KR101534232B1 - Heat sink having high radiation ceramic coating layer, method of manufacturing the same and metal PCB - Google Patents

Abstract

TECHNICAL FIELD [0001] The present invention relates to a heat sink having a highly heat radiating oil / inorganic composite coating thin film formed thereon, a method of manufacturing the same, and a heat sink integrated metal PCB (printed circuit board), the heat sink being provided on the heat source , A heat-radiating member made of a metal thinned to a thickness of 0.1 to 5 mm, and a coating layer formed on the heat-radiating member, the high-heat-resistance modified silicone resin for improving bonding with the heat- And a metal filler. The heat sink having the above-described configuration can be applied to a highly heat-dissipating heat sink or a metal PCB using the heat sink in a marketable LED lighting market in the future to enhance the heat radiation effect.

Oil, minerals, heat sink, PCB (printed circuit board)

Description

TECHNICAL FIELD [0001] The present invention relates to a heat sink having a high heat radiation oil / inorganic composite coating film, a method of manufacturing the same, and a heat sink having a high radiation ceramic coating layer,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink, a method of manufacturing a heat sink, and a metal-PCB with a heat sink, and more particularly to a heat sink, Metal-to-metal ratio.

In recent years, heat generation per unit volume has been increased due to the high integration of electronic devices in weight reduction, slimness, miniaturization, and high-speed operation. In the case of CPU, there is a problem such as malfunction, There is a problem such as a screen haze phenomenon, a deterioration in resolution, a decrease in contrast ratio, etc. In the case of a notebook computer, there is a problem such as an explosion accident, It is true.

Typical heat dissipation methods include a thermal interface material such as a thermally conductive grease, a thermally conductive acrylic foam tape, a silicone heat sink pad, a graphite, a PCM, a heat pipe (Heat (Heat) pipe and so on.

Since the thermal interface material serves only as a heat transfer between the heat source and the heat sink, the heat dissipation is substantially a heat sink. Therefore, in order to construct an excellent heat dissipation system, the pin type, which is a form of increasing the volume of the heat sink, . However, in the case of the pin-type heat sink, there is a technical problem of cost increase due to an increase in volume and weight, and a technical limitation in that it can not be used in a narrow space.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a high- Oil, and inorganic composite coatings.

Another object of the present invention is to manufacture a heat sink having a highly heat-radiating radiant oil and inorganic composite coating film which can maximize the heat dissipation of a heating element despite having a fine or slim condition.

Another object of the present invention is to provide a heat sink integrated metal-PCB, which is completed by forming a circuit pattern in which a thin film of high heat radiation oil and inorganic composite coating is formed, to which an expensive thermally conductive insulating resin is not applied.

According to an aspect of the present invention, there is provided a heat sink having a highly heat-radiating radiant oil / inorganic composite coating formed thereon, the heat sink having a thickness of 0.1 to 5 mm And a heat releasing member made of a slim metal. In addition, a high radiation-oil-inorganic composite coating formed on the heat-releasing member and including a high heat-resistant modified silicone resin, an inorganic filler having high heat radiation property, and a metal filler for improving bonding with the heat- Thin film.

As an example, the high spinneretics / inorganic composite coating film may have a thickness of 0.03 to 0.06 mm, and the temperature of the heat source may be reduced to 5 to 8 ° C when the heat emitting member is applied alone.

In one example, the inorganic filler may include a black ceramic-based inorganic material, a high-spinning inorganic material that emits a wavelength (thermal energy) of 0.75 to 25 m, or a mixture thereof.

For example, the black ceramic inorganic material may include B2O3, BaO, ZnO, TiO, CuO, NiO, MnO2, Cr2O3, Fe2O3, and the like. These may be used in combination of two or more.

As an example, the metal filler may include metals such as alumina, silica, titanium, iron and silver. These may include two or more metals.

As an example, the high spinning oil / inorganic composite coating film may be formed of a high radial inorganic filler including a modified silicone resin having high heat resistance at 200 to 300 ° C and a black ceramic inorganic material, and a layer made of silica, titanium, An inorganic composite coating agent in which a metal filler containing two or more selected metals are mixed is coated and cured on the surface of the heat releasing member.

