CN108966618A - The electronic device of shielding case and the application shielding case - Google Patents
The electronic device of shielding case and the application shielding case Download PDFInfo
- Publication number
- CN108966618A CN108966618A CN201710384270.0A CN201710384270A CN108966618A CN 108966618 A CN108966618 A CN 108966618A CN 201710384270 A CN201710384270 A CN 201710384270A CN 108966618 A CN108966618 A CN 108966618A
- Authority
- CN
- China
- Prior art keywords
- shielding
- shielding case
- deformations
- circuit board
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of shielding case, it include: shielding ontology, including framework, occlusion part and the engraved structure on occlusion part, the occlusion part is connect to form accommodation space with the framework, the engraved structure is correspondingly arranged with the accommodation space, and the engraved structure includes deformations and hollow-out parts；And shielding part, it is connected to the occlusion part and covers the engraved structure；When the shielding part and the heated engraved structure, the deformations are heated towards the direction dilatancy far from the shielding part.The present invention also provides a kind of electronic devices of application shielding case, the circuit board assemblies including shell and in shell, and the circuit board assemblies include circuit board, electronic component, heat carrier and above-mentioned shielding case.Above-mentioned shielding case and application the shielding case electronic device by setting can temperature distortion deformations, in electronic component adstante febre, heat carrier is simultaneously pressed to electronic component, improves the heat dissipation effect of electronic component by deformations dilatancy.
Description
Technical field
The present invention relates to shielding radiator structure and technical field of electronic equipment more particularly to a kind of shielding case and apply the screen
Cover the electronic device of cover.
Background technique
Existing electronic product, such as computer, mobile phone, its internal electronic component can generate heat at work, if too late
When to electronic component carry out radiating and cooling, will result in electronic product slow in reacting, Caton or even stuck, strong influence
Use of the people to electronic product.In addition in view of heat dissipation, the electronic component of electronic product is accounted for signal shielding, because
This shields external signal and is radiated, and shielding case top in electronic product usually using shielding case or shielding case
Portion is suitable at a distance from electronic component, and if too far, heat dissipation effect is poor；Distance too close may then touch even squeezes electricity
Subcomponent.
Currently, on circuit boards setting shielding case it is most there are two types of, one is the mask frames of shielding case and screening cover not
It is the state being separated from each other when use, the suitable mask frame of height is first framed the electronic component of circuit board by when use, then again
Screening cover and mask frame are fitted together, the assembling mode of screening cover and mask frame is mostly to buckle；Another kind is shielding case
Mask frame and screening cover integral structure, when use, directly cover on the electronic component of circuit board.But former shielding case is point
Installation is opened, installation steps are more, increase the activity duration, and installation effectiveness is low, and bigger space is needed to go to operate, and are not suitable for
Light and short electronic product；And latter shielding case can not grasp shielding case at a distance from electronic component during installation, shielding
Electronic component may be touched or be squeezed to the screening cover of cover, so that the work and heat dissipation to electronic component cause adverse effect.
Summary of the invention
In view of this, a kind of it is necessary to provide structures simple, installation quickly, at the top of shielding case deformable shielding case and is answered
With the electronic device of the shielding case.
A kind of shielding case characterized by comprising
Shield ontology, including framework, occlusion part and the engraved structure on occlusion part, the occlusion part with it is described
Framework is connected to form accommodation space, and the engraved structure is correspondingly arranged with the accommodation space, and the engraved structure includes shape
Change portion and hollow-out parts；And
Shielding part is connected to the occlusion part and covers the engraved structure；
When the shielding part and the heated engraved structure, the deformations are heated towards the direction far from the shielding part
Dilatancy.
Further, the shielding ontology and the shielding part are integrally formed metal structure, the shielding ontology
It is different with the thermal expansion coefficient of the shielding part.
Further, the deformations are to have effigurate flake structure, and thermal expansion coefficient is greater than the shielding
The thermal expansion coefficient of part.
Further, the occlusion part is the flanged structure extended from one side of framework to the framework center, described
Occlusion part is vertical setting with the framework.
It further, further include fixed part, the fixed part is set to the framework, the fixed part and the shield portions
It She Yu not be on two opposite flanks of the framework.
