KR20230118214A - Manufacturing method of the radiating device for displaying apparatus - Google Patents

Abstract

The present invention relates to a method for manufacturing a heat dissipation device for a display, and more particularly, to a heat dissipation device provided in a flat panel display device, which can be manufactured only by press processing at a relatively low processing cost, while simplifying the manufacturing process, so that mass production is easy It relates to a method for manufacturing a heat dissipation device for a display that can reduce production cost and at the same time reduce the thickness of the heat dissipation device so that the thickness of the entire display device can be slimmed down.

Description

Manufacturing method of the radiating device for display apparatus

The present invention relates to a method for manufacturing a heat dissipation device for a display, and more particularly, to a heat dissipation device provided in a flat panel display device, which can be manufactured only by press processing at a relatively low processing cost, while simplifying the manufacturing process, so that mass production is easy It relates to a method for manufacturing a heat dissipation device for a display that can reduce production cost and at the same time reduce the thickness of the heat dissipation device so that the thickness of the entire display device can be slimmed down.

In general, a display device refers to a device that displays characters or figures on a cathode ray tube similar to a TV set. , It began to be applied to devices where portability is important, such as laptops and digital cameras, but has recently been applied to bulky devices such as flat-panel TVs. It is used as a word for

In such a flat panel display device, slimming is required along with an increase in size. As flat panel display devices such as flat TVs are highly specified and highly functional, the processing speed of the central processing unit (CPU) increases, and heat generation is emerging as a major problem. .

Therefore, a heat dissipation device is usually used for the purpose of rapidly dissipating heat generated from the central processing unit to the outside. The method is mainly used to cool and dissipate the heat generated from the heat dissipation device.

In addition, a large amount of electromagnetic waves including non-ionizing radiation such as microwaves and radio waves are emitted from flat panel display devices. Concerns about the harmful effects of these electromagnetic waves on human health are increasing day by day, and interference with other devices due to electromagnetic waves is also a problem. In particular, electromagnetic waves generated during operation cause serious damage to nearby electronic devices. .

Therefore, in order to shield electromagnetic waves generated from electronic components mounted on a circuit board or to protect electronic components mounted on a circuit board from external electromagnetic waves, an EMI gasket having electrical conductivity and elasticity is provided between the circuit board and the heat dissipation device. can be applied

EMI stands for electromagnetic interference. Since the heat dissipation device made of metal plays the same role as an antenna, electromagnetic waves generated from electronic components mounted on the main board are grounded to the outside of the display device through the heat sink and EMI gasket.

In the case of a heat sink mainly used as a heat dissipation device for a conventional display, the center area of an aluminum material plate is pressurized using a press device to form a semiconductor contact portion in which the area of the central processing unit is depressed, and then the lower part of the semiconductor contact portion is placed in the central processing unit. attached to the upper surface of Some of the non-recessed flat portions of the heatsink come into contact with the top surface of the EMI gasket. Since a metallic film is adhered or coated on the surface of the EMI gasket, it can be electrically connected to a heat sink made of aluminum.

However, the conventional heat sink having the above structure has a problem in that the overall height of the heat dissipation device increases due to the height of the EMI gasket, and thus the thickness of the flat panel display cannot be slimmed down.

In order to solve this problem, a through hole is formed in the heat sink in contact with the upper surface of the EMI gasket so that an electrical connection is made by contact between the upper side of the EMI gasket and the side wall of the through hole, thereby reducing the height of the heat dissipation device. A way to reduce it can be considered. If the sidewall of the through hole is painted, electrical conduction between the EMI gasket and the heat sink is not made.

That is, the upper surface of the heat sink, which can be exposed to the outside, can be painted black for the purpose of improving the radiant heat transfer effect and making the appearance more beautiful. There is a problem that electricity conduction becomes impossible.

The above problems may be solved by masking the through hole and then painting, or by inserting a rubber packing into the through hole, and then painting. However, masking or rubber packing Since all insertion operations must be performed manually, the entire operation process becomes complicated and takes a long time.

As a result, not only productivity and economic feasibility may be lowered, but also there is a disadvantage in that defects are likely to occur because the painting blocking is not completely performed if the masking treatment or rubber packing is not properly inserted.

