KR20080075993A

KR20080075993A - Flexible heat sink and manufacturing method thereof

Info

Publication number: KR20080075993A
Application number: KR1020070015307A
Authority: KR
Inventors: 최훈석
Original assignee: 최훈석
Priority date: 2007-02-14
Filing date: 2007-02-14
Publication date: 2008-08-20
Also published as: KR100853711B1

Abstract

According to the present invention, a heat-resistant adhesive tape which does not interfere with heat conduction on one side of a thin plate of thermal conductor such as copper, aluminum, silver, or graphite sheet having a thermal conductivity of 0.035 to 0.1 mm and a thickness of 200 to 1.000 W / mK is 0.01 to 0.03 mm thick. It is a thin-walled heat sink which is flexible and has a heat dissipation and insulation function by coating a radiation coating material laminated with a inorganic ceramic coating agent and a coloring agent on the other side with a thickness of 0.03 to 0.09 mm. Minimize space and increase heat dissipation and insulation of heat generation parts of electronic devices such as high-density cell phones or laptops, PCBs, PDP TVs (TCP ICs, etc.), LCD TVs (DDI, etc.), LED lights, etc. High efficiency of battery stability through heat dissipation of secondary batteries (RC and hybrid car batteries) that cannot be used, integrating existing heat sinks and thermal conductive materials into one function The cost reduction effect can be applied in various ways such as heat dissipation effect on the heat-generating part of memory semiconductors of DDR2 and DDR3 (DDR4, 5, etc.), and can be made ultra slim by the thickness of the heat sink itself. It has excellent chemical property and is easy to cut to size suitable for use of heat sink, so it has excellent workability in the field.

Description

Flexible heat sink and manufacturing method thereof

1 is a cross-sectional view of a heat sink according to the present invention.

2 is a view illustrating a manufacturing process of a heat sink.

-Explanation of symbols for the main parts of the drawings

1: heat conductor thin sheet 2: heat-resistant adhesive tape

3: spinning coating material 4: release paper

The present invention relates to an ultra-thin flexible heat sink. In particular, the present invention by laminating a heat-resistant adhesive tape that does not interfere with the thermal conductivity on both sides of the thermal conductor thin plate, such as copper, aluminum, silver, graphite sheet having a thermal conductivity of 200 ~ 1,000 W / mK, respectively, by applying a high thermal conductive radiation coating material The deformation relates to a flexible heat sink which allows for a flexible deformation while increasing heat dissipation and insulation effects.

Recently, due to high integration for light weight, miniaturization, slimness, and high speed of electronic devices, heat generation per unit volume increases, and thermal load causes the CPU to malfunction, stop working, decrease in speed, etc. In the case of the same display products, there are problems such as screen haze, resolution deterioration, and contrast ratio deterioration, and in the case of notebooks, there is a problem such as an explosion accident, so the need for solving heat emission is increasing.

The thermally conductive grease containing carbon nanoparticles of Korean Patent Application Publication No. 10-2006-0122342 (Nov. 30, 2006) discloses a thermal interface material between a heat source such as a microprocessor and a heat sink such as a heat sink. (thermal interface material) is filled to maintain heat dissipation for a long time.

The heat dissipation method is mainly a method of applying a thermal interface material, that is, a thermal grease between the heat generating source and the heat sink, but since it is not adhesive, it requires mechanical processing on the substrate to prevent it from flowing down. It is also very difficult to process it with high integration.

In order to solve the problem in the heat dissipation method using the thermally conductive grease, a thermally conductive sheet or a thermally conductive acrylic foam tape coated with a thermally conductive material on a nonwoven fabric made of synthetic resin fibers having continuous pores, silicone pads, graphite, PCM Although a heat dissipation method using a thermally conductive material is used, they only serve as heat transfer between the heat source and the heat sink, but do not emit heat as the heat sink.

In addition, recently developed heat dissipation type heat pipe (heat pipe) with the highest thermal conductivity 'Platform heat pipe and heat sink' of the Republic of Korea Patent Publication No. 10-2004-0019150 (published on March 05, 2004) As with the heat sink, a heat sink or its replacement is essential.

