CN106634657B

CN106634657B - Composite material with electromagnetic radiation resistance and high thermal conductivity and preparation method thereof

Info

Publication number: CN106634657B
Application number: CN201510512193.3A
Authority: CN
Inventors: 张宇
Original assignee: Dongguan Jiayou Electronic Co ltd
Current assignee: Dongguan Jiayou Electronic Co ltd
Priority date: 2015-08-19
Filing date: 2015-08-19
Publication date: 2020-10-16
Anticipated expiration: 2035-08-19
Also published as: CN106634657A

Abstract

The invention relates to a composite material with electromagnetic radiation resistance and high thermal conductivity, which comprises a first composite layer, a heat-homogenizing layer, a second composite layer and a heat-conducting layer which are sequentially compounded into a whole, wherein the total thickness of the composite material is less than or equal to 2 mm; the first composite layer is formed by single-layer or multi-layer adhesive gum; the second composite layer is prepared from the following components in percentage by weight: 3-5% of curing agent and 95-97% of adhesion-promoting component; the uniform heating layer is made of one or the combination of two materials of metal and graphite. The invention also provides a preparation method of the composite material. The composite material with the electromagnetic radiation resistance and the high thermal conductivity has good thermal conductivity and radiation resistance, and the preparation method is simple, easy to operate and convenient for industrial application.

Description

Composite material with electromagnetic radiation resistance and high thermal conductivity and preparation method thereof

Technical Field

The invention relates to the field of materials, in particular to a composite material with electromagnetic radiation resistance and high thermal conductivity and a preparation method thereof.

Background

With the rapid development of modern electronic technology, the integration degree and the assembly density of electronic components are continuously improved, and the working power consumption and the heat productivity of the electronic components are increased sharply while providing strong use functions. High temperatures can have detrimental effects on the stability, reliability and lifetime of electronic components, such as excessive temperatures that can compromise semiconductor junctions, damage the circuit connection interfaces, increase the resistance of the conductors and cause mechanical stress damage. Therefore, ensuring that the heat generated by the heating electronic components can be discharged in time has become an important aspect of microelectronic product system assembly. For portable electronic products (such as mobile phones, tablet computers, notebook computers, automotive electronics and communication products) with high integration degree and assembly density, heat dissipation even becomes the technical bottleneck problem of the whole product.

The heat conduction material which is widely applied at present is a heat conduction silica gel sheet. The current analysis of the heat-conducting silica gel sheet on the defects of heat transfer performance and processing and assembling is as follows: 1. the heat conductivity coefficient of the heat-conducting silica gel sheet is generally between 1 and 5W, the specification is more than 0.2 to 2 millimeters, and the heat-conducting silica gel sheet with higher heat conductivity coefficient has high cost; 2. the heat-conducting silica gel sheet has high thermal impedance, low heat conduction capability of the large-thickness heat-conducting silica gel sheet, only point-to-point longitudinal heat transfer, extremely poor transverse heat diffusion capability and poor heat dissipation and heat uniformity capability for electronic products with high integration degree and assembly density; 3. the heat-conducting silica gel sheet has poor assembly performance and low assembly efficiency, is easy to damage in the assembly process, has extremely poor mechanical stability after assembly, and can not be reused for electronic products needing to be maintained and repaired, thereby wasting resources; 4. the capability of resisting EMI interference is not available, and the adhesive force to a heat dissipation structural part is extremely poor; 5. the thick heat-conducting silica gel sheet is weak in ageing resistance, risks of silicone oil seepage are caused, and evaporation gas can be generated to damage electronic devices (cameras and display equipment) sensitive to gas.

Disclosure of Invention

The invention aims to provide a composite material with electromagnetic radiation resistance and high thermal conductivity, which has high heat conduction efficiency, low cost and easy processing, and also provides a preparation method of the composite material.

