CN2909803Y - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- CN2909803Y CN2909803Y CN 200620112265 CN200620112265U CN2909803Y CN 2909803 Y CN2909803 Y CN 2909803Y CN 200620112265 CN200620112265 CN 200620112265 CN 200620112265 U CN200620112265 U CN 200620112265U CN 2909803 Y CN2909803 Y CN 2909803Y
- Authority
- CN
- China
- Prior art keywords
- radiator
- insulation film
- heat abstractor
- electronic chip
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A cooling device includes a radiator, an insulation film and a porous sponge. The radiator includes a base and a plurality of cooling fins extending upward from the base; the insulation film is arranged on the bottom surface of the base of the radiator and the middle part of the insulation film has an opening. Wherein, the radiator is arranged on a circuit board with an electronic chip; the top of the electronic chip gets through the opening of the insulation film and then touch the bottom surface of the base of the radiator; the surrounding of the electronic chip of the circuit board is arranged with a plurality of electronic components and the insulation film is arranged between the electronic component and the base of the radiator to prevent short circuit caused by the contact between the electronic component and the base.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to a kind of radiator base bottom surface that can prevent and contacts the heat abstractor that is short-circuited with other electron component on the circuit board.
Background technology
Along with integrated circuit develops towards densification, complicated direction, the heat that electronic devices and components produced in when work also increases severely thereupon, and the components and parts temperature is raise, and the operate as normal of components and parts is exerted an influence.The heat that produces when wherein, central processing unit is worked is high especially.Therefore, must install heat abstractor with guarantee central processing unit can be under lower temperature operate as normal.
The bottom of the radiator base shown in No. the 99235746.2nd, Chinese patent scribbles the heat transfer medium that one deck is used to improve heat-transfer capability; also be equiped with a heat transfer medium over cap that is used to protect heat transfer medium in addition; this heat transfer medium over cap need remove when radiator is assembled into system circuit board; on the end face of central processing unit, be its heat radiation and the pedestal of radiator directly amplexiformed; but also be equiped with a large amount of other electron components on the system circuit board; and radiator is (as aluminium by conductive metallic material; copper etc.) manufacturing forms; if the interval between these electronic components on the base bottom of radiator and the circuit board is nearer, cause the electronic component on the short circuit damage circuit board easily.Therefore, be necessary above-mentioned radiator is improved to prevent the generation of short circuit phenomenon.
Summary of the invention
Main purpose of the present utility model is to provide a kind of radiator base bottom surface that prevents to contact the heat abstractor that is short-circuited with other electron component on the circuit board.
In order to realize above-mentioned purpose, the utility model provides a kind of heat abstractor, it comprises a radiator and an insulation polyester film, this radiator comprises a pedestal and somely makes progress projection and the radiating fin that goes out from this pedestal, this insulation polyester film is to be installed on the bottom surface of this radiator base, and the middle part of this insulation polyester film offers an opening.This radiator is to be installed on the circuit board that is provided with an electronic chip, the end face of this electronic chip passes the bottom surface of amplexiforming this radiator base behind the opening of this insulation polyester film, also be provided with some electronic components around the electronic chip of this circuit board, this insulation polyester film intercepts between the pedestal of these electronic components and this radiator, prevents from that these electronic components from contacting with the pedestal of this radiator to cause short circuit.This heat abstractor also comprises one deck mandruka that is installed in this insulation polyester film below, and this mandruka middle part is provided with a perforate.
The utlity model has following beneficial effect: this electronic chip can pass the base bottom surface that the opening of insulation polyester film amplexiforms this radiator, thereby dispel the heat for this electronic chip effectively, other electron component then because the obstruct of insulation polyester film can not contact with the pedestal of radiator, prevents short circuit; Also be provided with one deck mandruka in addition below the insulation polyester film of this radiator, this mandruka can prevent to damage when radiator from vibrations taking place the electronic chip or the other electron component of below.
Description of drawings
Fig. 1 is the stereogram of the utility model heat abstractor and circuit board.
Fig. 2 is the three-dimensional exploded view of the utility model heat abstractor.
Fig. 3 is the three-dimensional exploded view of another angle of the utility model heat abstractor.
