CN213069733U - Combined type heat radiation component for server - Google Patents
Combined type heat radiation component for server Download PDFInfo
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- CN213069733U CN213069733U CN202022477595.3U CN202022477595U CN213069733U CN 213069733 U CN213069733 U CN 213069733U CN 202022477595 U CN202022477595 U CN 202022477595U CN 213069733 U CN213069733 U CN 213069733U
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- heat
- server
- heat dissipating
- radiator
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Abstract
The utility model discloses a heat radiation component for a combined server, which comprises a heat radiation plate, a heat radiation fin and a magnetic connecting piece; the side wall of the heat dissipation plate is provided with embedded grooves, and the overlapped area of the two embedded grooves is a vacant area; the radiating fins are arranged on the upper plate surface of the radiating plate, two adjacent radiating plates are connected through magnetic connecting pieces, and the magnetic connecting pieces are arranged in the embedded grooves in the two adjacent radiating plates. The utility model discloses with the heat radiation component modularization, be convenient for assemble according to the required radiator size of server, and adopt the magnetism connecting piece to be favorable to not having the firmware equipment between radiator and the server as the connecting piece between two heating panels.
Description
Technical Field
The utility model relates to a server heat dissipation technical field. In particular to a heat radiation component for a combined server.
Background
The server is used as energy-consuming electronic equipment, and heat generated in the working process of the server needs to be dissipated in order not to influence the normal work of the server. Therefore, a heat sink including heat dissipation fins and heat dissipation plates is mounted on the server, and heat generated by the server is dissipated by air cooling or liquid cooling. However, due to the limitation of the server structure, when a heat sink is added to improve the heat dissipation effect, the size and shape of the heat sink are often considered, and the problem of assembling the heat sink with the server is also considered.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model aims to solve the technical problem that a modular server is with radiator unit is provided, with the radiator unit modularization, be convenient for assemble according to the required radiator size of server, and adopt the magnetic connecting piece to be favorable to not having the firmware equipment between radiator and the server as the connecting piece between two heating panels.
In order to solve the technical problem, the utility model provides a following technical scheme:
a heat radiation component for a combined server comprises a heat radiation plate, a heat radiation fin and a magnetic connecting piece; the side wall of the heat dissipation plate is provided with embedded grooves, and the overlapped area of the two embedded grooves is a vacant area; the radiating fins are arranged on the upper plate surface of the radiating plate, two adjacent radiating plates are connected through magnetic connecting pieces, and the magnetic connecting pieces are arranged in the embedded grooves in the two adjacent radiating plates.
The upper plate surface of the heat dissipation plate is provided with a spherical groove.
In the heat dissipation member for combined server, the ratio of the depth of the spherical groove to the thickness of the heat dissipation plate is 0.6 to 0.8.
In the heat dissipation member for the combined server, on the same heat dissipation plate, the top end of the heat dissipation plate arranged in the spherical groove is higher than the top end of the heat dissipation plate arranged in the plane area of the heat dissipation plate.
In the above-described heat dissipation member for a combined server, on the same heat dissipation plate, when the heat dissipation plate is disposed on the upper plate surface of the heat dissipation plate in a manner that two adjacent heat dissipation plates are parallel to each other, the height of the heat dissipation plate is gradually reduced from the central axis of the spherical groove outward, with the upper plate surface plane area of the heat dissipation plate as a reference.
In the heat dissipation member for the combined server, the heat conduction film is arranged between two adjacent heat dissipation plates and sleeved on the magnetic connecting piece.
The magnetic connecting piece comprises a cylindrical body and a plate-shaped body, and the two cylindrical bodies are connected into the connecting piece with the dumbbell-shaped cross section through the plate-shaped body; the cylindrical body comprises a heat conduction material shell and a magnetic cylinder, and the heat conduction material shell is wrapped on the magnetic cylinder.
The technical scheme of the utility model following profitable technological effect has been obtained:
1. the utility model discloses carry out miniaturization and modularization with the radiator, be favorable to adjusting heat radiation member's shape according to heat radiating area and heat dissipation shape, and the magnetic connecting piece can provide the binding power for no firmware equipment between heat radiation member and the server again.
2. The utility model discloses utilize the fin to constitute non-planar fin group face, can increase the air flow between the fin, reduce the heat accumulation district, improve the radiating efficiency.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation member for a combination server of the present invention;
fig. 2 is a schematic structural view of a heat dissipating plate of the heat dissipating member for the combination server of the present invention;
FIG. 3 is a schematic structural view of a magnetic connecting member of a heat dissipating member for a combined server according to the present invention;
fig. 4 is a schematic view of another downward-looking structure of the magnetic connecting member of the heat dissipation member for a combination server of the present invention.
The reference numbers in the figures denote: 1-a heat sink; 2-a heat sink; 3-spherical groove; 4-magnetic connecting piece, 4-1-heat conducting material shell, 4-2-magnetic column body and 4-3-plate body; 5-a heat conducting film; 6-a tabling groove.
Detailed Description
In this embodiment, as shown in fig. 1 to 4, the heat dissipation member for a combined server of the present invention includes a heat dissipation plate 1, a heat dissipation plate 2, and a magnetic connecting member 4; the side wall of the heat dissipation plate 1 is provided with embedding grooves 6, and the overlapping area of the two embedding grooves 6 is a vacant area; the radiating fins 2 are arranged on the upper plate surface of the radiating plate 1, two adjacent radiating plates 1 are connected through magnetic connecting pieces 4, and the magnetic connecting pieces 4 are arranged in the embedded grooves 6 on the two adjacent radiating plates 1. The arrangement of the vacant areas is to facilitate the matching and installation of the magnetic connecting piece 4 and the embedding groove 6.
The upper plate surface of the heat dissipation plate 1 is provided with a spherical groove 3, and the ratio of the depth of the spherical groove 3 to the thickness of the heat dissipation plate 1 is 0.72. On the same fin 2, set up in spherical groove 3 fin 2 top is higher than the setting and is in 1 plane district of heating panel 1 top of heating panel, and when fin 2 sets up with adjacent two the parallel mode of fin 2 is in on 1 upper plate of heating panel, with 1 upper plate plane district of heating panel is the benchmark, fin 2's height by 3 outside gradually reductions in center pin of spherical groove.
In order to facilitate heat conduction between two adjacent heat dissipation plates 1 and improve the heat transfer efficiency between two adjacent heat dissipation plates 1, a heat conduction film 5 is arranged between two adjacent heat dissipation plates 1, and the heat conduction film 5 is sleeved on the magnetic connecting piece 4. The magnetic connecting piece 4 comprises a cylindrical body and a plate-shaped body 4-3, and the two cylindrical bodies are connected through the plate-shaped body 4-3 to form a connecting piece with a dumbbell-shaped cross section; the cylindrical body comprises a heat conduction material shell 4-1 and a magnetic cylinder 4-2, and the heat conduction material shell 4-1 is wrapped on the magnetic cylinder 4-2.
The utility model discloses in, carry out miniaturization and modularization with the radiator of large tracts of land, be favorable to the user to assemble shape and size to modular server with radiator unit's final according to the shape and the area size of cooling surface and adjust, dismantle simultaneously get off by fin 2 with the heat radiation module that heating panel 1 is constituteed can continue to be used in assembling of other radiators, improves the recycle rate of heat dissipation equipment, reduces the trouble that the just shape adjustment of radiator needs remodelling.
In this embodiment, the structure formed by the heat dissipation fins 2 on each heat dissipation plate 1 is a middle convex structure, which makes the side of the heat dissipation member away from the electronic device for the combined server be a wavy surface, as shown in fig. 1, and this structure is favorable for the flowing air to carry out the hot air between the heat dissipation fins 2, thereby reducing the heat accumulation in the heat dissipation area. The existing radiator is used for radiating, the central area of the contact surface of the radiator and the electronic device is mostly provided with accumulated heat, so that the edge temperature of the electronic device is reduced, the radiator is suitable for normal work of the electronic device, the central area is overhigh in temperature and is not suitable for normal work of the electronic device, the electronic device is often positioned at the edge which can not work normally, and the service life of the electronic device is reduced. And utilize the utility model discloses dispel the heat to electronic device, keep away from electronic device the wave face of modular server heat radiation component can provide different heat radiation pattern, when guaranteeing 2 radiating efficiency of fin, has improved the ventilation effect of wave face, is favorable to improving wholly modular server heat radiation component's heat radiation efficiency, this kind of structure is favorable to solving the problem that dull and stereotyped radiator middle zone amasss heat and is difficult to the diffusion moreover.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications are possible which remain within the scope of the appended claims.
Claims (7)
1. A heat radiation component for a combined server is characterized by comprising a heat radiation plate (1), a heat radiation fin (2) and a magnetic connecting piece (4); the side wall of the heat dissipation plate (1) is provided with embedding grooves (6), and the overlapping area of the two embedding grooves (6) is a vacant area; the radiating fins (2) are arranged on the upper plate surface of the radiating plate (1), two adjacent radiating plates (1) are connected through magnetic connecting pieces (4), and the magnetic connecting pieces (4) are arranged in the embedded grooves (6) on the two adjacent radiating plates (1).
2. The radiator structure for a server set according to claim 1, wherein the upper surface of the radiator plate (1) is provided with a spherical groove (3).
3. The heat dissipating structure for a server set as claimed in claim 2, wherein the ratio of the depth of the spherical groove (3) to the thickness of the heat dissipating plate (1) is 0.6 to 0.8.
4. The radiator structure for a combined server according to claim 3, wherein the top end of the radiator (2) disposed in the spherical groove (3) is higher than the top end of the radiator plate (1) disposed in the plane area of the radiator plate (1) on the same radiator plate (2).
5. The heat dissipating structure for a server cluster as set forth in claim 4, wherein in the same heat dissipating fin (2), when the heat dissipating fins (2) are disposed on the upper plate surface of the heat dissipating plate (1) in such a manner that two adjacent heat dissipating fins (2) are parallel to each other, the height of the heat dissipating fin (2) is gradually reduced from the center axis of the spherical groove (3) outward with reference to the upper plate surface plane area of the heat dissipating plate (1).
6. The heat dissipating structure for the server set of any one of claims 1 to 5, wherein a heat conducting film (5) is disposed between two adjacent heat dissipating plates (1) and the heat conducting film (5) is fitted over the magnetic connecting member (4).
7. The heat dissipating structure for a server set as claimed in any one of claims 1 to 5, wherein the magnetic connector (4) comprises a cylindrical body and a plate-like body (4-3), and the two cylindrical bodies are connected by the plate-like body (4-3) to form a connector having a dumbbell-shaped cross section; the cylindrical body comprises a heat conduction material shell (4-1) and a magnetic cylinder (4-2), and the heat conduction material shell (4-1) is wrapped on the magnetic cylinder (4-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022477595.3U CN213069733U (en) | 2020-10-29 | 2020-10-29 | Combined type heat radiation component for server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022477595.3U CN213069733U (en) | 2020-10-29 | 2020-10-29 | Combined type heat radiation component for server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213069733U true CN213069733U (en) | 2021-04-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022477595.3U Active CN213069733U (en) | 2020-10-29 | 2020-10-29 | Combined type heat radiation component for server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213069733U (en) |
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2020
- 2020-10-29 CN CN202022477595.3U patent/CN213069733U/en active Active
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