KR101723499B1 - Heatsink comprising electro conductive push pin - Google Patents
Heatsink comprising electro conductive push pin Download PDFInfo
- Publication number
- KR101723499B1 KR101723499B1 KR1020150100609A KR20150100609A KR101723499B1 KR 101723499 B1 KR101723499 B1 KR 101723499B1 KR 1020150100609 A KR1020150100609 A KR 1020150100609A KR 20150100609 A KR20150100609 A KR 20150100609A KR 101723499 B1 KR101723499 B1 KR 101723499B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- push pin
- head portion
- semiconductor
- pcb
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The heat sink includes a push pin of electrically conductive material according to the present invention. The heat sink includes a heat sink part contacting with a semiconductor semiconductor part provided on a PCB substrate and receiving heat generated from the semiconductor part, Wherein the push pin includes a pressing portion having an area of a predetermined size, a head portion inserted into the insertion opening formed in the heat sink portion, and a connecting portion connecting the pressing portion and the head portion, Wherein a portion of the heat sink portion where the push pin is installed is concave and the push pin is installed in the recessed portion via a spring and the push pin is made of an electrically conductive material .
According to the present invention, the antenna effect by the heat sink can be eliminated.
In addition, since the structure is simple and easy to manufacture, it can be easily installed on the PCB, thereby improving the workability.
Description
The present invention relates to a heat sink, and more particularly, to a heat sink that includes an electrically conductive push pin that can be easily installed on a PCB substrate, thereby improving assembling performance on a PCB substrate and eliminating an antenna effect generated in the heat sink And a push pin of an electrically conductive material.
The heat sink refers to a cooling device for absorbing heat from an electronic component or a memory device to dissipate heat to the outside.
The interior of a computer or digital TV includes components that generate heat, such as a central processing unit (CPU) or a graphics card, that are essential to its operation.
Such heat generating parts generate a lot of heat by themselves when power is supplied and operated.
If the generated heat is left untreated, the performance of the component itself may deteriorate, the service life may be shortened, and the operation may be stopped in severe cases.
Therefore, by providing a heat dissipating device on the heat-generating components as described above, the temperature of the heat-generating component is not raised to a certain level or more.
In recent years, as the speed of technology development has rapidly increased, the performance of industrially available products has been greatly improved, and the size of the product has become very compact. As the performance of a device such as a digital TV develops, .
In order to effectively dissipate the semiconductor components, heat sinks made of copper (Cu) or aluminum (Al), which are excellent in thermal conductivity, have been released. Such a heat sink is configured to diffuse heat to a large area and discharge it to the outside.
However, when the heat sink is installed inside the digital device, electric noise is transmitted through the heat sink made of a metal material, and this phenomenon is referred to as an antenna effect.
Such an antenna effect must be removed because it may disturb the signal of the digital device or be harmful to the human body.
Conventionally, EMI (Electro Magnetic Interference) bumpers have been mainly used to eliminate the antenna effect of the heat sink.
That is, the heat sink is fixed on the PCB substrate while the EMI bumper is placed between the heat sink and the PCB substrate, and the electrical noise generated in the heat sink is transmitted to the PCB board through the EMI bumper, which is an electrical conductor, .
However, since the EMI bumper has a certain elasticity, the EMI bumper disposed between the PCB substrate and the heat sink receives a force to continuously lift the heat sink.
With this state, the heat sink may be lifted from the initial position with the passage of time. In this case, the heat sink may not completely adhere to the surface of the semiconductor component and may be spaced apart.
The heat transfer efficiency is proportional to the size of the contact area. When the heat sink is spaced from the surface of the semiconductor component as described above, heat generated from the semiconductor component can not be smoothly discharged to the outside through the heat sink.
In order to solve the above problems, when the heat sink is fixed on the PCB of the PCB using a spring having a strong elasticity, there is a problem that the PCB of the PCB having the heat sink is locally bent due to the elastic force of the spring.
It is an object of the present invention to provide a heat sink including an electrically conductive push pin configured to eliminate an antenna effect caused by a heat sink.
It is still another object of the present invention to provide a heat sink including an electrically conductive push pin configured to be simple in structure and easy to install on a PCB.
According to an aspect of the present invention, there is provided a heat sink including a push pin of an electrically conductive material, the heat sink including a heat sink portion contacting a semiconductor semiconductor component provided on a PCB substrate and receiving heat generated from the semiconductor component, The push pin includes a pressing portion having an area of a predetermined size, a head portion inserted into the insertion opening formed in the heat sink portion, and a pressing portion connecting the pressing portion and the head portion Wherein the push pin is formed in a concave shape in which the push pin is installed in the heat sink portion, the push pin is installed in the push pin mounting portion via a spring, the push pin is electrically conductive And is made of a material.
Preferably, the semiconductor contact portion contacting the semiconductor component in the heat sink portion is concave.
Here, the head portion may be configured to have a narrower width toward the lower end of the side end surface.
Preferably, the pressing portion, the head portion, and the connecting portion are integrally formed, and a cut portion is formed in the head portion and the connecting portion.
In addition, contact protrusions may be formed on the connection portion.
Here, the connection section may be formed so that the width on the side surface becomes wider as it goes downward from the center in the height direction.
Preferably, the heat sink portion is formed of aluminum or an aluminum alloy, and a black coating portion is formed on the surface.
According to the present invention, the antenna effect by the heat sink can be eliminated.
Further, since the structure of the push pin is simple, it is easy to manufacture, and the heat sink can be easily mounted on the PCB of the PCB through the push pin, so that the workability can be improved.
BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
1 is a perspective view of a heat sink including an electrically conductive push pin according to the present invention,
FIG. 2 is a partial perspective view of a push pin mounting portion provided with a push pin in the heat sink,
3 is a front view of the push pin,
4 is a side cross-sectional view of the heat sink mounted on the PCB.
Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.
Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.
Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.
FIG. 1 is a perspective view of a heat sink including an electrically conductive push pin according to the present invention, FIG. 2 is a partial perspective view of a push pin installation portion provided with a push pin in the heat sink, FIG. 3 is a front view of the push pin, And Fig. 4 is a side cross-sectional view of the heat sink mounted on the PCB.
1 to 4, a heat sink including an electrically conductive push pin according to the present invention contacts a
The
The
In the
Thus, a black coating layer is formed on the surface of the
As the
Also, the push
The
The lower end of the
The
The lower end of the
That is, when the
Therefore, the lower end portion of the
Here, the
At this time, the
The
Thus, when the
Further, after the
A
3, the
Further, as shown in FIG. 3, the connecting portion 26 is formed to have a side surface SW having a wider side width in a downward direction from the center in the height direction thereof.
Thus, the connecting portion 26 can be stably contacted with the
The
Thus, the antenna effect generated by the
The
While the present invention has been described with reference to the exemplary embodiments and the drawings, it is to be understood that the technical scope of the present invention is not limited to these embodiments and that various changes and modifications will be apparent to those skilled in the art. Various modifications and variations may be made without departing from the scope of the appended claims.
10: Heatsink section
12: semiconductor contact
14: Push pin mounting portion
20: push pin
22:
24:
26: Connection
30: spring
100: PCB substrate
110: Semiconductor parts
Claims (7)
And a push pin for coupling the heat sink to the PCB,
The push-
A pressing portion having an area of a predetermined size;
A head portion inserted into the insertion opening formed in the heat sink portion;
And a connecting portion connecting the pressing portion and the head portion,
Wherein the push pin mounting portion on which the push pin is mounted is recessed in the heat sink portion,
Wherein the push pin is installed in the push pin mounting portion via a spring,
The push pin is made of an electrically conductive synthetic resin or a plated synthetic resin material,
The semiconductor contact portion contacting the semiconductor component in the heat sink portion is concave,
Wherein the head portion is configured to have a narrower width toward a lower end portion on a side end surface thereof,
Wherein the push portion, the head portion, and the connection portion are integrally formed, and the cut portion is formed in the head portion and the connection portion.
And a contact protrusion is formed on the connection portion.
And the width of the connection portion is increased from the center of the connection portion in the height direction toward the downside.
Wherein the heat sink portion is formed of aluminum or an aluminum alloy material, and a black coating portion is formed on a surface of the heat sink portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150100609A KR101723499B1 (en) | 2015-07-15 | 2015-07-15 | Heatsink comprising electro conductive push pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150100609A KR101723499B1 (en) | 2015-07-15 | 2015-07-15 | Heatsink comprising electro conductive push pin |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170010179A KR20170010179A (en) | 2017-01-26 |
KR101723499B1 true KR101723499B1 (en) | 2017-04-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020150100609A KR101723499B1 (en) | 2015-07-15 | 2015-07-15 | Heatsink comprising electro conductive push pin |
Country Status (1)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220138492A (en) | 2021-04-02 | 2022-10-13 | 주식회사 태인엘티에스 | Radiating device for displaying apparatus and its manufacturing method |
KR20230118214A (en) | 2022-02-03 | 2023-08-11 | 주식회사 태인엘티에스 | Manufacturing method of the radiating device for displaying apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111901733B (en) * | 2020-07-28 | 2021-10-12 | 维沃移动通信有限公司 | Electronic device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002510881A (en) * | 1998-04-03 | 2002-04-09 | エリクソン インコーポレイテッド | Capacitive mounting device for securing an integrated circuit package to a heat sink |
KR100457220B1 (en) * | 2002-02-27 | 2004-11-16 | 잘만테크 주식회사 | Heat sink device for cooling chipset |
JP2011023491A (en) * | 2009-07-15 | 2011-02-03 | Nec Corp | Lock jig, and semiconductor device |
KR101534232B1 (en) * | 2008-12-23 | 2015-07-06 | 최훈석 | Heat sink having high radiation ceramic coating layer, method of manufacturing the same and metal PCB |
-
2015
- 2015-07-15 KR KR1020150100609A patent/KR101723499B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002510881A (en) * | 1998-04-03 | 2002-04-09 | エリクソン インコーポレイテッド | Capacitive mounting device for securing an integrated circuit package to a heat sink |
KR100457220B1 (en) * | 2002-02-27 | 2004-11-16 | 잘만테크 주식회사 | Heat sink device for cooling chipset |
KR101534232B1 (en) * | 2008-12-23 | 2015-07-06 | 최훈석 | Heat sink having high radiation ceramic coating layer, method of manufacturing the same and metal PCB |
JP2011023491A (en) * | 2009-07-15 | 2011-02-03 | Nec Corp | Lock jig, and semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220138492A (en) | 2021-04-02 | 2022-10-13 | 주식회사 태인엘티에스 | Radiating device for displaying apparatus and its manufacturing method |
KR20230118214A (en) | 2022-02-03 | 2023-08-11 | 주식회사 태인엘티에스 | Manufacturing method of the radiating device for displaying apparatus |
Also Published As
Publication number | Publication date |
---|---|
KR20170010179A (en) | 2017-01-26 |
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