CN219678773U - Quick heat dissipation PCB circuit board - Google Patents
Quick heat dissipation PCB circuit board Download PDFInfo
- Publication number
- CN219678773U CN219678773U CN202320426818.4U CN202320426818U CN219678773U CN 219678773 U CN219678773 U CN 219678773U CN 202320426818 U CN202320426818 U CN 202320426818U CN 219678773 U CN219678773 U CN 219678773U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- aluminum sheet
- layer
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 78
- 239000000919 ceramic Substances 0.000 claims abstract description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000013461 design Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 239000007779 soft material Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005485 electric heating Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 11
- 238000005299 abrasion Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910021389 graphene Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite alkene Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
The utility model discloses a quick heat dissipation PCB circuit board, which is applied to the field of circuit boards, wherein an aluminum sheet is fixedly arranged on the rear side of a substrate, a ceramic heat dissipation layer is fixedly arranged on one side of the aluminum sheet, heat dissipation fins positioned in the ceramic heat dissipation layer are fixedly arranged at two ends of the rear side of the aluminum sheet, when the quick heat dissipation PCB circuit board is used, heat of the circuit board is preferentially transferred to the aluminum sheet through the cooperation of the ceramic heat dissipation layer and the heat dissipation fins, and then the heat dissipation fins connected with the aluminum sheet penetrate through the ceramic heat dissipation layer until the two sides of the substrate are contacted with air, so that part of heat dissipation is carried out, the ceramic heat dissipation layer greatly increases the heat dissipation area contacted with the air due to the structure of the ceramic heat dissipation layer, and the ceramic heat dissipation layer is simultaneously contacted with the aluminum sheet and the heat dissipation fins, so that the heat dissipation effect is greatly increased, and the failure caused by overheat of an electric heating plate is avoided, and the use of the circuit board is guaranteed.
Description
Technical Field
The utility model belongs to the field of circuit boards, and particularly relates to a fast heat dissipation PCB.
Background
The circuit board is also called a PCB, a printed circuit board and the like, is an important electronic component, is a support body of the electronic component, is a carrier for electric connection of the electronic component, is installed on equipment to be used, the PCB circuit board can generate certain heat in the operation process of the equipment, if the heat is not emitted in time, the equipment can continuously heat, the internal electronic component and the electronic component on the PCB circuit board can lose efficacy due to overheating, the reliability of the equipment is reduced, meanwhile, bolts are often used for fixing in the installation of the circuit board, the installation aperture of the circuit board is large or small, the installation bolts are required to be replaced and adjusted according to the actual size, the installation is inconvenient, and the generated vibration is caused between the circuit board and the bolts when the circuit board and the electric components in the installation shell are operated, so that the abrasion is caused, the influence of instability and the like is brought to the later operation.
Currently, the bulletin number is: the utility model of CN208143574U discloses a high-efficiency heat dissipation PCB, which mainly comprises a substrate made of insulating materials and a conductive printed pattern layer printed on the upper surface of the substrate; the upper surface of the substrate is coated with the plastic insulating layer, and graphene is used as a main heat dissipation material, so that heat dissipation is effectively and rapidly realized, meanwhile, the heat can be rapidly conducted out and dissipated by the graphene layer by utilizing the non-heat-accumulating property of the ceramic heat dissipation layer, and meanwhile, the ceramic heat dissipation layer can also avoid the cracking or pulverization of the graphene layer, so that the strength of the graphene layer is higher as a whole.
This circuit board dispels the heat to the circuit board through graphite alkene cooperation pottery heat dissipation layer, and the radiating effect of this setting is limited, and when the circuit board was installed, generally installs in the equipment casing bottom, and this makes the radiating effect limited.
Disclosure of Invention
The utility model aims to provide a rapid heat dissipation PCB, which has the advantages of increasing the heat dissipation effect and facilitating the installation.
