CN202322703U - Adhesive tape with heat conduction performance - Google Patents
Adhesive tape with heat conduction performance Download PDFInfo
- Publication number
- CN202322703U CN202322703U CN2011204353165U CN201120435316U CN202322703U CN 202322703 U CN202322703 U CN 202322703U CN 2011204353165 U CN2011204353165 U CN 2011204353165U CN 201120435316 U CN201120435316 U CN 201120435316U CN 202322703 U CN202322703 U CN 202322703U
- Authority
- CN
- China
- Prior art keywords
- heat
- adhesive tape
- heat conduction
- conducting medium
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 239000002344 surface layer Substances 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 239000004831 Hot glue Substances 0.000 claims abstract description 5
- -1 polypropylene Polymers 0.000 claims abstract description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 12
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 12
- 239000010439 graphite Substances 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000005030 aluminium foil Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 239000002023 wood Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 4
- 229910052582 BN Inorganic materials 0.000 abstract 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract 1
- 239000004743 Polypropylene Substances 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920001155 polypropylene Polymers 0.000 abstract 1
- 238000010345 tape casting Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The utility model discloses a structure of an adhesive tape with heat conduction performance. The structure is provided with a single-side adhesive tape with heat conduction performance, and a two-side adhesive tape with the heat conduction performance, wherein the single-side adhesive tape with heat conduction performance has an integrated structure and consists of a base material, a heat conduction medium adhesive layer and a releasing film which is adhered to the heat conduction medium adhesive layer; and the heat conduction medium adhesive layer consists of a heat conduction medium consisting of aluminum nitride, boron nitride or alumina which is added into polypropylene adhesive, organosilicon adhesive, or hot melt adhesive in a knife coating way on the surface layer of the base material. The two-side adhesive tape with the heat conduction performance has the same structure as the single-side adhesive tape; and heat conduction medium coatings are arranged on the surface layer and the bottom layer of the base materials respectively, and releasing films are adhered to heat conduction adhesive layers of the surface layer and the bottom layer. The structure of the adhesive tape has the advantages that materials are easy to obtain and the adhesive tape is easy to manufacture; and the adhesive tape can be processed into finished products with different shapes easily according to the shapes of various electronic products so as to meet the using requirements of various electronic products.
Description
Technical field
The utility model belongs to interface thermally conductive material technical field, relates to a kind of adhesive tape with heat conductivility.
Background technology
The development of science and technology and the market requirement make electron device, make the direction row of electron device to miniaturized, lightweight, compact construction operation high efficiency, and its radiating effect becomes the key of complete machine miniaturization Design.For guaranteeing electron device or equipment stable state fortune, needing in time derives the heat that produces, thereby quality, thermal conductivity, intensity and the stability of heat sink material has been proposed requirements at the higher level.
Of the prior art a kind of be silicone grease heat conduction adhesive tape, in silicone grease, form the heat conduction constituent by SP 1 through dispersed with stirring and then roll the heat conduction adhesive tape of processing film body.There is weak point in the heat conduction adhesive tape of this no base material: 1, thermal conductivity is low.2,, therefore often be difficult for being attached to securely the former device of LED or the CPU display card back side because the deflection of the poor adhesion of heat conduction adhesive tape and product is low.3, because apparatus and process limits, thicknesses of layers and thermal conductivity all can not reach the ideal requirement.4, cause silicon to pollute easily.
For this reason, at present thermally conductive material market, interface demands developing a kind of have high thermal conductivity, the good fusible high-heat-conductivity glue band that is provided with base material urgently, to substitute existing extrusion molding heat-conducting glue carries product.
The utility model content
The purpose of the utility model is to overcome weak point of the prior art, and a kind of high thermal conductivity and the good fusible a kind of adhesive tape with heat conductivility that is provided with base material are provided.
The utility model is for realizing above-mentioned purpose, and the technical scheme that is adopted is:
A kind of adhesive tape with heat conductivility, its structure are provided with single face adhesive tape with heat conductivility and the double sticky tape with heat conductivility respectively, wherein have the single face adhesive tape of heat conductivility, and its structure is by base material; On the base material surface layer, apply by being added on Vestolen PP 7052 glue paste or organic silicon adhesive through the scraper coating method, or the aluminium nitride AlN of hot melt adhesive, or SP 1; Or the heat-conducting medium formed of aluminum oxide and the heat-conducting medium coating that forms and on the heat-conducting medium coating, attach the heat conduction single face adhesive tape that dicing film constitutes integrative-structure, said base material is graphite film; Aluminium foil, glasscloth and macromolecular material and graphite compound composite wood, optional wherein a kind of; Said graphite film, aluminium foil, glasscloth and macromolecular material and graphite compound composite wood base material; Its thickness designs its thickness respectively and is designed to 50 μ m ~ 500 μ m respectively, 10 μ m ~ 50 μ m, 100 μ m ~ 150 μ m; 55 μ m ~ 500 μ m, said heat-conducting medium coating, its thickness is counted 20 μ m ~ 100 μ m; Said dicing film, its thickness is designed to 75 μ m.