In order to solve the problems, the technical scheme adopted by the invention is as follows:

a composite material with electromagnetic radiation resistance and high thermal conductivity comprises a first composite layer, a heat-homogenizing layer, a second composite layer and a heat-conducting layer which are sequentially compounded into a whole, wherein the total thickness of the composite material is less than or equal to 2 mm; the first composite layer is formed by single-layer or multi-layer adhesive gum, and the adhesive gum is conductive gum and/or heat-conducting gum; the material of the uniform heat layer is one or the combination of two materials of metal and graphite, in particular one or the combination of a plurality of metal foils, graphite sheets compounded with a layer of metal, metal foils compounded with a layer of graphite and metal foils compounded with a layer of carbon nano coating; the second composite layer is prepared from the following components in percentage by weight: 3-5% of curing agent and 95-97% of adhesion-promoting component; the adhesion promoting component is one or the combination of more than two of a silica gel treating agent, a tackifier and a tackifying primer; the heat conducting layer is made of at least one material of heat conducting silica gel, heat conducting adhesive tape and heat absorbing materials.

According to the invention, the first composite layer can be well attached to and wet the heating device, fully contacts with the surface of the heating device, squeezes away air, reduces the thermal resistance of the surface, better conducts heat to the uniform heating layer, and is tightly combined with the uniform heating layer to ensure the radiation resistance of a product; the adhesive can be selected from adhesives such as conductive adhesive, heat-conducting adhesive, insulating adhesive and the like, and the specific type can be selected according to the needs of users. The uniform heating layer can efficiently conduct and diffuse anisotropic heat and resist electromagnetic radiation, so that hot spots are converted into hot surfaces, and the transverse uniform heating capability of the product is enhanced; can be selected from graphite flake, graphite flake compounded with a layer of metal, metal foil compounded with a layer of graphite, metal foil compounded with a layer of carbon nano-coating, metal foil; the metal foil is made of at least one layer of metal sheet, such as a metal foil formed by compounding a copper sheet and a tin sheet, and the compounding mode can be an electroplating compounding mode and the like. The adhesion-promoting component in the second composite layer can effectively improve the surface polarity of the heat-conducting layer material and greatly improve the adhesion performance. The heat conducting layer can fully wet the surface of the heating device, so that the heating device is fully contacted with the device, air is squeezed away, surface contact thermal resistance is reduced, and heat is conducted to the heat homogenizing layer; the other surface is tightly combined with the even heat layer through a second composite layer.

In the composite material, the selected second composite layer can improve the surface polarity of the heat conducting layer, so that the heat conducting layer and the uniform heat layer are better bonded into a whole, and the heat conducting property of the material is improved; in use, the adopted heat conduction layer and the first composite layer (made of conductive adhesive and/or conductive adhesive material) can be well attached to and wet the heating device, fully contact with the surface of the heating device, squeeze air away, reduce the thermal resistance of the surface and better conduct heat to the uniform heat layer; the uniform heat layer is made of metal and/or graphite, has good heat conduction performance and radiation resistance, can achieve good heat conduction effect in the transverse and longitudinal directions, and further improves the overall heat conduction performance; in conclusion, the composite material disclosed by the invention has the advantages of good heat conduction efficiency and radiation resistance, low cost, easiness in processing and the like.

The thermal tape of the present invention includes, but is not limited to, a thermal double-sided tape; the heat absorbing material in the present invention includes, but is not limited to, silica gel.

In the present invention, it is preferable that the metal foil is composed of at least one metal sheet.

