CN220711703U - Antistatic multilayer HDI circuit board - Google Patents
Antistatic multilayer HDI circuit board Download PDFInfo
- Publication number
- CN220711703U CN220711703U CN202321816444.3U CN202321816444U CN220711703U CN 220711703 U CN220711703 U CN 220711703U CN 202321816444 U CN202321816444 U CN 202321816444U CN 220711703 U CN220711703 U CN 220711703U
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- CN
- China
- Prior art keywords
- circuit board
- hdi circuit
- heat
- antistatic
- hdi
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 19
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000013016 damping Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000003068 static effect Effects 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 8
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an antistatic multilayer HDI circuit board which comprises a fixed plate, wherein a fixed rod is connected with a first HDI circuit board and a second HDI circuit board, the first HDI circuit board and the second HDI circuit board are both provided with heat dissipation structures, the heat dissipation structures comprise heat conduction pads, an insulating layer, heat dissipation fins and heat dissipation holes, an antistatic coating is arranged on the surface of the insulating layer, and an ion fan is arranged on the fixed plate. According to the utility model, the antistatic coating can reduce static adsorption on the surface of the antistatic coating, the ion fan can blow ionized air out of the antistatic coating, the antistatic coating can eliminate static on the surface, the purpose of removing static is achieved, heat emitted by the circuit board can be transferred to the radiating fins through the heat conducting pad, the radiating fins are used for effectively radiating heat, the radiating speed is improved, and the radiating effect is improved by matching with air blown by the ion fan, so that the service life of the circuit board is prolonged.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an antistatic multilayer HDI circuit board.
Background
The circuit board is used as a main support body for mounting and plugging electronic components, is an indispensable part of all electronic products, has become one of the fastest industry for global growth in recent years in information, communication and consumer electronic product manufacturing, has become increasingly different day by day and is developed towards the directions of small volume, light weight and complex functions, and has higher requirements on the circuit board.
The prior art has the following problems:
the utility model patent of patent publication No. CN207340272U discloses a multilayer HDI circuit board with inner layer interconnection, which comprises a first circuit board, a second circuit board, a rivet hole, a rivet rod and a micro radiator, wherein a concave part is arranged on the first circuit board, a convex part is arranged on the second circuit board, the first circuit board and the second circuit board are connected with the concave part through the convex part, the beneficial effects are that the first circuit board and the second circuit board are connected with the concave part through the convex part, the whole device is more stable, the precision of the interconnection of the multilayer HDI circuit boards is improved, the surface layers of the convex part and the concave part are provided with metal coatings, the first circuit board and the second circuit board are electrified mutually, the normal use of the multilayer HDI circuit board is ensured, the heat generated by the multilayer HDI circuit board is conveniently transmitted into the rivet rod, the heat in the rivet rod is blown to the outer side of the metal plate through the micro radiator, and the radiating effect is improved.
However, the above-mentioned patent still has some shortages, and the multilayer HDI circuit board before is liable to be damaged by static, and firstly static is liable to adsorb the dust, if adsorb the dust particle and divide the dirt great, easily make electronic product scrap, secondly static discharge can cause electronic device breakdown harm, and the charge that accumulates on the circuit board produces the unwrapping wire when the conductor is close, and electronic component is attacked by static and life declines, so still can further improve.
For this reason, we propose an antistatic multilayer HDI circuit board to solve the above-mentioned drawbacks.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides an antistatic multilayer HDI circuit board.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides an antistatic multilayer HDI circuit board, includes the fixed plate, fixed plate surface mounting has the damping pad, the damping pad top is connected with the dead lever, and the dead lever is connected with first HDI circuit board and second HDI circuit board, heat radiation structure is all installed to first HDI circuit board and second HDI circuit board, and heat radiation structure includes heat conduction pad, insulating layer, radiating fin and louvre, heat conduction pad and first HDI circuit board surface connection, the heat conduction pad is connected with the insulating layer, radiating fin is installed to the heat conduction pad, and the louvre has been seted up to radiating fin, insulating layer surface mounting has antistatic coating, ion fan is installed to the fixed plate.