A kind of double sticky tape with heat conductivility; Its structure is by base material, on base material surface layer and bottom, applies by being added on Vestolen PP 7052 glue paste or organic silicon adhesive through the scraper coating method respectively, or the aluminium nitride AlN of hot melt adhesive; Or SP 1; Or the heat-conducting medium formed of aluminum oxide and the heat-conducting medium coating that forms with respectively at the bond plies band that attaches dicing film formation integrative-structure on the surface layer of heat-conducting medium coating and on the bottom of heat-conducting medium glue-line, said base material, heat-conducting medium coating; Dicing film and thickness thereof, all with heat conduction single face adhesive tape designed identical.
Advantage and beneficial effect
Advantage: the utlity model has the advantage that is easy to draw materials with processing and fabricating.
Beneficial effect: 1, the structure of the utility model is because of being provided with base material; And on base material, be coated with and be covered with the heat-conducting medium that contains sizing agent and constitute single face and two-sided heat conduction adhesive tape; Its thermal conductivity is greater than 3.0w/m.k; Being higher than the prior art thermal conductivity is the heat-conducting glue carries product of 0.8w/m.k, thereby has overcome the defective that prior art exists.2, can be easy to be processed into the different shape finished product according to the shape of various electron device product, to satisfy the request for utilization of various electron devices.
Description of drawings
Fig. 1 is the single face adhesive tape structure synoptic diagram with heat conductivility of the utility model;
Fig. 2 is the double sticky tape structural representation with heat conductivility of the utility model.
Among Fig. 1: the 1-dicing film; 2-heat-conducting medium glue-line; The 3-base material.
Among Fig. 2: the 1-dicing film; 2-heat-conducting medium glue-line; The 3-base material; 4-heat-conducting medium glue-line; The 5-dicing film.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Embodiment 1
A kind of single face adhesive tape with heat conductivility, its structure be by base material 3, through scraper coating method heat-conducting medium glue-line 2 that applies and the dicing film 1 that is attached to heat-conducting medium glue-line 2 surface layers, thereby constitutes the heat conduction single face adhesive tape D1 of integrative-structure;
Said base material 3, the utility model is designed to graphite film, and its thickness, the utility model are designed to 50 μ m;
Said heat-conducting medium glue-line 2, the utility model are designed to the heat-conducting medium glue-line 2 that formed by the aluminium nitride AlN that is added on the Vestolen PP 7052 glue paste, and it is 30 μ m that its thickness, the utility model are designed to;
Said dicing film 1, its thickness, the utility model are designed to 75 μ m.
A kind of double sticky tape with heat conductivility; Its structure is by base material 3; Be coated in heat-conducting medium glue-line 2 and the heat-conducting medium glue-line 4 of bottom of the surface layer of base material 3; And be attached to the dicing film 1 of heat-conducting medium glue-line 2 surface layers and the dicing film 5 of heat-conducting medium glue-line 4 bottoms, thereby constitute the heat conduction single face adhesive tape D2 of integrative-structure;
Said base material 3, the utility model is designed to graphite film, and its thickness, the utility model are designed to 50 μ m;
Said heat-conducting medium glue-line 2,4, the utility model design applies the heat-conducting medium glue-line of being made up of the aluminium nitride AlN that is added on the Vestolen PP 7052 glue paste 2,4 through the scraper coating method respectively on base material 3 surface layers and bottom; Its thickness, the utility model are designed to 30 μ m;
Said dicing film 1,5, its thickness, the utility model are designed to 75 μ m.
The above only is the preferred implementation of the utility model; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection domain of the utility model.