Further, the fixed part is grab, and the fixed part includes two symmetrical holding sections and blocks set on two
Bayonet between conjunction portion；The fixed part and the framework are integrally formed.
Further, the connection type of the shielding part and the occlusion part is riveting, welds, appointing in ultrasonic engagement
It is a kind of.
A kind of electronic device, the circuit board assemblies including shell and in shell, which is characterized in that the circuit board group
Part includes:
Circuit board；
Electronic component is fixedly arranged on the circuit board；
Heat carrier is closely attached on the electronic component；And
Shielding case covers the electronic component and the heat carrier and is connected to the circuit board；
When the shielding case is heated, the deformations deforms towards the heat carrier, and described in the heat carrier pressed to
Electronic component.
Further, the circuit board is equipped with fixation hole, and the shielding case passes through the fixed part and the fixation hole
Cooperation is fixed to the circuit board.
Further, the heat carrier is the plastic deformation piece with thermal conduction characteristic, and thermal resistance is low when being pressurized.
It can be seen that shielding case provided by the invention and application the shielding case electronic device setting can temperature distortion shape
Change portion, in electronic component adstante febre, heat carrier is simultaneously pressed to electronic component, compresses heat carrier further by deformations dilatancy
Electronic component reduces the heat dissipation resistance value of heat carrier, improves heat carrier to the heat transfer of electronic component, to improve electronics
The heat dissipation effect of element, structure is simple, good heat dissipation effect；Deformations have certain dilatancy range, when deformations deform
Can make up to radiate caused by thermally conductive body thickness deficiency influences, low to the thickness deviation requirement of heat carrier, and the processing is simple.
Detailed description of the invention
Fig. 1 show the decomposition texture schematic diagram of shielding case according to an embodiment of the invention.
Fig. 2 show the structural schematic diagram of shielding case according to an embodiment of the invention.
Fig. 3 show the decomposition texture schematic diagram of circuit board assemblies according to an embodiment of the invention.
Fig. 4 show the combining structure schematic diagram of the circuit board assemblies of Fig. 3.
Fig. 5 show circuit board assemblies according to an embodiment of the invention and removes the structural schematic diagram after heat carrier.
Main element symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Fig. 1 show the decomposition texture schematic diagram of shielding case 100 according to an embodiment of the invention.In figure, shielding case 100
Including shielding ontology 110 and shielding part 120, shielding ontology 110 is including framework 111, occlusion part 112 and is set to occlusion part 112
On engraved structure 117, framework 111 be a frame with the sheet panel, it is substantially square.111 side of framework is opening, and the other side is equipped with
Occlusion part 112 and engraved structure 117, framework 111 and occlusion part 112 form a rectangular accommodation space 116, engraved structure
117 face accommodation spaces 116.Occlusion part 112 is the flanged structure extended from 111 1 side of framework to 111 center of framework, and is blocked
Portion 112 is vertical setting with framework 111.The side opposite with occlusion part 112 of framework 111 is additionally provided with plural fixed part 115, framework
111 can be installed by plural fixed part 115 to the circuit board (not shown) of supporter, such as electronic device.Each fixed part 115
It is substantially in thin-slab structure comprising two symmetrical holding sections 1151 and the bayonet 1152 between two holding sections 1151,
The middle part of two holding sections 1151 is slightly larger than both ends, and when two symmetrical holding sections 1151 are compressed by external force, two symmetrical
Holding section 1151 is drawn close to deformation bayonet 1152, so that bayonet 1152 becomes smaller.Engraved structure 117 includes deformations 113 and hollow out
Portion 114, deformations 113 are connected to occlusion part 112, and hollow-out parts 114 are set between deformations 113 and occlusion part 112.Deformations
113 be a thin-slab structure, with certain shape.
In the present embodiment, it is preferred that two fixed parts 115 are set in framework 111, and two fixed parts 115 are respectively arranged on
On the opposite two sides of framework 111, fixed part 115 is grab；Occlusion part 112 and deformations 113 are an integral molding structure, occlusion part
112 be a square plate when initial, and the effigurate deformations of the tool formed after hollow-out parts 114 are dug on occlusion part 112
113, it is substantially in fold-line-shaped that deformations 113, which are a thin-slab structure,.In other embodiments, fixed part 115 is settable more
It is a, it is not limited to two；Occlusion part 112 and deformations 113 can be by being welded together；Deformations 113 are also not limited to
Fold-line-shaped, can also in other shapes or pattern, such as serpentine.
