CN210605631U - Heat radiation structure of notebook computer motherboard - Google Patents
Heat radiation structure of notebook computer motherboard Download PDFInfo
- Publication number
- CN210605631U CN210605631U CN201922232864.7U CN201922232864U CN210605631U CN 210605631 U CN210605631 U CN 210605631U CN 201922232864 U CN201922232864 U CN 201922232864U CN 210605631 U CN210605631 U CN 210605631U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- notebook computer
- metal copper
- motherboard
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000000498 cooling water Substances 0.000 claims abstract description 18
- 239000002826 coolant Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 239000004519 grease Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 230000017525 heat dissipation Effects 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 9
- 239000000110 cooling liquid Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat radiation structure of notebook computer motherboard, including the radiating block, the standing groove has been seted up to the radiating block bottom, the standing groove intussuseption is filled with heat conduction silicone grease, the radiating block includes a plurality of metal copper sheets, the metal copper sheet all is provided with condenser tube between two liang, condenser tube outer wall and metal copper sheet laminating, the condenser tube both ends all are provided with the shunt tubes, two there are circulative cooling pump and coolant tank through circulating line connection between the shunt tubes, be provided with the coolant liquid in the coolant tank. The utility model discloses a heat conduction silicone grease and metal copper sheet's setting can absorb the heat that the CPU of notebook computer motherboard produced fast, through to the cooling water intraductal injection endless coolant liquid of setting between the metal copper sheet, cooperation radiator fan can realize scattering and disappearing fast to the absorptive heat of metal copper sheet.
Description
Technical Field
The utility model relates to a notebook heat dissipation equipment technical field especially relates to a heat radiation structure of notebook type computer motherboard.
Background
The motherboard of notebook computer is a 'overpass' for transmitting data and information by various hardware in notebook computer, it integrates various hardware such as video card, memory and CPU, so that they are mutually independent and organically combined together, and each plays its own role to maintain normal operation of computer. The notebook pursues portability, and its volume and weight all have stricter control, therefore different from desktop computer, the notebook mainboard integration degree is very high, and the design layout is also very accurate compact.
In the operation process of the notebook computer, the high-speed operation of the CPU on the mainboard of the notebook computer can generate a large amount of heat, and the use of the computer can be greatly influenced if the heat cannot be timely removed, but most of the existing notebook mainboards have the problems of poor heat dissipation effect, low heat dissipation efficiency and the like.
Therefore, a heat dissipation structure of a notebook computer motherboard is provided.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat radiation structure of notebook type computer motherboard, aim at promote the radiating efficiency and the radiating effect of notebook type computer motherboard to effectively promote notebook type computer performance.
In order to realize the technical purpose, the technical effect is achieved, the utility model discloses a realize through following technical scheme:
the utility model provides a heat radiation structure of notebook type computer motherboard, includes the radiating block, the standing groove has been seted up to the radiating block bottom, the standing groove intussuseption is filled with heat conduction silicone grease, the radiating block includes a plurality of metal copper sheets, the metal copper sheet all is provided with condenser tube between two liang, condenser tube outer wall and the laminating of metal copper sheet, the condenser tube both ends all are provided with the shunt tubes, two there are circulative cooling pump and coolant tank through circulating pipe connection between the shunt tubes, be provided with the coolant liquid in the coolant tank.
Preferably, in the heat dissipation structure of the motherboard of the notebook computer, the cross section of the cooling water pipe is rectangular, and the cooling water pipe is arranged in a wave shape.
Based on above-mentioned technical characteristics, through setting up condenser tube into wavy rectangle pipeline, effectively promoted condenser tube and metal copper sheet's area of contact and the stroke of coolant liquid, promoted overall structure's radiating effect.
Preferably, in the heat dissipation structure of the motherboard of the notebook computer, the flow dividing pipe includes a volume cavity, a plurality of flow dividing ports are formed in the inner side of the volume cavity at uniform intervals, and a main liquid port is formed in the center of the right side of the volume cavity.
