CN213276533U - Heat radiator for memory subassembly - Google Patents
Heat radiator for memory subassembly Download PDFInfo
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- CN213276533U CN213276533U CN202021564652.5U CN202021564652U CN213276533U CN 213276533 U CN213276533 U CN 213276533U CN 202021564652 U CN202021564652 U CN 202021564652U CN 213276533 U CN213276533 U CN 213276533U
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- heat dissipation
- memory
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Abstract
The utility model belongs to the technical field of computers, and discloses a heat dissipation device of a memory component, which comprises a base, wherein the base is fixed on a printed circuit board, and the memory component is inserted on the printed circuit board; the bottom surface of the heat dissipation assembly is attached to the upper end of the memory assembly and comprises a heat dissipation plate and a heat conduction gasket, the heat dissipation plate is fixed on the base, the bottom surface of the heat dissipation plate is attached to the heat conduction gasket, and the bottom surface of the heat conduction gasket is attached to the upper end of the memory assembly. Through setting up the base on printed circuit board, provide the support fixed action for the radiator unit of laminating in memory subassembly top, make radiator unit's heating panel and heat conduction gasket can be tight laminating in memory subassembly's top, under the condition that occupies the inside less space of computer server, absorb the heat through heating panel and heat conduction gasket, and take away the heat through the radiating medium, the effectual radiating efficiency who improves memory subassembly, and whole heat abstractor easy dismounting.
Description
Technical Field
The utility model relates to a computer technology field especially relates to a heat abstractor of memory subassembly.
Background
With the development of computer technology, the requirements on the capacity and frequency of a memory (random access memory) are higher and higher, and with the increase of the capacity and frequency of the memory, a large amount of heat generated in a memory area can affect the normal operation of the memory and other components in a chassis.
In the prior art, a vest on a memory bank is often used as a memory cooling means, the vest dissipates heat by a fan after being heated, but the heat productivity is greatly increased due to the improvement of the memory capacity and the frequency, and the heat dissipation effect of the method is low in efficiency. In addition, the memory banks are often very densely arranged, and cannot provide enough space for heat dissipation, thereby further limiting the heat dissipation of the memory.
Therefore, it is an urgent need to solve the problem of how to provide a more effective means for heat dissipation of a memory than the conventional fan in the case of occupying a smaller space.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor of memory subassembly to solve traditional memory heat dissipation method inefficiency and the great problem of occupation space.
To achieve the purpose, the utility model adopts the following technical proposal: a heat dissipation device for a memory module, comprising:
the base is fixed on the printed circuit board, and the printed circuit board is inserted with the memory component;
the bottom surface of the heat dissipation assembly is attached to the upper end of the memory assembly, the heat dissipation assembly comprises a heat dissipation plate and a heat conduction gasket, the heat dissipation plate is fixed on the base, the bottom surface of the heat dissipation plate is attached to the heat conduction gasket, and the bottom surface of the heat conduction gasket is attached to the upper end of the memory assembly.
Preferably, the heat conductive gasket is compressible, and the heat conductive gasket is in a compressed state when the heat dissipation plate and the memory module are located therebetween.
Preferably, the memory component comprises a memory chip and a memory waistcoat, the memory chip is inserted on the printed circuit board, and the memory chip is embedded in the memory waistcoat.
Preferably, the heat dissipation assemblies are provided with one group, the memory assemblies are provided with one or more groups, and the heat dissipation assemblies are attached to all the memory assemblies;
or the heat dissipation assemblies are provided with a plurality of groups, the memory assemblies are provided with a plurality of groups, and each group of heat dissipation assemblies is attached to one or more groups of memory assemblies;
or, the heat dissipation assembly is provided with a plurality of groups, the memory assembly is provided with a group, and the plurality of groups of heat dissipation assemblies are all attached to the memory assembly.
Preferably, quick-release joints are installed at two ends of the heat dissipation plate and connected with connecting pipes, at least one connecting pipe is connected between the heat dissipation plates, and the connecting pipes are flexible pipes.
Preferably, the number of the heat dissipation plates is 2, the heat dissipation plates are connected by the connecting pipe, and the connection mode of the heat dissipation plates includes series connection or parallel connection.
Preferably, the number of the heat dissipation plates is 3 or more, the heat dissipation plates are connected by the connection pipe, and the connection mode of the heat dissipation plates includes series connection, parallel connection or series-parallel connection.
Preferably, the base and the printed circuit board are connected by screws or snap-fit connection.
Preferably, the heat dissipation plate and the base are connected by screws.
The utility model has the advantages that: the utility model discloses a set up the base on printed circuit board, for the laminating radiating component in memory subassembly top provides the support fixed action, make radiating component's heating panel and heat gasket can be tight laminating in memory subassembly's top, under the condition that occupies the inside less space of computer server, absorb the heat through heating panel and heat gasket, and take away the heat through the radiating medium, the effectual radiating efficiency who improves memory subassembly, and whole heat abstractor easy dismounting.