In the invention, the preferable scheme is that the curing agent is a silica gel curing agent; the tackifier is selected from the following substances: siloxane oligomers containing phenyl or ester groups, polymethylhydrosiloxanes containing phenyl groups, silatrane derivatives, secondary amines containing trialkoxysilyl groups and ester groups; the primer is prepared from the following components in parts by weight: 16.2-48.3 parts of chlorinated polypropylene, 7.8-46.6 parts of organic silicon polymer, 2.3-44.5 parts of acrylic resin copolymer, 0.7-31.9 parts of titanate coupling agent, 14.2-161.3 parts of benzene solvent, 0.8-34.2 parts of quinoline and 0.9-9.4 parts of solvent; wherein the organosilicon polymer is selected from aminopropyldimethoxy terminated polydimethylsiloxane, aminobutyldimethoxy terminated polydimethylsiloxane, chlorobutyltrimethoxysilane, vinyldiethoxysilane and polydimethylsiloxane; the molecular weight of the chlorinated polypropylene is 1500-; the titanate coupling agent is tetrabutyl titanate; the benzene solvent is selected from benzene, toluene and xylene; the solvent is selected from isopropanol, ethanol, ethyl acetate, dichloromethane, dichloroethane, trichloroethane and tetrachloroethane; the acrylic ester copolymer is selected from random copolymer of acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate or hydroxypropyl acrylate; the stabilizer is selected from bis (2, 2, 6, 6-tetramethyl-4-piperidyl) sebacate, polysuccinic acid (4-hydroxy-2, 2, 6, 6-tetramethyl-1-piperidylethanol) ester, poly- { [6- [ (1, 1, 3, 3-tetramethylbutyl) -imino ] -1, 3, 5-triazine-2, 4-diyl ] [2- (2, 2, 6, 6-tetramethylpiperidyl) -nitrogen ] -hexylene- [4- (2, 2, 6, 6-tetramethylpiperidyl) -amino ] }, bis (1, 2, 2, 6, 6-pentamethyl-4-piperidyl) sebacate and 1-methyl-8- (1, a mixture of 2, 2, 6, 6-pentamethyl-4-piperidine) sebacate, tetrakis [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] pentaerythritol ester and 2-hydroxy-4-n-octyloxy-benzophenone.

In the invention, the preferable scheme is that the thickness of the first composite layer is 0.001-0.2mm, and the thickness of the heat homogenizing layer is 0.01-0.48 mm; the thickness of the second composite layer is 0.001-0.2mm, and the thickness of the heat conduction layer is 0.05-1.0 mm.

In the invention, the preferable scheme is that the second composite layer is prepared from the following components in percentage by weight: 3.5 percent of curing agent and 96.5 percent of adhesion promoting component; the thickness of the first composite layer is 0.06mm, and the thickness of the heat homogenizing layer is 0.42 mm; the thickness of the second composite layer is 0.08mm, and the thickness of the heat conduction layer is 0.82 mm.

In the invention, the preferable scheme is that two surfaces of the composite material are respectively compounded with a layer of release film or release paper.

In the invention, the preferable scheme is that the release film is one of a PET release film, a PE release film and an OPP release film. The addition of the release film or the release paper can better protect the product from being polluted by external dust and sundries and keep the appearance and the performance of the adhesive layer unaffected. When the composite material is used, the release film is directly torn off, and then the composite material is attached to a heating device.

In the invention, the preferable scheme is that the silica gel treating agent is produced by Tengfeng rubber plastics Limited in Dongguan city; the curing agent is a silica gel curing agent produced by Jinan Ying Yu chemical Co.

The invention also provides a preparation method of the composite material with the electromagnetic radiation resistance and the high thermal conductivity, which comprises the following steps:

a. compounding conductive glue and/or heat-conducting glue on the uniform heating layer in a coating or attaching mode to obtain a uniform heating layer compounded with a first composite layer;

b. uniformly mixing the adhesion-promoting component and the curing agent, and then coating the mixture on the heat conduction layer to obtain a heat conduction layer compounded with a second composite layer;

c. and (c) bonding the uniform heating layer compounded with the first composite layer obtained in the step a and the heat conducting layer compounded with the second composite layer obtained in the step b together, and then drying or naturally airing to obtain the product.

b. uniformly mixing the adhesion-promoting component and the curing agent, and then coating the mixture on the uniform heating layer treated in the step a to obtain a uniform heating layer compounded with a second composite layer;

c. and c, compounding the heat conducting layer with the uniform heat layer obtained by the step b through one of the modes of attaching, coating and spraying, and then drying or naturally airing to obtain the product.