Based on the technical characteristics, the arrangement of the shunt pipes realizes the dispersed input and the concentrated output of the cooling liquid.
Preferably, in the heat dissipation structure of the motherboard of the notebook computer, a heat dissipation fan is detachably mounted on the top of the heat dissipation block.
Based on the technical characteristics, the heat radiation effect and the efficiency of the whole structure are further improved by the arrangement of the heat radiation fan.
Preferably, in the heat dissipation structure of the notebook computer motherboard, mounting ribs are disposed on both sides of the lower end of the heat dissipation block, fastening nuts are threadedly mounted on the mounting ribs, and fastening springs are disposed on the surfaces of the fastening nuts between the nuts and the motherboard.
Based on above-mentioned technical characteristics, through the fastening nut of screwing, realize installing the radiating block on the computer motherboard, fastening spring's setting has promoted compactness and stability after the radiating block installation.
Preferably, in the heat dissipation structure of the motherboard of the notebook computer, the elastic insulating pad is disposed on the bottom surface of the heat dissipation block, which is located around the placement groove.
Based on the technical characteristics, the elastic insulating pad plays a certain insulating role, and reduces the influence of static electricity on the computer mainboard.
The utility model has the advantages that:
the utility model has the advantages of simple and reasonable design, through the setting of heat conduction silicone grease and metal copper sheet, can absorb the heat that the CPU of notebook computer motherboard produced fast, through to the cooling water intraductal injection endless coolant liquid of setting between the metal copper sheet, cooperation radiator fan can realize scattering and disappearing fast to the absorptive heat of metal copper sheet, and the radiating efficiency is high, and the radiating effect is good, has effectively avoided causing the influence because of the CPU high temperature to the computer performance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the cooling water pipe of the present invention;
fig. 3 is a schematic view of the structure of the shunt tube of the present invention;
fig. 4 is a schematic view of the fastening spring mounting structure of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1-a heat dissipation block; 2-placing a groove; 3-heat-conducting silicone grease; 4-a metallic copper sheet; 5-a cooling water pipe; 6-shunt tubes; 7-a circulation pipeline; 8-a circulating cooling pump; 9-a cooling water tank; 10-cooling liquid; 11-a volume chamber; 12-a main liquid port; 13-a heat dissipation fan; 14-mounting a rib plate; 15-fastening a nut; 16-a fastening spring; 17-an elastic insulating pad; 18-a shunt port.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-4, the present embodiment is a heat dissipation structure of a notebook computer motherboard, including a heat dissipation block 1, two sides of a lower end of the heat dissipation block 1 are respectively provided with a mounting rib 14, a fastening nut 15 is threadedly mounted on the mounting rib 14, a fastening spring 16 is disposed on a surface of the fastening nut 15 at a position between a nut and the motherboard, the heat dissipation block 1 is mounted on the motherboard of the computer by screwing the fastening nut 15, the setting of the fastening spring 16 improves tightness and stability of the mounted heat dissipation block 1, an elastic insulating pad 17 is disposed on a bottom surface of the heat dissipation block 1 at a position around a placement groove 2, the elastic insulating pad 17 has a certain insulating effect to reduce an influence of static electricity on the motherboard of the computer, the placement groove 2 is formed at the bottom of the heat dissipation block 1, the placement groove 2 is filled with a heat conductive silicone grease 3, when mounting, the CPU of a notebook computer motherboard is placed in a placing groove 2, in the process of screwing a fastening nut 15, heat-conducting silicone grease 3 wraps the CPU in all directions, the heat generated by the CPU can be efficiently absorbed by the heat-conducting silicone grease 3, a heat-radiating fan 13 is detachably mounted at the top of a heat-radiating block 1, the heat-radiating effect and the heat-radiating efficiency of the whole structure are improved by the arrangement of the heat-radiating fan 13, the heat-radiating block 1 comprises a plurality of metal copper sheets 4, cooling water pipes 5 are arranged between every two metal copper sheets 4, the outer walls of the cooling water pipes 5 are attached to the metal copper sheets 4, the cross sections of the cooling water pipes 5 are rectangular, the cooling water pipes 5 are wavy, the contact area between the cooling water pipes 5 and the metal copper sheets 4 and the stroke of cooling liquid 10 are effectively improved by arranging the cooling water pipes 5 into wavy rectangular pipelines, the heat-radiating effect of the whole structure is improved, and shunt pipes, be connected with circulative cooling pump 8 and coolant tank 9 through circulating line 7 between two shunt tubes 6, be provided with coolant liquid 10 in the coolant tank 9, shunt tubes 6 include capacity chamber 11, and a plurality of diffluence openings have been seted up to 11 inboard even intervals in capacity chamber, and main liquid mouth 12 has been seted up at 11 right side centers in capacity chamber, and the setting of shunt tubes 6 realizes the dispersed input and the concentrated output of coolant liquid 10.
The utility model discloses a concrete implementation, when using, at first pack heat conduction silicone grease 3 to standing groove 2 intussuseption, then place standing groove 2 directly over the CPU of notebook computer motherboard in, install radiating block 1 through fastening nut 15 of screwing, after the installation is accomplished, through input coolant liquid 10 in driving cooling circulation pump 8 to condenser tube 5, realize the thermal getting rid of to metal copper sheet 4, cooperation radiator fan 13, the radiating effect is good.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. A heat radiation structure of a notebook computer motherboard is characterized in that: including radiating block (1), standing groove (2) have been seted up to radiating block (1) bottom, standing groove (2) intussuseption is filled with heat conduction silicone grease (3), radiating block (1) includes a plurality of metal copper sheets (4), metal copper sheet (4) all are provided with cooling water pipe (5) between two liang, cooling water pipe (5) outer wall and metal copper sheet (4) laminating, cooling water pipe (5) both ends all are provided with shunt tubes (6), two be connected with circulative cooling pump (8) and coolant tank (9) through circulating line (7) between shunt tubes (6), be provided with coolant liquid (10) in coolant tank (9).
2. The heat dissipation structure of the motherboard of a notebook computer according to claim 1, wherein: the section of the cooling water pipe (5) is rectangular, and the cooling water pipe (5) is wavy.
3. The heat dissipation structure of the motherboard of a notebook computer according to claim 1, wherein: shunt tubes (6) include capacity chamber (11), a plurality of diffluence pass (18) have been seted up to capacity chamber (11) inboard even interval, main liquid mouth (12) have been seted up at capacity chamber (11) right side center.
4. The heat dissipation structure of the motherboard of a notebook computer according to claim 1, wherein: the top of the radiating block (1) is detachably provided with a radiating fan (13).
5. The heat dissipation structure of the motherboard of a notebook computer according to claim 1, wherein: the heat dissipation block is characterized in that installation rib plates (14) are arranged on two sides of the lower end of the heat dissipation block (1), fastening nuts (15) are installed on the installation rib plates (14) in a threaded mode, and fastening springs (16) are arranged on the surfaces of the fastening nuts (15) and located between the nuts and the mainboard.
6. The heat dissipation structure of the motherboard of a notebook computer according to claim 1, wherein: elastic insulating pads (17) are arranged on the bottom surface of the heat dissipation block (1) and around the placing groove (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922232864.7U CN210605631U (en) | 2019-12-13 | 2019-12-13 | Heat radiation structure of notebook computer motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922232864.7U CN210605631U (en) | 2019-12-13 | 2019-12-13 | Heat radiation structure of notebook computer motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210605631U true CN210605631U (en) | 2020-05-22 |
Family
ID=70698106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922232864.7U Expired - Fee Related CN210605631U (en) | 2019-12-13 | 2019-12-13 | Heat radiation structure of notebook computer motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210605631U (en) |
-
2019
- 2019-12-13 CN CN201922232864.7U patent/CN210605631U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200522 |