Drawings
Fig. 1 is a schematic view of a heat dissipation device of a memory module according to the present invention;
fig. 2 is a schematic structural view of a longitudinal section of a heat dissipation device of the memory module according to the present invention;
in the figure: 1. a base; 2. a memory component; 3. a heat dissipating component; 4. a quick release joint; 5. a connecting pipe; 21. a memory chip; 22. storing a vest; 31. a heat dissipation plate; 32. a thermally conductive pad.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The utility model provides a heat abstractor of memory subassembly, it is applied to the memory subassembly, and it is fixed that the radiator unit passes through the base support, and close laminating can accomplish the high-efficient heat dissipation to the memory subassembly under the condition that occupies less space around the memory subassembly in the upper end of memory subassembly to easy dismounting.
The memory component 2 is inserted on the printed circuit board, the bases 1 are installed at two ends of the memory component 2, the bases 1 are fixed on the printed circuit board, the heat dissipation component 3 is fixed on the bases 1, the bottom surface of the heat dissipation component 3 is attached to the upper end of the memory component 2, and two ends of the heat dissipation component 3 are connected with a heat dissipation loop of the computer server. In the use process, when the temperature of the memory component 2 rises, the heat dissipation medium in the heat dissipation component 3 absorbs heat, and the heat is taken away in the circulation process of the heat dissipation loop of the computer server, so that the heat dissipation effect on the memory component 2 is completed.
Preferably, the heat dissipation assembly 3 includes a heat dissipation plate 31 and a heat conduction gasket 32, the heat dissipation plate 31 is fixed on the base 1, the heat conduction gasket 32 is attached to the bottom surface of the heat dissipation plate 31, and the bottom surface of the heat conduction gasket 32 is attached to the upper end of the memory assembly 2. The heat dissipation plate 31 is a main body part of the heat dissipation assembly 3, the bottom surface of the heat dissipation plate 31 is processed to have good flatness, and the heat dissipation plate 31 can have good fitting degree with the heat conduction gasket 32, so that heat on the memory assembly 2 can be well transmitted to the heat dissipation plate 31 through the heat conduction gasket 32. The heat dissipation plate 31 has a cavity therein, and a heat dissipation medium with good fluidity flows in the cavity inside the heat dissipation plate 31, which is beneficial to heat dissipation of the memory module 2.
Preferably, the heat conductive gasket 32 has a compressible deformation characteristic, as shown in fig. 2, when the heat conductive gasket 32 is located between the heat dissipation plate 31 and the memory module 2, it is in a compressed state, and when the heat conductive gasket 32 is in the compressed state, the heat conductive gasket 32 has a good contact with the heat dissipation plate 31 and the memory module 2, which ensures heat transfer. When mounting, the heat conducting gasket 32 is flatly adhered to the bottom surface of the heat dissipation plate 31, the heat dissipation plate 31 adhered with the heat conducting gasket 32 is vertically pressed on the memory module 2, and then the heat dissipation plate 31 is fixed on the base 1.
Preferably, the memory module 2 includes a memory chip 21 and a memory vest 22, the memory chip 21 is plugged on the printed circuit board, and the memory chip 21 is embedded in the memory vest 22. The memory chip 21 generates a large amount of heat during operation, and the memory vest 22 covering the memory chip 21 absorbs the heat and then transfers the heat to the heat sink 31 through the heat conductive pad 32.
For example, the heat dissipation assemblies 3 may be provided in a set, the memory assemblies 2 are also provided in a set, the memory assemblies 2 are plugged onto the printed circuit board, and the heat dissipation assemblies 3 are vertically attached to the top of the memory assemblies 2. It can be understood that a group of heat dissipation assemblies 3 can be arranged, a plurality of groups of memory assemblies 2 are arranged, the plurality of groups of memory assemblies 2 are inserted into the printed circuit board, and a group of heat dissipation assemblies 3 is vertically attached to the upper parts of the plurality of groups of memory assemblies 2. In this embodiment, the heat dissipation assemblies 3 may be provided with a plurality of groups, the memory assemblies 2 may be provided with a plurality of groups, each group of memory assemblies 2 is inserted into the printed circuit board, and each group of heat dissipation assemblies 3 is vertically attached to the upper side of each group of memory assemblies 2. It can be understood that, in this embodiment, the heat dissipation assemblies 3 may also be provided with multiple sets, the memory assemblies 2 are provided with multiple sets, the multiple sets of memory assemblies 2 are divided into multiple regions and are plugged onto the printed circuit board, each set of heat dissipation assembly 3 is vertically attached above the multiple sets of memory assemblies 2 in each region, specifically, as shown in fig. 1, the heat dissipation assemblies 3 are provided with 3 sets, the memory assemblies 2 are provided with 32 sets, the 32 sets of memory assemblies 2 are divided into three regions and are plugged onto the printed circuit board, each set of memory assemblies 2 is placed side by side, and each set of heat dissipation assemblies 3 is respectively attached above the multiple sets of memory assemblies 2 in one region. In another embodiment, there may be multiple sets of heat dissipation assemblies 3, one set of memory assemblies 2 plugged onto the printed circuit board, and multiple sets of heat dissipation assemblies 3 vertically attached to the top of one set of memory assemblies 2.
Preferably, quick release joints 4 are installed at two ends of the heat dissipation plate 31, the quick release joints 4 are connected with connecting pipes 5, the heat dissipation plates 31 are connected by at least one connecting pipe 5, and the connecting pipe 5 is a flexible pipe. Because the memory module 2 belongs to a quick-wear part in the computer server board group and needs to be frequently disassembled and assembled, the quick-release joint 4 is arranged on the heat dissipation plate 31, which is beneficial to the disassembly and assembly of the heat dissipation module 3. The heat dissipation plates 31 are connected by the connecting pipe 5, so that each heat dissipation plate 31 is communicated with a heat dissipation loop of the computer server, and the heat dissipation medium is favorable for flowing after absorbing the heat of the memory component 2 and taking away the heat. Because the memory module 2 has a large height tolerance, the heat dissipation modules 3 attached to the memory modules 2 in different areas need to be connected by flexible pipes.
Illustratively, the number of the heat dissipation plates 31 is 2, and the heat dissipation plates 31 include a first heat dissipation plate and a second heat dissipation plate, the heat dissipation plates 31 are connected by a connection pipe 5, the heat dissipation plates 31 are connected in series, one end of the first heat dissipation plate is connected with an outlet end of a heat dissipation loop of the computer server, the other end of the first heat dissipation plate is connected with one end of the second heat dissipation plate, and the other end of the second heat dissipation plate is connected with an inlet end of the heat dissipation loop of the computer server. It can be understood that the number of the heat dissipation plates 31 is 2, the heat dissipation plates 31 are connected by the connection pipe 5, the connection mode of the heat dissipation plates 31 is parallel connection, the outlet end of the computer server heat dissipation loop is simultaneously connected with one end of the 2 heat dissipation plates 31, and the other end of the 2 heat dissipation plates 31 is simultaneously connected with the inlet end of the computer server heat dissipation loop. Different connection modes can enable workers to flexibly select a proper connection mode according to the position and the space condition of the memory component 2 of the computer server.
Illustratively, the number of the heat dissipation plates 31 is 3, and the heat dissipation plates 31 include a first heat dissipation plate, a second heat dissipation plate and a third heat dissipation plate, the heat dissipation plates 31 are connected by a connection pipe 5, the connection mode of the heat dissipation plates 31 may be a series connection, one end of the first heat dissipation plate is connected to an outlet end of a heat dissipation loop of the computer server, the other end of the first heat dissipation plate is connected to one end of the second heat dissipation plate, the other end of the second heat dissipation plate is connected to one end of the third heat dissipation plate, and the other end of the third heat dissipation plate is connected to an inlet end of. It can be understood that the number of the heat dissipation plates 31 is 3, the heat dissipation plates 31 are connected by the connection pipe 5, the connection mode of the heat dissipation plates 31 can also be parallel connection, the outlet end of the computer server heat dissipation loop is simultaneously connected with one end of the 3 heat dissipation plates 31, and the other end of the 3 heat dissipation plates 31 is simultaneously connected with the inlet end of the computer server heat dissipation loop. In another embodiment, the number of the heat dissipation plates 31 is 3, and the heat dissipation plates 31 include a first heat dissipation plate, a second heat dissipation plate and a third heat dissipation plate, the heat dissipation plates 31 are connected by a connection pipe 5, the heat dissipation plates 31 are connected in series-parallel, an outlet end of the heat dissipation loop of the computer server is connected to one end of the first heat dissipation plate and one end of the second heat dissipation plate, the other ends of the first heat dissipation plate and the second heat dissipation plate are connected to one end of the third heat dissipation plate, and the other end of the third heat dissipation plate is connected to an inlet end of the heat dissipation loop. It is understood that when the number of the heat dissipation plates 31 is more than 3, the series, parallel or series-parallel connection between the respective heat dissipation plates 31 is a superposition of the above embodiments. Different connection modes can enable workers to flexibly select a proper connection mode according to the position and the space condition of the memory component 2 of the computer server.
Preferably, base 1 passes through screw connection or buckle with printed circuit board and is connected, and base 1 passes through screw or buckle and is connected with printed circuit board, can guarantee joint strength, provides stable fixed support effect for radiator unit 3.
Preferably, the heat dissipation plate 31 is connected to the base 1 by screws, the heat conductive gasket 32 requires the heat dissipation plate 31 to press and compress the memory module 2, the heat dissipation plate 31 is fixed to the base 1 by screws, and when the screws are tightened, the pressing force can be provided, and the assembly and disassembly are convenient.
According to the above embodiment, the utility model provides a heat abstractor of memory subassembly, it is through setting up the base on printed circuit board, provide the support fixed action for the radiator unit of laminating in the memory subassembly top, make radiator unit's heating panel and heat conduction gasket can be tight laminating in the top of memory subassembly, under the condition that occupies the inside less space of computer server, absorb the heat through heating panel and heat conduction gasket, and take away the heat through heat-radiating medium, the effectual radiating efficiency who improves memory subassembly. Through setting up the flexible tube, can connect the radiator unit on the memory module of different heights. Through the quick detach joint and the setting of screw connection for whole radiator unit dismouting is easier, makes things convenient for computer server's maintenance.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (8)
1. A heat dissipation device for a memory module, comprising:
the base (1), the said base (1) is fixed on p-c board, the said p-c board is inserted and connected with the memory assembly (2);
the bottom surface of the heat dissipation assembly (3) is attached to the upper end of the memory assembly (2), the heat dissipation assembly (3) comprises a heat dissipation plate (31) and a heat conduction gasket (32), the heat dissipation plate (31) is fixed on the base (1), the bottom surface of the heat dissipation plate (31) is attached to the heat conduction gasket (32), and the bottom surface of the heat conduction gasket (32) is attached to the upper end of the memory assembly (2);
quick detach connects (4) are installed at heating panel (31) both ends, quick detach connects (4) and is connected with connecting pipe (5), at least by one between heating panel (31) connecting pipe (5) are connected, connecting pipe (5) are the flexible tube.
2. The heat sink of claim 1, wherein the heat conducting gasket (32) is compressible, and wherein the heat conducting gasket (32) is in a compressed state when it is located between the heat spreader plate (31) and the memory module (2).
3. The heat dissipation device of the memory module as claimed in claim 2, wherein the memory module (2) comprises a memory chip (21) and a memory waistcoat (22), the memory chip (21) is plugged onto the printed circuit board, and the memory chip (21) is embedded in the memory waistcoat (22).
4. The heat dissipating device of a memory device according to any one of claims 1 to 3,
the heat dissipation assemblies (3) are provided with one group, the memory assemblies (2) are provided with one or more groups, and the heat dissipation assemblies (3) are attached to all the memory assemblies (2);
or a plurality of groups of radiating assemblies (3) are arranged, a plurality of groups of memory assemblies (2) are arranged, and each group of radiating assemblies (3) is attached to one or more groups of memory assemblies (2);
or, the heat dissipation assembly (3) is provided with a plurality of groups, the memory assembly (2) is provided with a group, and the heat dissipation assemblies (3) are attached to the memory assembly (2).
5. The heat dissipation device of memory module according to claim 1, wherein the number of the heat dissipation plates (31) is 2, the heat dissipation plates (31) are connected by the connection pipe (5), and the connection manner of the heat dissipation plates (31) comprises series connection or parallel connection.
6. The heat dissipating device of a memory module according to claim 1, wherein the number of the heat dissipating plates (31) is 3 or more, the heat dissipating plates (31) are connected by the connecting pipe (5), and the connection of the heat dissipating plates (31) comprises series connection, parallel connection or series-parallel connection.
7. The heat sink of claim 1, wherein the base (1) and the printed circuit board are connected by screws or snaps.
8. The heat sink for memory modules according to claim 1, wherein the heat sink (31) is screwed to the base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021564652.5U CN213276533U (en) | 2020-07-31 | 2020-07-31 | Heat radiator for memory subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021564652.5U CN213276533U (en) | 2020-07-31 | 2020-07-31 | Heat radiator for memory subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213276533U true CN213276533U (en) | 2021-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021564652.5U Active CN213276533U (en) | 2020-07-31 | 2020-07-31 | Heat radiator for memory subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213276533U (en) |
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2020
- 2020-07-31 CN CN202021564652.5U patent/CN213276533U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201611 No.3 workshop, 1199 Xinfei Road, Songjiang District, Shanghai Patentee after: Baode (Shanghai) Technology Co.,Ltd. Address before: 201611 No.3 workshop, 1199 Xinfei Road, Songjiang District, Shanghai Patentee before: AAVID THERMALLOY LLC |
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| CP01 | Change in the name or title of a patent holder |