Please with reference to Fig. 2, shielding part 120 is a square plate, is used to shield and radiate.Shield ontology 110 and screen
Shield 120 is integrally formed metal structure, and shielding part 120 is connected to the occlusion part 112 of framework 111 and by engraved structure
117 coverings, form framework 111 closed at one end, and the other end is the hood-like structure of opening.The connection of shielding part 120 and framework 111
There are many modes, such as riveting, welding, ultrasonic engagement, in the present embodiment, it is preferred that shielding part 120 and framework 111 are logical
It is integral to cross welded connecting.
The thermal expansion coefficient for shielding ontology 110 is different from shielding part 120, and the thermal expansion coefficient of deformations 113 is greater than screen
Shield 120.The thermal expansion coefficient of different metal is different, and the degree of expanded by heating is also different, the case where absorbing equal heat quantity
Under, the big expansion of metal degree of thermal expansion coefficient is greater than the small metal of thermal expansion coefficient, therefore, by shielding part 120 and deformations
113 when being placed on same fever environment, and the degrees of expansion of deformations 113 is greater than shielding part 120.
It is illustrated below in conjunction with the course of work of the attached drawing 1-2 to shielding case 100:
In use, by the installation of shielding case 100 to needing on the electronic device that radiates, for example, electronic device circuit board hair
Pyrotoxin is covered and passes through the installation of fixed part 115 to circuit board, deformations 113 and shielding by heat source (not shown), shielding case 100
Part 120 is located at the surface of pyrotoxin.When not working, deformations 113 are adjacent to shielding part 120；When work, pyrotoxin issues heat
Amount, deformations 113 and shielding part 120 are jointly heated, since the thermal expansion coefficient of deformations 113 is greater than shielding part 120, deformations
113 are largely expanded deformation, and 120 dilatancy degree of shielding part is small (can almost regard as indeformable), the expansion of deformations 113
Deformation direction is indefinite, but shielding part 120 hardly deforms, thus deformations 113 towards shielding part 120 deform when will receive shielding
Part 120 stops, and deformations 113 can not be towards the Direction distortion of shielding part 120, can only be towards the Direction distortion of pyrotoxin.
Referring to Fig. 3, the present invention also provides a kind of electronic devices, including shell (not shown) and in shell
Circuit board assemblies 200, circuit board assemblies 200 include circuit board 210, the electronic component 220 on circuit board 210, are close to electricity
The heat carrier 230 and shielding case 100 of subcomponent 220, shielding case 100 include the screen to link together by welding
Ontology 110 and shielding part 120 are covered, shielding 110 side of ontology is equipped with deformations 113 and hollow-out parts 114, and the other side is equipped with fixed part
115, circuit board 210 is equipped with the fixation hole 211 cooperated with fixed part 115.Heat carrier 230 is that the plasticity with thermal conduction characteristic becomes
Shape piece, thermal resistance is low when being pressurized.230 shape of heat carrier is shown in electronic component 220, and electronic component 220 is completely covered, from
And improve the heat dissipation effect to electronic component 220.
The installation of circuit board assemblies 200 and the course of work are illustrated below in conjunction with attached drawing 1-5:
When installation, the receiving portion 116 of shielding case 100 is first substantially aligned with electronic component 220 on circuit board 210 and thermally conductive
Then fixed part 115 is precisely aligned fixation hole 211 by body 230, be then inserted into fixed part 115 and be stuck in fixation hole 211,
Finally fixed part 115 is welded on circuit board 210.After installing, electronic component 220 and heat carrier 230 are housed in shielding
In the accommodation space 116 of cover 100, deformations 113 abut heat carrier 230.
When work, circuit board 210 is powered, and stopping pregnancy heat amount, heat carrier 230 do not absorb the start-up operation of electronic component 220
And the heat of the generation of electronic component 220 is distributed, heat carrier 230 distributes there are two types of the modes of heat, mode one: first that heat is direct
It conducts to the deformations 113 being in contact with it, then by the conduction of deformations 113 to shielding part 120, is dissipated finally by shielding part 120
It is dealt into the exterior space of shielding case 100.Mode two: first distributing heat into the air in accommodation space 116, then by engraving
The empty conduction of portion 114 is dispersed into the exterior space of shielding case 100 finally by shielding part 120 to deformations 113 and shielding part 120
In.Both radiating modes carry out simultaneously, to improve the heat dissipation effect to electronic component 220.