Preferably, the heat dissipation structure is provided with a plurality of groups, and the heat dissipation structure is uniformly distributed on two side surfaces of the first HDI circuit board and the second HDI circuit board.
Preferably, the radiating fins penetrate through the insulating layer and the antistatic coating.
Preferably, each group of heat dissipation structures is uniformly provided with a plurality of groups of heat dissipation fins.
Preferably, the fixing plate is spirally provided with fixing screws, and the fixing screws are provided with a plurality of groups.
Preferably, a protective layer is arranged at the top end of the fixing rod, and a corrosion-resistant layer is arranged on the surface of the protective layer.
Compared with the prior art, the utility model has the beneficial effects that;
according to the utility model, through the matched use of the antistatic coating and the ion fan, the antistatic effect is achieved, the antistatic coating can reduce static adsorption on the surface of the antistatic coating, the ion fan can blow ionized air out of the antistatic coating, the antistatic coating can eliminate static on the surface of the antistatic coating, the purpose of static elimination is achieved, the heat emitted by the circuit board can be transferred to the radiating fins through the heat conducting pad, the radiating fins are used for effectively radiating heat, the radiating speed is improved, and the radiating effect is improved when the air blown by the ion fan is matched, so that the service life of the circuit board is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments will be briefly described below.
FIG. 1 is a schematic diagram of an antistatic multilayer HDI circuit board according to the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation structure of an anti-static multi-layered HDI circuit board according to the present utility model;
fig. 3 is a schematic diagram of a heat dissipation fin of an antistatic multilayer HDI circuit board according to the present utility model.
Legend description:
1. a fixing plate; 2. a fixed rod; 3. a first HDI circuit board; 4. a second HDI circuit board; 5. an ion blower; 6. a damping pad; 7. a set screw; 8. a heat dissipation structure; 81. a thermal pad; 82. a heat radiation hole; 83. a heat radiation fin; 84. an insulating layer; 9. an antistatic coating; 10. a protective layer; 11. and a corrosion resistant layer.
Detailed Description
The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the utility model. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present utility model.
Referring to fig. 1-3, an antistatic multilayer HDI circuit board includes a fixing plate 1, a damping pad 6 is mounted on a surface of the fixing plate 1, a fixing rod 2 is connected to a top end of the damping pad 6, the fixing rod 2 is connected to a first HDI circuit board 3 and a second HDI circuit board 4, heat dissipation structures 8 are mounted on the first HDI circuit board 3 and the second HDI circuit board 4, the heat dissipation structures 8 include a heat conduction pad 81, an insulating layer 84, heat dissipation fins 83 and heat dissipation holes 82, the heat conduction pad 81 is connected with a surface of the first HDI circuit board 3, the heat conduction pad 81 is connected with the insulating layer 84, the heat dissipation fins 83 are mounted on the heat conduction pad 81, the heat dissipation fins 83 are provided with heat dissipation holes 82, an antistatic coating 9 is mounted on a surface of the insulating layer 84, an ion blower 5 is mounted on the fixing plate 1, the heat dissipation fins 83 penetrate through the insulating layer 84, and the antistatic coating 9 are uniformly provided with multiple groups of heat dissipation fins 83.
In this embodiment: through setting up the cooperation of antistatic coating 9 and ion fan 5 and using, reach the effect of preventing static, antistatic coating 9 can reduce static absorption at its surface, ion fan 5 can blow off the air that has the ionization, blow at antistatic coating 9 surface, it can eliminate static on the surface, reach the purpose of destaticizing, can distribute the heat transfer of circuit board to radiating fin 83 through setting up heat conduction pad 81, effectively dispel the heat by radiating fin 83, improve the radiating rate, the wind that blows off at cooperation ion fan 5, improve the radiating effect, thereby the life of circuit board has been improved.