The technical aim of the utility model is realized by the following technical scheme: the utility model provides a quick heat dissipation PCB circuit board, includes the base plate, the rear side fixed mounting of base plate has the aluminum sheet, one side fixed mounting of aluminum sheet has ceramic heat dissipation layer, the equal fixed mounting in both ends of aluminum sheet rear side has the inside heat dissipation fin that is located ceramic heat dissipation layer, the surface spraying of base plate has conductive printing layer, the mounting hole has all been seted up at the both ends of base plate, aluminum sheet and ceramic heat dissipation layer both sides, the inside of mounting hole is equipped with the contact block, one side fixed mounting of contact block has the spring.
The technical scheme is adopted: when using quick heat dissipation PCB circuit board, through the cooperation of ceramic heat dissipation layer and radiator fin, give the aluminum sheet with the heat priority transfer of circuit board, then the radiator fin that the aluminum sheet is connected runs through ceramic heat dissipation layer, contact with the air to the base plate both sides, carry out the heat dissipation of part, ceramic heat dissipation layer is because of its own structure, greatly increased the radiating area with the air contact, and ceramic heat dissipation layer contacts with aluminum sheet and radiator fin simultaneously, the radiating effect has been increased to the greater degree, avoid the electric plate overheated and lead to the inefficacy, guarantee for the use of circuit board, when using quick heat dissipation PCB circuit board, be convenient for fix this circuit board and equipment through the bolt through the mounting hole, make the installation of less bolt be close to the mounting hole depths inner wall, and bigger bolt contacts with the mounting hole both sides inner wall, compatibility when installing the different bolts of this circuit board to the size has been increased through the setting up of contact block, increase its installation convenience, and avoid the wear to circuit board aperture when having avoided wearing and tearing back circuit board installation unstable condition simultaneously.
The utility model further provides that the radiating fins are L-shaped.
The technical scheme is adopted: the L-shaped design is convenient for the extending use of the radiating fins.
The utility model is further arranged that one end of the radiating fin penetrates to one side of the ceramic radiating layer.
The technical scheme is adopted: the heat dissipation effect of the heat dissipation fins is increased through the ceramic heat dissipation layer.
The utility model further provides that the contact block is made of soft material.
The technical scheme is adopted: the contact block is convenient to deform in extrusion by soft materials.
The utility model further provides that the mounting hole is in a fan-shaped design, and the contact block is in an arc-shaped design.
The technical scheme is adopted: the fan-shaped design is convenient for enable the mounting hole to accommodate bolts of different sizes, and the arc-shaped design is convenient for fit between the contact block and the inner wall of the bolt and the mounting hole.
The utility model further provides that the surface of the conductive printing layer is provided with copper wires fixedly connected with the surface of the substrate.
The technical scheme is adopted: the copper wire is matched with the substrate for normal use.
The utility model is further arranged that the two ends of the two sides of the substrate are respectively provided with an inner groove, and the other end of the spring is fixedly connected with the inner wall of the inner groove.
The technical scheme is adopted: the mounting of the substrate to the spring is facilitated by the inner groove.
In summary, the utility model has the following beneficial effects:
1. when the rapid heat dissipation PCB is used, the heat of the PCB is preferentially transferred to the aluminum sheets through the matching of the ceramic heat dissipation layer and the heat dissipation fins, and then the heat dissipation fins connected with the aluminum sheets penetrate through the ceramic heat dissipation layer to the two sides of the substrate to be contacted with air for heat dissipation, so that the heat dissipation area contacted with the air is greatly increased by the ceramic heat dissipation layer due to the self structure, and the ceramic heat dissipation layer is contacted with the aluminum sheets and the heat dissipation fins at the same time, so that the heat dissipation effect is greatly increased, the failure caused by overheat of an electric heating plate is avoided, and the use of the PCB is ensured;
2. when the PCB with the rapid heat dissipation function is used, the PCB and the equipment are conveniently fixed through the bolts through the mounting holes, so that the smaller bolts are close to the inner walls in the depth of the mounting holes and are in contact with the inner walls at two sides of the mounting holes, the compatibility of the PCB for mounting the bolts with different sizes is improved through the arrangement of the contact blocks, the mounting convenience is improved, the abrasion to the aperture of the PCB in the conventional hole type mounting process is avoided, and meanwhile, the unstable mounting condition of the PCB after abrasion is avoided.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic elevational view of the structure of the present utility model;
FIG. 3 is a schematic top cross-sectional view of the structure of the present utility model;
fig. 4 is a schematic elevational view in partial cross-section of the present utility model.