In above two radiating mode, deformations 113 and shielding part 120 can all absorb the heat that electronic component 220 issues
Amount, since the thermal expansion coefficient of deformations 113 is greater than shielding part 120, deformations 113 are largely expanded deformation, and shielding part 120
Dilatancy degree is small (can almost regard as indeformable), is stopped by shielding part 120, deformations can not be towards the direction of shielding part 120
Deformation, and can only be towards the Direction distortion of heat carrier 230, and then heat carrier 230 is squeezed, so that heat carrier 230 is further compressed electricity
Subcomponent 220.In the present embodiment, it is preferred that heat carrier 230 is the plastic deformation piece with thermal conduction characteristic, heat when being pressurized
Hinder low, therefore, when extruding of the heat carrier 230 by deformations 113, the thermal resistance of heat carrier 230 is lower, and accelerates heat carrier
230 heat conduction rate to improve the heat transfer efficiency of heat carrier 230, and then improves shielding case 100 to electronic component 220
Heat dissipation effect.
In other embodiments, the thickness of heat carrier 230 can be slightly smaller than between deformations 113 and electronic component 220
Distance, after installing, deformations 113 do not abut heat carrier 230, but with heat carrier 230 have one section it is small at a distance from；
When work, deformations 113 are heated to abut towards the deformation of heat carrier 230 and squeezes heat carrier 230.Therefore, the thickness of heat carrier 230
It does not need very accurately, deformations 113, which can make up to radiate caused by heat carrier 230 thickness deficiency when deforming, to be influenced.Heat carrier 230
Tolerance is low, manufacture easy to process.
It can be seen that the electronic device setting of shielding case 100 provided by the invention and the application shielding case 100 can be become by heat
The deformations 113 of shape, in 220 adstante febre of electronic component, heat carrier 230 is simultaneously pressed to electronic component by 113 dilatancy of deformations
220, so that heat carrier 230 is further compressed electronic component 220, reduces the heat dissipation resistance value of heat carrier 230, improve heat carrier
The heat transfer of 230 pairs of electronic components 220, to improve the heat dissipation effect of electronic component 220, structure is simple, good heat dissipation effect；
Caused by there is deformations 113 certain dilatancy range, deformations 113 can make up heat carrier 230 thickness deficiency when deforming
Heat dissipation influences, low to the thickness deviation requirement of heat carrier 230, and the processing is simple.
To those skilled in the art, it can be combined and be generated with scheme of the invention according to the present invention and inventive concept
Actual needs make other and be altered or modified accordingly, and these change and adjustment all should belong to the guarantors of the claims in the present invention
Protect range.
Claims (10)
1. a kind of shielding case characterized by comprising
Ontology is shielded, including framework, occlusion part and the engraved structure on occlusion part, the occlusion part and the framework
Connection is to form accommodation space, and the engraved structure is correspondingly arranged with the accommodation space, and the engraved structure includes deformations
And hollow-out parts；And
Shielding part is connected to the occlusion part and covers the engraved structure；
When the shielding part and the heated engraved structure, the deformations are heated to be expanded towards the direction far from the shielding part
Deformation.
2. shielding case as described in claim 1, which is characterized in that the shielding ontology and the shielding part are integrally formed
Metal structure, the thermal expansion coefficient of the shielding ontology and the shielding part is different.
3. shielding case as claimed in claim 2, which is characterized in that the deformations are to have effigurate flake structure,
Its thermal expansion coefficient is greater than the thermal expansion coefficient of the shielding part.
4. shielding case as described in claim 1, which is characterized in that the occlusion part is from one side of framework to the framework
The flanged structure that center extends, the occlusion part are vertical setting with the framework.
5. shielding case as claimed in claim 4, which is characterized in that it further include fixed part, the fixed part is set to the framework,
The fixed part and the occlusion part are respectively arranged on two opposite flanks of the framework.
6. shielding case as claimed in claim 5, which is characterized in that the fixed part is grab, and the fixed part includes two
Symmetrical holding section and the bayonet between two holding sections；The fixed part and the framework are integrally formed.
7. shielding case as described in claim 1, which is characterized in that the connection type of the shielding part and the occlusion part is riveting
Connect, weld, ultrasonic engagement any one of.
8. a kind of electronic device, the circuit board assemblies including shell and in shell, which is characterized in that the circuit board assemblies
Include:
Circuit board；
Electronic component is fixedly arranged on the circuit board；
Heat carrier is closely attached on the electronic component；And
Shielding case as described in any one of claim 1 to 7 covers the electronic component and the heat carrier and is connected to described
Circuit board；
When the shielding case is heated, the deformations are deformed towards the heat carrier, and the heat carrier is pressed to the electronics
Element.
9. electronic device as claimed in claim 8, which is characterized in that the circuit board is equipped with fixation hole, and the shielding case is logical
The cooperation for crossing the fixed part and the fixation hole is fixed to the circuit board.
10. electronic device as claimed in claim 8, which is characterized in that the heat carrier is that the plasticity with thermal conduction characteristic becomes
Shape piece, thermal resistance is low when being pressurized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710384270.0A CN108966618B (en) | 2017-05-26 | 2017-05-26 | Shielding case and electronic device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710384270.0A CN108966618B (en) | 2017-05-26 | 2017-05-26 | Shielding case and electronic device using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108966618A true CN108966618A (en) | 2018-12-07 |
| CN108966618B CN108966618B (en) | 2020-04-24 |
Family
ID=64494171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710384270.0A Expired - Fee Related CN108966618B (en) | 2017-05-26 | 2017-05-26 | Shielding case and electronic device using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108966618B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888207A (en) * | 2019-11-29 | 2021-06-01 | 宏碁股份有限公司 | Casing and manufacturing method thereof |
| CN113597241A (en) * | 2020-04-30 | 2021-11-02 | 华为技术有限公司 | Shielding case and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1130954A2 (en) * | 2000-03-01 | 2001-09-05 | Sony Corporation | Shield case |
| TW200520643A (en) * | 2003-10-27 | 2005-06-16 | Sanyo Electric Co | Circuit device |
| CN101500391A (en) * | 2008-01-29 | 2009-08-05 | 瑞鼎科技股份有限公司 | Heat radiation assembly, chip comprising the heat radiation assembly and heat radiating method for the chip |
| CN105307451A (en) * | 2014-06-06 | 2016-02-03 | 纬创资通股份有限公司 | Heat radiation module and electronic device with same |
| CN205213256U (en) * | 2015-11-27 | 2016-05-04 | 上海与德通讯技术有限公司 | Mainboard shielding structure and mainboard |
| CN106304772A (en) * | 2015-06-09 | 2017-01-04 | 联想(北京)有限公司 | Heat abstractor, electronic equipment and thermal control method |
-
2017
- 2017-05-26 CN CN201710384270.0A patent/CN108966618B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1130954A2 (en) * | 2000-03-01 | 2001-09-05 | Sony Corporation | Shield case |
| TW200520643A (en) * | 2003-10-27 | 2005-06-16 | Sanyo Electric Co | Circuit device |
| CN101500391A (en) * | 2008-01-29 | 2009-08-05 | 瑞鼎科技股份有限公司 | Heat radiation assembly, chip comprising the heat radiation assembly and heat radiating method for the chip |
| CN105307451A (en) * | 2014-06-06 | 2016-02-03 | 纬创资通股份有限公司 | Heat radiation module and electronic device with same |
| CN106304772A (en) * | 2015-06-09 | 2017-01-04 | 联想(北京)有限公司 | Heat abstractor, electronic equipment and thermal control method |
| CN205213256U (en) * | 2015-11-27 | 2016-05-04 | 上海与德通讯技术有限公司 | Mainboard shielding structure and mainboard |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888207A (en) * | 2019-11-29 | 2021-06-01 | 宏碁股份有限公司 | Casing and manufacturing method thereof |
| CN113597241A (en) * | 2020-04-30 | 2021-11-02 | 华为技术有限公司 | Shielding case and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108966618B (en) | 2020-04-24 |
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