As an example, the heat sink may further comprise a thermally conductive acrylic foam tape, a silicone heat sink pad, graphite, a thermally conductive thermal interface material, or a thermally conductive double sided tape.

According to another aspect of the present invention, there is provided a heat sink having a highly heat-radiating radiation-oil and inorganic composite coating formed thereon. The heat sink is made of a slim metal having a thickness of 0.1 to 5 mm Thereby forming a heat releasing member. Subsequently, at least one surface of the heat releasing member is subjected to a Sand Brasting surface treatment. Then, a surface of the heat-dissipating member, which is surface-treated, is coated with a high-spinnability inorganic filler including a modified silicone resin having high heat resistance at 200 to 300 ° C and a black ceramics inorganic substance having high heat radiation property, and silica, titanium, iron and silver And a metal filler containing at least two metals selected from the group consisting of a metal and a metal. Then, the high heat radiation composite coating agent coated on the heat releasing member is dried to form a highly heat radiating oil / inorganic composite coating film having a thickness of 0.03 to 0.06 mm. As a result, a heat sink in which a high radial-oil / inorganic composite coating film is formed can be manufactured.

According to another aspect of the present invention, there is provided a metal-PCB integrated type heat sink according to an embodiment of the present invention includes a heat sink having a high heat radiation oil and inorganic composite coating film formed thereon, And a metal thin film for forming a circuit pattern. The heat sink may include a heat dissipation member made of a slim metal having a thickness of 0.1 to 5 mm and a high heat resistant modified silicone resin coated on the heat dissipation member to improve bonding with the heat dissipation member, Inorganic composite coating film comprising the high inorganic filler and the metal filler.

As described above, the heat sink of the present invention can effectively reduce the temperature of the heat source of the electric and electronic products in which the space is narrowed due to the integration due to the formation of the highly heat dissipating radiant oil / inorganic composite coating thin film. In addition, due to the formation of a highly heat-radiating radiant oil and inorganic composite coating film, it has a heat dissipation effect and a heat radiation effect of about 50% higher than that of the conventional heat sink. Therefore, a CPU, a chipset ) And heat generating parts such as PDP, LCD TV and the like. Furthermore, the heat sink having the highly heat-radiating radiant oil / inorganic composite coating thin film formed thereon can be directly provided to a heating element such as a semiconductor DRAM memory module for a server, so that it is possible to achieve a simple operation and a high heat radiation effect . In addition, the heat sink of the present invention can be used as a marketable LED lighting market and a metal PCB to increase the heat radiation effect and reduce the cost.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a heat sink in which a high heat radiation oil and inorganic composite coating film is formed according to preferred embodiments of the present invention, a method of manufacturing the same, and a metal cover integrated with a heat sink will be described in detail with reference to embodiments. It should be understood, however, that it is not intended to limit the invention to the particular forms of embodiments but to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The various components used in the detailed description should not be limited by the terms stated. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprising" or "comprising" or the like is intended to specify that there is a feature, a number, a step, an operation, an element, But do not preclude the presence or addition of features, numbers, steps, operations, components, or combinations thereof. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

High radiant heat sink

FIG. 1 is a view showing a heat sink in which a thin film of highly heat radiation oil and inorganic composite coating is formed according to an embodiment of the present invention.

Referring to FIG. 1, the heat sink 150 of the present embodiment includes a heat radiation member 110 provided on the heat source for discharging the temperature of the heat source, and a high radiation heat radiation oil and inorganic composite coating film 120 Respectively.

The heat-radiating member 110 is a heat-radiating plate made of a plated steel sheet, aluminum, copper, or an alloy thereof, and has a slim thickness of about 0.1 to 5 mm for application to a tight space of a highly integrated electrical and electronic product. As one example, the surface of the heat-radiating member may be provided with micro-roughness to improve the bonding property with the coating film. In addition, the heat releasing member may have various shapes such as a slender flat plate or a cubic shape or a cylindrical shape in the form of a volume.