Fig. 4 is the three-dimensional combination figure of the utility model heat abstractor.
Fig. 5 is the end view of the utility model heat abstractor.
Embodiment
See also Fig. 1 to Fig. 5, a kind of heat abstractor, it comprises a radiator 1, an insulation polyester film 2, a mandruka 3 and two fixtures 4 that are installed in these radiator 1 both sides respectively.
This radiator 1 is installed on the circuit board 5, and this circuit board 5 is provided with an electronic chip 52, also is provided with some other electron components 54 around this electronic chip 52, also offers the locking hole 56 of two radiators 1 that are used to lock on this circuit board 5.This radiator 1 is installed in and gives this electronic chip 52 heat radiations on the end face 522 of this electronic chip 52.
This radiator 1 comprises a pedestal 12 and some radiating fins 14 that is upwards stretched out by this pedestal 12.When this radiator 1 was installed on the circuit board 5, amplexiformed mutually with the end face 522 of this electronic chip 52 bottom surface 122 of its pedestal 12.Each outwards is equipped with a mounting ear 16 two ends of the pedestal 12 of this radiator 1, respectively offers an installing hole 18 on this two mounting ear 16.
This insulation polyester film 2 is to adopt 3M 467 adhesive stickers directly to stick on the bottom surface 122 of this pedestal 12, its middle part offers one and these electronic chip 52 corresponding openings 22, the equal and opposite in direction of the size of this opening 22 and this electronic chip 52 or little by little big slightly.
This mandruka 3 sticks on the below of this insulation polyester film 2, and this mandruka 3 is the square frame shape, and its middle part is provided with a perforate 32, and this perforate 32 is greater than the size of this electronic chip 52.When this radiator 1 was installed on the circuit board 5, the end face 522 of this electronic chip 52 passed the bottom surface 122 of amplexiforming this radiator 1 pedestal 12 behind the opening 22 of the perforate 32 of this mandruka 3 and this insulation polyester film 2.This insulation polyester film 2 intercepts between the pedestal 12 of these electronic components 54 and this radiator 1, prevents from that these electronic components 54 from contacting with the pedestal 12 of this radiator 1 to cause short circuit.This mandruka 3 then pad is located between this radiator 1 and this circuit board 5, prevents that radiator 1 from damaging the electronic chip 52 or the other electron component 54 of below when vibrations take place.
This two fixture 4 is installed in respectively in two installing holes 18 of this radiator 1.Each fixture 4 comprises a hook fastener 42 and a spring 48.These hook fastener 42 rear ends are press sections 44, and each extends a barb 46 after oblique the both sides, end of front end.This spring 48 is to be set on the body of rod of this hook fastener 42.
During installation, earlier insulation polyester film 2 is sticked on the bottom surface 122 of the pedestal 12 of this radiator 1, mandruka 3 is sticked on the below of this insulation polyester film 2 again, this two fixture 4 is located in respectively in two installing holes 18 of this radiator 1; Then these two hook fastener, 42 correspondences are snapped onto the locking hole 56 on this circuit board 5, after passing these locking hole 56 elastic recoverys, two barbs 46 for the treatment of this hook fastener 42 promptly can't oppositely make progress, and these spring 48 elasticity are replaced and are made the hook fastener 42 can't be to lower slider between the mounting ear 16 of the press section 44 of hook fastener 42 and radiator 1, just this radiator 1 is locked on the circuit board 5, this moment, end face 522 perforate 32 of passing this mandruka 3 of this electronic chip 52 was passed after the opening 22 of this insulation polyester film 2 again, just amplexiform pedestal 12 bottom surfaces 122 of this radiator 1, the heat that electronic chip 52 is produced can distribute by radiator 1.
The utility model is pasted with one deck insulation polyester film 2 on the bottom surface 122 of this radiator 1 pedestal 12, this insulation polyester film 2 is provided with an opening 22, the opening 22 that this electronic chip 52 can pass insulation polyester film 2 amplexiforms this radiator 1 pedestal 12, thereby dispel the heat for electronic chip 52 effectively, other electron component 54 on the circuit board 5 then because the obstruct of insulation polyester film 2 can not contact with the pedestal 12 of radiator 1, prevents short circuit; Also be provided with one deck mandruka 3 in addition below the insulation polyester film 2 of this radiator 1, this mandruka 3 can prevent that radiator 1 from damaging the electronic chip 52 or the other electron component 54 of below when vibrations take place.