In the preparation method, the selection of the compounding mode of the heat conduction layer and the heat equalizing layer in the step c can be selected according to the thickness of the heat conduction layer, generally speaking, the heat conduction layer with a larger thickness is preferably compounded with the heat equalizing layer in a fitting mode; a thinner heat conducting layer, preferably coated with a uniform heat layer; the thinner heat conducting layer is preferably sprayed and compounded with the even heat layer.

Compared with the prior art, the invention has the following advantages: the selected second composite layer can improve the surface polarity of the heat conduction layer, so that the heat conduction layer and the uniform heat layer are better bonded into a whole, and the heat conduction performance of the material is improved; in use, the adopted heat conduction layer and the first composite layer (made of conductive adhesive and/or conductive adhesive material) can be well attached to and wet the heating device, fully contact with the surface of the heating device, squeeze air away, reduce the thermal resistance of the surface and better conduct heat to the uniform heat layer; the uniform heat layer is made of metal and/or graphite, has good heat conduction performance and radiation resistance, can achieve good heat conduction effect in the transverse and longitudinal directions, and further improves the overall heat conduction performance; in conclusion, the composite material has good heat conduction efficiency and radiation resistance, and also has the advantages of low cost, easy processing and the like; the preparation method is simple, easy to operate and convenient for industrial application.

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a schematic structural diagram of a composite material with electromagnetic radiation resistance and high thermal conductivity in example 1.

Wherein, 1, a first composite layer; 2. heat homogenizing layer; 3. a second composite layer; 4. and a heat-conducting silica gel layer.

Detailed Description

In the specific implementation mode of the invention, in the examples and the comparative examples, the heat-conducting adhesive is a heat-conducting adhesive with the model number of W-3 produced by Nanjing Xiliet Adhesives Co., Ltd; the conductive adhesive is a non-base material conductive adhesive with the model number of E630-C produced by Taicang Xianghui electronic material Co Ltd_；The silica gel treating agent is a silica gel treating agent which is produced by Tengfei rubber plastics Limited in Dongguan and has the model of TF-222; the curing agent is a 107-model silica gel curing agent produced by Jinan Yingyu chemical Limited company; the uniform heating layer is tin foil; the heat conduction layer is a heat conduction silica gel layer made of heat conduction silica gel; the adhesion-promoting primer is 3M94# manufactured by 3M company in the United states.

The preparation method of the composite material with the electromagnetic radiation resistance and the high thermal conductivity comprises the following steps:

Example 1

The composite material comprises a first composite layer, a uniform heating layer, a second composite layer and a heat-conducting silica gel layer which are sequentially compounded into a whole, wherein the second composite layer is prepared from the following components in percentage by weight: 3.5 percent of curing agent and 96.5 percent of silica gel treating agent; the thickness of the first composite layer is 0.06mm, and the thickness of the heat homogenizing layer is 0.42 mm; the thickness of the second composite layer is 0.08mm, and the thickness of the heat conduction silica gel layer is 0.82 mm.

Example 2

A composite material with electromagnetic radiation resistance and high thermal conductivity is characterized in that: the composite material comprises a first composite layer, a uniform heating layer, a second composite layer and a heat-conducting silica gel layer which are sequentially compounded into a whole, wherein the second composite layer is prepared from the following components in percentage by weight: 3% of curing agent and 97% of silica gel treating agent; the thickness of the first composite layer is 0.001mm, and the thickness of the heat homogenizing layer is 0.01 mm; the thickness of the second composite layer is 0.001mm, and the thickness of the heat conduction silica gel layer is 0.05 mm.

Example 3

A composite material with electromagnetic radiation resistance and high thermal conductivity is characterized in that: the composite material comprises a first composite layer, a uniform heating layer, a second composite layer and a heat-conducting silica gel layer which are sequentially compounded into a whole, wherein the second composite layer is prepared from the following components in percentage by weight: 5% of curing agent and 95% of silica gel treating agent; the thickness of the first composite layer is 0.2mm, and the thickness of the heat homogenizing layer is 0.48 mm; the thickness of the second composite layer is 0.2mm, and the thickness of the heat conduction silica gel layer is 1 mm.