1. Republic of Korea Patent Registration No. 10-1723499 (registered on March 30, 2017)

The present invention has been made to solve the problems of the prior art as described above, and an object of the present invention is to reduce production cost by making it possible to manufacture a heat dissipation device provided in a flat panel display device only by press processing at a relatively low processing cost. It is to provide a method for manufacturing a heat dissipation device for a display that enables.

In addition, another object of the present invention is to provide a method for manufacturing a heat dissipation device for a display that can be easily mass-produced by simplifying the manufacturing process while minimizing the thickness of the heat sink portion so that the overall thickness of the flat panel display device can be slimmed down. there is.

The present invention for achieving the above objects,

A method for manufacturing a heat dissipation device for a display including a flat heat sink including a central processing unit contact portion and an EMI gasket contact portion, and a heat dissipation plate connected to the heat sink portion, by press processing using an aluminum plate A heat sink part manufacturing step of forming a heat sink part, a bonding step of bonding a heat pipe between the heat sink part and the heat radiation plate by soldering, and a painting operation on the upper surface of the bonded heat sink part, the heat pipe and the heat radiation plate It may include a painting step to be performed.

At this time, in the heat sink part manufacturing step, after cutting the aluminum plate into a desired shape through shear processing, the central processing unit contact part forming step of forming the central processing unit contact part through bending and punching processing, and drawing process and forming the EMI gasket contact portion through the EMI gasket contact portion.

Also, the forming of the EMI gasket contact portion may include a second drawing step of forming a protrusion at a location where the EMI gasket contact portion is to be formed on the central processing unit contact portion by drawing.

The method may further include a cut-off processing step of forming a first through hole into which an upper end of the EMI gasket is inserted by removing the protrusion formed in the second drawing step after the painting step.

In addition, the first through-hole may be formed to have the same size as the EMI gasket so that an upper side surface of the EMI gasket is in contact with an inner circumferential surface of the first through-hole, so that electromagnetic waves may be grounded through side grounding.

Also, an upper surface of the EMI gasket may be positioned at the same level as an upper surface of the heat sink unit.

According to the present invention, a heat dissipation device provided in a flat panel display device can be manufactured only by press processing, which is relatively inexpensive in processing cost, and thus has an excellent effect of reducing production cost.

In addition, according to the present invention, the thickness of the heat sink can be minimized, thereby further reducing the overall thickness of the flat panel display device.

In addition, according to the present invention, mass production is facilitated through simplification of the manufacturing process, while also having an effect of reducing the defect rate.

1 is a diagram showing a printed circuit board used in a flat panel display.
Figure 2 is a view showing a heat dissipation device for a display manufactured by the present invention.
3 (a) and (b) are upper and lower perspective views illustrating a heat sink part of the heat dissipation device for a display shown in FIG. 2 .
Figure 4 (a), (b) is a cross-sectional side view showing the heat sink portion shown in Figure 3 compared to the conventional heat sink portion.
5 is a view showing an embodiment of a push pin coupled to a push pin coupling part of the heat dissipation device shown in FIG. 2;
6 is a flow chart sequentially showing a method for manufacturing a heat dissipation device for a display according to the present invention.
Figures 7 (a) ~ (c) is a view schematically showing the step of forming the push pin coupling part of the present invention shown in Figure 6.
8(a) to (c) are diagrams schematically showing the EMI gasket contact forming step and the cutoff processing step of the present invention shown in FIG. 6;

Hereinafter, preferred embodiments of a method for manufacturing a heat dissipation device for a display according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a printed circuit board used in a flat panel display, FIG. 2 is a view showing a heat dissipation device for a display manufactured according to the present invention, and FIG. 3 (a) and (b) are the display shown in FIG. It is an upper and lower perspective view showing a heat sink part of a heat dissipation device for use, and FIG. 4 (a) and (b) are side cross-sectional views showing the heat sink part shown in FIG. 3 in comparison with a conventional heat sink part, and FIG. 5 is FIG. 2 It is a view showing an embodiment of a push pin coupled to a push pin coupling part among heat dissipation devices shown in , and FIG. 6 is a flowchart sequentially showing a method of manufacturing a heat dissipation device for a display according to the present invention, and FIG. 7 (a) to (c) is a diagram schematically showing the step of forming the push pin coupling part of the present invention shown in FIG. 6, and (a) to (c) of FIG. 8 are the step of forming the EMI gasket contact part and cutoff processing of the present invention shown in FIG. It is a schematic diagram showing the steps.