It more than is preferred embodiment of the present utility model; distortion as the foregoing description; the material of this insulation polyester film 2 not merely is defined as polyester material; from effect and function; need be that the film (as plastic tab) with insulation function can be realized identical purpose and effect only; also can wait and replace this mandruka 3 with other elastomer such as rubber; and the replacement of these technical characterictics; all be that present technique field those of ordinary skill does not need creative work just can realize; such as use the technical solution of the utility model and technical conceive to make other various corresponding changes and distortion, and all these changes and distortion all should belong within the protection range of the utility model claim.
Claims (11)
1, a kind of heat abstractor, it is characterized in that: this heat abstractor comprises a radiator and an insulation film, this radiator comprises a pedestal and some radiating fins, and this insulation film is installed on the bottom surface of this radiator base, and the middle part of this insulation film offers an opening.
2, heat abstractor according to claim 1 is characterized in that: this insulation film is an insulation polyester film.
3, heat abstractor according to claim 1 and 2 is characterized in that: this insulation film is the bottom surface that sticks on this radiator base.
4, heat abstractor according to claim 3 is characterized in that: this insulation film is the bottom surface that pastes this radiator base with the 3M467 adhesive sticker.
5, heat abstractor according to claim 1 is characterized in that: this heat abstractor comprises that also one is installed in the elastomer of this insulation film below, and this elastomer middle part is provided with a perforate.
6, heat abstractor according to claim 5 is characterized in that: this elastomer is a mandruka that sticks on this insulation film below.
7, according to claim 5 or 6 described heat abstractors, it is characterized in that: this radiator is to be installed on the circuit board that is provided with an electronic chip, this elastomeric perforate is greater than the size of this electronic chip, and the end face of this electronic chip passes the base bottom surface of amplexiforming this radiator behind the opening of this elastomeric perforate and this insulation film.
8, heat abstractor according to claim 1, it is characterized in that: this radiator is to be installed on the circuit board that is provided with an electronic chip, the opening of this insulation film is equal to, or greater than the size of this electronic chip, and the end face of this electronic chip passes the bottom surface of amplexiforming this radiator base behind the opening of this insulation film.
9, heat abstractor according to claim 8, it is characterized in that: this circuit board also is provided with some electronic components around this electronic chip, this insulation film intercepts between the pedestal of these electronic components and this radiator, prevents from that these electronic components from contacting with the pedestal of this radiator to cause short circuit.
10, heat abstractor according to claim 1 is characterized in that: each outwards is equipped with a mounting ear two ends of this radiator base, respectively offers an installing hole on this two mounting ear, respectively is equiped with a fixture in this two installing hole.
11, heat abstractor according to claim 1 is characterized in that: these radiating fins make progress projection and go out from this pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620112265 CN2909803Y (en) | 2006-05-24 | 2006-05-24 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620112265 CN2909803Y (en) | 2006-05-24 | 2006-05-24 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2909803Y true CN2909803Y (en) | 2007-06-06 |
Family
ID=38129012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620112265 Expired - Fee Related CN2909803Y (en) | 2006-05-24 | 2006-05-24 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2909803Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015035600A1 (en) * | 2013-09-13 | 2015-03-19 | Xu Rui | Heat dissipation device |
| CN104582404A (en) * | 2013-10-09 | 2015-04-29 | 英业达科技有限公司 | Electronic device with heat dissipation structure and heat dissipation structure |
-
2006
- 2006-05-24 CN CN 200620112265 patent/CN2909803Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015035600A1 (en) * | 2013-09-13 | 2015-03-19 | Xu Rui | Heat dissipation device |
| CN104582404A (en) * | 2013-10-09 | 2015-04-29 | 英业达科技有限公司 | Electronic device with heat dissipation structure and heat dissipation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070606 Termination date: 20120524 |