Reference numerals: 1. a substrate; 2. a conductive printed layer; 3. an aluminum sheet; 4. a ceramic heat dissipation layer; 5. a heat radiation fin; 6. copper wire; 7. a mounting hole; 8. a contact block; 9. a spring; 10. an inner tank.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
Example 1:
referring to fig. 1, fig. 2, fig. 3 and fig. 4, a fast radiating PCB circuit board comprises a substrate 1, an aluminum sheet 3 is fixedly installed at the rear side of the substrate 1, a ceramic radiating layer 4 is fixedly installed at one side of the aluminum sheet 3, radiating fins 5 positioned in the ceramic radiating layer 4 are fixedly installed at two ends of the rear side of the aluminum sheet 3, when the fast radiating PCB circuit board is used, heat of the circuit board is preferentially transferred to the aluminum sheet 3 through the matching of the ceramic radiating layer 4 and the radiating fins 5, and then the radiating fins 5 connected with the aluminum sheet 3 penetrate through the ceramic radiating layer 4 until two sides of the substrate 1 are contacted with air, so that a part of heat is radiated, the radiating area contacted with the air is greatly increased by the ceramic radiating layer 4, and the ceramic radiating layer 4 is simultaneously contacted with the aluminum sheet 3 and the radiating fins 5, so that the radiating effect is greatly increased, and the failure caused by overheat of an electric heating plate is avoided, and the use of the circuit board is guaranteed.
Referring to fig. 3, the heat sink fins 5 are L-shaped, and the extension of the heat sink fins 5 is facilitated by the L-shaped design.
Referring to fig. 1, one end of the heat dissipation fin 5 penetrates to one side of the ceramic heat dissipation layer 4, and the heat dissipation effect thereof is increased by the heat dissipation fin 5 through the ceramic heat dissipation layer 4.
The use process is briefly described: when the PCB circuit board capable of rapidly radiating is used, heat of the circuit board is preferentially transferred to the aluminum sheet 3 through the matching of the ceramic heat dissipation layer 4 and the heat dissipation fins 5, then the heat dissipation fins 5 connected with the aluminum sheet 3 penetrate through the ceramic heat dissipation layer 4 to enable two sides of the substrate 1 to be in contact with air for radiating a part of heat, the ceramic heat dissipation layer 4 greatly increases the heat dissipation area in contact with the air due to the micro-hole structure of the ceramic heat dissipation layer 4, and the ceramic heat dissipation layer 4 is simultaneously in contact with the aluminum sheet 3 and the heat dissipation fins 5, so that the heat dissipation effect is greatly increased, the failure caused by overheat of an electric heating plate is avoided, the use of the circuit board is guaranteed, and the L-shaped design is convenient for the extending use of the heat dissipation fins 5.
Example 2:
referring to fig. 1, fig. 2, fig. 3 and fig. 4, a quick radiating PCB circuit board comprises a substrate 1, conductive printing layer 2 is sprayed on the surface of substrate 1, mounting holes 7 are all formed in the two ends of substrate 1, aluminum sheet 3 and ceramic radiating layer 4, contact block 8 is arranged in mounting holes 7, springs 9 are fixedly arranged on one sides of contact block 8, when the quick radiating PCB circuit board is used, the circuit board and equipment are conveniently fixed through bolts through mounting holes 7, small bolts are close to the inner walls of the deep portions of mounting holes 7, and large bolts are in contact with the inner walls of the two sides of mounting holes 7, compatibility of the circuit board in mounting of different bolts is improved through the arrangement of contact block 8, mounting convenience of the circuit board is improved, abrasion of the apertures of the circuit board in mounting of the prior art is avoided, and meanwhile, unstable circuit board mounting after abrasion is avoided.
Referring to fig. 1, the contact block 8 is made of a soft material, and the contact block 8 is convenient to deform in extrusion through the soft material.