The present invention makes it possible to manufacture a heat dissipation device provided in a flat panel display device only by press processing at a relatively low processing cost, while simplifying the manufacturing process, thereby facilitating mass production and reducing production cost. It relates to a method for manufacturing a heat dissipation device for a display capable of slimming the thickness of the entire display device by minimizing the thickness of the display, and the heat dissipation device for a display manufactured by the present invention described below is various display devices used in various industrial fields. However, the heat dissipation device 1 used in the flat panel display, which is most related to the problem to be solved by the present invention, will be described.

Briefly explaining the structure of a heat dissipation device 1 for a display manufactured according to the present invention (hereinafter referred to as 'the heat dissipation device 1') and a flat panel display device to which the heat dissipation device 1 can be applied, first, the As shown in FIG. 1, the flat panel display device includes a printed circuit board 10 equipped with a central processing unit (CPU) 12, a push pin binding member 14, and an EMI gasket 16.

The heat dissipation device 1 is coupled to the upper portion of the printed circuit board 10 to serve to dissipate heat generated in the printed circuit board 10, that is, mainly the central processing unit 12, to the outside. As shown in FIG. 2 , the configuration may include a heat sink unit 100 , a connection unit 200 and a heat dissipation plate 300 .

First, the heat sink unit 100 is bound to the upper part of the printed circuit board 10 by the push pin 20 made of an electrically conductive material, and is generated in the central processing unit 12 provided in the printed circuit board 10. It is configured to dissipate heat by conduction, and may be made of a metal material such as aluminum.

The heat sink unit 100 is mainly formed in a flat plate shape in order to minimize the increase in the thickness of the display device. The device contact portion 110, the push pin coupling portion 120 into which the push pin 20 is inserted and coupled, and the EMI gasket contact portion 130 in contact with the EMI gasket 16 of the printed circuit board 10 may be provided. .

More specifically, first, the EMI gasket contact portion 130 contacts a plurality of EMI gaskets 16 provided on the printed circuit board 10, respectively, and serves to ground electromagnetic waves generated from electronic components to the outside of the display device. Thus, a first insertion groove 132 into which an upper end of the EMI gasket 16 is inserted into the EMI gasket contact portion 130 may be formed.

That is, in the conventional case, as shown in (a) of FIG. 4, the lower surface of the heat sink part 100 is configured to simply contact the upper part of the EMI gasket 16, whereas the heat dissipation device manufactured by the present invention (1), as shown in (b) of FIG. 4, the first insertion groove 132 into which the upper end of the EMI gasket 16 is inserted is formed in the EMI gasket contact portion 130, so that the first insertion groove ( The thickness of the heat sink unit 100 may be reduced by an amount corresponding to the height of 132).

As described above, when the first insertion groove 132 is formed by the EMI gasket contact portion 130, the contact area between the EMI gasket 16 and the EMI gasket contact portion 130, that is, the first insertion groove 132 is increased, so that the electromagnetic wave Ground grounding efficiency of can be improved.

Meanwhile, a first through hole 134 may be formed as the EMI gasket contact portion 130. The first through hole 134 is formed to have the same size as that of the EMI gasket 16 so as to The upper side of the first through hole 134 of the inner circumferential surface, that is, may be configured to be in contact with the side.

At this time, the upper surface of the EMI gasket 16 may be located at the same height as or lower than the upper surface of the heat sink unit 100, and the ground grounding effect of electromagnetic waves may be shown only by grounding the side of the EMI gasket 16. Therefore, when the first through hole 134 is used as the EMI gasket contact portion 130 as described above, a slimming effect corresponding to the maximum thickness of the heat sink portion 100 can be shown compared to the prior art.

