conductive network chain of heat filling by adding a small amount of low modulus auxiliary agent
It is formed, improves the compatibility with silicone oil, additionally it is possible to realize the performance of soft and low modulus after heat conduction organosilicon material solidification, it is high
Heat dissipation long-time stability under the conditions of temperature are good, and low modulus, gap easy to attach, thermal resistance is low, oil-tight, non-volatile, can automate a little
Glue construction, provides better interface Heat Conduction Material between electronic apparatus heating element and radiating element or equipment.And it is existing
Technology then mainly realizes low modulus by addition crosslinking agent, but under the high temperature conditions, low modulus can not stablize holding.
In addition, high temperature resistant auxiliary agent added by the present invention belongs to organic silicon metal complex compound, with basic silicon based polymers
Compatibility is good, is added in organosilicon material system of the invention, significantly improves high temperature resistance, and the high-performance of preparation is organic
The problems such as silicon materials can be used for a long time at 260 DEG C, and Heat Conduction Material is not in cracking, dusting, has been effectively ensured hot conditions
Under long-term radiation stability.
Preferably, the mass ratio of the silicone oil and the conduction powder filler is 95-105:900-1050, the conductive powder
The mass ratio of body filler and the low modulus auxiliary agent is 100:0.7-1.5, the silicone oil, the high temperature resistant auxiliary agent, the crosslinking
Agent, the platinum catalyst mass ratio be followed successively by 100:0.2-0.8:8-12:0.12-0.18.
Preferably, the low modulus auxiliary agent is selected from hydroxyvinyl silicone oil, alkoxy vinyl silicone oil or combinations thereof object, glues
Degree is 1-20cp.In organosilicon material technical field, hydroxyvinyl silicone oil and alkoxy vinyl silicone oil are often used as gluing
Connect auxiliary agent.Inventor is had found by creative work, by adding a small amount of hydroxyl second in organosilicon material system of the invention
As low modulus auxiliary agent, viscosity is very low for alkenyl silicone oil and/or alkoxy vinyl silicone oil, contains or the hydroxyl that generates can be with
The reaction of heat filling powder surface hydroxyl changes powder surface polarity, raising and oil compatibility, it is ensured that can drop in mixing
Low material viscosity, improves the dispersion effect and filling rate of heat filling powder, and the thermal conductive network chain for facilitating heat filling is formed；Separately
One side hydroxyvinyl silicone oil and/or alkoxy vinyl silicone oil contain vinyl groups again, occur in silicone oil and crosslinking agent
When cross-linking reaction, energy subparticipation lengthens base polymer strand linearly into cross-linking reaction, then passes through branching and hands over
Connection achievees the purpose that crosslink density and distribution are controllable, helps to realize heat conduction organosilicon material to change network topology structure
The performance of soft and low modulus after solidification, at the same the low modulus base polymer network by hydroxyvinyl silicone oil and/or
Alkoxy vinyl silicone oil is connected chemically with heat filling powder, to make heat conduction organosilicon material obtained while have
The advantages that low modulus, heating conduction are stable, oil-tight and non-volatile.
It is highly preferred that the low modulus auxiliary agent is by hydroxyvinyl silicone oil and alkoxy vinyl silicone oil with the matter of 4-10:1
Amount is than composition, viscosity 1-16cp.Low modulus auxiliary agent is by hydroxyvinyl silicone oil and alkoxy vinyl silicone oil with 4-10:1's
When mass ratio forms, 100% stress at definite elongation is lower, low modulus better effect.
Preferably, the high temperature resistant auxiliary agent is selected from organosilicon copper complex, organosilicon aluminium complex, organosilicon iron complex
With one of organosilicon zirconium complex or a variety of.
Preferably, the silicone oil is methyl vinyl silicon oil, phenyl-vinyl silicon oil or combinations thereof object, viscosity 250-
1000cp。
Preferably, the conduction powder filler be selected from aluminium oxide, zinc oxide, boron nitride, silicon carbide, aluminium nitride, graphene,
One of aluminium powder and carbon nanotube dust are a variety of, and partial size is 0.1-100 μm.It is highly preferred that partial size is 1-20 μm, shape
For ball-type.It is highly preferred that the conduction powder filler is made of aluminium oxide and boron nitride with the mass ratio of 90:2, or by aluminium oxide
It is formed with zinc oxide with the mass ratio of 4:1, or is made of aluminium oxide and graphene with the mass ratio of 90:2.