Specifically, the heat dissipation structures 8 are provided with a plurality of groups, and the heat dissipation structures 8 are uniformly distributed on the surfaces of two sides of the first HDI circuit board 3 and the second HDI circuit board 4.
In this embodiment: by arranging a plurality of groups of heat dissipation structures 8, the heat dissipation effect is improved.
Specifically, the fixing plate 1 is screw-mounted with fixing screws 7, and the fixing screws 7 are provided with a plurality of groups.
In this embodiment: through setting up set screw 7, be convenient for carry out fixed mounting to multilayer HDI circuit board.
Specifically, the top end of the fixing rod 2 is provided with a protective layer 10, and the surface of the protective layer 10 is provided with a corrosion-resistant layer 11.
In this embodiment: through setting up protective layer 10 and corrosion-resistant layer 11, promote the protection to multilayer HDI circuit board, increase of service life.
Working principle: during operation, the antistatic coating 9 can reduce static adsorption on the surface of the antistatic coating, the ion fan 5 can blow out ionized air, and the air is blown onto the surface of the antistatic coating 9, so that static electricity on the surface can be eliminated, the purpose of static electricity elimination is achieved, heat emitted by a circuit board can be transferred to the radiating fins 83 through the heat conducting pad 81, the radiating fins 83 effectively dissipate heat, the radiating speed is improved, the radiating effect is improved when the air blown out by the ion fan 5 is matched, and the service life of the circuit board is prolonged.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (6)
1. The utility model provides an antistatic multilayer HDI circuit board, includes fixed plate (1), its characterized in that, fixed plate (1) surface mounting has damping pad (6), damping pad (6) top is connected with dead lever (2), and dead lever (2) are connected with first HDI circuit board (3) and second HDI circuit board (4), heat radiation structure (8) are all installed to first HDI circuit board (3) and second HDI circuit board (4), and heat radiation structure (8) include heat conduction pad (81), insulating layer (84), radiating fin (83) and louvre (82), heat conduction pad (81) and first HDI circuit board (3) surface connection, heat conduction pad (81) are connected with insulating layer (84), radiating fin (83) are installed to heat conduction pad (81), and radiating fin (83) have seted up louvre (82), insulating layer (84) surface mounting has antistatic coating (9), ion fan (5) are installed to fixed plate (1).
2. The antistatic multilayer HDI circuit board according to claim 1, wherein the heat dissipation structures (8) are provided with a plurality of groups, and the heat dissipation structures (8) are uniformly distributed on two side surfaces of the first HDI circuit board (3) and the second HDI circuit board (4).
3. An antistatic multilayer HDI wiring board according to claim 1, characterized in that the heat dissipating fins (83) penetrate through the insulating layer (84), antistatic coating (9).
4. An antistatic multilayer HDI circuit board according to claim 1, characterized in that each set of heat dissipating structures (8) is uniformly provided with a plurality of sets of heat dissipating fins (83).
5. An antistatic multilayer HDI wiring board according to claim 1, characterized in that the fixing plate (1) is screw-mounted with fixing screws (7), and the fixing screws (7) are provided with a plurality of groups.
6. The antistatic multilayer HDI circuit board according to claim 1, wherein a protective layer (10) is installed at the top end of the fixing rod (2), and a corrosion-resistant layer (11) is installed on the surface of the protective layer (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321816444.3U CN220711703U (en) | 2023-07-11 | 2023-07-11 | Antistatic multilayer HDI circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321816444.3U CN220711703U (en) | 2023-07-11 | 2023-07-11 | Antistatic multilayer HDI circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220711703U true CN220711703U (en) | 2024-04-02 |
Family
ID=90452886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321816444.3U Active CN220711703U (en) | 2023-07-11 | 2023-07-11 | Antistatic multilayer HDI circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220711703U (en) |
-
2023
- 2023-07-11 CN CN202321816444.3U patent/CN220711703U/en active Active
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