In addition, the first insertion groove 132 and the first through hole 134 may be selectively used as the EMI gasket contact portion 130 according to the installation position of the EMI gasket 16 .

Next, the central processing unit contact portion 110 is in contact with the central processing unit 12 provided on the printed circuit board 10 to serve to dissipate heat generated from the central processing unit 12, and conventional heat Like the sink unit, it may be recessed to come into contact with the upper surface of the central processing unit 12, but in order to slim down the heat sink unit 100, the heat sink unit 100 has the same height as the surrounding area, or the height of FIGS. 3(a) and 4(b) As can be seen in ), it can be formed in a structure that is bent upward by the bending portion 114.

In more detail, the central processing unit contact portion 110 may be formed in a form protruding upward compared to the heat sink portion 100 around it by the bent portion 114, which is provided on the printed circuit board 10. Since the height of the central processing unit 12 is constant and the lower surface of the central processing unit contact portion 110 must be in contact with the upper surface of the central processing unit 12, the heat sink of the remaining portion except for the central processing unit contact portion 110 The portion 100 is formed at a lower height than the central processing unit contact portion 110, and accordingly, even if the central processing unit contact portion 110 is formed in a protruding shape compared to the surrounding area as described above, the entire printed circuit board 10 ) and the heat sink unit 100 does not mean that the height, that is, the thickness of the combination body becomes thick.

At this time, a second through hole 112 may be formed in the central processing unit contact portion 110, and the second through hole 112 is in contact with the upper surface of the central processing unit 12 of the printed circuit board 10. A heat sink made of copper may be coupled.

In more detail, it is configured to improve heat dissipation efficiency by combining a heat sink made of copper having excellent thermal conductivity compared to aluminum used as a material for a heat sink part. At this time, a connection part 200 to be described later may be connected and installed to the heat sink, and the connection part 200 may also be made of a copper material.

In addition, the size of the second through hole 112 is formed to be the same as the size of the top protrusion of the central processing unit 12, and the thickness of the heat sink is made thinner than that of the heat sink unit 100, so that the heat dissipation plate The upper surface may be integrally combined with the upper surface of the heat sink unit 100. In this case, a step is formed between the lower surface of the heat sink unit 100 and the lower surface of the heat dissipation plate, so that a part of the upper end of the central processing unit 12 is removed. It may be inserted into the inside of the two through holes 112.

That is, as can be seen in FIG. 1, the central processing unit 12 generally used in flat panel display devices has a two-stage structure at the upper end, and the size of the second through hole 112 is the central processing unit ( When formed to have the same size as the top protrusion of 12) and to make the heat sink made of copper coupled to the inside thereof integral with the upper surface of the heat sink unit 100 to be thinner than the thickness of the heat sink unit 100, A part of the upper end of the two-stage central processing unit 12 is inserted into the second through hole 112 to reduce the overall thickness of the combination of the heat sink 100 and the printed circuit board 10 .

Meanwhile, as described above, when the central processing unit contact portion 110 is formed higher than the surrounding area by the bent portion 114, the EMI gasket contact portion 130 positioned at the corresponding portion, that is, the heat sink portion 100 formed higher than the surrounding area is formed as the first through hole 134, and the first insertion groove 132 may be formed as the EMI gasket contact portion 130 located at a relatively low position, which increases the overall thickness of the heat sink portion 100. This is to minimize and at the same time facilitate the coupling operation of the heat dissipation device 1 according to the present invention, that is, the operation of coupling the heat dissipation device 1 to the top of the printed circuit board 10.

That is, as will be described later, according to the present invention, the heat sink unit 100 of the heat dissipation device 1 can be manufactured only by press working. When the first insertion groove 132 is formed by press working, the first insertion is performed by pressing force. The opposite surface of the groove 132, that is, the upper surface of the heat sink unit 100 is inevitably relatively protruded.