Preferably, the crosslinking agent is made of end containing hydrogen silicone oil and side containing hydrogen silicone oil with the mass ratio of 1:1.5-2, the end
The hydrogen content of containing hydrogen silicone oil is 0.05-0.2wt%, and the hydrogen content of the side containing hydrogen silicone oil is 0.1-0.3wt%.
Preferably, the platinum catalyst is Karst platinum catalyst, and platinum content is 5000ppm.
Correspondingly, the present invention also provides the preparation methods of high performance organo-silicon material, comprising the following steps:
S1 puts into silicone oil in dispersion machine, and conduction powder filler and low modulus auxiliary agent are added in batches, stirs evenly；
Then S2 puts into high temperature resistant auxiliary agent, crosslinking agent in dispersion machine, stir evenly；
It is warming up to 105-115 DEG C under the conditions of S3 vacuum protection, vacuumizes and is dispersed with stirring reaction 40-80min；
S4 is cooled to 68-72 DEG C after reaction, to material, and platinum catalyst is added, vacuumizes and is stirred to react 25-
40min then cools to room temperature to get high performance organo-silicon material is arrived.
By adopting the above technical scheme, it by the way that conduction powder filler and low modulus auxiliary agent is first added in batches into silicone oil, stirs
High temperature resistant auxiliary agent and crosslinking agent are added after mixing uniformly, the thermal conductive network chain for facilitating heat filling is formed and product heat conduction organosilicon
The holding of the excellent performances such as material soft, low modulus, oil-tight.
Claims (10)
1. a kind of high performance organo-silicon material, it is characterised in that: including preparing raw material as follows: silicone oil, conduction powder filler, low mould
Measure auxiliary agent, high temperature resistant auxiliary agent, crosslinking agent and platinum catalyst；The mass ratio of the silicone oil and the conduction powder filler is 95-
105:950-1050, the mass ratio of the conduction powder filler and the low modulus auxiliary agent are 100:1-2, the silicone oil, described
High temperature resistant auxiliary agent, the crosslinking agent, the platinum catalyst mass ratio be followed successively by 100:0.1-1:5-12:0.1-0.2.
2. high performance organo-silicon material according to claim 1, it is characterised in that: the silicone oil is filled out with the conduction powder
The mass ratio of material is 95-105:900-1050, and the mass ratio of the conduction powder filler and the low modulus auxiliary agent is 100:
0.7-1.5, the silicone oil, the high temperature resistant auxiliary agent, the crosslinking agent, the platinum catalyst mass ratio be followed successively by 100:
0.2-0.8:8-12:0.12-0.18.
3. high performance organo-silicon material according to claim 1 or 2, it is characterised in that: the low modulus auxiliary agent is selected from hydroxyl
Base vinyl silicone oil, alkoxy vinyl silicone oil or combinations thereof object, viscosity 1-20cp.
4. high performance organo-silicon material according to claim 1 or 2, it is characterised in that: the low modulus auxiliary agent is by hydroxyl
Vinyl silicone oil and alkoxy vinyl silicone oil are formed with the mass ratio of 4-10:1, viscosity 1-16cp.
5. high performance organo-silicon material according to claim 1 or 2, it is characterised in that: the high temperature resistant auxiliary agent, which is selected from, to be had
One of machine copper silicon complex compound, organosilicon aluminium complex, organosilicon iron complex and organosilicon zirconium complex are a variety of.
6. high performance organo-silicon material according to claim 1 or 2, it is characterised in that: the silicone oil is methyl ethylene
Silicone oil, phenyl-vinyl silicon oil or combinations thereof object, viscosity 250-1000cp.
7. high performance organo-silicon material according to claim 1 or 2, it is characterised in that: the conduction powder filler is selected from
One of aluminium oxide, zinc oxide, boron nitride, silicon carbide, aluminium nitride, graphene, aluminium powder and carbon nanotube dust are a variety of,
Partial size is 0.1-100 μm.