Claims (2)
1. adhesive tape with heat conductivility, it is characterized in that: its structure is provided with single face adhesive tape (D1) with heat conductivility and the double sticky tape (D2) with heat conductivility respectively, wherein has the single face adhesive tape (D1) of heat conductivility, and its structure is by base material (3); On base material (3) surface layer, apply by being added on Vestolen PP 7052 glue paste or organic silicon adhesive through the scraper coating method, or the aluminium nitride AlN of hot melt adhesive, or SP 1; Or the heat-conducting medium formed of aluminum oxide and the heat-conducting medium glue-line (2) that forms and go up at heat-conducting medium glue-line (2) and to attach the heat conduction single face adhesive tape (D1) that dicing film (1) constitutes integrative-structure, said base material (3) is graphite film; Aluminium foil, glasscloth and macromolecular material and graphite compound composite wood, optional wherein a kind of; Said graphite film, aluminium foil, glasscloth and macromolecular material and graphite compound composite wood base material (3); Its thickness is designed to 50 μ m ~ 500 μ m respectively, 10 μ m ~ 50 μ m, 100 μ m ~ 150 μ m; 55 μ m ~ 500 μ m, said heat-conducting medium glue-line (2), its thickness count 20 μ m ~ 100 μ m; Said dicing film (1), its thickness is designed to 75 μ m.
2. double sticky tape with heat conductivility; It is characterized in that: its structure is by base material (3); On base material (3) surface layer and bottom, apply by being added on Vestolen PP 7052 glue paste or organic silicon adhesive through the scraper coating method respectively; Or the aluminium nitride AlN of hot melt adhesive, or SP 1, or the heat-conducting medium formed of aluminum oxide and the heat-conducting medium glue-line (2,4) that forms with respectively at the bond plies band (D2) that attaches a dicing film (1,5) formation integrative-structure on the surface layer of heat-conducting medium glue-line (2) and on the bottom of heat-conducting medium glue-line (4); Said base material (3); Heat-conducting medium glue-line (2,4), dicing film (1,5) and thickness thereof, all with heat conduction single face adhesive tape (D1) designed identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204353165U CN202322703U (en) | 2011-11-07 | 2011-11-07 | Adhesive tape with heat conduction performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204353165U CN202322703U (en) | 2011-11-07 | 2011-11-07 | Adhesive tape with heat conduction performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202322703U true CN202322703U (en) | 2012-07-11 |
Family
ID=46434691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204353165U Expired - Fee Related CN202322703U (en) | 2011-11-07 | 2011-11-07 | Adhesive tape with heat conduction performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202322703U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103045128A (en) * | 2012-12-28 | 2013-04-17 | 宁波大榭开发区综研化学有限公司 | Heat conduction adhesive and preparation method of adhesive tape employing same |
| CN103045119A (en) * | 2012-12-28 | 2013-04-17 | 苏州斯迪克新材料科技股份有限公司 | Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient |
| CN103763892A (en) * | 2014-01-26 | 2014-04-30 | 斯迪克新型材料（江苏）有限公司 | Heat conduction graphite patch for microelectronic device |
| CN103781329A (en) * | 2012-10-26 | 2014-05-07 | 史广洲 | Graphite aluminum foil heat-conducting material |
| CN104140769A (en) * | 2014-08-06 | 2014-11-12 | 苏州卓越工程塑料有限公司 | Hot melt adhesive for bubble cap packaging |
| CN104812205A (en) * | 2014-01-26 | 2015-07-29 | 苏州斯迪克新材料科技股份有限公司 | Tensile heat-radiating graphite patch |
| CN105153960A (en) * | 2015-10-26 | 2015-12-16 | 衡山县佳诚新材料有限公司 | Ultrathin heat dissipation adhesive tape |
| CN105873414A (en) * | 2014-01-26 | 2016-08-17 | 苏州斯迪克新材料科技股份有限公司 | Preparation process for graphite heat conduction and dissipation patch |
| CN106366972A (en) * | 2016-09-26 | 2017-02-01 | 福建师范大学 | Adhesive tape specially used for three-dimensional (3D) printing |
| CN106459685A (en) * | 2015-12-29 | 2017-02-22 | 苏州斯迪克新材料科技股份有限公司 | High thermal conductivity ultrathin adhesive tape based on synthetic graphite modification |