The first insertion groove 132 is formed in the heat sink unit 100 located at a relatively low position, so that even if the upper surface of the heat sink unit 100 protrudes upward, the central processing unit contact unit is located at a relatively high position. Although the overall thickness of the heat sink portion 100 is not increased by 110, it is limited by the EMI gasket contact portion 130 located on the heat sink portion 100 adjacent to the central processing unit contact portion 110 formed higher than the surrounding area. 1 When the insertion groove 132 is formed, the overall thickness of the heat sink portion 100 inevitably increases, so the EMI gasket contact portion 130 located on the heat sink portion 100 formed higher than the surrounding area is press-worked. It is preferable to form the first through hole 134 in which the thickness does not increase even when the thickness is increased.

In addition, when all the EMI gasket contact portions 130 existing in the heat sink portion 100 are formed as the first through holes 134, the heat sink portion 100 is formed on the printed circuit board 10 due to processing errors and the like. Since it may be difficult to combine the first through hole 132 into the first through hole ( 134), it may be preferable to use the first insertion groove 132.

At this time, although not shown, depending on the height of the EMI gasket 16 provided on the printed circuit board 10, the portion where the central processing unit contact portion 110 is formed may be recessed to be located at a relatively low height, In this case, on the contrary, the first insertion groove 132 is formed with the EMI gasket contact part 130 adjacent to the central processing unit contact part 110 located at a relatively low height, and the heat sink part 100 located at a relatively high position. ), the first through hole 134 may be formed as the EMI gasket contact portion 130 formed therein.

Next, the push pin coupling part 120 is configured to fix and install the push pin 20 for binding the heat sink part 100 to the printed circuit board 10, and the push pin coupling part 120 As shown in (a) of Figure 3, it may be formed in a concave recessed form.

First, the push pin 20 is installed on the push pin coupling part 120 via the spring 26, and as shown in FIG. 5, it will include a pressing part 22 and a head part 24. can

The head part 24 is inserted into the push pin binding hole 14 provided on the printed circuit board 10 so that the heat sink part 100 can be fixedly installed on the printed circuit board 10. The pressing portion 22 is configured to press the head portion 24 so that it can be inserted and coupled into the push pin binding member 14. Since the detailed configuration of the push pin 20 is already known and is not intended to be claimed in the present invention, a detailed description of the working relationship thereof will be omitted.

Further, the push pin coupling part 120 may include a second insertion groove 122 and a third through hole 124, and the second insertion groove 122 is a pressing part of the push pin 20 ( 22) serves to be inserted into the inside and supported, and the third through hole 124 is formed in the center of the second insertion groove 122 so that the head portion 24 of the push pin 20 It is configured to pass through and be coupled to the push pin binding sphere 14 of the printed circuit board 10.

The second insertion groove 122 is also a configuration for slimming the combination of the printed circuit board 10 and the heat sink part 100, and like the first insertion groove 132 of the EMI gasket contact part 130 described above, the second insertion groove 122 Compared to the case where the insertion groove 122 is not formed, a slimming effect corresponding to the thickness of the second insertion groove 122 may be exhibited.

Next, the connection part 200 is connected and installed between the heat sink part 100 and the heat dissipation plate 300 to transfer heat conducted from the printed circuit board 10 to the heat sink part 100 to the heat dissipation plate 300. It serves to transmit, and may be composed of a conventional heat pipe 200 made of copper.

Next, the heat dissipation plate 300 serves to dissipate heat conducted from the printed circuit board 10 to the heat sink unit 100 by being connected to the heat sink unit 100 by the connection unit, that is, the heat pipe 200. By doing, a conventional heat dissipation fin made of a metal material containing aluminum can be provided.

Hereinafter, with reference to the accompanying drawings, a method of manufacturing the heat dissipation device 1 including the configuration described above will be described in detail.

As shown in FIG. 6 , the manufacturing method of the heat dissipation device according to the present invention may largely include a heat sink part manufacturing step (S10), a bonding step (S20), and a painting step (S30).

First, the heat sink part manufacturing step (S10) is a process for manufacturing the heat sink part 100 of the heat dissipation device 1 described above, and the heat sink part 100 can be manufactured only by press processing with relatively low processing cost. It is characterized in that the manufacturing cost can be reduced compared to the prior art in which the heat sink unit 100 was mainly manufactured by die casting.