The highly heat dissipating radiant oil / inorganic composite coating thin film 120 is placed on the surface of the heat releasing member with good bonding with the surface of the heat releasing member 110. As an example, the high heat radiation oil and inorganic composite coating film 120 may be formed on one surface, both surfaces or all over the surface of the heat radiation member. Specifically, the high heat radiation oil and inorganic composite coating thin film includes a high heat resistant modified silicone resin, a highly heat radiating inorganic filler, and a metal filler for improving bonding with a heat releasing member.

In one embodiment, the modified silicone resin having high heat resistance is a modified silicone resin having high heat resistance at 200 to 300 ° C, and is used as a binder of components mixed in the high heat radiation oil / The thin film is used to improve the bonding property with the surface of the heat radiation member.

The inorganic filler has a composition including a black ceramic-based inorganic material, a high-spinning inorganic material emitting a heat energy wavelength of 0.75 to 25 m, or a mixture thereof. Specifically, the black ceramic-based inorganic material may include B2O3, BaO, ZnO, TiO, CuO, NiO, MnO2, Cr2O3, Fe2O3 and the like. These may be used in combination of two or more. As an example, the metal filler may include metals such as alumina, silica, titanium, iron, and silver to improve the heat radiation capability of the coating film with the inorganic filler. These may include two or more metals.

In one embodiment, the high heat radiation inorganic and / or organic composite coating film 120 may include a high radial inorganic filler including a denatured silicone resin having high heat resistance at 200 to 300 ° C and a black ceramic inorganic material having high heat radiation, , A metal filler including two or more metals selected from the group consisting of iron, silver, and silver is mixed and cured on the surface of the heat releasing member. The highly heat-radiating radiant oil / inorganic composite coating film thus formed has a thickness of 0.03 to 0.06 mm, and the temperature of the heat source can be reduced to 5 to 8 ° C when the heat-radiating member is applied alone.

Although not shown in the drawings, the heat sink 150 of the present embodiment further includes a thermally conductive thermal interface material or a double-sided tape which is one of a thermally conductive acrylic foam tape, a silicon heat-radiating pad, a graphite, a PCM or a heat pipe can do.

Manufacture of high heat radiation heat sink

Hereinafter, a method of manufacturing a heat sink in which the heat radiation oil and inorganic composite coating film shown in FIG. 1 is formed will be described.

In order to manufacture the heat sink having the heat radiation oil / inorganic composite coating film shown in FIG. 1, first, a heat radiation member of the heat sink provided on the heat source is formed to discharge the temperature of the heat source. The heat dissipation member is a metal substrate slimmed to a thickness of 0.1 to 5 mm to release a temperature of the heat source, and the metal substrate may be formed of a coated steel sheet, aluminum, copper, or an alloy thereof.

Subsequently, at least one surface of the heat releasing member is subjected to a Sand Brasting surface treatment. The sandblasting treatment is a process for improving the bonding property of the high heat radiation composite coating agent by coating the surface of the heat radiation member with the surface of the heat radiation member by applying a fine roughness to the surface of the heat radiation member. In addition, it is possible to remove foreign substances such as dust and oil existing on the surface of the heat emitting member.

Then, on the surface of the surface-treated heat-radiating member, a high-spinnability inorganic filler comprising a modified silicone resin having high heat resistance at 200 to 300 ° C and a black ceramic-type inorganic material having high heat radiation property and a metal filler including a metal are mixed Coating a high heat radiation composite coating. At this time, it is preferable that the high heat radiation composite coating agent is coated to a thickness of 0.06 mm or less. The detailed description of the spinner inorganic filler and the metal filler included in the coating agent is omitted because it has been described in detail above.

Next, the high heat radiation composite coating agent coated on the heat releasing member is dried. The high heat radiation composite coating agent may be dried at a temperature of from room temperature to 230 ° C.

As a result, a highly radiating spinning oil / inorganic composite coating thin film having excellent adhesion to the surface of the heat emitting member is formed. The highly heat-radiating radiant oil / inorganic composite coating film thus formed has a thickness of 0.03 to 0.06 mm, and the temperature of the heat source can be reduced to 5 to 8 ° C when the heat-radiating member is applied alone. Although the thickness of the high heat radiation inorganic and organic composite coating thin film applied to the heat sink in the present embodiment is limited as described above, the thickness can be increased or decreased to such an extent that no crack occurs depending on the application.