| CN106634657A (en) * | 2015-08-19 | 2017-05-10 | 东莞市佳佑电子有限公司 | Composite material with characteristics of electromagnetic radiation resistance and high thermal conductivity, and preparation method thereof |
| CN109694662A (en) * | 2019-02-14 | 2019-04-30 | 江苏金由新材料有限公司 | A kind of dissipation from electronic devices adhesive layer and its radiator structure |
-
2011
- 2011-11-07 CN CN2011204353165U patent/CN202322703U/en not_active Expired - Fee Related
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781329A (en) * | 2012-10-26 | 2014-05-07 | 史广洲 | Graphite aluminum foil heat-conducting material |
| CN103045128B (en) * | 2012-12-28 | 2015-01-07 | 宁波大榭开发区综研化学有限公司 | Heat conduction adhesive and preparation method of adhesive tape employing same |
| CN103045119A (en) * | 2012-12-28 | 2013-04-17 | 苏州斯迪克新材料科技股份有限公司 | Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient |
| CN103045128A (en) * | 2012-12-28 | 2013-04-17 | 宁波大榭开发区综研化学有限公司 | Heat conduction adhesive and preparation method of adhesive tape employing same |
| CN103763892B (en) * | 2014-01-26 | 2017-01-11 | 斯迪克新型材料（江苏）有限公司 | Heat conduction graphite patch for microelectronic device |
| CN104812205B (en) * | 2014-01-26 | 2017-10-27 | 江苏斯迪克新材料科技股份有限公司 | Stretch-proof radiating graphite paster |
| CN104812205A (en) * | 2014-01-26 | 2015-07-29 | 苏州斯迪克新材料科技股份有限公司 | Tensile heat-radiating graphite patch |
| CN105873414B (en) * | 2014-01-26 | 2018-08-31 | 江苏斯迪克新材料科技股份有限公司 | Manufacturing process for graphite heat conducting heat dissipation patch |
| CN106535560A (en) * | 2014-01-26 | 2017-03-22 | 斯迪克新型材料（江苏）有限公司 | Manufacturing process for heat-conducting graphite paste films for flat computers |
| CN105873414A (en) * | 2014-01-26 | 2016-08-17 | 苏州斯迪克新材料科技股份有限公司 | Preparation process for graphite heat conduction and dissipation patch |
| CN103763892A (en) * | 2014-01-26 | 2014-04-30 | 斯迪克新型材料（江苏）有限公司 | Heat conduction graphite patch for microelectronic device |
| CN106332521A (en) * | 2014-01-26 | 2017-01-11 | 斯迪克新型材料（江苏）有限公司 | Manufacturing method for double-sided adhesive graphite flake |
| CN104140769B (en) * | 2014-08-06 | 2016-05-11 | 苏州卓越工程塑料有限公司 | A kind of blister package PUR |
| CN104140769A (en) * | 2014-08-06 | 2014-11-12 | 苏州卓越工程塑料有限公司 | Hot melt adhesive for bubble cap packaging |
| CN106634657A (en) * | 2015-08-19 | 2017-05-10 | 东莞市佳佑电子有限公司 | Composite material with characteristics of electromagnetic radiation resistance and high thermal conductivity, and preparation method thereof |
| CN106634657B (en) * | 2015-08-19 | 2020-10-16 | 东莞市佳佑电子有限公司 | Composite material with electromagnetic radiation resistance and high thermal conductivity and preparation method thereof |
| CN105153960A (en) * | 2015-10-26 | 2015-12-16 | 衡山县佳诚新材料有限公司 | Ultrathin heat dissipation adhesive tape |
| CN106459685A (en) * | 2015-12-29 | 2017-02-22 | 苏州斯迪克新材料科技股份有限公司 | High thermal conductivity ultrathin adhesive tape based on synthetic graphite modification |
| WO2017113084A1 (en) * | 2015-12-29 | 2017-07-06 | 江苏斯迪克新材料科技股份有限公司 | Modified ultra-thin adhesive tape with high heat conductivity based on synthetic graphite |
| CN106366972A (en) * | 2016-09-26 | 2017-02-01 | 福建师范大学 | Adhesive tape specially used for three-dimensional (3D) printing |
| CN109694662A (en) * | 2019-02-14 | 2019-04-30 | 江苏金由新材料有限公司 | A kind of dissipation from electronic devices adhesive layer and its radiator structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HENGLANG TECHNOLOGY (TIANJIN) CO., LTD. Free format text: FORMER OWNER: WU ZHIGAO Effective date: 20131009 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 300350 HONGQIAO, TIANJIN TO: 300000 JINNAN, TIANJIN |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131009 Address after: 300000 Tianjin City, Jinnan Economic Development Zone (West) Dragon Street No. 10 Jiuzhou Creative Park A3 Building Room 903 Patentee after: Heng Lang Technology (Tianjin) Co., Ltd. Address before: 300350 Tianjin District, Hongqiao, Hong Wah Road, A building, gate 1, 1501 Patentee before: Wu Zhigao |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20151107 |
|
| EXPY | Termination of patent right or utility model |