That is, in the case of press working, the processing cost is relatively low, but there is a disadvantage in that processing of complex shapes is difficult, and in the case of die casting, processing of complex shapes is possible, but the manufacturing cost is relatively high compared to press processing. In the case of (100), in order to slim down, processing of grooves or holes in the EMI gasket contact portion 130 must be necessarily accompanied, and in particular, the heat sink portion requiring the second insertion groove 122 and the third through hole 124 at the same time. In the case of the push pin coupling part 120 of (100), it is difficult to manufacture only by press working and it is common to use a die casting method even if the manufacturing cost is high. However, in the present invention, the push pin coupling part 120 ) and the heat sink unit 100 including the EMI gasket contact unit 130 can be manufactured.

In more detail, the heat sink part manufacturing step (S10) may include a central processing unit contact part forming step (S12), a push pin coupling part forming step (S14), and an EMI gasket contact part forming step (S16). The central processing unit contact unit forming step (S12) is a process for forming the central processing unit contact unit 110 that contacts the central processing unit 12 and dissipates heat generated from the central processing unit 12, and shears using a press. Machining, punching and bending may be utilized.

That is, the shear processing is a process for forming the outer shape of the heat sink unit 100, and the heat sink is cut into a desired shape by a method such as blanking processing or notching processing. The outer shape of the part 100 is formed.

Next, the punching process is a process for forming a second through hole 112 in an aluminum plate cut into a desired shape, and the second through hole 112 is the central processing unit 12 of the printed circuit board 10 It may be formed at a position corresponding to.

At this time, as described above, a heat sink made of copper may be coupled to the second through hole 112, and the size of the second through hole 112 is the same as the size of the upper protrusion of the central processing unit 12. can be formed

In addition, the bending process is a process for forming a bent portion 114 in a flat aluminum plate material, and the bent portion 114 is formed at both ends of the second through hole 112, respectively, so that the bent portion 114 ), the central processing unit contact portion 110 can form a shape protruding upward compared to the surrounding heat sink portion 100.

Next, the push pin coupling part forming step (S14) is a push pin 20 for binding the heat sink part 100 to the printed circuit board 10 at the four corners of the aluminum plate on which the central processing unit contact part 110 is formed. ) may include a first punching step (S14a), a pressing step (S14b) and a second punching step (S14c) as a process for forming the push pin coupling portion 120 to which is coupled.

More specifically, in the first punching step (S14a), as shown in (a) of FIG. 7, a diameter greater than that of the push pin 20 is formed in a flat aluminum plate by punching using a press device. This is the process of forming a through hole with

Next, the pressing step (S14b) is a process of pressurizing the through-hole periphery from the top to the bottom using a pressurizing tool having a flat lower surface having a diameter larger than the diameter of the through-hole. A second insertion groove 122 of the push pin coupling part 120 may be formed.

That is, as shown in (b) of FIG. 7, as the material is pushed downward by the pressurization by the pressurizing tool, the diameter of the through hole formed in the first punching step (S14a) is narrowed, and at the same time, the heat sink unit 100 ) A protrusion 126 protruding downward from the lower surface may be formed.

At this time, it is preferable that the height of the protruding part 126 be less than 1/2 of the thickness of the plate constituting the heat sink part 100 by adjusting the pressing force of the pressing part. This is to minimize an increase in the thickness of the portion 100.

Next, the second punching step (S14c) is a process of once again performing punching processing using a press device on the through hole whose diameter is narrowed by the pressing step (S14b). ) of the third through hole 124 may be formed.

That is, as described above, since the diameter of the through hole is narrowed while the material is pushed downward by the pressurization by the pressurizing tool in the pressing step (S14b), in the second punching step (S14c), the push pin 20 A third through hole 124 through which the head portion 24 of the push pin 20 can pass can be formed by punching the through hole portion having a narrowed diameter using a punching mechanism corresponding to the diameter of .

Next, in the EMI gasket contact forming step (S16), the EMI gaskets 16 provided on the printed circuit board 10 are in contact with each other through a drawing process to transmit electromagnetic waves generated from electronic components to the outside of the display device. As a process for forming the EMI gasket contact portion 130 to be grounded, a first drawing step (S16a) and a second drawing step (S16b) may be included.