The heat sink manufactured by the above-described method may include a heat-emitting member and an organic / inorganic composite coating film coated therewith, as well as a heat conductive acrylic film such as a thermally conductive acrylic foam tape, a silicone heat sink pad, graphite, PCM, The thermal interface material or the double-sided tape may be further laminated on one or both sides of the heat-radiating member where the coating film is formed by applying heat at 110 to 130 占 폚.

Heatsink Integrated Metal - PCB

FIG. 2 is a view illustrating a metal-PCB having a high heat dissipation radiation heat sink integrated according to an embodiment of the present invention.

Referring to FIG. 2, the metal-PCB 250 includes a metal circuit pattern 210 or a metal thin film 210 for forming a circuit pattern on a heat sink 150 having a highly heat- Has a laminated structure.

In the present embodiment, the metal PCB (printed circuit board) has a metal circuit pattern 210 on a heat sink 150 on which the high heat radiation oil and inorganic composite coating thin film is formed, unlike the existing technology for forming a circuit pattern on a metal substrate. Or the metal thin film 210 is directly formed. As an example, the circuit pattern or the metal thin film is attached or laminated on the coating thin film 120 of the heat sink 150 by a bonding sheet (not shown) as a thermal adhesive.

In the present embodiment, detailed description of the heat sink 150 in which the high heat radiation oil and inorganic composite coating thin film is formed is described in detail above and is omitted here.

For example, in the case of a circuit pattern applied to the heat sink integrated metal-PCB 250, a metal thin film having a thickness of 10 mu m to 100 mu m is adhered to the coating thin film by applying a thermal adhesive, Circuit pattern to correspond to the circuit.

Evaluation of heat sink with coated thin film 1

In order to evaluate the heat dissipation effect of the heat sink having the heat radiation oil / inorganic composite coating thin film, a heat sink (Example 1) having the high heat radiation oil / inorganic composite coating film (0.05 mm) (Comparative Example 1) and a heat radiation temperature test were performed. At this time, in the heat radiation temperature test, a heat conductive silicone pad (0.38 T, 1 W / mK) was applied to a heat source (heating element 30 mm W x 7 mm L x 5 mm T) Mm W x 25 mm L x 1 mm T), and the temperature of the heat source after 1 hour was measured. The results are shown in Table 1.

<Table 1>

As can be seen from the experimental results shown in Table 1, in the case of the heat sink having the highly radiating radiant oil / inorganic composite coating thin film according to the present invention, the heat radiation effect is about 5 ~ 8 ℃ compared to the conventional heat sink, , Inorganic composite coating thin film has the effect of chemical resistance because it has high insulation and corrosion resistance which can replace anodizing process to prevent oxidation of aluminum. In addition, in the above evaluation, when a semiconductor memory module of a semiconductor memory module is tested with a heat sink or when a parallel memory module is inserted between two heat sinks (front and back) in actual use, .

Evaluation of heat sink with coated thin film 2

A heat sink (volume: 3.150 ㎣ Example 2) having a high heat radiation oil / inorganic composite coating film (0.05 mm) formed for slimness of heat dissipation and evaluation of exothermic property for a heat sink having a high heat radiation oil / Heat sinks (comparative examples 2 to 5) having volume of 9.720 ㎣, 13.475 ㎣, 26.775 ㎣ and 39.975 체 were mounted on the above-mentioned heat source with a silicon pad of 1 W / mK as an existing pin-type heat sink, The temperature was measured. The results are shown in Table 2.

<Table 2>

As can be seen from the experimental results shown in Table 2, it can be seen that the heat sink having the highly radiating radiant oil and inorganic composite coated thin film according to the present invention has a heat dissipation effect similar to that of the heat sink of Comparative Example 5. [ Comparing the volume, it was confirmed that the heat sink of Example 2 had a slimmer volume of 80% or more as compared with the conventional pin-type heat sink.

As described above, the heat sink of the present invention can effectively reduce the temperature of the heat source of the electric and electronic products in which the space is narrowed due to the integration due to the formation of the highly radiating spinning oil / inorganic composite coating thin film.

In addition, due to the formation of a highly heat-radiating radiant oil and inorganic composite coating film, it has a heat dissipation effect and a heat radiation effect of about 50% higher than that of the conventional heat sink, so that a CPU, a chipset ) And heat generating parts such as PDP, LCD TV and the like.