Referring to fig. 2, the mounting hole 7 is of a fan-shaped design, the contact block 8 is of an arc-shaped design, the mounting hole 7 is convenient to accommodate bolts of different sizes through the fan-shaped design, and the arc-shaped design is convenient to attach between the contact block 8 and the inner wall of the bolt and the mounting hole 7.
Referring to fig. 1, a copper wire 6 fixedly connected with the surface of a substrate 1 is arranged on the surface of a conductive printing layer 2, and the substrate 1 is matched with the copper wire 6 for normal use.
Referring to fig. 4, both ends of both sides of the substrate 1 are provided with inner grooves 10, the other ends of the springs 9 are fixedly connected with the inner walls of the inner grooves 10, and the mounting of the springs 9 to the substrate 1 is facilitated through the inner grooves 10.
The use process is briefly described: when using quick heat dissipation PCB circuit board, be convenient for fix this circuit board through the bolt between equipment through mounting hole 7, fan-shaped design through mounting hole 7 is convenient for make mounting hole 7 hold the bolt of equidimension not, through the cooperation of contact block 8 and spring 9, make less bolt be close to mounting hole 7 deep inner wall and install, and great bolt contacts with mounting hole 7 both sides inner wall, spring 9 cooperation contact block 8 contacts with the bolt of equidimension, and contact block 8 is flexible material and is convenient for contact block 8 to deform in the extrusion, arc-shaped design is convenient for laminating between contact block 8 and bolt and the mounting hole 7 inner wall, compatibility when installing to the different bolts of equidimension has been increased to this circuit board through the setting of contact block 8, increase its installation convenience, and avoid the wearing and tearing to circuit board aperture when having avoided the wearing and tearing back circuit board installation unstable condition simultaneously, copper line 6 and conductive printing layer 2 cooperate the base plate to normally use.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment, which may not creatively contribute to the present utility model as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present utility model.
Claims (7)
1. The utility model provides a quick heat dissipation PCB circuit board, includes base plate (1), its characterized in that: the utility model discloses a ceramic heat dissipation device, including base plate (1), aluminum sheet (3) is installed to the rear side fixed mounting of base plate (1), one side fixed mounting of aluminum sheet (3) has ceramic heat dissipation layer (4), the equal fixed mounting in both ends of aluminum sheet (3) rear side has heat dissipation fin (5) that are located inside ceramic heat dissipation layer (4), the surface spraying of base plate (1) has electrically conductive printing layer (2), mounting hole (7) have all been seted up at the both ends of base plate (1), aluminum sheet (3) and ceramic heat dissipation layer (4) both sides, the inside of mounting hole (7) is equipped with contact block (8), one side fixed mounting of contact block (8) has spring (9).
2. The rapid thermal dissipation PCB of claim 1, wherein: the radiating fins (5) are L-shaped.
3. The rapid thermal dissipation PCB of claim 1, wherein: one end of the radiating fin (5) penetrates to one side of the ceramic radiating layer (4).
4. The rapid thermal dissipation PCB of claim 1, wherein: the contact block (8) is made of soft materials.
5. The rapid thermal dissipation PCB of claim 1, wherein: the mounting holes (7) are of a fan-shaped design, and the contact blocks (8) are of an arc-shaped design.
6. The rapid thermal dissipation PCB of claim 1, wherein: the surface of the conductive printing layer (2) is provided with copper wires (6) fixedly connected with the surface of the substrate (1).
7. The rapid thermal dissipation PCB of claim 1, wherein: an inner groove (10) is formed in two ends of two sides of the substrate (1), and the other end of the spring (9) is fixedly connected with the inner wall of the inner groove (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320426818.4U CN219678773U (en) | 2023-03-08 | 2023-03-08 | Quick heat dissipation PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320426818.4U CN219678773U (en) | 2023-03-08 | 2023-03-08 | Quick heat dissipation PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219678773U true CN219678773U (en) | 2023-09-12 |
Family
ID=87923598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320426818.4U Active CN219678773U (en) | 2023-03-08 | 2023-03-08 | Quick heat dissipation PCB circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219678773U (en) |
-
2023
- 2023-03-08 CN CN202320426818.4U patent/CN219678773U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |