CN213126960U - Rack-mounted server with novel heat dissipation component - Google Patents
Rack-mounted server with novel heat dissipation component Download PDFInfo
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- CN213126960U CN213126960U CN202022455878.8U CN202022455878U CN213126960U CN 213126960 U CN213126960 U CN 213126960U CN 202022455878 U CN202022455878 U CN 202022455878U CN 213126960 U CN213126960 U CN 213126960U
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Abstract
The utility model discloses a rack-mounted server with a novel heat dissipation component, which comprises a server host and the novel heat dissipation component, wherein the novel heat dissipation component comprises a heat dissipation plate, a heat dissipation fin and a magnetic connecting piece; the side wall of the heat dissipation plate is provided with embedded grooves, and the overlapped area of the two embedded grooves is a vacant area; the radiating fins are arranged on the upper plate surface of the radiating plate, two adjacent radiating plates are connected through a magnetic connecting piece, and the magnetic connecting piece is arranged in the embedded groove on the two adjacent radiating plates; the novel heat dissipation component is adsorbed on the server host shell through magnetic force. The utility model discloses with the heat radiation component modularization, be convenient for assemble according to the required radiator size of server, and adopt the magnetism connecting piece to be favorable to not having the firmware equipment between radiator and the server as the connecting piece between two heating panels.
Description
Technical Field
The utility model relates to a server technical field. In particular to a rack server with a novel heat dissipation component.
Background
In the maintenance of electronic devices, heat dissipation during operation of electronic devices is a constantly studied aspect. Many electronic components are integrated in the server, and these electronic components generate a large amount of heat during operation, and if these heat is not discharged in time, the temperature of the operating environment of the electronic components will rise rapidly, thereby affecting the normal operation and service life of the electronic components. The heat dissipation structure of the existing server is basically stable, except that air cooling is changed into liquid cooling, the adjustment of the basic structure is relatively troublesome, and the heat dissipation structure can not be specifically adjusted according to the heat dissipation condition of the server, such as the installation and the arrangement of heat dissipation components, and particularly solves the problems of heat dissipation and ventilation between two adjacent servers in a server group.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model aims to solve the technical problem that a rack-mounted server with novel heat dissipation component is provided, with the heat dissipation component modularization, be convenient for assemble according to the required radiator size of server, and adopt the magnetism connecting piece to be favorable to not having the firmware equipment between radiator and the server as the connecting piece between two heating panels.
In order to solve the technical problem, the utility model provides a following technical scheme:
a rack server with a novel heat dissipation component comprises a server host and the novel heat dissipation component, wherein the novel heat dissipation component comprises a heat dissipation plate, a heat dissipation fin and a magnetic connecting piece; the side wall of the heat dissipation plate is provided with embedded grooves, and the overlapped area of the two embedded grooves is a vacant area; the radiating fins are arranged on the upper plate surface of the radiating plate, two adjacent radiating plates are connected through a magnetic connecting piece, and the magnetic connecting piece is arranged in the embedded groove on the two adjacent radiating plates; the novel heat dissipation component is adsorbed on the server host shell through magnetic force.
According to the rack-mounted server with the novel heat dissipation member, the graphene film layer with the thickness of 0.1-0.5 mm is arranged on the lower plate surface of the heat dissipation plate.
Above-mentioned rack-mounted server with novel heat radiation component, be provided with a sphere groove on the heating panel upper plate.
In the rack server with the novel heat dissipation member, the ratio of the depth of the spherical groove to the thickness of the heat dissipation plate is 0.6-0.8.
According to the rack-mounted server with the novel heat dissipation component, on the same heat dissipation sheet, the top end of the heat dissipation sheet arranged in the spherical groove is higher than the top end of the heat dissipation sheet arranged in the plane area of the heat dissipation sheet.
Above-mentioned rack-mounted server with novel heat radiation component, it is same on the fin, work as the fin is with adjacent two the parallel mode of fin sets up when on the face on the fin, with face plane district is the benchmark on the fin, the height of fin by the sphere groove center pin outwards reduces gradually.
Above-mentioned rack-mounted server with novel heat radiation component, adjacent two be equipped with the heat conduction membrane just between the heating panel the heat conduction membrane cover is in on the magnetism connecting piece.
The rack server with the novel heat dissipation component comprises a magnetic connector and a magnetic connector, wherein the magnetic connector comprises a cylindrical body and a plate-shaped body, and the two cylindrical bodies are connected through the plate-shaped body to form a connector with a dumbbell-shaped cross section; the cylindrical body comprises a heat conduction material shell and a magnetic cylinder, and the heat conduction material shell is wrapped on the magnetic cylinder.
The technical scheme of the utility model following profitable technological effect has been obtained:
1. the utility model discloses the utilization sets up modularization and miniaturized novel radiating component in amassing the hot area and can effectively solve the too much and slow problem of amassing the heat dissipation of hot area of the amassing server host computer, amassing the problem of hot area rapid heating up when being favorable to the server to deal with high frequency access, has alleviated the phenomenon that the server host computer appears shutting down because of the server high temperature during high frequency access greatly.
2. The utility model discloses utilize the fin to constitute non-planar fin group face, can increase the air flow between the fin, reduce the heat accumulation district, improve the radiating efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a rack server with a novel heat dissipation member according to the present invention;
FIG. 2 is a schematic structural diagram of a novel heat dissipation member of a rack server with the novel heat dissipation member according to the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation plate of a rack server with a novel heat dissipation member according to the present invention;
FIG. 4 is a schematic structural diagram of a magnetic connector of a rack server with a novel heat dissipation member according to the present invention;
fig. 5 is a schematic view of another downward-looking structure of the magnetic connector of the rack server with the novel heat dissipation member of the present invention.
The reference numbers in the figures denote: 10-a server host; 20-radiating member, 21-radiating plate, 22-radiating fin, 23-spherical groove, 24-magnetic connecting piece, 24-1-heat conducting material shell, 24-2-magnetic column, 24-3-plate-shaped body, 25-heat conducting film and 26-embedded groove; 30-graphene film layer.
Detailed Description
In the present embodiment, as shown in fig. 1 to 5, the server host 10 and the novel heat dissipation member 20 are included, where the novel heat dissipation member 20 includes a heat dissipation plate 21, a heat dissipation fin 22 and a magnetic connection member 24; the side wall of the heat dissipation plate 21 is provided with a tabling groove 26, and the overlapping area of the two tabling grooves 26 is a vacant area; the heat dissipation plate 22 is arranged on the upper plate surface of the heat dissipation plate 21, the graphene film layer 30 with the thickness of 0.3mm is arranged on the lower plate surface of the heat dissipation plate 21, two adjacent heat dissipation plates 21 are connected through a magnetic connecting piece 24, and the magnetic connecting piece 24 is arranged in the embedding groove 26 on the two adjacent heat dissipation plates 21; the novel heat dissipation member 20 is attached to the housing of the server main unit 10 by magnetic force. The arrangement of the vacant areas is to facilitate the fitting of the magnetic connectors 24 and the fitting grooves 26.
The upper plate surface of the heat dissipation plate 21 is provided with a spherical groove 23, and the ratio of the depth of the spherical groove 23 to the thickness of the heat dissipation plate 21 is 0.72. On the same heat dissipation plate 22, the top end of the heat dissipation plate 22 arranged in the spherical groove 23 is higher than the top end of the heat dissipation plate 21 arranged in the plane area of the heat dissipation plate 21, and when the heat dissipation plate 22 is arranged on the upper plate surface of the heat dissipation plate 21 in a manner that two adjacent heat dissipation plates 22 are parallel, the height of the heat dissipation plate 22 is gradually reduced outwards from the central axis of the spherical groove 23 by taking the plane area of the upper plate surface of the heat dissipation plate 21 as a reference.
In order to facilitate heat conduction between two adjacent heat dissipation plates 21 and improve the heat transfer efficiency between two adjacent heat dissipation plates 21, a heat conduction film 5 is arranged between two adjacent heat dissipation plates 21, and the heat conduction film 25 is sleeved on the magnetic connecting piece 24. The magnetic connecting piece 24 comprises a cylindrical body 24-1 and a plate-shaped body 24-3, and the two cylindrical bodies are connected through the plate-shaped body 24-3 to form a connecting piece with a dumbbell-shaped cross section; the cylindrical body comprises a heat conduction material shell 24-1 and a magnetic cylinder 24-2, and the heat conduction material shell 24-1 is wrapped on the magnetic cylinder 24-2.
The utility model discloses in, it is right to carry out miniaturization and modularization with the radiator of large tracts of land, is favorable to the user according to the shape and the area size of cooling surface novel the shape is assembled to radiator unit 20 finally and the size is adjusted, dismantle simultaneously get off by fin 22 with the heat radiation module that heating panel 21 is constituteed can continue to be used in assembling of other radiators, improves the recycle ratio of heat dissipation equipment, reduces the trouble that the mould is needed again to radiator just shape adjustment.
In this embodiment, the structure formed by the heat dissipation fins 22 on each heat dissipation plate 21 is a middle convex structure, which makes the side of the whole novel heat dissipation member 20 away from the electronic device a wavy surface, as shown in fig. 2, and this structure is favorable for the flowing air to carry out the hot air between the heat dissipation fins 22, thereby reducing the heat accumulation in the heat dissipation area. The existing server usually adopts air cooling or liquid cooling, even if the existing radiator is adopted for assistance, the problem that a heat accumulation area is easily formed in the central area of the radiator still exists, the condition that the server host is shut down due to overhigh temperature of the server host still exists, and the load of a heat radiation system is still overlarge. And adopt to have the wave surface novel heat dissipation component 20 as the heat dissipation auxiliary component, not only can increase the area of contact of fin 22 with mobile air or liquid, can also reduce the constraint effect of fin to air or liquid flow simultaneously, the air that is favorable to after the intensification can flow out from the radiating area relatively fast, has improved the radiating efficiency to the problem that dull and stereotyped radiator middle zone heat accumulation is difficult to the diffusion has been solved.
Will the utility model discloses in using the server group, can be according to the position adjustment that single server was located in the server group novel heat dissipation component 20's size and shape to it is relatively less to utilize novel heat dissipation component 20 reaches the best radiating effect.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications are possible which remain within the scope of the appended claims.
Claims (8)
1. A rack server with a novel heat dissipation component is characterized by comprising a server host (10) and the novel heat dissipation component, wherein the novel heat dissipation component (20) comprises a heat dissipation plate (21), a heat dissipation fin (22) and a magnetic connecting piece (24); the side wall of the heat dissipation plate (21) is provided with embedding grooves (26), and the overlapping area of the two embedding grooves (26) is a vacant area; the radiating fins (22) are arranged on the upper plate surface of the radiating plate (21), two adjacent radiating plates (21) are connected through magnetic connecting pieces (24), and the magnetic connecting pieces (24) are arranged in the embedding grooves (26) on the two adjacent radiating plates (21); the novel heat dissipation component (20) is adsorbed on the shell of the server host (10) through magnetic force.
2. The rack server with the novel heat dissipation member according to claim 1, wherein a graphene film layer (30) with a thickness of 0.1-0.5 mm is disposed on the lower surface of the heat dissipation plate (21).
3. The rack server with the novel heat dissipation member as claimed in claim 2, wherein the heat dissipation plate (21) has a spherical groove (23) on the upper plate surface.
4. The rack server with the novel heat dissipation member as claimed in claim 3, wherein the ratio of the depth of the spherical groove (23) to the thickness of the heat dissipation plate (21) is 0.6-0.8.
5. The rack server with the novel heat dissipation member as claimed in claim 4, wherein the top end of the heat dissipation plate (22) disposed in the spherical groove (23) is higher than the top end of the heat dissipation plate (21) disposed in the plane area of the heat dissipation plate (21) on the same heat dissipation plate (22).
6. The rack server with the novel heat dissipation member as claimed in claim 5, wherein on the same heat dissipation fin (22), when the heat dissipation fin (22) is disposed on the upper plate surface of the heat dissipation plate (21) in a manner that two adjacent heat dissipation fins (22) are parallel, the height of the heat dissipation fin (22) is gradually reduced from the central axis of the spherical groove (23) outwards based on the upper plate surface plane area of the heat dissipation plate (21).
7. The rack server with the novel heat dissipation member as claimed in any one of claims 1 to 6, wherein a heat conduction film (25) is disposed between two adjacent heat dissipation plates (21) and the heat conduction film (25) is sleeved on the magnetic connecting member (24).
8. The rack server with the novel heat dissipation component as claimed in any one of claims 1 to 6, wherein the magnetic connector (24) comprises a cylindrical body (24-1) and a plate-shaped body (24-3), and the two cylindrical bodies (24-1) are connected through the plate-shaped body (24-3) to form a connector with a dumbbell-shaped cross section; the cylindrical body (24-1) comprises a heat conduction material shell and a magnetic cylinder (24-2), and the heat conduction material shell is wrapped on the magnetic cylinder (24-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022455878.8U CN213126960U (en) | 2020-10-29 | 2020-10-29 | Rack-mounted server with novel heat dissipation component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022455878.8U CN213126960U (en) | 2020-10-29 | 2020-10-29 | Rack-mounted server with novel heat dissipation component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213126960U true CN213126960U (en) | 2021-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022455878.8U Active CN213126960U (en) | 2020-10-29 | 2020-10-29 | Rack-mounted server with novel heat dissipation component |
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| Country | Link |
|---|---|
| CN (1) | CN213126960U (en) |
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2020
- 2020-10-29 CN CN202022455878.8U patent/CN213126960U/en active Active
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