Example 4

The composite material comprises a first composite layer, a uniform heating layer, a second composite layer and a heat-conducting silica gel layer which are sequentially compounded into a whole, wherein the second composite layer is prepared from the following components in percentage by weight: 3.5 percent of curing agent and 96.5 percent of silica gel treating agent; the thickness of the first composite layer is 0.08mm, and the thickness of the heat homogenizing layer is 0.36 mm; the thickness of the second composite layer is 0.12mm, and the thickness of the heat conduction silica gel layer is 0.78 mm.

Example 5

The composite material comprises a first composite layer, a uniform heating layer, a second composite layer and a heat-conducting silica gel layer which are sequentially compounded into a whole, wherein the second composite layer is prepared from the following components in percentage by weight: 3.5 percent of curing agent and 96.5 percent of silica gel treating agent; the thickness of the first composite layer is 0.15mm, and the thickness of the heat homogenizing layer is 0.46 mm; the thickness of the second composite layer is 0.06mm, and the thickness of the heat conduction silica gel layer is 0.92 mm.

Example 6

A composite material with electromagnetic radiation resistance and high thermal conductivity is characterized in that: the composite material comprises a first composite layer, a uniform heating layer, a second composite layer and a heat-conducting silica gel layer which are sequentially compounded into a whole, wherein the second composite layer is prepared from the following components in percentage by weight: 5% of curing agent and 95% of tackifying primer; the thickness of the first composite layer is 0.2mm, and the thickness of the heat homogenizing layer is 0.48 mm; the thickness of the second composite layer is 0.2mm, and the thickness of the heat conduction silica gel layer is 1 mm.

Comparative example 1

A composite material with electromagnetic radiation resistance and high thermal conductivity is prepared from the following components in percentage by weight: 2% of curing agent and 98% of silica gel treating agent; the remaining structure and parameters were the same as those in example 1.

Comparative example 2

A composite material with electromagnetic radiation resistance and high thermal conductivity is prepared from the following components in percentage by weight: 6% of curing agent and 94% of silica gel treating agent; the remaining structure and parameters were the same as those in example 1.

Comparative example 3

The composite material with the electromagnetic radiation resistance and high thermal conductivity is characterized in that the thickness of the first composite layer is 0.01mm, and the thickness of the heat-homogenizing layer is 0.52 mm; the thickness of the second composite layer is 0.005mm, the thickness of the heat-conducting silica gel layer is 1.5mm, and the rest structures and parameters are the same as those of the embodiment 1.

Comparative example 4

The composite material with the electromagnetic radiation resistance and high thermal conductivity has the advantages that the thickness of the first composite layer is 0.005mm, and the thickness of the heat-homogenizing layer is 0.005 mm; the thickness of the second composite layer is 0.23mm, the thickness of the heat-conducting silica gel layer is 0.52mm, and the rest structures and parameters are the same as those of the embodiment 1.

Comparative example 5

The second composite layer is made of silicon AB glue, and the rest of the structure and parameters are the same as those of the embodiment 1.

Comparative example 6

The second composite layer is made of AB glue, and the rest of the structure and parameters are the same as those of the embodiment 2.

Examples of the experiments

The composite materials with electromagnetic radiation resistance and high thermal conductivity prepared in examples 1-6 and comparative examples 1-6 are taken, and then the thermal conductivity coefficient of the composite materials of the examples and comparative examples at 20 ℃ is tested by using a standard test method for measuring the thermal conductivity of a solid by using an ASTM E1461-2013 flash method, and the specific test is detailed in the following table 1:

table 1: thermal conductivity test data sheet

As can be seen from the data in Table 1, the composite material with electromagnetic radiation resistance and high thermal conductivity of the present invention has a thermal conductivity significantly higher than that of the comparative example, and thus has good thermal conductivity. In addition, the embodiment of the invention has the advantages that the composite material with the electromagnetic radiation resistance and the high heat conductivity is made of the metallic tin, so that the material obtains good radiation resistance.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims

1. A composite material with electromagnetic radiation resistance and high thermal conductivity is characterized in that: the composite material comprises a first composite layer, a heat-homogenizing layer, a second composite layer and a heat-conducting layer which are sequentially compounded into a whole, wherein the total thickness of the composite material is less than or equal to 2 mm; wherein the thickness of the first composite layer is 0.001-0.2mm, and the thickness of the uniform heat layer is 0.01-0.48 mm; the thickness of the second composite layer is 0.001-0.2mm, and the thickness of the heat conduction layer is 0.05-1.0 mm;

the first composite layer is formed by single-layer or multi-layer adhesive gum, and the adhesive gum is conductive gum and/or heat-conducting gum;

the uniform heat layer is a metal foil formed by compounding a copper sheet and a tin sheet;

the second composite layer is prepared from the following components in percentage by weight: 3-5% of curing agent and 95-97% of adhesion-promoting component; the adhesion promoting component is one or the combination of more than two of a silica gel treating agent, a tackifier and a tackifying primer;

the heat conducting layer is made of at least one material of heat conducting silica gel, heat conducting adhesive tape and heat absorbing materials.

2. The composite material with electromagnetic radiation resistance and high thermal conductivity according to claim 1, wherein: the curing agent is a silica gel curing agent;

the tackifier is selected from the following substances: siloxane oligomers containing phenyl or ester groups, polymethylhydrosiloxanes containing phenyl groups, silatrane derivatives, secondary amines containing trialkoxysilyl groups and ester groups;

the adhesion-promoting primer is prepared from the following components in parts by weight: 16.2-48.3 parts of chlorinated polypropylene, 7.8-46.6 parts of organic silicon polymer, 2.3-44.5 parts of acrylic resin copolymer, 0.7-31.9 parts of titanate coupling agent, 14.2-161.3 parts of benzene solvent, 0.8-34.2 parts of quinoline and 0.9-9.4 parts of solvent; wherein the organic silicon polymer is selected from aminopropyldimethoxy terminated polydimethylsiloxane and aminobutyldimethoxy terminated polydimethylsiloxane; the molecular weight of the chlorinated polypropylene is 1500-; the titanate coupling agent is tetrabutyl titanate; the benzene solvent is selected from benzene, toluene and xylene; the solvent is selected from isopropanol, ethanol, ethyl acetate, dichloromethane, dichloroethane, trichloroethane and tetrachloroethane; the acrylic ester copolymer is selected from random copolymer of acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate or hydroxypropyl acrylate.

3. The composite material with electromagnetic radiation resistance and high thermal conductivity according to claim 1, wherein: the second composite layer is prepared from the following components in percentage by weight: 3.5 percent of curing agent and 96.5 percent of adhesion promoting component; the thickness of the first composite layer is 0.06mm, and the thickness of the heat homogenizing layer is 0.42 mm; the thickness of the second composite layer is 0.08mm, and the thickness of the heat conduction layer is 0.82 mm.

4. The composite material with electromagnetic radiation resistance and high thermal conductivity according to any one of claims 1 to 3, wherein: a layer of release film or release paper is compounded on each of the two surfaces of the composite material; the release film is one of a PET release film, a PE release film and an OPP release film.

5. The composite material with electromagnetic radiation resistance and high thermal conductivity according to any one of claims 1 to 3, wherein: the silica gel treating agent is produced by Tengfei rubber plastics Limited of Dongguan city; the curing agent is a silica gel curing agent produced by Jinan Ying Yu chemical Co.

6. The method for preparing the composite material with the electromagnetic radiation resistance and the high thermal conductivity according to claim 1, characterized by comprising the following steps:

7. The method for preparing the composite material with the electromagnetic radiation resistance and the high thermal conductivity according to claim 1, characterized by comprising the following steps: