CN209593899U - A kind of board facilitating separation radiating subassembly - Google Patents
A kind of board facilitating separation radiating subassembly Download PDFInfo
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- CN209593899U CN209593899U CN201822182029.2U CN201822182029U CN209593899U CN 209593899 U CN209593899 U CN 209593899U CN 201822182029 U CN201822182029 U CN 201822182029U CN 209593899 U CN209593899 U CN 209593899U
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- heat
- conducting plate
- screw
- shaped groove
- snap
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of boards for facilitating separation radiating subassembly, including snap-gauge ontology, the two sides of the snap-gauge ontology offer U-shaped groove respectively, the middle part of first heat-conducting plate and the second heat-conducting plate is fixedly installed with mounting ear respectively, tension spring is connected between mounting ear described in two groups, activity is plugged with screw in the through-hole opened up at the outer ledge of first heat-conducting plate and the second heat-conducting plate, the lower end of the screw is connected in U-shaped groove, the threaded upper ends of the screw are connected with nut, the lower surface of first heat-conducting plate and the second heat-conducting plate is pasted with thermal conductive silicon pad；By opening up U-shaped groove in the avris of snap-gauge ontology, clamping is inserted into convenient for screw, and the first heat-conducting plate and the second heat-conducting plate are tensed by tension spring, so that spacer pin is securely plugged in limit hole, by pulling the first heat-conducting plate and the second heat-conducting plate to two sides, so that screw is detached from U-shaped groove, can dismantle, it is easy to operate, it is conveniently replaceable.
Description
Technical field
The utility model relates to board technical field, specially a kind of board for facilitating separation radiating subassembly.
Background technique
Board is a kind of printed circuit board, abbreviation pcb board, and when production has lock pin, and the main circuit of computer can be inserted
In the slot of plate (mainboard), for controlling the equipment such as the operation of hardware, such as display, capture card, after driver is installed, i.e.,
Corresponding hardware capability can be achieved；Board has been widely used in industry and business, for its heat dissipation technology
Also there are many kinds of, it is common practice to carry out active heat dissipation in CPCI securing plate card backside installing small aerogenerator, board dissipates
Hot property directly affects the service performance of board, therefore is directed to heat dissipation, must have enough heat-sinking capabilities, with reply
Different applications.
At present to promote compliance server, the specification of chip cooling piece is affected, and can not design large scale cooling fin, when
When chip power-consumption is higher, board heat dissipation problem is serious, needs to be improved the heat dissipation of board；And existing radiating subassembly is all to pass through spiral shell
Bolt is fixed, and disassembly trouble is not easy to replace.It would therefore be desirable to mention a kind of board for facilitating separation radiating subassembly.
Utility model content
The purpose of this utility model is to provide a kind of board for facilitating separation radiating subassembly, structure designs advantages of simple,
It is easy to operate, easy to disassemble, the progress for facilitating snap-gauge to radiate, to solve the problems mentioned in the above background technology.
To achieve the above object, the utility model provides the following technical solutions: a kind of board facilitating separation radiating subassembly,
Including snap-gauge ontology, the two sides of the snap-gauge ontology offer U-shaped groove respectively, and the upside of the snap-gauge ontology is equipped with first and leads
The upper surface of hot plate and the second heat-conducting plate, first heat-conducting plate and the second heat-conducting plate is separately installed with radiator, and described
Limit hole is offered on the inside of one heat-conducting plate, spacer pin is offered on the inside of second heat-conducting plate, and the spacer pin is plugged on
In limit hole, the middle part of first heat-conducting plate and the second heat-conducting plate is fixedly installed with mounting ear, mounting ear described in two groups respectively
Between be connected with tension spring, activity is plugged with spiral shell in the through-hole opened up at the outer ledge of first heat-conducting plate and the second heat-conducting plate
Nail, the lower end of the screw are connected in U-shaped groove, and the threaded upper ends of the screw are connected with nut, first heat-conducting plate
Thermal conductive silicon pad is pasted with the lower surface of the second heat-conducting plate.
Preferably, the U-shaped groove is provided with two groups, and every group this there are two U-shaped groove, the position of the screw with
U-shaped groove corresponds.
Preferably, the radiator includes cooling fin and cooling fan, and the cooling fan is fixedly mounted on first and leads
On hot plate, it is fixedly installed with cooling fin respectively on first heat-conducting plate and the second heat-conducting plate.
Preferably, thermal conductive silicon pad lower surface is bonded with snap-gauge body upper surface.
Preferably, spring is installed, the spring is arranged in the upside of the first heat-conducting plate, on the spring on the screw
Side is equipped with gasket.
Compared with prior art, the utility model has the beneficial effects that
1, the first heat-conducting plate and the second heat-conducting plate, the heat transfer for being generated this running body of snap-gauge by thermal conductive silicon pad are set
Heat is distributed onto the first heat-conducting plate and the second heat-conducting plate, and through radiator, snap-gauge is avoided to cross cause thermal damage circuit element；
2, by opening up U-shaped groove in the avris of snap-gauge ontology, it is inserted into clamping convenient for screw, and lead first by tension spring
Hot plate and the second heat-conducting plate tense, so that spacer pin is securely plugged in limit hole, by the way that the first heat-conducting plate and second is thermally conductive
Plate is pulled to two sides, so that screw is detached from U-shaped groove, can be dismantled, easy to operate, is conveniently replaceable.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the overlooking structure diagram of the utility model；
Fig. 3 is the structural schematic diagram of snap-gauge ontology in the utility model.
In figure: 1 snap-gauge ontology, 2 U-shaped grooves, 3 first heat-conducting plates, 4 second heat-conducting plates, 5 cooling fins, 6 cooling fans, 7
Spacer pin, 8 limit holes, 9 mounting ears, 10 tension springs, 11 screws, 12 springs, 13 gaskets, 14 nuts, 15 thermal conductive silicon pads.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of board facilitating separation radiating subassembly, packet
Snap-gauge ontology 1 is included, the two sides of the snap-gauge ontology 1 offer U-shaped groove 2 respectively, and the upside of the snap-gauge ontology 1 is equipped with first
The upper surface of heat-conducting plate 3 and the second heat-conducting plate 4, first heat-conducting plate 3 and the second heat-conducting plate 4 is separately installed with radiator,
The inside of first heat-conducting plate 3 offers limit hole 8, and the inside of second heat-conducting plate 4 offers spacer pin 7, the limit
Position pin 7 is plugged in limit hole 8, and the middle part of first heat-conducting plate 3 and the second heat-conducting plate 4 is fixedly installed with mounting ear 9 respectively,
It is connected with tension spring 10 between mounting ear 9 described in two groups, is opened up at the outer ledge of first heat-conducting plate 3 and the second heat-conducting plate 4
Through-hole in activity be plugged with screw 11, the lower end of the screw 11 is connected in U-shaped groove 2, the upper end spiral shell of the screw 11
Line is connected with nut 14, and the lower surface of first heat-conducting plate 3 and the second heat-conducting plate 4 is pasted with thermal conductive silicon pad 15.
Specifically, the U-shaped groove 2 is provided with two groups, and every group this there are two U-shaped groove 2, the positions of the screw 11
It sets and is corresponded with U-shaped groove 2.
Specifically, the radiator includes cooling fin 5 and cooling fan 6, the cooling fan 6 is fixedly mounted on first
On heat-conducting plate 3, it is fixedly installed with cooling fin 5 respectively on first heat-conducting plate 3 and the second heat-conducting plate 4.
It is bonded specifically, the thermal conductive silicon pads 15 lower surfaces with 1 upper surface of snap-gauge ontology, convenient for the heat of snap-gauge ontology 1
Smoothly it is transmitted on the first heat-conducting plate 3 and the second heat-conducting plate 4.
Specifically, being equipped with spring 12 on the screw 11, the upside of the first heat-conducting plate 3, institute is arranged in the spring 12
State on the upside of spring 12 be equipped with gasket 13, by be arranged spring 12, can have to the first heat-conducting plate 3 and the second heat-conducting plate 4 one downwards
Elastic force so that being contacted with thermal conductive silicon pad 15 well.
Working principle: when in use, being arranged the first heat-conducting plate 3 and the second heat-conducting plate 4, by thermal conductive silicon pad 15 by snap-gauge sheet
In the heat transfer to the first heat-conducting plate 3 and the second heat-conducting plate 4 that the operation of body 1 generates, and heat is distributed by radiator, avoided
Snap-gauge ontology 1 crosses cause thermal damage circuit element；By opening up U-shaped groove 2 in the avris of snap-gauge ontology 1, convenient for the insertion card of screw 11
Tightly, and by tension spring 10 first heat-conducting plate 3 and the second heat-conducting plate 4 are tensed, so that spacer pin 7 is securely plugged in limit hole 8,
By pulling the first heat-conducting plate 3 and the second heat-conducting plate 4 to two sides, it so that screw 11 is detached from U-shaped groove 2, can dismantle, operate
It is convenient and efficient, it is conveniently replaceable.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of board for facilitating separation radiating subassembly, including snap-gauge ontology (1), it is characterised in that: the snap-gauge ontology (1)
Two sides offer U-shaped groove (2) respectively, and the upside of the snap-gauge ontology (1) is equipped with the first heat-conducting plate (3) and the second heat-conducting plate
(4), the upper surface of first heat-conducting plate (3) and the second heat-conducting plate (4) is separately installed with radiator, first heat-conducting plate
(3) it offers on the inside of limit hole (8), is offered spacer pin (7) on the inside of second heat-conducting plate (4), the spacer pin (7)
It is plugged in limit hole (8), the middle part of first heat-conducting plate (3) and the second heat-conducting plate (4) is fixedly installed with mounting ear respectively
(9), be connected with tension spring (10) between mounting ear described in two groups (9), first heat-conducting plate (3) and the second heat-conducting plate (4) it is outer
Activity is plugged with screw (11) in the through-hole opened up at side edge, and the lower end of the screw (11) is connected in U-shaped groove (2),
The threaded upper ends of the screw (11) are connected with nut (14), the lower surface of first heat-conducting plate (3) and the second heat-conducting plate (4)
It is pasted with thermal conductive silicon pad (15).
2. a kind of board for facilitating separation radiating subassembly according to claim 1, it is characterised in that: the U-shaped groove (2)
Be provided with two groups, and every group this there are two U-shaped groove (2), the position and U-shaped groove (2) of the screw (11) correspond.
3. a kind of board for facilitating separation radiating subassembly according to claim 1, it is characterised in that: the radiator packet
Cooling fin (5) and cooling fan (6) are included, the cooling fan (6) is fixedly mounted on the first heat-conducting plate (3), and described first leads
It is fixedly installed with cooling fin (5) respectively on hot plate (3) and the second heat-conducting plate (4).
4. a kind of board for facilitating separation radiating subassembly according to claim 1, it is characterised in that: the thermal conductive silicon pad
(15) lower surface is bonded with snap-gauge ontology (1) upper surface.
5. a kind of board for facilitating separation radiating subassembly according to claim 1, it is characterised in that: on the screw (11)
It is equipped with spring (12), spring (12) setting is equipped with gasket on the upside of the upside of the first heat-conducting plate (3), the spring (12)
(13)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822182029.2U CN209593899U (en) | 2018-12-25 | 2018-12-25 | A kind of board facilitating separation radiating subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822182029.2U CN209593899U (en) | 2018-12-25 | 2018-12-25 | A kind of board facilitating separation radiating subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209593899U true CN209593899U (en) | 2019-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822182029.2U Active CN209593899U (en) | 2018-12-25 | 2018-12-25 | A kind of board facilitating separation radiating subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209593899U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836460A (en) * | 2020-07-21 | 2020-10-27 | 方炜 | Circuit board and preparation method thereof |
-
2018
- 2018-12-25 CN CN201822182029.2U patent/CN209593899U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836460A (en) * | 2020-07-21 | 2020-10-27 | 方炜 | Circuit board and preparation method thereof |
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