Furthermore, the heat sink having the highly heat-radiating radiant oil / inorganic composite coating thin film formed thereon can be directly provided to a heating element such as a semiconductor DRAM memory module for a server or the like, thereby achieving a simple operation and a high heat dissipation effect . In addition, the heat sink of the present invention can be used as a marketable LED lighting market and a metal PCB to increase the heat radiation effect and reduce the cost.

FIG. 1 is a view showing a heat sink in which a thin film of highly heat radiation oil and inorganic composite coating is formed according to an embodiment of the present invention.

FIG. 2 is a view illustrating a metal-PCB having a high heat dissipation radiation heat sink integrated according to an embodiment of the present invention.

Description of the Related Art [0002]

110: heat releasing member 120: organic / inorganic composite coating film

150: heat sink 210: metal circuit pattern

250: Metal - PCB

Claims (9)

A heat releasing member provided on the heat source for releasing the temperature of the heat source and made of metal slimmed to a thickness of 0.1 to 5 mm; And Inorganic composite coating film formed on the heat releasing member and having a thickness of 0.03 to 0.06 mm, The organic / inorganic composite coating film A modified silicone resin having high heat resistance at 200 to 300 캜 for improving the bonding property with the heat releasing member; An inorganic filler containing at least one black ceramic inorganic material selected from the group consisting of B2O3, BaO, ZnO, CuO, NiO, MnO2, Cr2O3 and Fe2O3 and an inorganic material emitting a wavelength (heat energy) of 0.75 to 25 mu m; And Wherein the inorganic filler comprises at least two metal fillers selected from the group consisting of alumina, silica, titanium, iron and silver. [Claim 2] The method according to claim 1, wherein the high-spinnability, inorganic composite coating film has a thickness of 0.03 to 0.06 mm, and the temperature of the heat source is reduced to 5 to 8 DEG C more than when the heat- Heat radiation oil, and inorganic composite coating thin film. delete delete delete delete The high heat radiation inorganic and / or organic composite coating film according to claim 1, wherein a thermally conductive acrylic foam tape, a silicone heat-radiating pad, a graphite, a thermally conductive thermal interface material, or a double- Formed heat sink. A method of manufacturing a heat sink provided on a heat source for releasing a temperature of a heat source, Forming a heat releasing member made of a metal slimmed to a thickness of 0.1 to 5 mm to release the temperature of the heat source; Sandblasting a surface of at least one surface of the heat dissipation member; A modified silicone resin having a high heat resistance of 200 to 300 ° C on the surface of the surface-treated heat-dissipating member; An inorganic filler containing at least one black ceramic inorganic material selected from the group consisting of B2O3, BaO, ZnO, CuO, NiO, MnO2, Cr2O3 and Fe2O3 and an inorganic material emitting a wavelength (heat energy) of 0.75 to 25 mu m; And a high heat radiation composite coating agent in which two or more metal fillers selected from the group consisting of alumina, silica, titanium, iron and silver are mixed; And And a step of drying the high heat radiation composite coating agent coated on the heat releasing member to form a thin film of a highly heat radiation oil and inorganic composite coating having a thickness of 0.03 to 0.06 mm, A method of manufacturing a heat sink. A heat sink including a heat dissipation member made of metal slimmed to a thickness of 0.1 to 5 mm and an organic / inorganic composite coating thin film formed on the heat dissipation member in a thickness of 0.03 to 0.06 mm; And A metal circuit pattern or a metal thin film for a circuit pattern attached to the high heat radiation oil and the inorganic composite coating thin film of the heat sink, The organic / inorganic composite coating thin film may include a modified silicone resin having high heat resistance at 200 to 300 캜 for improving bonding with the heat dissipating member; An inorganic filler containing at least one black ceramic inorganic material selected from the group consisting of B2O3, BaO, ZnO, CuO, NiO, MnO2, Cr2O3 and Fe2O3 and an inorganic material emitting a wavelength (heat energy) of 0.75 to 25 mu m; And at least two metal fillers selected from the group consisting of alumina, silica, titanium, iron and silver.

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