The present invention for solving the conventional problems as described above is to minimize the space occupied by the heat sink, high-density mobile phone or laptop, PDP TV (TCP IC, etc.) LCD TV (DDI, etc.), such as LED lighting High effect of heat dissipation and insulation effect at heat generating area and battery stability through heat dissipation of secondary battery (RC and hybrid car battery) that cannot use heat sink, and integrates existing heat sink and heat conductive material into one function In addition, the cost reduction effect, the heat dissipation effect of the memory semiconductors of DDR2 and DDR3 (DDR4, 5, etc.) are enhanced, and the thickness of the heat sink itself is slimmed, and the corrosion resistance and chemical resistance are excellent. Its purpose is to make it easy to cut to the size suitable for the use of the sink, so that workability in the field is excellent.

According to the present invention for achieving the above object, the flexible ultra-thin plate heat sink has a heat resistance that does not impede heat conduction on one side of a thin plate of thermal conductor having a thermal conductivity of 0.035 to 0.1 mm of 200 to 1,000 W / mK. An adhesive tape is laminated to a thickness of 0.01 to 0.03 mm, and a spin coating material in which an inorganic ceramic coating agent and a colorant are mixed on the other side is applied to a thickness of 0.03 to 0.09 mm, It has a heat dissipation and insulation.

In addition, according to the present invention, the flexible thin plate heat sink according to the present invention has a release paper adhered to one side of a thin thermal conductor plate having a thermal conductivity of 0.035 to 0.1 mm by 200 to 1,000 W / mK by a heat conductive adhesive, and the other side. Is coated with an inorganic ceramic coating agent (ceramic coating agent) and a colorant in a thickness of 0.03 ~ 0.09 mm, characterized in that it has a heat release and insulation functions.

In addition, in the present invention, the material of the thermal conductor thin plate may be copper, aluminum, silver, graphite sheet or the like.

In addition, the manufacturing method of the flexible flexible ultra-thin heat sink according to the present invention, the cutting processing step of cutting the heat conductive sheet having a thermal conductivity of 200 to 1,000W / m-K of 0.035 ~ 0.1 mm thickness according to the intended use; A pre-treatment step of washing and etching the thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / m-K to remove foreign substances and oil or corona electrode treatment to improve adhesion of the coating; Laminating a heat-resistant adhesive tape that does not interfere with heat conduction by applying heat of 110 to 130 ° C. on one side of the thin plate of thermal conductor having a thermal conductivity of 200 to 1,000 W / mK after completing the pretreatment step to 0.01 to 0.03 mm thickness. laminating step; The coating step of applying a radiation coating material containing a inorganic ceramic coating agent and a colorant to a thickness of 0.03 to 0.09 mm on the other side of the thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / mK after the pretreatment step. ; And a drying step of drying or naturally drying by applying heat of 80 to 180 ° C. to the thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / m-K after the applying step.

In addition, the manufacturing method of the flexible flexible thin heat sink according to the present invention, the cutting processing step of cutting the heat conductive sheet having a thermal conductivity of 200 to 1,000 W / m-K of 0.035 ~ 0.1 mm thickness according to the intended use; A pre-treatment step of washing and etching the thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / m-K to remove foreign substances and oil or corona electrode treatment to improve adhesion of the coating; A release paper attaching step of applying a thermally conductive adhesive to one surface of the thermal conductor thin plate having a thermal conductivity of 200 to 1,000 W / m-K after the pretreatment step and attaching a release paper to the surface; The coating step of applying a radiation coating material containing a inorganic ceramic coating agent and a colorant to a thickness of 0.03 to 0.09 mm on the other side of the thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / mK after the pretreatment step. ; And a drying step of drying or naturally drying by applying heat of 80 to 180 ° C. to the thermal conductor thin film having a thermal conductivity of 200 to 1,000 W / m-K after the applying step.

In addition, in the present invention, the material of the thermal conductor thin plate may be used, such as copper or aluminum, silver, graphite sheet.

Hereinafter, the present invention will be described in detail.