First, the first drawing step (S16a) is a process for forming the first insertion groove 132 into which the upper end of the EMI gasket 16 is inserted, and as described above, the first insertion groove 132 is formed only on the portion except for the contact portion 110 of the central processing unit, so that the overall thickness of the heat sink portion 100 is not increased by the first insertion groove 132 .

Next, the second drawing step (S16b) is a process for forming the EMI gasket contact part 130 located on the central processing unit contact part 110, and as described above, on the central processing contact part located at a relatively high position. Although the first through-hole 134 should be formed in the EMI gasket contact portion 130 to prevent an increase in the overall thickness of the heat sink portion 100, when the first through-hole 134 is formed in this step. , Black paint is also applied to the side of the first through hole 134 by painting in the painting step (S30) to be described later, so that the ground between the side of the first through hole 134 and the EMI gasket 16 is not made. do.

In order to prevent this, a masking operation is performed after forming the first through hole 134 by punching in this step, or a painting step in a state where the first through hole 134 is sealed using rubber packing or the like ( A method of performing S30) may be used, but as described above, the masking process and the rubber packing insertion work must be done manually, so the overall work process is complicated and takes a long time, and the masking process or rubber packing If the packing is not properly inserted, there is a high possibility of defects because the painting is not completely blocked.

Therefore, in the present invention, as shown in (a) and (b) of FIG. 8, the first through hole 134 on the central processing unit contact portion 110 is formed through the drawing process in the second drawing step (S16b). The side surface of the first through hole 134 is formed by first forming the protrusion 116 at the position to be formed and then removing the protrusion 116 after the painting step (S30) to form the first through hole 134. It can make it possible to work quickly while preventing painting from being applied to the surface.

At this time, it is preferable to form the sidewall of the protrusion 116 as thin as possible so that the protrusion 116 can be more easily removed in the cut-off processing step (S40) to be described later.

Next, the bonding step (S20) is a process of connecting the heat sink part 100 manufactured in the heat sink part manufacturing step (S10) and the heat dissipation plate 300 to each other using a connection part, that is, the heat pipe 200. As such, it may include a nickel plating step (S22) and a soldering step (S24).

First, the nickel plating step (S22) is a preparation process for the soldering joint between the heat sink unit 100 and the heat dissipation plate 300 and the heat pipe 200, and the heat pipe 200 and the heat sink of the portion to be soldered This is a step of performing nickel plating on the unit 100 and the heat dissipation plate 300.

That is, the heat sink unit 100 and the heat dissipation plate 300 may be made of aluminum. Since aluminum is difficult to solder due to the formation of a natural oxide film on its surface, the portion to be bonded to the heat pipe 200 By performing nickel plating on the heat sink unit 100 and the heat dissipation plate 300, soldering bonding may be possible.

Next, the soldering step (S24) is a process for soldering and bonding the heat pipe 200 made of copper to the nickel plating layer of the heat sink portion 100 and the heat dissipation plate 300 formed in the nickel plating step (S22). Since the soldering process is already known, a detailed description thereof will be omitted.

Next, the painting step (S30) is a process of painting by spraying or applying black paint on the upper surfaces of the bonded heat sink unit 100, the heat pipe 200, and the heat dissipation plate 300, such a painting step (S30 ) may be performed for the purpose of enhancing the heat dissipation effect by radiant heat of the heat dissipation device 1 while enhancing the overall appearance of the heat dissipation device 1 at the same time.

In the above, the paint used in the painting step (S30) is limited to the black paint, but it is of course possible to use the known heat dissipation paint of various colors in the painting step (S30).

Meanwhile, the method for manufacturing a heat dissipation device according to the present invention may further include a cut-off processing step (S40) after the painting step (S30). As a process for removing the protrusion 116 formed in the drawing step (S16b), the first through hole 134 into which the upper end of the EMI gasket 16 is inserted can be formed through the removal of the protrusion 116. there will be

At this time, when the sidewall of the protrusion 116 is formed as thin as possible in the second drawing step (S16b), the protrusion 116 can be easily removed by hand using a hand tool such as pliers or nippers.

In addition, as shown in (c) and (d) of FIG. 8, in a state in which the protrusion 116 formed in the second drawing step (S16b) faces upward, the protrusion 116 is formed by shearing using a press machine. By removing it, the first through hole 134 can be formed in the central processing unit contact unit 110 .

Therefore, according to the method for manufacturing a heat dissipation device for a display according to the present invention as described above, the heat dissipation device 1 provided in a flat panel display device can be manufactured only by press processing at a relatively low processing cost, thereby reducing production cost. , The thickness of the heat sink unit 100 can be minimized, thereby reducing the overall thickness of the flat panel display device, as well as reducing the defect rate while facilitating mass production through simplification of the manufacturing process. is to have

Although the foregoing embodiments have been described with respect to the most preferred examples of the present invention, it is not limited to only the above embodiments, and it is clear to those skilled in the art that various modifications are possible without departing from the technical spirit of the present invention.

The present invention relates to a method for manufacturing a heat dissipation device for a display, and more particularly, to a heat dissipation device provided in a flat panel display device, which can be manufactured only by press processing at a relatively low processing cost, while simplifying the manufacturing process, so that mass production is easy It relates to a method for manufacturing a heat dissipation device for a display that can reduce production cost and at the same time reduce the thickness of the heat dissipation device so that the thickness of the entire display device can be slimmed down.

1: heat dissipation device 10: printed circuit board
12: central processing unit 14: push pin binding tool
16: EMI gasket 20: push pin
22: pressing part 24: head part
26: spring 100: heat sink
110: central processing unit contact part 112: second through hole
114: bent portion 116, 126: protruding portion
120: push pin coupling part 122: second insertion groove
124: third through hole 130: EMI gasket contact portion
132: first insertion groove 134: first through hole
200: connection part (heat pipe) 300: heat dissipation plate
S10: heat sink part manufacturing step S12: central processing unit contact part forming step
S14: Forming a push pin coupling part S14a: First punching step
S14b: pressing step S14c: second punching step
S16: EMI gasket contact forming step S16a: first drawing step
S16b: Second drawing step S20: Joining step
S22: Nickel plating step S24: Soldering step
S30: Painting step S40: Cut-off processing step

Claims (6)

In the manufacturing method of a heat dissipation device for a display comprising a flat heat sink portion including a central processing unit contact portion and an EMI gasket contact portion, and a heat dissipation plate connected to the heat sink portion,
A heat sink part manufacturing step of forming a heat sink part by press working using an aluminum plate;
A bonding step of bonding a heat pipe between the heat sink unit and the heat dissipation plate by soldering; and
A method of manufacturing a heat dissipation device for a display comprising a painting step of performing a painting operation on upper surfaces of the bonded heat sink unit, the heat pipe, and the heat dissipation plate.
According to claim 1,
The heat sink part manufacturing step,
A central processing unit contact part forming step of cutting the aluminum plate into a desired shape through shearing and then forming the central processing unit contact part through bending and punching;
A method of manufacturing a heat dissipation device for a display comprising an EMI gasket contact portion forming step of forming the EMI gasket contact portion through a drawing process.
According to claim 2,
The EMI gasket contact forming step,
A method of manufacturing a heat dissipation device for a display comprising a second drawing step of forming a protrusion at a location where an EMI gasket contact portion is to be formed on a central processing unit contact portion by drawing.
According to claim 3,
The manufacturing method of the heat dissipation device for a display further comprising a cut-off processing step of removing the protrusion formed in the second drawing step after the painting step to form a first through hole into which an upper end of the EMI gasket is inserted.
According to claim 4,
The first through hole is formed to have the same size as the EMI gasket so that the upper side of the EMI gasket is in contact with the inner circumferential surface of the first through hole to ground the electromagnetic waves through the side ground. Manufacturing method of a heat dissipation device for a display .
According to claim 5,
The upper surface of the EMI gasket is located at the same height as the upper surface of the heat sink unit, manufacturing method of a heat dissipation device for a display.