8. high performance organo-silicon material according to claim 1 or 2, it is characterised in that: the crosslinking agent is by end Silicon Containing Hydrogen
Oil and side containing hydrogen silicone oil are formed with the mass ratio of 1:1.5-2, and the hydrogen content of the end containing hydrogen silicone oil is 0.05-0.2wt%, described
The hydrogen content of side containing hydrogen silicone oil is 0.1-0.3wt%.
9. high performance organo-silicon material according to claim 1 or 2, it is characterised in that: the platinum catalyst is to block this
Special platinum catalyst, platinum content are 5000ppm.
10. the preparation method of high performance organo-silicon material according to claim 1, it is characterised in that: the following steps are included:
S1 puts into silicone oil in dispersion machine, and conduction powder filler and low modulus auxiliary agent are added in batches, stirs evenly；
Then S2 puts into high temperature resistant auxiliary agent, crosslinking agent in dispersion machine, stir evenly；
It is warming up to 105-115 DEG C under the conditions of S3 vacuum protection, vacuumizes and is dispersed with stirring reaction 40-80min；
S4 is cooled to 68-72 DEG C after reaction, to material, and platinum catalyst is added, vacuumizes and is stirred to react 25-40min, so
After be cooled to room temperature to get to high performance organo-silicon material.
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| CN110791104A (en) * | 2019-09-19 | 2020-02-14 | 安徽若水化工有限公司 | High-temperature-resistant low-modulus silicon material and preparation method thereof |
| CN111117260A (en) * | 2019-12-31 | 2020-05-08 | 深圳市飞鸿达科技有限公司 | Preparation method of micro-crosslinked single-component heat-conducting wave-absorbing gel |
| CN112705702A (en) * | 2020-12-07 | 2021-04-27 | 中国科学院深圳先进技术研究院 | Aluminum powder surface modification method |
| CN112852171A (en) * | 2021-03-11 | 2021-05-28 | 天津泽希新材料有限公司 | Ultra-soft high-thermal-conductivity silicone rubber composite material and preparation method thereof |
| CN113736266A (en) * | 2021-09-27 | 2021-12-03 | 广州集泰化工股份有限公司 | Double-component heat-conducting gel and preparation method and application thereof |
| CN113831900A (en) * | 2021-10-25 | 2021-12-24 | 中国电子科技集团公司第三十三研究所 | High-viscosity thermal control material with heat recovery function and preparation method thereof |
| CN114539780A (en) * | 2020-11-24 | 2022-05-27 | 深圳先进电子材料国际创新研究院 | Single-component thermal interface material and preparation method thereof |
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2018
- 2018-11-29 CN CN201811442294.8A patent/CN109517390A/en not_active Withdrawn
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| CN110791104A (en) * | 2019-09-19 | 2020-02-14 | 安徽若水化工有限公司 | High-temperature-resistant low-modulus silicon material and preparation method thereof |
| CN111117260A (en) * | 2019-12-31 | 2020-05-08 | 深圳市飞鸿达科技有限公司 | Preparation method of micro-crosslinked single-component heat-conducting wave-absorbing gel |
| CN114539780A (en) * | 2020-11-24 | 2022-05-27 | 深圳先进电子材料国际创新研究院 | Single-component thermal interface material and preparation method thereof |
| CN112705702A (en) * | 2020-12-07 | 2021-04-27 | 中国科学院深圳先进技术研究院 | Aluminum powder surface modification method |
| CN112852171A (en) * | 2021-03-11 | 2021-05-28 | 天津泽希新材料有限公司 | Ultra-soft high-thermal-conductivity silicone rubber composite material and preparation method thereof |
| CN113736266A (en) * | 2021-09-27 | 2021-12-03 | 广州集泰化工股份有限公司 | Double-component heat-conducting gel and preparation method and application thereof |
| CN113831900A (en) * | 2021-10-25 | 2021-12-24 | 中国电子科技集团公司第三十三研究所 | High-viscosity thermal control material with heat recovery function and preparation method thereof |
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