1 is a cross-sectional view of an ultra-thin heat sink according to the present invention, in which the ultra-thin heat sink according to the present invention has a thermal conductivity of 0.035 to 0.1 mm and a thermal conductivity of 200 to 1,000 W / mK, such as copper, aluminum, silver, graphite sheet, and the like. On the underside of the conductor sheet 1, a heat resistant adhesive tape 2 which does not interfere with the heat conduction is laminated to a thickness of 0.01 to 0.03 mm, and on the upper side, as in Si02, A12O3, Fe304, Sic and other binders. The thermally conductive inorganic ceramic coating agent and the radiation coating material 3 in which the colorant is blended have a thickness of 0.03 to 0.09 mm.

Here, the same effect can be obtained by attaching the release paper 4 to the bottom surface of the heat conductor thin plate 1 using the heat conductive adhesive instead of the heat resistant adhesive tape 2. Of course, when using the heat-resistant adhesive tape 2, of course, the release paper 4 should be attached to facilitate storage and transportation.

Figure 2 shows the manufacturing process of the ultra-thin heat sink according to the present invention, the operator in the field is a copper, aluminum, silver, 0.035 ~ 0.1 mm thick thermal conductivity of 200 ~ 1,000 W / mK, depending on the use of the heat sink, The thermally conductive thin plate 1 such as graphite sheet is cut to a suitable size.

The operator cleans and etches the surface of the thermally conductive thin plate 1 such as copper, aluminum, silver, and graphite sheet having a thermal conductivity of 200 to 1,000 W / mK, and removes foreign substances or oil. Corona electrode treatment accordingly improves the adhesion during coating or application.

Then, the operator applies heat of 110 to 130 ° C. to the heat resistant adhesive tape 2 which does not interfere with the heat conduction, and thermal conductors such as copper, aluminum, silver, graphite sheet or the like having a thermal conductivity of 200 to 1,000 W / mK. One side of the thin plate 1 is laminated to a thickness of 0.01 to 0.03 mm. Here, the worker may attach the release paper 4 to the surface of the heat-resistant adhesive tape 2 to facilitate storage and transportation.

The operator then combines a high thermal conductive inorganic ceramic coating agent and colorant, such as Si02, A12O3, Fe304, Sic, and other binders, to produce a spinning coating material (2), which has a thermal conductivity of 200 to 1,000 W / The other side of the thermal conductor thin plate 1, which is mK, is coated so that the radiation coating material 3 having a thickness of 0.03 to 0.09 mm is applied.

After that, the worker applies 80 ~ 180 ℃ heat to the heat conductor thin plate (1) such as copper, aluminum, silver, graphite sheet, etc. whose thermal conductivity is 200 ~ 1,000 W / mK, and after drying or natural drying, processing work according to the specification according to product specification. Do it.

Here, the operator may apply the release adhesive 4 to the heat conductive thin plate 1 having a thermal conductivity of 200 to 1,000 W / mK in place of the heat-resistant adhesive tape 2, and then attach a release liner 4 to the same effect. Can be obtained.

Example 1

Workers in manufacturing and production lines, such as factories, cut a copper foil having a thermal conductivity of 400 W / m-K with a thickness of 0.035 mm to an appropriate size in consideration of the calorific value of an electric device or a component thereof.

The operator can remove the foreign matter or oil by eching the copper sheet surface with the cut thermal conductivity of 400 W / mK, and adhere to the coating of the adhesive tape or radiation coating material that does not interfere with the thermal conductivity by corona electrode treatment. Increase

The operator then applies 120 ° C. heat to an acrylic adhesive tape that does not interfere with the heat conduction, laminating to one side of the copper sheet having a thermal conductivity of 400 W / m-K to a thickness of 0.02 mm.

Then, the worker prepares a spin coating material by mixing a ceramic coating agent and a colorant, and coats it on the other side of a copper sheet having a thermal conductivity of 400 W / m-K to apply a thickness of 0.04 mm.

Afterwards, the worker heats or heats a copper foil with a thermal conductivity of 400 W / mK coated with a spinning coating material that does not interfere with heat conduction and has a thermal conductivity of 400 W / mK. do.

Example 2

When the operator removes foreign substances or oil by etching the copper sheet surface with the cut thermal conductivity of 400 W / mK, and corona electrode treatment, coating of heat-resistant adhesive tape or radiation coating material that does not interfere with heat conduction. Improve adhesion

Then, the worker applies a release paper after applying a thermally conductive adhesive on one side of a thin copper sheet having a thermal conductivity of 400 W / m-K.

After that, the worker attaches the release paper by the thermally conductive adhesive and heats or heats the copper sheet having the thermal conductivity of 400 W / m-K coated with 180 W by heating at 180 ° C., and then processes it according to the specifications according to the product specifications.

Therefore, according to the present invention, the present invention provides a method for heat generation of electronic devices such as mobile phones or laptops, PCBs, PDP TVs (TCP ICs), LCD TVs (DDI, etc.), LED lighting, etc., while minimizing the space occupied by the heat sink. It can increase heat dissipation and insulation effect, and has high effect such as battery stability through heat dissipation of secondary battery (RC and hybrid car battery) that cannot use heat sink, and it combines existing heat sink and heat conductive material as one function. It can reduce the cost of integration, and can be applied to various areas such as heat dissipation effect on the heat-generating parts of memory semiconductors of DDR2 and DDR3 (DDR4, 5, etc.), and can be made ultra-slim with the thickness of the heat sink itself. It has excellent corrosion resistance and chemical resistance, and is easy to cut to the size suitable for use of heat sink, so it has excellent workability in the field.

Claims

On one side of a thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / mK having a thickness of 0.035 to 0.1 mm, an adhesive tape which does not interfere with heat conduction is laminated to a thickness of 0.01 to 0.03 mm, and the other side. An ultra-thin heat sink having a flexible deformation, characterized in that a radiation coating material containing an inorganic ceramic coating agent and a colorant is coated to a thickness of 0.03 to 0.09 mm, and have heat release and insulation functions.

After applying a thermally conductive adhesive on one side of a thin plate of thermal conductor having a thickness of 0.035 to 0.1 mm and having a thermal conductivity of 200 to 1,000 W / mK, release paper is attached, and an inorganic ceramic coating agent and a colorant are mixed on the other side. An ultra-thin heat sink having a flexible deformation, characterized in that the coated radiation coating material is applied at a thickness of 0.03 to 0.09 mm and has heat release and insulation functions.

The method according to claim 1 or 2,

The thin metal plate is a flexible flexible thin heat sink, characterized in that the thermal conductivity of the thermal conductivity of 200 ~ 1,000 W / m-K, such as aluminum or copper, silver, graphite sheet.

A cutting processing step of cutting a thermally conductive thin plate having a thermal conductivity of 200 to 1,000 W / m-K having a thickness of 0.035 to 0.1 mm depending on the intended use;

A pre-treatment step of washing and etching the thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / m-K to remove foreign substances and oil or corona electrode treatment to improve adhesion of the coating;

Laminating a heat-resistant adhesive tape that does not interfere with heat conduction by applying heat of 110 to 130 ° C. on one side of the thin plate of thermal conductor having a thermal conductivity of 200 to 1,000 W / mK after completing the pretreatment step to 0.01 to 0.03 mm thickness. laminating step;

The coating step of applying a radiation coating material containing a inorganic ceramic coating agent and a colorant to a thickness of 0.03 to 0.09 mm on the other side of the thermal conductor sheet having a thermal conductivity of 200 to 1,000 W / mK after the pretreatment step. ; And

The drying step of drying or natural drying by applying a heat of 80 ~ 180 ℃ to a heat conductor sheet having a thermal conductivity of 200 ~ 1,000 W / m-K after the coating step; characterized in that the flexible flexible thin heat sink.

A release paper attaching step of applying a thermally conductive adhesive to one surface of the thermal conductor thin plate having a thermal conductivity of 200 to 1,000 W / m-K after the pretreatment step and attaching a release paper to the surface;

The method according to claim 4 or 5,

The material of the thin metal sheet is a method of manufacturing a flexible flexible thin heat sink, characterized in that the thermal conductivity of the thermal conductivity is 200 to 1,000 W / m-K, such as aluminum or copper, silver, graphite sheet.